USA: In a parallel effort to its development of UV-C light emitting diodes (LEDs), HexaTech recently demonstrated optically pumped, AlGaN-based lasers grown on highest-quality, single crystalline AlN substrates.
Laser structures fabricated at HexaTech and tested in collaboration with North Carolina State University (NCSU) featured lasing thresholds as low as 85 kW/cm2 at wavelengths of 264 and 280 nm. This not only represents record-breaking laser performance, but also further validates the value proposition of HexaTech's AlN substrate platform for UV-C opto-electronic applications.
"Our recent results show convincing evidence of the feasibility of a solid-state UV-C laser," commented Dr. Andy Xie. "The tests not only demonstrate lasing at low pump intensities, but we also observed emission peak line widths as narrow as 0.02 nm, and further telltale signs of a properly operating laser, including spectrally resolved cavity modes, TE-mode polarization, and elliptically-shaped far-field patterns."
The observed lasing at low pump intensities is an important milestone toward the development of semiconductor lasers operating at short wavelengths in the UV-C range. Enabled by HexaTech's industry-leading, low dislocation density bulk aluminum nitride (AlN) substrates, these results add to the record-breaking UV-C LED and laser performance reported by other groups.
The use of high-quality, native AlN substrates that are lattice-matched to the overgrown III-nitride device layers allow for fabrication of opto-electronic devices of superior structural quality, and, thus, previously unachievable performance.
There is a growing market opportunity for UV-C lasers used for chemical, biological, and explosive material detection. "HexaTech's core expertise in AlN crystal growth and wafer fabrication has already led to the development of world-class UV-C LEDs with previously unachievable device lifetimes," noted Joe Grzyb , HexaTech CEO. "Our AlN substrate platform, again, advances UV-C opto-electronics to new levels of performance."
Monday, February 4, 2013
Microchip adds Bluetooth module for streaming audio
USA: Microchip Technology Inc. announced the expansion of its wireless product portfolio with a certified Bluetooth Audio Module that supports audio for voice and music.
The RN52 module provides extremely low power consumption in a small, surface-mount form factor, and includes standard Bluetooth audio and data profiles for all smart-phone platforms. These features makes it easy for designers to add high-quality wireless audio, combined with data capabilities, in a broad range of applications, such as wireless stereo speakers, headphones, automotive hands-free, medical devices and computer accessories.
The advantages of wireless, along with the rapidly expanding smartphone and tablet markets, are driving the demand for Bluetooth wireless audio accessories. Microchip's RN52 module, which is based on technology acquired from Roving Networks, has the Bluetooth stack on board.
Including the stack on the module provides a simple-to-use and robust design model that works with any microprocessor or microcontroller, helping designers to get their accessories to market faster. The RN52's embedded Bluetooth stack includes the popular SPP, A2DP, HFP/HSP and AVRCP profiles, along with the iAP for use with iPhone® and iPod. Additionally, the RN52 supports a variety of audio codecs, such as SBC, aptX, AAC and MP3.
"The superior streaming-audio capability of the RN52 greatly expands Microchip's Bluetooth portfolio," said Steve Caldwell, director of Microchip's Wireless Products Division. "We have incorporated all the major codecs and profiles, enabling customers to easily create Bluetooth wireless audio accessories with minimal design effort and fast time to market."
To make designing RN52-based Bluetooth accessories even faster, Microchip is also introducing the Bluetooth Audio Evaluation Kit (part # RN-52-EK). This new kit is expected to be available in February.
The RN52 Bluetooth Audio Module (part # RN-52-I/RM) is expected to be available in March, in a compact, surface-mount form factor in 1,000-unit quantities.
The advantages of wireless, along with the rapidly expanding smartphone and tablet markets, are driving the demand for Bluetooth wireless audio accessories. Microchip's RN52 module, which is based on technology acquired from Roving Networks, has the Bluetooth stack on board.
Including the stack on the module provides a simple-to-use and robust design model that works with any microprocessor or microcontroller, helping designers to get their accessories to market faster. The RN52's embedded Bluetooth stack includes the popular SPP, A2DP, HFP/HSP and AVRCP profiles, along with the iAP for use with iPhone® and iPod. Additionally, the RN52 supports a variety of audio codecs, such as SBC, aptX, AAC and MP3.
"The superior streaming-audio capability of the RN52 greatly expands Microchip's Bluetooth portfolio," said Steve Caldwell, director of Microchip's Wireless Products Division. "We have incorporated all the major codecs and profiles, enabling customers to easily create Bluetooth wireless audio accessories with minimal design effort and fast time to market."
To make designing RN52-based Bluetooth accessories even faster, Microchip is also introducing the Bluetooth Audio Evaluation Kit (part # RN-52-EK). This new kit is expected to be available in February.
The RN52 Bluetooth Audio Module (part # RN-52-I/RM) is expected to be available in March, in a compact, surface-mount form factor in 1,000-unit quantities.
Datacentre activities boost global Ethernet test equipment market
ENGLAND: An increase in datacentre activities, rapid growth of the 40/100 GbE market, mobile backhaul applications, and infrastructure development by end users to accommodate gigabit Ethernet are driving the global Ethernet test equipment market.
New analysis from Frost & Sullivan titled High Growth Testing Opportunity: Global Ethernet Test Equipment Market, finds that the market earned revenues of $822.5 million in 2011 and estimates this to reach $1225.7 million in 2016. The 1 GbE, 10 GbE and 40/100 GbE test equipment segments are expected to grow at single, double and triple digit rates, respectively.
Modern datacentre technologies including virtualisation, converged datacentre networks and cloud computing are changing the designs of traditional datacentres. These newer designs require higher bandwidth; 40/100 GbE equipment is better suited to the core and aggregation layers.
"With constantly evolving processor performance, it is anticipated that the 40/100 GbE interfaces will become the default requirement," saidFrost & Sullivan Measurement & Instrumentation Industry Analyst Prathima Bommakanti . "This has led to a corresponding demand for 40/100 GbE test equipment."
End-user demand for high density test equipment is considered both a driver and a challenge for Ethernet test equipment vendors. While it offers immense growth opportunities, test vendors are constantly being challenged to keep their products aligned with the market's emerging functional test requirements – such as Layer4 wire-speed TCP/IP testing, Y.1564, 1588v2/SYNC, and IPv6 – even while continuing to provide value for money.
As technology improves and port count increases, end users are becoming accustomed to purchasing test solutions with greater capabilities across a range of technologies. Equipment prices have steadily fallen over the last few years even as end users have been pressured to create efficiencies and reduce unnecessary expenditure.
"The increasing complexity of protocols and the concurrent development of different standards call for Ethernet test equipment with greater testing capabilities," remarked Bommakanti. "However, as protocols become more difficult to comply with, it will be a greater challenge for the test equipment to provide the desired results."
Market prospects will be boosted by continued efforts by manufacturers to overcome the glitches inherent in advanced technologies and to offer competitive products. Rapidly evolving end-user technologies will motivate test vendors to focus on R&D and product introductions that best address customer needs.
New analysis from Frost & Sullivan titled High Growth Testing Opportunity: Global Ethernet Test Equipment Market, finds that the market earned revenues of $822.5 million in 2011 and estimates this to reach $1225.7 million in 2016. The 1 GbE, 10 GbE and 40/100 GbE test equipment segments are expected to grow at single, double and triple digit rates, respectively.
Modern datacentre technologies including virtualisation, converged datacentre networks and cloud computing are changing the designs of traditional datacentres. These newer designs require higher bandwidth; 40/100 GbE equipment is better suited to the core and aggregation layers.
"With constantly evolving processor performance, it is anticipated that the 40/100 GbE interfaces will become the default requirement," saidFrost & Sullivan Measurement & Instrumentation Industry Analyst Prathima Bommakanti . "This has led to a corresponding demand for 40/100 GbE test equipment."
End-user demand for high density test equipment is considered both a driver and a challenge for Ethernet test equipment vendors. While it offers immense growth opportunities, test vendors are constantly being challenged to keep their products aligned with the market's emerging functional test requirements – such as Layer4 wire-speed TCP/IP testing, Y.1564, 1588v2/SYNC, and IPv6 – even while continuing to provide value for money.
As technology improves and port count increases, end users are becoming accustomed to purchasing test solutions with greater capabilities across a range of technologies. Equipment prices have steadily fallen over the last few years even as end users have been pressured to create efficiencies and reduce unnecessary expenditure.
"The increasing complexity of protocols and the concurrent development of different standards call for Ethernet test equipment with greater testing capabilities," remarked Bommakanti. "However, as protocols become more difficult to comply with, it will be a greater challenge for the test equipment to provide the desired results."
Market prospects will be boosted by continued efforts by manufacturers to overcome the glitches inherent in advanced technologies and to offer competitive products. Rapidly evolving end-user technologies will motivate test vendors to focus on R&D and product introductions that best address customer needs.
TTM signs letter of intent for SYE and DMC plants
USA: TTM Technologies Inc., a major printed circuit board (PCB) manufacturer, has signed a letter of intent with its minority partner, Shengyi Technology Co. Ltd. (Sytech) to dispose of TTM's 70.2 percent equity interest in the SYE plant and to acquire Sytech's 20 percent equity interest in the DMC plant.
The SYE and DMC plants manufacture conventional PCBs and are located in Dongguan, China. Subject to conclusion of a formal sale and purchase agreement between the parties, the transaction is expected to close by the end of the second quarter of 2013. A condition for closing is that the parties value all of SYE at 1 billion RMB (about $161 million) and all of DMC at 900 million RMB (about $145 million).
"In our Asia Pacific operating segment, we see the strongest growth prospects and customer demand for our advanced technology PCBs," said Kent Alder, CEO of TTM. "When completed, this transaction will reduce our footprint for conventional PCBs in Asia Pacific and should help improve our capacity utilization."
The SYE and DMC plants manufacture conventional PCBs and are located in Dongguan, China. Subject to conclusion of a formal sale and purchase agreement between the parties, the transaction is expected to close by the end of the second quarter of 2013. A condition for closing is that the parties value all of SYE at 1 billion RMB (about $161 million) and all of DMC at 900 million RMB (about $145 million).
"In our Asia Pacific operating segment, we see the strongest growth prospects and customer demand for our advanced technology PCBs," said Kent Alder, CEO of TTM. "When completed, this transaction will reduce our footprint for conventional PCBs in Asia Pacific and should help improve our capacity utilization."
Friday, February 1, 2013
Toshiba to enter contact image-sensor module market for banknote recognition
JAPAN: Toshiba Corp. announced that it will enter the linear image-sensor market for banknote recognition applications, a high growth business. The company has developed a contact image-sensor module (CISM) for banknote recognition as its first product, and mass production is scheduled for June 2013.
Toshiba has cultivated a linear image-sensor business with products for scanning applications, such as MFPs and text and image scanners, and sensing applications, such as barcode readers. The company has now broadened its portfolio in the sensing field with a linear image-sensor that offers approximately four times the infrared sensitivity of existing Toshiba products.
The new linear sensor is a CISM integrated with the new sensors and it will be promoted as a solution that meets the Chinese government's enhanced requirements for banknote recognition systems, under the national standard "GB16999-2010".
Following the initial product, "CIPS183BS200" (effective scanning length: 183mm; resolution: 200dpi and 100dpi (selectable); data rate: 8MHz), products with thinner module cases, variations in effective scanning length and improved data rates are scheduled to follow. Customized module cases will be considered as an option, at the request of customers.
Toshiba has cultivated a linear image-sensor business with products for scanning applications, such as MFPs and text and image scanners, and sensing applications, such as barcode readers. The company has now broadened its portfolio in the sensing field with a linear image-sensor that offers approximately four times the infrared sensitivity of existing Toshiba products.
The new linear sensor is a CISM integrated with the new sensors and it will be promoted as a solution that meets the Chinese government's enhanced requirements for banknote recognition systems, under the national standard "GB16999-2010".
Following the initial product, "CIPS183BS200" (effective scanning length: 183mm; resolution: 200dpi and 100dpi (selectable); data rate: 8MHz), products with thinner module cases, variations in effective scanning length and improved data rates are scheduled to follow. Customized module cases will be considered as an option, at the request of customers.
Emerson Network Power launches first OpenVPX system
HONG KONG: Emerson Network Power, a business of Emerson and the global leader in enabling Business-Critical Continuity, announced its first system-level OpenVPX fanless enclosure - including power, storage and processor elements - designed to minimize size, weight and power (SWaP) for military, aerospace, commercial and other High Performance Embedded Computing (HPEC) applications.
The Emerson Network Power VPX3000 includes a configurable I/O Adapter Board (IAB) that routes I/O from the payload blades to the front of the enclosure. The IAB is designed to mate with Emerson Network Power’s iVPX7225 processor blade, based on the Intel® 3rd generation Core mobile chipset and also launched today.
The VPX3000 accepts up to three 3U conduction cooled OpenVPX modules and includes a VITA-62 compliant AC or DC power supply with a MIL-38999 power input connector and a front panel switch.
“As OpenVPX technology becomes more widely adopted, Emerson Network Power remains committed to providing innovative solutions for OEMs,” said Eric Gauthier, VP product marketing for Emerson Network Power’s Embedded Computing business. “This is a complex market that demands customization and integrated platforms, and the VPX3000 system enclosure is one of the building blocks in a growing portfolio that enables Emerson Network Power to deliver complete solutions.”
Two Data Plane Fat Pipes from each slot are connected in a full mesh configuration. Two Control Plane Ultra Thin Pipes from each slot are routed to the IAB as 1000Base-T interfaces. USB 2.0 and Display Port interfaces are also routed to the IAB in all variants.
A rugged variant of the VPX300, targeted at military, aerospace and government applications includes three MIL-38999 connectors for I/O from each slot. An alternative variant includes commercial connectors on the IAB and is targeted towards industrial and development applications.
The Emerson Network Power VPX3000 includes a configurable I/O Adapter Board (IAB) that routes I/O from the payload blades to the front of the enclosure. The IAB is designed to mate with Emerson Network Power’s iVPX7225 processor blade, based on the Intel® 3rd generation Core mobile chipset and also launched today.
The VPX3000 accepts up to three 3U conduction cooled OpenVPX modules and includes a VITA-62 compliant AC or DC power supply with a MIL-38999 power input connector and a front panel switch.
“As OpenVPX technology becomes more widely adopted, Emerson Network Power remains committed to providing innovative solutions for OEMs,” said Eric Gauthier, VP product marketing for Emerson Network Power’s Embedded Computing business. “This is a complex market that demands customization and integrated platforms, and the VPX3000 system enclosure is one of the building blocks in a growing portfolio that enables Emerson Network Power to deliver complete solutions.”
Two Data Plane Fat Pipes from each slot are connected in a full mesh configuration. Two Control Plane Ultra Thin Pipes from each slot are routed to the IAB as 1000Base-T interfaces. USB 2.0 and Display Port interfaces are also routed to the IAB in all variants.
A rugged variant of the VPX300, targeted at military, aerospace and government applications includes three MIL-38999 connectors for I/O from each slot. An alternative variant includes commercial connectors on the IAB and is targeted towards industrial and development applications.
Emerson Network Power intros OpenVPX processor board
HONG KONG: Emerson Network Power, a business of Emerson and the global leader in enabling Business-Critical Continuity, announced a new 3U OpenVPX processor board designed to provide high compute performance, flexibility, and high speed fabric connectivity for a range of industrial, communication and military/aerospace applications.
The iVPX7225 is based on the dual-core third generation Intel Core i7 2.5 GHz processor, featuring the new Intel Advanced Vector Extensions (AVX) floating point instructions, with integrated graphics and memory controller and the mobile Intel QM77 PCH chipset with leading edge I/O functionality. It combines the significantly improved floating-point performance of the Intel Core i7 processor with the substantial bandwidth and system-enabling features of the 3U OpenVPX form factor.
The Emerson Network Power iVPX7225 is designed to operate in a wide range of OpenVPX enclosures, including the company’s VPX3000 system platform also launched today. On-board memory includes up to 16 GB DDR3L-1600 memory, embedded USB flash, and 1 MByte nonvolatile Ferroelectric Random Access Memory (F-RAM).
The iVPX7225 offers both PCI Express high speed data plane fabric connectivity and Gigabit Ethernet control plane connectivity with data transfer rates up to 5 Gbps. Additional connectivity includes three USB 2.0 ports, two serial ports, three SATA ports, eight GPIO, DisplayPort, VGA and one XMC site for maximum flexibility.
“Many of our customers are developing demanding applications for highly constrained environments in terms of size, weight and power and Emerson Network Power’s iVPX7225 provides an outstanding solution,” said Eric Gauthier, VP, product marketing Emerson Network Power’s Embedded Computing business. “Available as a fully rugged single board computer for extreme environments with extended shock, vibration, temperatures and conduction or air cooling, it provides an exceptionally versatile platform for a wide range of High Performance Embedded Computing (HPEC) applications.”
The iVPX7225 software support includes UEFI compliant BIOS with password protection and a wide range of operating systems including Wind River VxWorks 6.9 and Linux 3.x.
The iVPX7225 is based on the dual-core third generation Intel Core i7 2.5 GHz processor, featuring the new Intel Advanced Vector Extensions (AVX) floating point instructions, with integrated graphics and memory controller and the mobile Intel QM77 PCH chipset with leading edge I/O functionality. It combines the significantly improved floating-point performance of the Intel Core i7 processor with the substantial bandwidth and system-enabling features of the 3U OpenVPX form factor.
The Emerson Network Power iVPX7225 is designed to operate in a wide range of OpenVPX enclosures, including the company’s VPX3000 system platform also launched today. On-board memory includes up to 16 GB DDR3L-1600 memory, embedded USB flash, and 1 MByte nonvolatile Ferroelectric Random Access Memory (F-RAM).
The iVPX7225 offers both PCI Express high speed data plane fabric connectivity and Gigabit Ethernet control plane connectivity with data transfer rates up to 5 Gbps. Additional connectivity includes three USB 2.0 ports, two serial ports, three SATA ports, eight GPIO, DisplayPort, VGA and one XMC site for maximum flexibility.
“Many of our customers are developing demanding applications for highly constrained environments in terms of size, weight and power and Emerson Network Power’s iVPX7225 provides an outstanding solution,” said Eric Gauthier, VP, product marketing Emerson Network Power’s Embedded Computing business. “Available as a fully rugged single board computer for extreme environments with extended shock, vibration, temperatures and conduction or air cooling, it provides an exceptionally versatile platform for a wide range of High Performance Embedded Computing (HPEC) applications.”
The iVPX7225 software support includes UEFI compliant BIOS with password protection and a wide range of operating systems including Wind River VxWorks 6.9 and Linux 3.x.
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