DesignCon 2011, LISLE, USA: Molex Inc. has announced its newest additions to the iPass+ product family.
The iPass+ High-Speed Channel (HSC) CXP copper and optical system offers connectors and cables that achieve rates of up to 120 Gbps of pluggable data over 12 lanes in one assembly. The first-to-market technology will be on display in Molex booth 501 at DesignCon 2011, February 1 and 2, Santa Clara, CA. This dual paddle-card system was adopted as the InfiniBand* CXP 12x QDR standard and by IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10 Gbps data rates.
Molex has leveraged the latest high data-rate capable wafer technology and compliant-pin tails to develop two integrated connector offerings for the growing server-storage market:
The enhanced footprint version is a high-density, 10-channel connector, which conforms to IEEE 802.3ba requirements for the 10-channel 100 Gigabit Ethernet interface and provides a path to future terabit networks.
The standard version is a high-density, 12-channel connector capable of achieving Quad Data Rates (QDR) of 10 Gbps. The one-piece press-fit connector and cage assembly provides one-step placement to the board and is offered in both single and stacked dual-port configurations.
“Not only does the iPass+ HSC CXP deliver one of the highest data-rate capable I/Os on the market today, but it provides the most effective utilization of space,” said Larry Schultz, global product manager, Molex. “This allows our customers, the server and switch manufacturers, to provide twice as many high data-rate capable channels as their current products and deliver a superior solution to the end-user.”
Other Molex iPass+ HSC CXP products include:
Stacked Dual-Port Integrated Connector: The stacked dual-port connector and cage assembly integrates two individual 12x ports into a single press-fit connector that provides one-step placement to the board.
Copper Cable Assemblies: The copper cables are designed to accommodate single, ganged or stacked connector configurations in extremely high-density requirements. CXP passive copper cables are available in a variety of lengths.
Active Optical Cable Assemblies: CXP active optical cable (AOC) assemblies and pluggable transceiver modules utilize 12 transmit (TX) and 12 receive (RX) channels and deliver 10 Gbps per channel over multimode optical fiber with transmission distances up to 1km (3280.840’). Optical-to-electrical conversion at the cable ends is provided by integrated transceiver modules containing an optical engine specifically optimized for low-power consumption and high reliability.
Optical Module Assemblies: The low profile CXP optical 4.50mm round module assemblies offer improved fiber management over traditional flat cables for connecting CXP transceivers. The CXP optical module assemblies utilize 24 fibers using industry-standard MTP/MPO connectors to provide 12 transmit (TX) and 12 receive (RX) channels over 10 Gbps high-bandwidth (OM3) fiber. This design meets InfiniBand bandwidth requirements for CXP modules spaced up to 300m.
Wednesday, February 2, 2011
Rudolph Technologies expands into LED market
FLANDERS, USA: Rudolph Technologies Inc., a leading provider of process characterization equipment and software that is designed to improve yield for the microelectronics and solar manufacturing industries, has expanded into the LED (light emitting diode) market with two significant orders.
Rudolph has shipped its Explorer Automated Macro Defect Inspection System and Discover Enterprise Data Analysis Software to a leading world-wide producer of LEDs. In addition, a US-based market leader in LEDs has placed new orders for Rudolph’s ProcessWORKS and ARTIST process control software, along with repeat orders for AutoShell factory automation software.
“Rudolph offers a suite of inspection, metrology and data analysis technologies that help high-volume LED makers better understand the causes of defects and yield loss in their front and back-end processes, ultimately lowering manufacturing costs and enhancing the performance and reliability of their products,” said Ardy Johnson, Rudolph’s marketing vice president.
“As the LED industry enters what promises to be a period of rapid expansion, rising costs and increased competition are driving a focus on yield management. This is similar to developments we have seen in semiconductor manufacturing, where the effort to maximize yield has been in place for many years.”
Newer, high brightness (HB) LEDs deliver higher performance, but require tighter control of variability and defectivity in the front-end processes, where the LED itself is formed, to ensure process yield and consistent performance of these high-output devices.
Johnson added, “Understanding and improving front-end processes is critical to achieving the performance and reliability required, while maintaining manufacturing costs that allow LED manufacturers to succeed in a very competitive industry.”
Rudolph’s Explorer System provides automated macro defect inspection of front-end processes, while its NSX Series enables high-throughput inspection in the back-end. Discover Enterprise software collects and analyzes data from various inspection and metrology sources throughout the process to provide valuable feedback on yield loss and systematic process variation.
“Adding ProcessWORKS, ARTIST and AutoShell to the manufacturing line has demonstrated further improvements to yield with a very high return on investment,” said Mike Plisinski, vice president and general manager of Rudolph’s Data Analysis and Review Business Unit. “One customer is using the AutoShell systems automation software to connect process tools to their factory systems. They have seen firsthand how AutoShell can reduce errors and improve operator productivity.”
Plisinski adds, “As the industry turns its focus from capacity expansions to better yields and tighter process control, software like ARTIST, AutoShell, and ProcessWORKS will become invaluable to LED manufacturing as they are now to the semiconductor industry.”
Rudolph has shipped its Explorer Automated Macro Defect Inspection System and Discover Enterprise Data Analysis Software to a leading world-wide producer of LEDs. In addition, a US-based market leader in LEDs has placed new orders for Rudolph’s ProcessWORKS and ARTIST process control software, along with repeat orders for AutoShell factory automation software.
“Rudolph offers a suite of inspection, metrology and data analysis technologies that help high-volume LED makers better understand the causes of defects and yield loss in their front and back-end processes, ultimately lowering manufacturing costs and enhancing the performance and reliability of their products,” said Ardy Johnson, Rudolph’s marketing vice president.
“As the LED industry enters what promises to be a period of rapid expansion, rising costs and increased competition are driving a focus on yield management. This is similar to developments we have seen in semiconductor manufacturing, where the effort to maximize yield has been in place for many years.”
Newer, high brightness (HB) LEDs deliver higher performance, but require tighter control of variability and defectivity in the front-end processes, where the LED itself is formed, to ensure process yield and consistent performance of these high-output devices.
Johnson added, “Understanding and improving front-end processes is critical to achieving the performance and reliability required, while maintaining manufacturing costs that allow LED manufacturers to succeed in a very competitive industry.”
Rudolph’s Explorer System provides automated macro defect inspection of front-end processes, while its NSX Series enables high-throughput inspection in the back-end. Discover Enterprise software collects and analyzes data from various inspection and metrology sources throughout the process to provide valuable feedback on yield loss and systematic process variation.
“Adding ProcessWORKS, ARTIST and AutoShell to the manufacturing line has demonstrated further improvements to yield with a very high return on investment,” said Mike Plisinski, vice president and general manager of Rudolph’s Data Analysis and Review Business Unit. “One customer is using the AutoShell systems automation software to connect process tools to their factory systems. They have seen firsthand how AutoShell can reduce errors and improve operator productivity.”
Plisinski adds, “As the industry turns its focus from capacity expansions to better yields and tighter process control, software like ARTIST, AutoShell, and ProcessWORKS will become invaluable to LED manufacturing as they are now to the semiconductor industry.”
Digi-Key signs global distribution agreement with Techflex
THIEF RIVER FALLS & SPARTA, USA: Electronic components distributor Digi-Key Corp. and Techflex, a globally recognized specialist in the engineering and manufacture of advanced sleeving solutions, announced that the two companies have entered into an agreement in which Digi-Key will distribute Techflex products to customers worldwide.
Products from Techflex are now in stock and available for purchase on Digi-Key's global websites. Products will also be featured in future print and online catalogs.
"We are very pleased to announce this distribution agreement with Techflex with its strong product offerings in braided sleeving solutions," said Jeff Shafer, Digi-Key's vice president of interconnect, passive, and electromechanical products. "Adding Techflex's quality product line to Digi-Key's offering exemplifies our commitment to provide our customers with the broadest range of products for the electronics industry."
Products from Techflex are now in stock and available for purchase on Digi-Key's global websites. Products will also be featured in future print and online catalogs.
"We are very pleased to announce this distribution agreement with Techflex with its strong product offerings in braided sleeving solutions," said Jeff Shafer, Digi-Key's vice president of interconnect, passive, and electromechanical products. "Adding Techflex's quality product line to Digi-Key's offering exemplifies our commitment to provide our customers with the broadest range of products for the electronics industry."
Tuesday, February 1, 2011
Molex zQSFP+ interconnect system provides high-performance products meeting high-density apps
DesignCon 2011, LISLE, USA: Molex Inc. has introduced the z-Quad Small Form-factor Pluggable Plus (zQSFP+) interconnect solution, designed for high-density applications found in telecommunications, data networking, test and measurement and medical diagnostic equipment.
The zQSFP+ system, which provides proven 25 Gbps data rates, will be demonstrated in Molex booth 501 at DesignCon 2011, February 1 and 2, Santa Clara, CA. The products support next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand* Enhanced Data Rate (EDR) applications and are designed to accommodate stacked and ganged connector configurations in extremely high-density requirements.
“The new zQSFP+ connector system allows users to deliver high-performance connectivity while maximizing real estate usage compared to traditional SFP+ products,” said Joe Dambach, new product development manager, Molex. “It’s also a highly-integrated system that provides excellent thermal performance, signal integrity (SI), electromagnetic interference (EMI) protection and some of the lowest power consumption in the industry for optical cable assemblies.”
Components of the system include:
Surface Mount (SMT) Through Hole Connector: Molex’s zQSFP+ SMT EDR application consists of 4 lanes of high data-rate differential signals with proven data rates of 25 Gbps and capable data rates of 40 Gbps. The patent-pending preferential coupling design uses insert molding to support a narrow edge-coupled blanked and formed contact geometry to optimize electrical performance. The zQSFP+ connector shares the same mating interface as the QSFP+ form factor, making it backward compatible with current connectors, cages and cable assemblies.
Electromagnetic Interference (EMI) Shielding Cage: Molex’s zQSFP+ EMI cages are designed with an advanced heat-sink system to provide a high level of heat dissipation for next-generation system-power levels. The spring-finger design provides optimal EMI grounding and allows for more space to route high-speed traces.
Passive Copper Cable Assemblies: The next-generation copper cable assembly construction provides improved insertion loss (IL) performance at 12.5 and 14.0 GHz, and has been tested up to 30 GHz. The 4 lane and SI performance design on the paddle card and the cable termination process assures low reflection, low cross talk and controlled impedance.
Active Optical Cables (AOC): Molex’s low-power AOC integrated cable solution provides less expensive, reliable transport for aggregated data rates up to 100 Gbps. The single mode fiber technology provides long reaches of up to 4km, enabling deployment in data centers and campus environments.
The zQSFP+ system, which provides proven 25 Gbps data rates, will be demonstrated in Molex booth 501 at DesignCon 2011, February 1 and 2, Santa Clara, CA. The products support next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand* Enhanced Data Rate (EDR) applications and are designed to accommodate stacked and ganged connector configurations in extremely high-density requirements.
“The new zQSFP+ connector system allows users to deliver high-performance connectivity while maximizing real estate usage compared to traditional SFP+ products,” said Joe Dambach, new product development manager, Molex. “It’s also a highly-integrated system that provides excellent thermal performance, signal integrity (SI), electromagnetic interference (EMI) protection and some of the lowest power consumption in the industry for optical cable assemblies.”
Components of the system include:
Surface Mount (SMT) Through Hole Connector: Molex’s zQSFP+ SMT EDR application consists of 4 lanes of high data-rate differential signals with proven data rates of 25 Gbps and capable data rates of 40 Gbps. The patent-pending preferential coupling design uses insert molding to support a narrow edge-coupled blanked and formed contact geometry to optimize electrical performance. The zQSFP+ connector shares the same mating interface as the QSFP+ form factor, making it backward compatible with current connectors, cages and cable assemblies.
Electromagnetic Interference (EMI) Shielding Cage: Molex’s zQSFP+ EMI cages are designed with an advanced heat-sink system to provide a high level of heat dissipation for next-generation system-power levels. The spring-finger design provides optimal EMI grounding and allows for more space to route high-speed traces.
Passive Copper Cable Assemblies: The next-generation copper cable assembly construction provides improved insertion loss (IL) performance at 12.5 and 14.0 GHz, and has been tested up to 30 GHz. The 4 lane and SI performance design on the paddle card and the cable termination process assures low reflection, low cross talk and controlled impedance.
Active Optical Cables (AOC): Molex’s low-power AOC integrated cable solution provides less expensive, reliable transport for aggregated data rates up to 100 Gbps. The single mode fiber technology provides long reaches of up to 4km, enabling deployment in data centers and campus environments.
Efficient battery-powered devices and alternate energy markets to drive power management growth in 2011
EL SEGUNDO, USA: Following a 41.6 percent boom in 2010, revenue growth in the global power management semiconductor market will slow significantly in 2011 but still will manage to increase at a double-digit pace, according to new IHS iSuppli research.
Global power management semiconductor revenue will climb to $36.2 billion in 2011, up 13.9 percent from 2010.
Growth will occur during every quarter throughout 2011, as presented in the figure.
Source: IHS iSuppli, USA.
“The solid rise in 2011 follows a banner year in 2010, when power management semiconductor revenue soared to $31.8 billion,” said Marijana Vukicevic, principal analyst for power management at IHS. That figure, Vukicevic noted, was up from $22.5 billion in 2009.
Growth will decelerate in 2011 because this year follows a period of extraordinary growth in 2010. “Sales in 2011 simply will not be able to keep pace with the rapid expansion of 2010, when revenue rebounded dramatically from the recession year of 2009,” Vukicevic added.
Among the factors causing the continuing expansion of global revenue in 2011 is the move toward more efficient battery-powered devices. With consumers everywhere looking for longer battery life in their mobile devices—from cell phones to tablets, to notebooks, to portable navigation devices—new design trends will likely emerge in power management integrated circuits (ICs), boosting revenue among suppliers.
Another factor driving expansion will be the growth in alternate energy markets, including solar, wind, the electrification of vehicles and the smart grid. IHS iSuppli research shows alternative energy being transformed from an emerging market in power management to a more mainstream segment in 2011, thus generating revenue growth for suppliers.
Also anticipated in 2011 is a move toward greater integration in power ICs; suppliers with the technology to further integrate their chips will reap the greatest benefits in terms of revenue.
For their part, some of the old legacy power suppliers are expected to radically change strategies to accommodate shifting market dynamics, IHS believes. Having grown less competitive and now being aggressively attacked by many smaller suppliers that deliver respectable designs at lower prices, legacy suppliers are likely to reorganize in order to counter the threats.
Source: IHS iSuppli, USA.
Global power management semiconductor revenue will climb to $36.2 billion in 2011, up 13.9 percent from 2010.
Growth will occur during every quarter throughout 2011, as presented in the figure.
Source: IHS iSuppli, USA.“The solid rise in 2011 follows a banner year in 2010, when power management semiconductor revenue soared to $31.8 billion,” said Marijana Vukicevic, principal analyst for power management at IHS. That figure, Vukicevic noted, was up from $22.5 billion in 2009.
Growth will decelerate in 2011 because this year follows a period of extraordinary growth in 2010. “Sales in 2011 simply will not be able to keep pace with the rapid expansion of 2010, when revenue rebounded dramatically from the recession year of 2009,” Vukicevic added.
Among the factors causing the continuing expansion of global revenue in 2011 is the move toward more efficient battery-powered devices. With consumers everywhere looking for longer battery life in their mobile devices—from cell phones to tablets, to notebooks, to portable navigation devices—new design trends will likely emerge in power management integrated circuits (ICs), boosting revenue among suppliers.
Another factor driving expansion will be the growth in alternate energy markets, including solar, wind, the electrification of vehicles and the smart grid. IHS iSuppli research shows alternative energy being transformed from an emerging market in power management to a more mainstream segment in 2011, thus generating revenue growth for suppliers.
Also anticipated in 2011 is a move toward greater integration in power ICs; suppliers with the technology to further integrate their chips will reap the greatest benefits in terms of revenue.
For their part, some of the old legacy power suppliers are expected to radically change strategies to accommodate shifting market dynamics, IHS believes. Having grown less competitive and now being aggressively attacked by many smaller suppliers that deliver respectable designs at lower prices, legacy suppliers are likely to reorganize in order to counter the threats.
Source: IHS iSuppli, USA.
LED Korea 2011: A success with new technology, latest products, and industry collaboration featured
SEOUL, KOREA: Amidst the backdrop of a growing global LED industry estimated at $100 billion and a local market projected to grow to 15 trillion Won by 2015, LED Korea 2011, held last week in Seoul, opened to increased attention and attendance.
The event, organized by SEMI Korea and co-located with SEMICON Korea for the fifth time, is the largest exhibition in Korea focused on LED manufacturing and serving the solid state lighting (SSL) supply chain.
LED Korea 2011 featured 60 exhibiting companies, displaying the newest technology and latest products that will lead the next generation of the LED market. International companies, including Aixtron, Veeco, and Kulicke & Soffa, took part in the event. Major local firms in the exhibitor list included TSE, Mirtec, Top Engineering, and QMC. Combined attendance with SEMICON Korea is estimated to have exceeded 25,000.
The LED Workshop on January 27 presented the current status of the lighting and display market— covering materials to end-user applications including consumer electronics, lighting, medical equipment, automotive and other commercial products.
The region’s leaders in LED shared strategies for the industry’s further development while also covering hot topics such as LED application products standardization, technical issues and development of LED lighting, and LED-IT convergence technology in Korea.
Next year’s LED Korea will feature a special session on environmental and safety related matters with the help of Taiwan’s LED Industry Association. LED Korea 2011 will offer an exclusive opportunity for exhibitors and participants to demonstrate their new products and technologies, expand their business abroad through supply chains, and ultimately gain competitive edge and stronger foothold both in and out of the country.
The event, organized by SEMI Korea and co-located with SEMICON Korea for the fifth time, is the largest exhibition in Korea focused on LED manufacturing and serving the solid state lighting (SSL) supply chain.
LED Korea 2011 featured 60 exhibiting companies, displaying the newest technology and latest products that will lead the next generation of the LED market. International companies, including Aixtron, Veeco, and Kulicke & Soffa, took part in the event. Major local firms in the exhibitor list included TSE, Mirtec, Top Engineering, and QMC. Combined attendance with SEMICON Korea is estimated to have exceeded 25,000.
The LED Workshop on January 27 presented the current status of the lighting and display market— covering materials to end-user applications including consumer electronics, lighting, medical equipment, automotive and other commercial products.
The region’s leaders in LED shared strategies for the industry’s further development while also covering hot topics such as LED application products standardization, technical issues and development of LED lighting, and LED-IT convergence technology in Korea.
Next year’s LED Korea will feature a special session on environmental and safety related matters with the help of Taiwan’s LED Industry Association. LED Korea 2011 will offer an exclusive opportunity for exhibitors and participants to demonstrate their new products and technologies, expand their business abroad through supply chains, and ultimately gain competitive edge and stronger foothold both in and out of the country.
Monday, January 31, 2011
Avnet Express launches EMEA-wide e-commerce site
PHOENIX, USA: Avnet Express, part of the Avnet Electronics Marketing operating group of Avnet Inc., is once again extending its online reach with the launch of a comprehensive e-Commerce website that now also encompasses Europe, the Middle East and Africa (EMEA).
The site, www.avnetexpress.eu, offers design engineers and purchasing executives at OEM and EMS firms access to inventory held in Europe. What’s more, they can also enjoy online access to Avnet Electronics Marketing’s entire global component menu, which now includes more than 4.5 million different parts.
“Expanding our web offerings to EMEA considerably reduces logistics costs and accelerates cycle times for our customers,” said Beth Ely, senior vice president of Avnet Express. “Avnet Express Europe broadens the scope of our web offerings, giving our customers the flexibility to view and order products from the location closest to them, while also giving them visibility and purchasing capability of our North America and Asian inventory as well.”
Patrick Zammit, president of Avnet Electronics Marketing EMEA, comments: “We are making our entire product portfolio now available for online purchasing and giving customers the opportunity to buy all products through one channel. Avnet Express Europe complements our strategy of technology and design focus that we execute through our speedboat model, by offering a channel for small volume transactions.”
Avnet Electronics Marketing EMEA goes to market with the following speedboats: EBV Elektronik, Silica, Avnet Memec and Avnet Abacus. These combined speedboats carry nearly 300 different franchised lines – each one available for purchase on Avnet Express Europe.
Available in nine languages and offering the flexibility of purchasing with both the Euro and the British Pound, Avnet Express Europe makes purchasing online simple and fast. Combining the scale and scope of one of the largest global distributors, the site has been designed with a host of powerful functions such as parametric part search, Bill of Material (BOM) optimization and parts cross-referencing.
The site, www.avnetexpress.eu, offers design engineers and purchasing executives at OEM and EMS firms access to inventory held in Europe. What’s more, they can also enjoy online access to Avnet Electronics Marketing’s entire global component menu, which now includes more than 4.5 million different parts.
“Expanding our web offerings to EMEA considerably reduces logistics costs and accelerates cycle times for our customers,” said Beth Ely, senior vice president of Avnet Express. “Avnet Express Europe broadens the scope of our web offerings, giving our customers the flexibility to view and order products from the location closest to them, while also giving them visibility and purchasing capability of our North America and Asian inventory as well.”
Patrick Zammit, president of Avnet Electronics Marketing EMEA, comments: “We are making our entire product portfolio now available for online purchasing and giving customers the opportunity to buy all products through one channel. Avnet Express Europe complements our strategy of technology and design focus that we execute through our speedboat model, by offering a channel for small volume transactions.”
Avnet Electronics Marketing EMEA goes to market with the following speedboats: EBV Elektronik, Silica, Avnet Memec and Avnet Abacus. These combined speedboats carry nearly 300 different franchised lines – each one available for purchase on Avnet Express Europe.
Available in nine languages and offering the flexibility of purchasing with both the Euro and the British Pound, Avnet Express Europe makes purchasing online simple and fast. Combining the scale and scope of one of the largest global distributors, the site has been designed with a host of powerful functions such as parametric part search, Bill of Material (BOM) optimization and parts cross-referencing.
Subscribe to:
Posts (Atom)
