Friday, February 21, 2014

NextG-Com announces first LTE protocol stack to target small cell relay nodes backhaul

STAINES, ENGLAND: NextG-Com, an expert in embedded software products and services for LTE, M2M and satellite communications, announced the availability of ALPS 521, a Release 11 compliant UE protocol stack designed for easy integration of relay node (RN) backhaul functionality with an existing eNodeB (eNB) solution. Relays are a key element of LTE-Advanced (LTE-A).

Traditionally, user equipment (UE) architectures are optimized for a high level of hardware integration, for example using an ASIC, and unlike eNB are based on different design approaches that focus on high volume and power efficiency. ALPS 521 is designed to provide interfaces to eNB network protocols via the NextG-Com IPC framework, and is pre-integrated with eNB RN interfaces to the scheduler and eNB controller entities.

"Our ALPS 521 LTE protocol variant offers a fast and effective way of delivering a small cell solution to infrastructure vendors who wish to extend their existing eNB portfolio to support future relay node features," said Denis Bidinost, NextG-Com CEO. "Our UE knowledge and expertise can help eNB vendors where additional development and integration services are required to bring the small cell relay node to market."

Using an in-house 3GPP test environment, ALPS 521 is pre-tested with RN-specific scenarios and configuration parameters, and can be flawlessly integrated into the relay architecture.

ALPS 521 is fully tested against relevant 3GPP/non 3GPP third party conformance tests specific for relays.

As it is already fully Release 11 compliant, ALPS 521 provides a simple platform for the integration and verification of the interactions of relay functionalities to Release 11 specifications such as impact of R-PDCCH and ePDCCH, CoMP, and relay interactions.

ALPS 521 is future-proof to support RN Layer 1 interfaces through an adaptation layer (L1A), which supports both in-band without isolation and out-band/in-band with isolation RF architecture. It is designed with well-proven L1 adaptation layer APIs that can be easily customized based on the different MAC and Physical Layer architecture. The protocol stack components are also supplied with a host of tools-Trace, ASN.1, SE-RTOSTM-to help deliver faster product development and reduce third party licensing costs.

Qolsys announces general availability of IQ panel

CUPERTINO, USA: Qolsys Inc. announced that its innovative IQ Panel, powered by, is now widely available through distributors in the United States.

The groundbreaking "all-in-one" solution is built on Google's Android, the world's leading mobile operating system.  The sleek 7" touchscreen tightly integrates with's market-leading connected home services platform, supporting interactive security, video monitoring, energy management and home automation.

After launching the company in April 2013 at ISC West, Qolsys began delivering the IQ Panel and full line of peripherals to Qolsys Foundation Club members in June, followed by shipping to limited dealers in November.

"The IQ Panel redefines the traditional self-contained number pad into today's all-in-one platform," says Qolsys VP of Sales and Marketing, Mike Hackett.  "We're excited to partner with the security industry to deliver next generation technology and innovation, enabling dealers to meet the demands of the broader marketplace."

"Integrating's interactive services with the IQ Panel gives our dealers a highly attractive package," says Nate Natale,'s Vice President of Sales.  "We look for the most innovative technologies when partnering so that our dealers can bring the best options to property owners."

The six (6) built-in communications radios with no external antennas include a dedicated cellular connection for life safety signals and home automation commands, and Wi-Fi for seamless software updates delivering the latest features while reducing dealer support and maintenance; Z-Wave for traditional in-home management and device control, and the Image Sensor for affordable visual verification.

The intuitive interface makes it easy to navigate features, including simple touch arming, disarm photos taken from the integrated panel camera, and photo frame.

Thursday, June 20, 2013

Ultratech ships first ambient control laser spike anneal system

USA: Ultratech Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), announced the first shipment of its LSA201 system to a leading IDM.

The LSA201 is built on a new platform that enables precise control over the gases that surround the wafer during processing (i.e., ambient control). At the customer's facility, the system will be used to develop leading-edge logic technology, mainly focusing on FinFETs.  This first shipment of the LSA201 is an example of Ultratech's continuing efforts to develop solutions that enable the leading-edge technology roadmaps of its global customers. Ultratech plans to begin volume shipments of the LSA201 in the second half of 2013.

Ultratech's LSA201 LSA system built on the highly customizable Unity Platform includes a patented micro chamber design, which enables full-wafer ambient control in a scanning laser system. The micro chamber is a system which does not require the use of vacuum hardware. The current system is capable of running mixtures of any inert gases, but the micro-chamber architecture is extendible to more reactive gases for future processes.

The LSA201 targets middle-of-line (MOL) applications, such as silicide formation, and advanced front-end-of-line (FEOL) applications, such as defect annealing. The LSA201 is well suited for processes such as interface engineering and film property modification where ambient control is critical at sub-20nm.

Wednesday, June 19, 2013

Photronics announces successful completion of tender offer to acquire PSMC

USA: Photronics Inc., a worldwide leader in supplying innovative imaging technology solutions for the global electronics industry, announced the successful completion of the tender offer to acquire the outstanding shares of Photronics Semiconductor Mask Corp. (PSMC), a majority-owned subsidiary of Photronics Inc.

As of the expiration of the offering period on June 18, 2013, a total of 50,259,277 shares were tendered at the offering price of NT$16.30 with the total costs of the transaction of approximately $28 million. As a result of the transaction, Photronics owns 98 percent of the outstanding shares of common stock of PSMC.

NKK Switches inks global distribution agreement with Digi-Key

USA: NKK Switches, the world's leading designer and manufacturer of innovative electromechanical switches, has signed a global distribution agreement with Digi-Key Corp.

The agreement enables Digi-Key to distribute NKK's market-leading products globally, with a specific focus on North America, Europe, Japan and the Asia Pacific region.

Digi-Key is the industry leader in electronic component selection, availability and delivery. The company's customer-centric approach and global online resources combined with their expansive NKK product portfolio will help NKK enhance its global recognition and ability to market to worldwide territories.

ShineOn revolutionizes LED lighting industry

CHINA: ShineOn Holding Inc., a global LED lighting solution provider, announced the successful demonstration of its DiscLight LED Light Engine, the world's first fully-integrated LED light engine without any external electronic components, at the Guangzhou International Lighting Exposition on June 9-12, 2014.

ShineOn's DiscLight LED Light Engine integrates a high voltage CMOS based driver IC with multi LED chip arrays on a single substrate. Leveraging its innovative control algorithm design and special IC configuration, this integrated module is capable of connecting to either 110V or a 220V AC power line directly, and can drive the LED array without requiring any additional electronic components such as voltage transformers, inductors and electrolyte capacitors.

Compared to 2-board solutions and solutions with discrete electronic components, ShineOn's elimination of such external components significantly improves the reliability as well as reducing the physical size of the module by more than 70 percent. These factors make ShineOn's DiscLight an excellent choice for indoor lighting applications ranging from 3-20W, such as candle lights, MR Light or PAR Lights.

"The LED lighting industry is at a critical stage in its evolution, and poised for accelerated growth," said Dr. Frank Fan, president of ShineOn. "Similar to the IT industry of the past 30 years, new innovations -- from chip, package, module, to system and software -- are supporting the advancement of this industry. ShineOn's successful demonstration of DiscLight is an important step for us to establish a leadership position, and we will continue to bring together the expertise of U.S. design innovations and Chinese manufacturing to provide advanced, ground-breaking module solutions for the global lighting industry."

DiscLight features include:
* High reliability and a high power factor of 0.99.
* Compact physical size at 19mm x 19mm x 2mm.
* High total lumens efficiency (including driver and LED) of  less than 90lm/W at warm white with more than 80 CRI.
* linearly dimmable device that is compatible with majority of existing dimmer circuits.
* lower total system BOM cost.

Tuesday, June 18, 2013

RFX240 CMOS PA delivers 26dBm linear power with best-in-class efficiency

USA: RFaxis Inc. has begun mass production of the RFX240 high-power 2.4GHz PA for wireless local area network (WLAN) applications.

The RFX240 is the first of RFaxis' pure CMOS high-power CMOS PA series targeting the rapidly growing wireless access point (AP), Router, Set Top Box (STB), home gateway, hot spot and other wireless infrastructure markets. The RFX240 is pin-to-pin compatible with incumbent solutions available in today’s market, including Skyworks SE2576L, SE2604L and SE2605L, which are all based on significantly more expensive compound semiconductor processes.

The RFX240 is a high power, high linearity power amplifier built on industry-standard bulk CMOS, the lowest-cost semiconductor process ever to implement an RF device. The RFX240 is optimized to provide the functionality of transmit power amplification for IEEE 802.11b/g/n applications in the 2.4GHz frequency range.

It provides 30dB power gain, 26dBm linear output power for OFDM/64QAM with 5V power supply and consumes 30mA less current than competition PAs of the same category. It integrates full-CMOS logic control, on-chip input and inter-stage impedance matching, RF decoupling, as well as a truly directional coupler based power detector for accurate closed-loop power control. The RFX240 is assembled in a compact 3.0x3.0x0.55mm 16-pin Quad Flat No-Lead (QFN) package. Samples are now available.