Wednesday, February 1, 2012

Palomar develops wire-bond-free direct attach for LEDs

CARLSBAD, USA: Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced a precision eutectic process development for direct attach light emitting diodes (LEDs).

"Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs," explains Donald Beck, GM of Palomar Technologies Assembly Services.

"Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies' Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management."

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