THIEF RIVER FALLS, USA & OSLO, NORWAY: Electronic components distributor Digi-Key Corp. has announced today a worldwide agreement with Energy Micro for distribution of its ultra low power EFM®32 Gecko microcontroller products.
Energy Micro’s energy friendly product range, comprising 32-bit ARM Cortex-M3 based microcontrollers, energyAware tools and companion development kits, are now available from Digi-Key’s global websites and will appear in future print and on-line catalogs.
Dave Doherty, Digi-Key’s VP of Semiconductor Products said: “We’ve already seen, through our North American agreement with Energy Micro, that there is strong market interest in their low power microcontroller solution. Design engineers around the world are under pressure to extend battery life, and we’re delighted to support them with this global distribution agreement.”
Geir Førre, Energy Micro’s President and CEO said: “Digi-Key has already demonstrated to us its ability to reach design engineers with some very real energy management problems to solve. We now look forward to working together with Digi-Key on a worldwide basis to promote the ideals of true energy-friendly design.”
Suiting a range of energy sensitive applications including metering, alarm/security, portable medical and lifestyle products, the EFM32 microcontroller architecture has been designed to dramatically reduce total system energy consumption. The unique advanced energy monitoring (AEM) facility of the EFM32 development kits provides designers with a graphical energy debugging tool enabling early identification and removal of adverse energy drains.
Saturday, October 30, 2010
Advanced charging technologies to top $34 billion in 2015
NEW YORK, USA: Markets for advanced charging technologies (including solar-powered handsets, solar chargers, wireless power units, fuel-cell battery charging products and public charging kiosks), worth about $1.5 billion in 2010, are forecast by ABI Research to grow at a robust CAGR of more than 86 percent to exceed $34 billion in 2015.
As people carry and use increasing numbers of portable electronic devices, they have a growing need to charge their batteries on the go. Today’s road warriors can tell you it’s not always feasible to plug a cellphone handset into a wall outlet or car adapter for a quick charge.
That is why a number of vendors are developing and commercializing advanced charging technologies that can top up batteries wirelessly or using solar or wind power, or which provide for a fast download of electricity while waiting for one’s flight.
Research director Larry Fisher of NextGen, ABI Research’s emerging technologies research incubator, says: “With developers about to release advanced charging products in late 2010 and the first half of 2011, the advanced charging revolution is about to take off.
"In addition, the Wireless Power Consortium’s release of the Qi standard for interoperable wireless charging in 2010 has set the stage for portable electronics manufacturers and infrastructure producers such as Panasonic, Philips Electronics, Samsung, LG Electronics and Nokia to incorporate the technology into their products."
Some of these technologies are particularly applicable to users in developing countries. Parts of the Middle East and Africa, for example, do not have access to stable power, and cellphone users must travel many miles and pay to charge up.
Solar chargers and handsets could make a real difference to the lives of people in such circumstances, even though they’re currently being marketed primarily to the eco-conscious in the developed world.
As people carry and use increasing numbers of portable electronic devices, they have a growing need to charge their batteries on the go. Today’s road warriors can tell you it’s not always feasible to plug a cellphone handset into a wall outlet or car adapter for a quick charge.
That is why a number of vendors are developing and commercializing advanced charging technologies that can top up batteries wirelessly or using solar or wind power, or which provide for a fast download of electricity while waiting for one’s flight.
Research director Larry Fisher of NextGen, ABI Research’s emerging technologies research incubator, says: “With developers about to release advanced charging products in late 2010 and the first half of 2011, the advanced charging revolution is about to take off.
"In addition, the Wireless Power Consortium’s release of the Qi standard for interoperable wireless charging in 2010 has set the stage for portable electronics manufacturers and infrastructure producers such as Panasonic, Philips Electronics, Samsung, LG Electronics and Nokia to incorporate the technology into their products."
Some of these technologies are particularly applicable to users in developing countries. Parts of the Middle East and Africa, for example, do not have access to stable power, and cellphone users must travel many miles and pay to charge up.
Solar chargers and handsets could make a real difference to the lives of people in such circumstances, even though they’re currently being marketed primarily to the eco-conscious in the developed world.
Thursday, October 28, 2010
Packaged LED market experiencing tremendous growth with an expected CAGR of 28.2 percent between 2009 and 2015
LYON & PARIS, FRANCE: Yole DĂ©veloppement and EPIC will announce the publication on 15 November 2010 of their new market & technological studies dedicated to LED market and manufacturing technologies:
* Status of the LED industry “SLI 2010”, 2008-2020 analysis.
* LED Manufacturing Technologies “LED ManTech 2010”
This comprehensive survey describes the main market metrics and manufacturing technologies implementing broad adoption of Solid State Lighting.
The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2 percent between 2009 and 2015. In our base scenario, revenues will reach $8.9 billion in 2010 and grow to $25.7 billion in 2015 and close to $30 billion in 2020.
In terms of volume, LED die surface will increase from 6.3b mm2 to 51b mm2 in 2015, a 41.6 percent CAGR. This will prompt substrate volumes to growth from 12.7M TIE (Two Inch Equivalent) in 2009 to 84.4M TIE in 2015, a 37.1 percent CAGR (smaller than the die surface increase due to significant manufacturing yield improvements). The equipment market will experiment a dramatic growth cycle with demand driving the installation of close to 1400 reactors in the 2010-2012 period.
“Anticipation of future demand and generous subsidies in China will trigger the installation of another 700-1000 reactors in the same period, leading to a short period of oversupply starting in late 2011. However, this oversupply will mostly affect the low end of the market,” explains Tom Pearsall, EPIC.
Growth in general lighting applications will be enabled by significant technology and manufacturing efficiency improvements that will help to lower the cost per lumen of packaged LED to be reduced 10 fold between 2010 and 2020: Economies of scale, LED efficiency improvement, including at high power (droop effect), Improved phosphors, Improved packaging technologies, Significant improvements in LED epitaxy cost of ownership through yield and throughput. However, additional breathoughs are needed; Haitz’s Law is not enough.
* Status of the LED industry “SLI 2010”, 2008-2020 analysis.
* LED Manufacturing Technologies “LED ManTech 2010”
This comprehensive survey describes the main market metrics and manufacturing technologies implementing broad adoption of Solid State Lighting.
The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2 percent between 2009 and 2015. In our base scenario, revenues will reach $8.9 billion in 2010 and grow to $25.7 billion in 2015 and close to $30 billion in 2020.
In terms of volume, LED die surface will increase from 6.3b mm2 to 51b mm2 in 2015, a 41.6 percent CAGR. This will prompt substrate volumes to growth from 12.7M TIE (Two Inch Equivalent) in 2009 to 84.4M TIE in 2015, a 37.1 percent CAGR (smaller than the die surface increase due to significant manufacturing yield improvements). The equipment market will experiment a dramatic growth cycle with demand driving the installation of close to 1400 reactors in the 2010-2012 period.
“Anticipation of future demand and generous subsidies in China will trigger the installation of another 700-1000 reactors in the same period, leading to a short period of oversupply starting in late 2011. However, this oversupply will mostly affect the low end of the market,” explains Tom Pearsall, EPIC.
Growth in general lighting applications will be enabled by significant technology and manufacturing efficiency improvements that will help to lower the cost per lumen of packaged LED to be reduced 10 fold between 2010 and 2020: Economies of scale, LED efficiency improvement, including at high power (droop effect), Improved phosphors, Improved packaging technologies, Significant improvements in LED epitaxy cost of ownership through yield and throughput. However, additional breathoughs are needed; Haitz’s Law is not enough.
White paper on optimizing LED-based recessed downlight apps
MONTREAL, CANADA: A new white paper providing guidelines for developing high-performance solid state downlights is now available from Future Lighting Solutions.
The paper, titled “Enabling LED-Based Recessed Downlight Applications,” describes the considerations and components for implementing LED-based downlight fixtures that meet market needs as well as ENERGY STAR requirements, including light output, efficacy and longevity benchmarks.
Topics covered in the paper include component selection, how to determine the corrected drive parameters, and the role of optical, thermal and power solutions in producing reliable solid state downlighting.
Examples provided utilize Philips Lumileds LUXEON Rebel LEDs, NXP dimmable IC drivers, and Future Lighting Solutions simpleLED light engines that accelerate time to market by providing LEDs, secondary optics and onboard connectors already mounted on circuit boards.
The simpleLED off-the-shelf assemblies also include UL recognition that eliminates the need for a full in-system LED component investigation to obtain UL Listed status for new luminaires.
The paper provides a road map for implementing a Future-developed 4” and 6” reference design for recessed downlight systems.
The attention to downlight applications reflects the fact that downlighting accounts for up to one-fourth of the lighting energy used. LED-based downlights reduce energy consumption by 45% to 80% over conventional luminaires. They also significantly reduce bulb replacements costs because they have longer hours of operation compared to traditional light sources, provide a green RoHS-compliant, and enable far more flexible designs because of their small form factor.
The paper, titled “Enabling LED-Based Recessed Downlight Applications,” describes the considerations and components for implementing LED-based downlight fixtures that meet market needs as well as ENERGY STAR requirements, including light output, efficacy and longevity benchmarks.
Topics covered in the paper include component selection, how to determine the corrected drive parameters, and the role of optical, thermal and power solutions in producing reliable solid state downlighting.
Examples provided utilize Philips Lumileds LUXEON Rebel LEDs, NXP dimmable IC drivers, and Future Lighting Solutions simpleLED light engines that accelerate time to market by providing LEDs, secondary optics and onboard connectors already mounted on circuit boards.
The simpleLED off-the-shelf assemblies also include UL recognition that eliminates the need for a full in-system LED component investigation to obtain UL Listed status for new luminaires.
The paper provides a road map for implementing a Future-developed 4” and 6” reference design for recessed downlight systems.
The attention to downlight applications reflects the fact that downlighting accounts for up to one-fourth of the lighting energy used. LED-based downlights reduce energy consumption by 45% to 80% over conventional luminaires. They also significantly reduce bulb replacements costs because they have longer hours of operation compared to traditional light sources, provide a green RoHS-compliant, and enable far more flexible designs because of their small form factor.
Wednesday, October 27, 2010
Avnet Memec marks 5th anniversary with nearly 13,000 design wins
PHOENIX, USA: Avnet Memec Americas, a division of Avnet Inc., celebrated its fifth anniversary by logging an impressive 12,757 design registrations since being formed in 2005.
Avnet Memec is a name synonymous with design, built on the Memec legacy. The division was created with the Avnet acquisition of Memec in 2005. Today, with more than 40 dedicated field application engineers (FAEs), Avnet Memec has the technical expertise to rapidly move projects from design to production, helping customers overcome technology challenges in today’s fast-paced, high-tech marketplace.
Phil Sansone, senior vice president of Avnet Memec Americas, said that the company’s continued focus of offering a select number of product lines, combined with the powerful technical knowledge of design-driven experts, has lead to an impressive 30 percent growth in design-win sales over the past five years.
“Our success has largely been attributed to our consistent dedication to true innovation and design,” said Sansone. “We look forward to continued success in the next five years and beyond.”
Avnet Memec is a name synonymous with design, built on the Memec legacy. The division was created with the Avnet acquisition of Memec in 2005. Today, with more than 40 dedicated field application engineers (FAEs), Avnet Memec has the technical expertise to rapidly move projects from design to production, helping customers overcome technology challenges in today’s fast-paced, high-tech marketplace.
Phil Sansone, senior vice president of Avnet Memec Americas, said that the company’s continued focus of offering a select number of product lines, combined with the powerful technical knowledge of design-driven experts, has lead to an impressive 30 percent growth in design-win sales over the past five years.
“Our success has largely been attributed to our consistent dedication to true innovation and design,” said Sansone. “We look forward to continued success in the next five years and beyond.”
RFMD unveils new family of integrated configurable components
GREENSBORO, USA: RF Micro Devices Inc. has announced a new family of integrated configurable components for multiple markets.
The highly integrated components, comprised of the RFFC207x and RFFC507x product families, perform multiple common RF functions in a reduced footprint while delivering the flexibility necessary to develop radio systems that operate over a wide dynamic range and across a broad range of frequencies and channel bandwidths.
The RFFC207x and RFFC507x product families integrate RFMD's world-class fractional-N PLL/VCO combination with RF mixers to provide radio designers an elegant radio partitioning option with very high performance, superior integration and no compromise in flexibility.
The RFFC207x and RFFC507x represent the second generation of RFMD's innovative RF205x family of integrated configurable components, which enables radio designers across industries to shrink circuit board area, reduce risk and shorten product development time – all of which lower the total cost of radio implementation.
The RFFC207x and RFFC507x expand upon the capabilities of the RF205x family by enhancing performance and extending frequency range to serve even more industries and applications. General purpose in nature, RFMD's newest family of integrated configurable components is applicable to fixed and mobile infrastructure, radio repeaters, super-heterodyne radios, diversity receivers, frequency band shifters, CATV, software-defined radios, point-to-point radios, satcom, VHF/UHF radios, military, industrial and other applications.
The product family's wide bandwidth enables use in multiple systems and applications. The RFFC207x series has a local oscillator (LO) range from 85MHz to 2700MHz, with a 30MHz to 2700MHz mixer on-chip. The RFFC507x series has an LO range of 85MHz to 4500MHz with mixer range extending up to 6000MHz.
With industry-leading integrated phase noise of 0.18deg rms at 1GHz, the RFFC207x and RFFC507x improve system performance for radio designers. Additionally, the integrated fractional-N synthesizer features an advanced sigma-delta modulator to achieve ultra-fine step sizes and lower spurious products, while integrated mixers enable a smaller implementation (5mm x 5mm) than competing solutions.
Finally, by integrating the entire LO path on-chip, the RFFC207x and RFFC507x eliminate the need for designers to work with the highly sensitive interface from VCO to mixer, saving valuable design time and improving end product manufacturing yields.
The RFFC207x and RFFC507x series also deliver industry-low power consumption. The components' bandwidth and phase noise specifications are achieved using only 125mA from a 3-volt supply (single-mixer, high linearity setting), and the current can be reduced to 100mA by reducing the programmable mixer linearity setting. Importantly, the 4500MHz components use only 10mA more than the 2700MHz components.
All of the components can be programmed through a simple 3-wire serial interface. They also feature a unique programming mode that allows up to four devices to be controlled from a common serial bus. By eliminating the need for separate chip-select control lines between devices and host controller, this lowers the cost of implementation and the risk of interference between RF and digital lines on the target PCB.
Finally, two frequencies can be loaded into the device when it is initialized, allowing convenient switching between frequencies, and lock detect and general purpose pins are available, enabling control though the serial bus.
RFMD is showcasing its industry-leading integrated configurable components at the Electronica Tradeshow, in Munich, Germany, November 9-12 at booth #A4.135.
The single-mixer, 2700MHz RFFC2072 starts at $7.00 per 10,000 units, and the single-mixer, 5000MHz RFFC5072 starts at $9.00 per 10,000 units. Samples and evaluation boards are available now, and production quantities are expected to be available by the end of the December 2010 quarter.
The highly integrated components, comprised of the RFFC207x and RFFC507x product families, perform multiple common RF functions in a reduced footprint while delivering the flexibility necessary to develop radio systems that operate over a wide dynamic range and across a broad range of frequencies and channel bandwidths.
The RFFC207x and RFFC507x product families integrate RFMD's world-class fractional-N PLL/VCO combination with RF mixers to provide radio designers an elegant radio partitioning option with very high performance, superior integration and no compromise in flexibility.
The RFFC207x and RFFC507x represent the second generation of RFMD's innovative RF205x family of integrated configurable components, which enables radio designers across industries to shrink circuit board area, reduce risk and shorten product development time – all of which lower the total cost of radio implementation.
The RFFC207x and RFFC507x expand upon the capabilities of the RF205x family by enhancing performance and extending frequency range to serve even more industries and applications. General purpose in nature, RFMD's newest family of integrated configurable components is applicable to fixed and mobile infrastructure, radio repeaters, super-heterodyne radios, diversity receivers, frequency band shifters, CATV, software-defined radios, point-to-point radios, satcom, VHF/UHF radios, military, industrial and other applications.
The product family's wide bandwidth enables use in multiple systems and applications. The RFFC207x series has a local oscillator (LO) range from 85MHz to 2700MHz, with a 30MHz to 2700MHz mixer on-chip. The RFFC507x series has an LO range of 85MHz to 4500MHz with mixer range extending up to 6000MHz.
With industry-leading integrated phase noise of 0.18deg rms at 1GHz, the RFFC207x and RFFC507x improve system performance for radio designers. Additionally, the integrated fractional-N synthesizer features an advanced sigma-delta modulator to achieve ultra-fine step sizes and lower spurious products, while integrated mixers enable a smaller implementation (5mm x 5mm) than competing solutions.
Finally, by integrating the entire LO path on-chip, the RFFC207x and RFFC507x eliminate the need for designers to work with the highly sensitive interface from VCO to mixer, saving valuable design time and improving end product manufacturing yields.
The RFFC207x and RFFC507x series also deliver industry-low power consumption. The components' bandwidth and phase noise specifications are achieved using only 125mA from a 3-volt supply (single-mixer, high linearity setting), and the current can be reduced to 100mA by reducing the programmable mixer linearity setting. Importantly, the 4500MHz components use only 10mA more than the 2700MHz components.
All of the components can be programmed through a simple 3-wire serial interface. They also feature a unique programming mode that allows up to four devices to be controlled from a common serial bus. By eliminating the need for separate chip-select control lines between devices and host controller, this lowers the cost of implementation and the risk of interference between RF and digital lines on the target PCB.
Finally, two frequencies can be loaded into the device when it is initialized, allowing convenient switching between frequencies, and lock detect and general purpose pins are available, enabling control though the serial bus.
RFMD is showcasing its industry-leading integrated configurable components at the Electronica Tradeshow, in Munich, Germany, November 9-12 at booth #A4.135.
The single-mixer, 2700MHz RFFC2072 starts at $7.00 per 10,000 units, and the single-mixer, 5000MHz RFFC5072 starts at $9.00 per 10,000 units. Samples and evaluation boards are available now, and production quantities are expected to be available by the end of the December 2010 quarter.
FIST SA publishes new patent landscape on lithium metal phosphate batteries
PARIS, FRANCE: In the current roadmap on emerging battery technologies, LiMPO4 cathodes raises high hope concerning the possibility of efficient energy storage at high charge and discharge rate, thus raising the technical potential of hybrid and plug‐in hybrid electric vehicles as well as wind and solar energy storage.
The patent war has already started in this sector: more than 1100 patents have been filed and a growth rate of 50 percent of new published patent in 2009! This report identifies all protected solutions and provides a comprehensive panorama of the intellectual property landscape in LiMPO4 batteries sector.
Report highlights
* Strong attractiveness of the sector - Very high research and patenting activity in the last years with a strong rise of new entrants as of 2005 (new applicants represent half the number of total applicants in 2008).
* Strategic protection of battery manufacturers but also of institutional laboratories and of end-users companies on their specific applications.
* Map of patent protection and dependency – While a “patent war” has been engaged for a long time concerning the Dr. Goodenough key patent, other actors are building up their portfolio notably in China where this key patent is not extended.
* Segmentation by type of material – Strategic positioning of the actors on LiFePO4 cathodes (60 percent), but also other metal or combinations of metals (Mn, Co, V, Ni, etc.) (20 percent).
* Applicant’s strategy - Analysis of the patent strategy of current major players which are not necessarily the major patent holders (Sony, Toyota, A123 SYSTEMS, Valence). The question can be raised for a few of them of their possibility to evolve rapidly enough to maintain their market position towards better protected competitors.
The patent war has already started in this sector: more than 1100 patents have been filed and a growth rate of 50 percent of new published patent in 2009! This report identifies all protected solutions and provides a comprehensive panorama of the intellectual property landscape in LiMPO4 batteries sector.
Report highlights
* Strong attractiveness of the sector - Very high research and patenting activity in the last years with a strong rise of new entrants as of 2005 (new applicants represent half the number of total applicants in 2008).
* Strategic protection of battery manufacturers but also of institutional laboratories and of end-users companies on their specific applications.
* Map of patent protection and dependency – While a “patent war” has been engaged for a long time concerning the Dr. Goodenough key patent, other actors are building up their portfolio notably in China where this key patent is not extended.
* Segmentation by type of material – Strategic positioning of the actors on LiFePO4 cathodes (60 percent), but also other metal or combinations of metals (Mn, Co, V, Ni, etc.) (20 percent).
* Applicant’s strategy - Analysis of the patent strategy of current major players which are not necessarily the major patent holders (Sony, Toyota, A123 SYSTEMS, Valence). The question can be raised for a few of them of their possibility to evolve rapidly enough to maintain their market position towards better protected competitors.
Epistar places multi-tool order for Veeco MOCVD systems
PLAINVIEW, USA: Veeco Instruments Inc. announced that Epistar Corp., headquartered in Taiwan, has placed a multi-tool order for Veeco’s TurboDisc K465i gallium nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems for high volume light emitting diode (LED) production.
Dr. M.J. Jou, president of Epistar, commented, “Since we qualified Veeco’s tools for production back in May, we have been extremely satisfied with their performance. Given the systems’ ease-of-use and low cost of ownership, we now plan to include Veeco as an important supplier to Epistar.”
Bill Miller, Ph.D., executive VP, Compound Semiconductor and head of Veeco’s MOCVD Operations commented, “We are excited to continue to establish this strong relationship with Epistar in 2010, and pleased to support their current and future MOCVD requirements.”
With superior wavelength uniformity and excellent run-to-run repeatability, the production-proven K465i extends Veeco’s lead in capital efficiency – the number of good wafers per day for each capital dollar – for high volume LED manufacturers. The K465i provides ease-of-tuning for fast process optimization on wafer sizes up to 8 inches and fast tool recovery time after maintenance.
Dr. M.J. Jou, president of Epistar, commented, “Since we qualified Veeco’s tools for production back in May, we have been extremely satisfied with their performance. Given the systems’ ease-of-use and low cost of ownership, we now plan to include Veeco as an important supplier to Epistar.”
Bill Miller, Ph.D., executive VP, Compound Semiconductor and head of Veeco’s MOCVD Operations commented, “We are excited to continue to establish this strong relationship with Epistar in 2010, and pleased to support their current and future MOCVD requirements.”
With superior wavelength uniformity and excellent run-to-run repeatability, the production-proven K465i extends Veeco’s lead in capital efficiency – the number of good wafers per day for each capital dollar – for high volume LED manufacturers. The K465i provides ease-of-tuning for fast process optimization on wafer sizes up to 8 inches and fast tool recovery time after maintenance.
Tuesday, October 26, 2010
RS Components to demo comprehensive range of online design resources
electronica 2010, OXFORD, ENGLAND: RS Components will be showcasing its comprehensive range of online design resources for the global electronics design engineering community at Electronica. RS will be in Hall A4, on stand 117, and will be providing visitors with unique access to a range of technical experts and tools during the week.
Launching on DesignSpark this week, visitors to the RS stand at Electronica will have the opportunity to post questions to experts, experience the market-leading 3D CAD model download functionality available from RS, and get exclusive access to free manufacturer software.
Users of DesignSpark PCB, the new free-of-charge PCB design package from RS will be able to attend surgery sessions each day, and book one-to-one seminars with the team of technical experts behind DesignSpark PCB.
Supported by Fresh Networks, RS is giving DesignSpark members the ability to reserve their individual DesignSpark PCB surgery session, and learn more about how RS will link with manufacturers and experts.
Glenn Jarrett, head of Electronics Marketing, RS Components, said, “Engineers have told us how much they value our range of online design resources, and are already debating use and functionality on forums in DesignSpark and elsewhere.”
Launching on DesignSpark this week, visitors to the RS stand at Electronica will have the opportunity to post questions to experts, experience the market-leading 3D CAD model download functionality available from RS, and get exclusive access to free manufacturer software.
Users of DesignSpark PCB, the new free-of-charge PCB design package from RS will be able to attend surgery sessions each day, and book one-to-one seminars with the team of technical experts behind DesignSpark PCB.
Supported by Fresh Networks, RS is giving DesignSpark members the ability to reserve their individual DesignSpark PCB surgery session, and learn more about how RS will link with manufacturers and experts.
Glenn Jarrett, head of Electronics Marketing, RS Components, said, “Engineers have told us how much they value our range of online design resources, and are already debating use and functionality on forums in DesignSpark and elsewhere.”
Microchip's 16V op amps feature low quiescent current (135 microamperes)
CHANDLER, USA: Microchip Technology Inc. has announced the MCP6H01 and MCP6H02 (MCP6H01/2) general-purpose operational amplifiers (op amps) with a gain-bandwidth product of 1.2 MHz and supply voltage from 3.5V to 16V.
These devices also feature low quiescent current of 135 microamperes (typ.), offset voltage of 3.5 mV (max.), Common Mode Rejection Ratio (CMRR) of 100 dB (typ.), and Power-Supply Rejection Ratio (PSRR) of 102 dB (typ.).
The MCP6H01/2 is targeted for applications that operate on voltages up to 16V, such as those in the medical (e.g. portable instrumentation, heart- and blood-pressure monitors), automotive (e.g. proximity, temperature or flow sensors), and industrial (e.g. high-side current sensing in power supplies) markets.
These devices also offer high CMRR and PSRR for improved noise performance. Additionally, low current consumption combined with space-saving package offerings make the MCP6H01/2 ideal for portable applications.
“With their low power and wide operating voltage range, the MCP6H01/2 family is a significant addition to Microchip’s linear product portfolio,” said Bryan J. Liddiard, vice president of marketing with Microchip’s Analog and Interface Products Division. “The performance of the MCP6H01/2 family is expected to enable new markets and applications for Microchip.”
These devices also feature low quiescent current of 135 microamperes (typ.), offset voltage of 3.5 mV (max.), Common Mode Rejection Ratio (CMRR) of 100 dB (typ.), and Power-Supply Rejection Ratio (PSRR) of 102 dB (typ.).
The MCP6H01/2 is targeted for applications that operate on voltages up to 16V, such as those in the medical (e.g. portable instrumentation, heart- and blood-pressure monitors), automotive (e.g. proximity, temperature or flow sensors), and industrial (e.g. high-side current sensing in power supplies) markets.
These devices also offer high CMRR and PSRR for improved noise performance. Additionally, low current consumption combined with space-saving package offerings make the MCP6H01/2 ideal for portable applications.
“With their low power and wide operating voltage range, the MCP6H01/2 family is a significant addition to Microchip’s linear product portfolio,” said Bryan J. Liddiard, vice president of marketing with Microchip’s Analog and Interface Products Division. “The performance of the MCP6H01/2 family is expected to enable new markets and applications for Microchip.”
Monday, October 25, 2010
Premier Farnell launches new proposition under element14
I wonder how is this going to help Farnell! It has had element14 for so long now. At least, I don't see any newness here! Unless, there are plans to dilute the Farnell brand, which will be strange!
BANGALORE, INDIA: Premier Farnell plc has announced the launch of a new, market leading customer proposition in Asia offering a significantly expanded inventory of products relevant to electronic design engineers, next-day delivery in Asia Pacific and an enhanced range of services, under the name element14.
The unique fusion of commerce and community, signals a new era for component distribution in the region and is based on extensive customer research. element14 offers the best inventory for engineers in Asia, with access to an unrivalled breadth and depth of the latest technology products.
From today, the Group’s businesses located in Australia, China, India, Malaysia, Singapore and New Zealand will be known as element14 and will offer customers and suppliers a multi-channel, multi-currency, multi-language way to source their product needs, quickly and easily.
In addition to locally based sales and technical teams and state of the art service centres across the region, the newly enhanced eCommerce websites offer speed and ease of search to access the best product offering for engineers and buyers alike.
The transactional websites integrate seamlessly with the Group’s global online community portal (www.element14.com ) - the place where engineers the world over go to collaborate, connect and access the latest production information, tools and services, all backed up by online technical service from our engineering teams 24/5. This latest transformation follows the launch of element14 websites in Thailand, Taiwan and Korea in August 2010.
Named after the 14th element in the periodic table, Silicon – the fundamental building block of modern electronics – the launch of element 14 delivers a first in Asia’s electronic components distribution industry – blending community and commerce into one integrated business operation through the power of the Internet, able to satisfy customer demand again and again through superior inventory and logistics.
Harriet Green, CEO, Premier Farnell plc, said: “The world is changing, and new technology innovation is driving the pace of change - never faster than here in Asia where customers need fast, convenient, and reliable ways to transact their business.
"We’ve doubled our locally held inventory through significant investment, and strengthened our local teams to ensure we offer customers multiple channels to transact their business in local currency and language with 24 hour access to our customer service and technical teams.
"This unique fusion of commerce and community will ensure we continue to lead the way, offering the best support for engineers and purchasing professionals across Asia as we accelerate change and challenge the traditional ways of working, by building a new future as element14.”
Salman Syed, president, Asia Pacific, element14 agreed: "This is an exciting time for the electronics industry in Asia. Our business continues to grow with sales up over 47 percent year-on-year and our supplier partners, including many of the world’s leading manufacturers, are very supportive of the move to element14 and the enhanced service commitments and product availability we’ll now offer our customers as the pre-eminent high service distributor in the region.
"We believe that element14’s unique blend of commerce and community will ensure that at any time, and from anywhere, Asia Pacific’s electronic design engineers can connect with us through multiple channels to source the products and information they need. This is the right time to enhance our total service and support with the one-brand, one-voice and one-experience that is element14."
BANGALORE, INDIA: Premier Farnell plc has announced the launch of a new, market leading customer proposition in Asia offering a significantly expanded inventory of products relevant to electronic design engineers, next-day delivery in Asia Pacific and an enhanced range of services, under the name element14.
The unique fusion of commerce and community, signals a new era for component distribution in the region and is based on extensive customer research. element14 offers the best inventory for engineers in Asia, with access to an unrivalled breadth and depth of the latest technology products.
From today, the Group’s businesses located in Australia, China, India, Malaysia, Singapore and New Zealand will be known as element14 and will offer customers and suppliers a multi-channel, multi-currency, multi-language way to source their product needs, quickly and easily.
In addition to locally based sales and technical teams and state of the art service centres across the region, the newly enhanced eCommerce websites offer speed and ease of search to access the best product offering for engineers and buyers alike.
The transactional websites integrate seamlessly with the Group’s global online community portal (www.element14.com ) - the place where engineers the world over go to collaborate, connect and access the latest production information, tools and services, all backed up by online technical service from our engineering teams 24/5. This latest transformation follows the launch of element14 websites in Thailand, Taiwan and Korea in August 2010.
Named after the 14th element in the periodic table, Silicon – the fundamental building block of modern electronics – the launch of element 14 delivers a first in Asia’s electronic components distribution industry – blending community and commerce into one integrated business operation through the power of the Internet, able to satisfy customer demand again and again through superior inventory and logistics.
Harriet Green, CEO, Premier Farnell plc, said: “The world is changing, and new technology innovation is driving the pace of change - never faster than here in Asia where customers need fast, convenient, and reliable ways to transact their business.
"We’ve doubled our locally held inventory through significant investment, and strengthened our local teams to ensure we offer customers multiple channels to transact their business in local currency and language with 24 hour access to our customer service and technical teams.
"This unique fusion of commerce and community will ensure we continue to lead the way, offering the best support for engineers and purchasing professionals across Asia as we accelerate change and challenge the traditional ways of working, by building a new future as element14.”
Salman Syed, president, Asia Pacific, element14 agreed: "This is an exciting time for the electronics industry in Asia. Our business continues to grow with sales up over 47 percent year-on-year and our supplier partners, including many of the world’s leading manufacturers, are very supportive of the move to element14 and the enhanced service commitments and product availability we’ll now offer our customers as the pre-eminent high service distributor in the region.
"We believe that element14’s unique blend of commerce and community will ensure that at any time, and from anywhere, Asia Pacific’s electronic design engineers can connect with us through multiple channels to source the products and information they need. This is the right time to enhance our total service and support with the one-brand, one-voice and one-experience that is element14."
A little PDA will now save you money!
PAINESVILLE, USA: Meritec releases to production the new Printed Direct Attach (PDA). In addition to Meritec’s original “Direct Attach” 4X/12X line of InfiniBand cables the PDA is a more cost effective solution.
While the Direct Attach line provided superior performance when compared to all other industry standard offerings, the PDA line meets or exceeds the same rigorous Industry standards at a more than competitive price. The signal conductors in the cable are directly attached to the printed circuit board which then becomes the direct interface with the contacts in the board receptacle.
The new PDA 4X and 12X assemblies are compliant with all SFF-8470 specifications and will interface with all SFF-8470 and SFF-8473 board receptacles. They meet or exceed the InfiniBand and Ethernet Double Data Rate requirements.
A one meter 4X assembly is priced at $35 at 1,000 pieces. Consult factory for additional pricing and lead-times.
While the Direct Attach line provided superior performance when compared to all other industry standard offerings, the PDA line meets or exceeds the same rigorous Industry standards at a more than competitive price. The signal conductors in the cable are directly attached to the printed circuit board which then becomes the direct interface with the contacts in the board receptacle.
The new PDA 4X and 12X assemblies are compliant with all SFF-8470 specifications and will interface with all SFF-8470 and SFF-8473 board receptacles. They meet or exceed the InfiniBand and Ethernet Double Data Rate requirements.
A one meter 4X assembly is priced at $35 at 1,000 pieces. Consult factory for additional pricing and lead-times.
Friday, October 22, 2010
Dramatic demand decline pulls down LED price in Q310, down pressure likely to exist in Q4
TAIWAN: LEDinside has released its latest LED price trend report, showing that the LED price plummeted sharply in Q3 2010 due to the sudden decline in the LED application demand including inventory adjustment resulting from less-than-expected large-size panel demand and sluggish lighting application demand.
The LED price for large-size panel application fell around 11-16 percent, while the price for high power LED for lighting application slumped more than 17 percent. As for the mobile application, LED price was roughly flat with about 3-4 percent seasonal erosion thanks to the relatively stable demand.
Source: LEDinside, Taiwan.
In light of large and medium-size backlight applications in Q3 2010, under the combined influence of inventory adjustment and weakening LED demand due to worse-than-expected panel shipment, the price of mainstream 5630 LED for TV backlight application lowered about 11 percent, price at $0.17-$0.12. Meanwhile, the LED price for NB and LCD monitor backlight application decreased between 12-16 percent as well.
LEDinside points out that the price of LED products which include 0.4t and 0.6t for mobile backlight applications is expected to remain stable, down around 3-4 percent as a result of the stable shipment.
Regarding the high power LED for lighting applications, the LED price severely slid due to an enlarging supply and demand gap because new projects sluggish and the demand didn’t meet expectations plus new production capacity readiness. The price of mainstream 100-120lm dropped up to 20 percent in Q3.
LED price outlook for Q4 2010
LEDinside predicts that the mainstream product specification might have minor change as Q4 2010 enters the seasonal down cycle although there are new products in developing.
As demand on new type TV backlight is limited and new lighting demand doesn't turn strong, the LED price is estimated to decline near 10 percent under down pressure in Q4 2010.
The market price pressure is expected to stabilize between the end of Q4 2010 and the beginning of Q1 2011, because the demand for shipment of large-size backlight is expecting to picking up. Meanwhile, the demand for LED lighting is expected to rebound.
The LED price for large-size panel application fell around 11-16 percent, while the price for high power LED for lighting application slumped more than 17 percent. As for the mobile application, LED price was roughly flat with about 3-4 percent seasonal erosion thanks to the relatively stable demand.
Source: LEDinside, Taiwan.In light of large and medium-size backlight applications in Q3 2010, under the combined influence of inventory adjustment and weakening LED demand due to worse-than-expected panel shipment, the price of mainstream 5630 LED for TV backlight application lowered about 11 percent, price at $0.17-$0.12. Meanwhile, the LED price for NB and LCD monitor backlight application decreased between 12-16 percent as well.
LEDinside points out that the price of LED products which include 0.4t and 0.6t for mobile backlight applications is expected to remain stable, down around 3-4 percent as a result of the stable shipment.
Regarding the high power LED for lighting applications, the LED price severely slid due to an enlarging supply and demand gap because new projects sluggish and the demand didn’t meet expectations plus new production capacity readiness. The price of mainstream 100-120lm dropped up to 20 percent in Q3.
LED price outlook for Q4 2010
LEDinside predicts that the mainstream product specification might have minor change as Q4 2010 enters the seasonal down cycle although there are new products in developing.
As demand on new type TV backlight is limited and new lighting demand doesn't turn strong, the LED price is estimated to decline near 10 percent under down pressure in Q4 2010.
The market price pressure is expected to stabilize between the end of Q4 2010 and the beginning of Q1 2011, because the demand for shipment of large-size backlight is expecting to picking up. Meanwhile, the demand for LED lighting is expected to rebound.
RFMD expands broadband product portfolio for HFC networks
NEW ORLEANS, USA: RF Micro Devices Inc. announced the expansion of its broadband product portfolio targeting Hybrid Fiber Coax (HFC) transmission network hardware, cable head end, cable hub equipment, and Multi Dwelling Unit/Multiple Tenant Unit (MDU/MTU) equipment.
The new broadband products enhance cable operators' network performance and enable increased bandwidth to support rapidly growing digital-centric services, such as HDTV, 3D HDTV and "mid-split" DOCSIS networking.
The use of mid-split architectures can expand the amount of usable upstream or return path bandwidth by more than 160MHz. As an example, a mid-split capable HFC network can provide cable subscribers with Internet upload data rates that are five times faster than typical North American DOCSIS capable cable HFC networks.
This enables multiple service operators (MSOs) to scale the data services on their existing cable transmission infrastructure, while delivering an enhanced Internet user experience and expanded digital services (e.g. HDTV streaming, HDTV downloads at ten times real-time data rates) to cable subscribers.
RFMD's newest HFC RF components are being showcased at the SCTE Cable-Tec Expo® in New Orleans, October 20-22, and include a broad selection of amplifiers and wide bandwidth passive components. The amplifiers include linear amplifiers, low noise amplifiers and return path amplifiers, and the passive components include couplers, two-way splitters and transformers.
As RFMD extends its product and technology leadership in broadband components, leading cable network equipment OEMs are increasingly selecting the company's HFC RF components for their superior performance, reduced power consumption and enhanced user experience.
The new broadband products enhance cable operators' network performance and enable increased bandwidth to support rapidly growing digital-centric services, such as HDTV, 3D HDTV and "mid-split" DOCSIS networking.
The use of mid-split architectures can expand the amount of usable upstream or return path bandwidth by more than 160MHz. As an example, a mid-split capable HFC network can provide cable subscribers with Internet upload data rates that are five times faster than typical North American DOCSIS capable cable HFC networks.
This enables multiple service operators (MSOs) to scale the data services on their existing cable transmission infrastructure, while delivering an enhanced Internet user experience and expanded digital services (e.g. HDTV streaming, HDTV downloads at ten times real-time data rates) to cable subscribers.
RFMD's newest HFC RF components are being showcased at the SCTE Cable-Tec Expo® in New Orleans, October 20-22, and include a broad selection of amplifiers and wide bandwidth passive components. The amplifiers include linear amplifiers, low noise amplifiers and return path amplifiers, and the passive components include couplers, two-way splitters and transformers.
As RFMD extends its product and technology leadership in broadband components, leading cable network equipment OEMs are increasingly selecting the company's HFC RF components for their superior performance, reduced power consumption and enhanced user experience.
Molex ships 100 millionth antenna with laser direct structuring (LDS) technology
LISLE, USA: Molex Inc. has shipped its 100 millionth antenna with Laser Direct Structuring (LDS) technology. Molex, the global leader for LDS and two-shot antennas, originally developed LDS antennas in 2006 as a research project. Since the company began mass production in 2008, demand for LDS antennas has grown dramatically and now contributes to more than half of the Molex antenna shipments.
Using a 3D laser system, LDS technology allows the transfer of the antenna design from CAD data onto a molded antenna carrier or even directly onto the device structure.
“The full 3D radiator design freedom of the LDS technology gives our customers the ability to manage the increased RF content in mobile devices, especially with the launch of the first 4G devices. Space will be the key issue. We see a growing demand for LDS to replace the previously used flex antenna technology, particularly for Smartphone applications,’’ said Ellen McMillan, antenna business unit director, Molex.
Key advantages of the technology include greater flexibility for fast design changes and the possibility of creating antenna structures on a 3D surface. LDS technology also allows customers a higher level of product integration with fewer components and lower costs. Molex offers a variety of subassembly services ranging from mechanical assembly to SMT and provides a fully vertically integrated product.
“Our customers value Molex’s vertical manufacturing approach. The entire LDS antenna manufacturing process – from molding, lasering, plating and cosmetic painting to assembly and RF and audio testing – is done under one roof. This strength in 3D antenna manufacturing combined with the Molex RF technologies for small size multi-band antennas gives us a unique position in the market,” added McMillan.
Using a 3D laser system, LDS technology allows the transfer of the antenna design from CAD data onto a molded antenna carrier or even directly onto the device structure.
“The full 3D radiator design freedom of the LDS technology gives our customers the ability to manage the increased RF content in mobile devices, especially with the launch of the first 4G devices. Space will be the key issue. We see a growing demand for LDS to replace the previously used flex antenna technology, particularly for Smartphone applications,’’ said Ellen McMillan, antenna business unit director, Molex.
Key advantages of the technology include greater flexibility for fast design changes and the possibility of creating antenna structures on a 3D surface. LDS technology also allows customers a higher level of product integration with fewer components and lower costs. Molex offers a variety of subassembly services ranging from mechanical assembly to SMT and provides a fully vertically integrated product.
“Our customers value Molex’s vertical manufacturing approach. The entire LDS antenna manufacturing process – from molding, lasering, plating and cosmetic painting to assembly and RF and audio testing – is done under one roof. This strength in 3D antenna manufacturing combined with the Molex RF technologies for small size multi-band antennas gives us a unique position in the market,” added McMillan.
Luminus’ PhlatLight LEDs power new spot lights from Strong Entertainment Lighting
LDI 2010, BILLERICA, USA: Luminus Devices, developer and manufacturer of big-chip PhlatLight LEDs, announced that it is powering the new Strong Entertainment Lighting Solutions 650 and 900 spot lights, used to light the largest skyscrapers and towers in the world, antennas, amphitheaters and artwork displays.
The Solutions 650 and 900 lights have a total light output of 20,000 lumens and have a lifespan of 50,000 hours.
The Strong Solutions 650 and 900 lights are well suited for indoor and outdoor environments where high-brightness and performance is needed. The Solutions 650 utilizes a proprietary optics system giving the user a narrow 3 degree beam of light, with a reach of more than 1,500 feet. The Solutions 900 is a full color mixing fixture employing an array of PhlatLight LEDs and is four to five times brighter than anything on the market today.
“Our new Solutions products represent a unique application of LED technology that wouldn’t be possible without the Luminus CBT-90,” said Paul Rabinovitz, VP of lighting, Strong Entertainment Lighting. “Together, Luminus Devices and Strong are developing next-generation narrow beam LED-based light fixtures with very long throws previously achievable only by using the highest performance lamps.”
“CBT-90 white LEDs provide lighting fixture manufacturers such as Strong Lighting with ultra-bright, white light with superior optical coupling and beam control enabling more efficient next-generation lighting applications,” said Don McDaniel, director, global entertainment, Luminus Devices.
“Big-chip LEDs offer superior brightness over competitive products and can last the lifetime of the luminaire, eliminating the frequent lamp replacement of traditional spot lights.”
The Solutions 650 and 900 lights have a total light output of 20,000 lumens and have a lifespan of 50,000 hours.
The Strong Solutions 650 and 900 lights are well suited for indoor and outdoor environments where high-brightness and performance is needed. The Solutions 650 utilizes a proprietary optics system giving the user a narrow 3 degree beam of light, with a reach of more than 1,500 feet. The Solutions 900 is a full color mixing fixture employing an array of PhlatLight LEDs and is four to five times brighter than anything on the market today.
“Our new Solutions products represent a unique application of LED technology that wouldn’t be possible without the Luminus CBT-90,” said Paul Rabinovitz, VP of lighting, Strong Entertainment Lighting. “Together, Luminus Devices and Strong are developing next-generation narrow beam LED-based light fixtures with very long throws previously achievable only by using the highest performance lamps.”
“CBT-90 white LEDs provide lighting fixture manufacturers such as Strong Lighting with ultra-bright, white light with superior optical coupling and beam control enabling more efficient next-generation lighting applications,” said Don McDaniel, director, global entertainment, Luminus Devices.
“Big-chip LEDs offer superior brightness over competitive products and can last the lifetime of the luminaire, eliminating the frequent lamp replacement of traditional spot lights.”
Thursday, October 21, 2010
Digi-Key and Exar sign global distribution agreement
THIEF RIVER FALLS & FREMONT, USA: Electronic components distributor Digi-Key Corp. has entered into an agreement with Exar Corp. to distribute the company’s analog and mixed-signal ICs to Digi-Key customers around the globe.
Exar delivers highly differentiated silicon, software and subsystem solutions for industrial, datacom and storage applications. Exar’s product portfolio includes power management and interface components, communications products, storage optimization solutions, network security and applied service processors.
Exar products are now available for purchase on Digi-Key’s global websites and will be featured in future print and online catalogs.
“We are excited to be partnering with Digi-Key, a clear leader in on-line distribution with unparalleled worldwide market penetration,” said Bentley Long, vice president, Worldwide Sales, Exar.
“Digi-Key’s robust web capabilities, focused on solving an engineer’s design challenges, include localized websites, technology zones, and dynamic product training modules will accelerate the evaluation and adoption of Exar's products. We look forward to working with Digi-Key to establish and support new customers and markets.”
“We are very pleased to announce this distribution agreement with Exar with its strong product offerings in power, communication and interface devices,” said Dave Doherty, Digi-Key’s vice president of semiconductor product. “Digi-Key’s customers worldwide will benefit from their commitment to silicon, software and subsystem solutions.”
Exar delivers highly differentiated silicon, software and subsystem solutions for industrial, datacom and storage applications. Exar’s product portfolio includes power management and interface components, communications products, storage optimization solutions, network security and applied service processors.
Exar products are now available for purchase on Digi-Key’s global websites and will be featured in future print and online catalogs.
“We are excited to be partnering with Digi-Key, a clear leader in on-line distribution with unparalleled worldwide market penetration,” said Bentley Long, vice president, Worldwide Sales, Exar.
“Digi-Key’s robust web capabilities, focused on solving an engineer’s design challenges, include localized websites, technology zones, and dynamic product training modules will accelerate the evaluation and adoption of Exar's products. We look forward to working with Digi-Key to establish and support new customers and markets.”
“We are very pleased to announce this distribution agreement with Exar with its strong product offerings in power, communication and interface devices,” said Dave Doherty, Digi-Key’s vice president of semiconductor product. “Digi-Key’s customers worldwide will benefit from their commitment to silicon, software and subsystem solutions.”
Pulse introduces new products and solutions
electronica 2010, SAN DIEGO, USA: Pulse, a Technitrol company, a leader in electronic component and subassembly design and manufacturing, will be introducing components and application solutions for equipment manufacturers in the access network, automation, motor control, Smart Energy, and metering markets in Hall 6 stand 323 at electronica 2010, Munich, Germany, November 9-12.
Included will be wireless products for telemetric and machine-to-machine (M2M) applications and a broad array of antennas. Although Pulse is predominantly known as a magnetic components supplier to the wide and local area network and power markets, it has actively increased its presence in other areas over the past few years.
"Increased attention to environmental issues has led to a growth-market for Smart Metering, energy management systems, and metering applications, where the latest current sensors from Pulse can be used," explained Robert Frost, network marketing support for Pulse Europe.
"Based on the inherent advantages of a Rogowski coil, the Pulse product range has high-accuracy and exceptional linearity for electricity meters with unrivaled flexibility in size and shape. In addition to just collecting data, there are various solutions for transmitting it with our wide range of antenna and networking products."
The Wireless Devices Group has introduced a series of specific antennas for metering and M2M-based applications from IP65 industrial 2.4GHz antennas, covering Bluetooth to Zigbee and other ISM band standards, to stubby cellular 2G, 2.5G, and 3G antennas and active GPS solutions for location responsive applications.
In addition, it offers a mobile antenna design that targets the handset market. Pulse's Mobile Division will promote near field communication (NFC) antenna solutions and hearing aid compatible (HAC) feedback reducers during the show.
In the access network market, Pulse leads the way in smaller, higher density modules and splitter solutions for the Central Telephone Exchange, components, modules, and integrated RJ45 connectors for 1Gigabit and 10 Gigabit ethernet over copper for LAN, and single and stacked small form-factor pluggable (SFP+) modules for fiber optic transport switches. Pulse also provides complex filters for mixed signal delivery to the home for CATV, multi-media over coax, and other RF products.
Included will be wireless products for telemetric and machine-to-machine (M2M) applications and a broad array of antennas. Although Pulse is predominantly known as a magnetic components supplier to the wide and local area network and power markets, it has actively increased its presence in other areas over the past few years.
"Increased attention to environmental issues has led to a growth-market for Smart Metering, energy management systems, and metering applications, where the latest current sensors from Pulse can be used," explained Robert Frost, network marketing support for Pulse Europe.
"Based on the inherent advantages of a Rogowski coil, the Pulse product range has high-accuracy and exceptional linearity for electricity meters with unrivaled flexibility in size and shape. In addition to just collecting data, there are various solutions for transmitting it with our wide range of antenna and networking products."
The Wireless Devices Group has introduced a series of specific antennas for metering and M2M-based applications from IP65 industrial 2.4GHz antennas, covering Bluetooth to Zigbee and other ISM band standards, to stubby cellular 2G, 2.5G, and 3G antennas and active GPS solutions for location responsive applications.
In addition, it offers a mobile antenna design that targets the handset market. Pulse's Mobile Division will promote near field communication (NFC) antenna solutions and hearing aid compatible (HAC) feedback reducers during the show.
In the access network market, Pulse leads the way in smaller, higher density modules and splitter solutions for the Central Telephone Exchange, components, modules, and integrated RJ45 connectors for 1Gigabit and 10 Gigabit ethernet over copper for LAN, and single and stacked small form-factor pluggable (SFP+) modules for fiber optic transport switches. Pulse also provides complex filters for mixed signal delivery to the home for CATV, multi-media over coax, and other RF products.
ROHM LED driver targets automotive headlamp cluster functions
SAN DIEGO, USA: ROHM Semiconductor announced the availability of model BD8381EFV-M high-brightness LED driver for automotive forward illumination applications. With this new flexible IC, designers can now specify the same driver for use in high-beam, low-beam and daytime running light (DRL) circuits.
The BD8381EFV-M current-mode buck/boost controller provides stable operation over a wide input voltage (5-30V) and removes constraints on the number of LEDs in series connection. Integrated protection monitors voltage, current and temperature.
LED open and short circuit detection is also provided. The BD8381EFV-M has an internal PWM controller so dimming functions can be implemented with a simple external CR circuit. This same circuit can be implemented to limit output current in case of LED overtemperature detection.
Senior Design Engineering Manager for ROHM Semiconductor, Nick Ikuta, said: "Instead of having to select a different drive for each headlamp function, designers can now use one device. Because of its buck/boost configuration, it can handle series LED connections numbering from just one to several."
The BD8381EFV-M current-mode buck/boost controller provides stable operation over a wide input voltage (5-30V) and removes constraints on the number of LEDs in series connection. Integrated protection monitors voltage, current and temperature.
LED open and short circuit detection is also provided. The BD8381EFV-M has an internal PWM controller so dimming functions can be implemented with a simple external CR circuit. This same circuit can be implemented to limit output current in case of LED overtemperature detection.
Senior Design Engineering Manager for ROHM Semiconductor, Nick Ikuta, said: "Instead of having to select a different drive for each headlamp function, designers can now use one device. Because of its buck/boost configuration, it can handle series LED connections numbering from just one to several."
IR expands family of automotive DirectFET®2 power MOSFETs with system scalability
EL SEGUNDO, USA: International Rectifier (IR) has expanded its family of automotive DirectFET®2 power MOSFETs that deliver exceptional power density, dual-sided cooling and minimal parasitic inductance and resistance for heavy load applications, including Electric Power Steering (EPS), power supplies, battery switches on hybrid electric vehicles and Integrated Starter Alternators (ISA) on micro hybrid vehicles.
The automotive-qualified DirectFET®2 devices offer overall system level size and cost reductions along with superior performance and efficiency when compared to traditional standard plastic packaged components.
Featuring a PCB footprint 60 percent smaller than a D2Pak, the AUIRF7738L2 and AUIRF7737L2 DirectFET®2 devices deliver exceptionally low on-state resistance (RDS(on)), while the AUIRF7736M2 features a PCB footprint the same size as a 5x6 mm PQFN or SO-8 package with low RDS(on) of 2.5mOhm, making it suitable for more cost sensitive, lower power applications.
“Utilizing IR’s advanced Trench silicon process, the expansion of our DirectFET®2 portfolio offers automotive systems designers the proven benefits of exceptional power density, dual-sided cooling and low parasitic package inductance and resistance in a robust, reliable and scalable power package,” said Benjamin Jackson, product manager, IR’s Automotive Products Business Unit.
The AUIRF7737L2 and AUIRF7738L2 share a common Large Can PCB footprint with the previously released AUIRF7739L2 making the devices highly desirable components where a scalable system design is required. With a package current rating of 315 A for both devices, the DirectFET® package places no constraint on current capability of the silicon. Moreover, the maximum package current ratings far exceed the limits of traditional DPak and D2Pak packages.
The devices are qualified according to AEC-Q101 standards, feature an environmentally friendly, lead-free and RoHS compliant bill of materials, and are part of IR’s automotive quality initiative targeting zero defects.
The automotive-qualified DirectFET®2 devices offer overall system level size and cost reductions along with superior performance and efficiency when compared to traditional standard plastic packaged components.
Featuring a PCB footprint 60 percent smaller than a D2Pak, the AUIRF7738L2 and AUIRF7737L2 DirectFET®2 devices deliver exceptionally low on-state resistance (RDS(on)), while the AUIRF7736M2 features a PCB footprint the same size as a 5x6 mm PQFN or SO-8 package with low RDS(on) of 2.5mOhm, making it suitable for more cost sensitive, lower power applications.
“Utilizing IR’s advanced Trench silicon process, the expansion of our DirectFET®2 portfolio offers automotive systems designers the proven benefits of exceptional power density, dual-sided cooling and low parasitic package inductance and resistance in a robust, reliable and scalable power package,” said Benjamin Jackson, product manager, IR’s Automotive Products Business Unit.
The AUIRF7737L2 and AUIRF7738L2 share a common Large Can PCB footprint with the previously released AUIRF7739L2 making the devices highly desirable components where a scalable system design is required. With a package current rating of 315 A for both devices, the DirectFET® package places no constraint on current capability of the silicon. Moreover, the maximum package current ratings far exceed the limits of traditional DPak and D2Pak packages.
The devices are qualified according to AEC-Q101 standards, feature an environmentally friendly, lead-free and RoHS compliant bill of materials, and are part of IR’s automotive quality initiative targeting zero defects.
Wednesday, October 20, 2010
Avago extends talk time in GSM/EDGE handsets with new linear power amplifier modules
SAN JOSE, USA & SINGAPORE: Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, has announced new power amplifier modules (PAMs) that extend handset talk time for GSM/EDGE communication.
The new ACPM-7868 PAMs are fully compatible with Qualcomm’s newest generation of chipsets that support linear quad-band GSM/EDGE operation, enabling improved power efficiency for the world’s most widely-used cellular standard.
The new ACPM-7868 PAMs incorporate Avago’s sixth generation CoolPAM technology, which enhances power efficiency with digital power mode control. Two mode control pins provide four power modes for low band and three power modes for high band.
The technology delivers higher efficiency, resulting in extended talk time. At 29 dBm antenna power where talk time is measured, the technology enables a handset to save current consumption by more than 100 mA compared with conventional power amplifiers. It also reduces quiescent current down to 8.5 mA typically.
“Handset manufacturers are seeing strong demand for extended talk time of EDGE,” said James Wilson, marketing director for RF and Microwave products at Avago. “Avago’s new ACPM-7868 power amplifier modules use our proprietary CoolPAM technology to deliver better power efficiency and help meet these demands.”
Avago’s ACPM-7868 PAMs feature pre-distortion by chipset for improved linearity and efficiency. The modules incorporate 50 ohm matching networks for both RF input and output. The new power amplifiers are manufactured on advanced InGaP HBT (Hetero-junction Bipolar Transistor) technology with proven state-of-the-art reliability, temperature stability and ruggedness.
The ACPM-7868 modules are available in a compact 16-pin surface mount package with a 5- by 5-mm footprint. The package’s 0.9-mm height supports slim handset designs. The devices are lead-free and RoHS compliant, and have a -20°C to +90°C case operating temperature range.
Avago’s ACPM-7868 GSM/EDGE PAMs are priced beginning at $1.50 in 10,000 piece quantities. Samples and production quantities are available now through Avago’s direct sales channel and worldwide distribution partners.
The new ACPM-7868 PAMs are fully compatible with Qualcomm’s newest generation of chipsets that support linear quad-band GSM/EDGE operation, enabling improved power efficiency for the world’s most widely-used cellular standard.
The new ACPM-7868 PAMs incorporate Avago’s sixth generation CoolPAM technology, which enhances power efficiency with digital power mode control. Two mode control pins provide four power modes for low band and three power modes for high band.
The technology delivers higher efficiency, resulting in extended talk time. At 29 dBm antenna power where talk time is measured, the technology enables a handset to save current consumption by more than 100 mA compared with conventional power amplifiers. It also reduces quiescent current down to 8.5 mA typically.
“Handset manufacturers are seeing strong demand for extended talk time of EDGE,” said James Wilson, marketing director for RF and Microwave products at Avago. “Avago’s new ACPM-7868 power amplifier modules use our proprietary CoolPAM technology to deliver better power efficiency and help meet these demands.”
Avago’s ACPM-7868 PAMs feature pre-distortion by chipset for improved linearity and efficiency. The modules incorporate 50 ohm matching networks for both RF input and output. The new power amplifiers are manufactured on advanced InGaP HBT (Hetero-junction Bipolar Transistor) technology with proven state-of-the-art reliability, temperature stability and ruggedness.
The ACPM-7868 modules are available in a compact 16-pin surface mount package with a 5- by 5-mm footprint. The package’s 0.9-mm height supports slim handset designs. The devices are lead-free and RoHS compliant, and have a -20°C to +90°C case operating temperature range.
Avago’s ACPM-7868 GSM/EDGE PAMs are priced beginning at $1.50 in 10,000 piece quantities. Samples and production quantities are available now through Avago’s direct sales channel and worldwide distribution partners.
Viasystems collaborates with Faraday on advanced plating technology
ST. LOUIS, USA: Viasystems Group Inc. and Faraday Technology Inc. are collaborating on demonstration of the FARADAYIC ElectroCell technology for the manufacture of printed circuit boards (PCBs) with high-density interconnect features and at high plating rates for improved productivity.
The patented ElectroCell technology has been shown to plate copper features rapidly with greater copper uniformity than achieved with the standard plating cell geometries used throughout the industry today.
Dr. Craig Davidson, Viasystems’ VP of Engineering and Technology, stated: “Improved thickness uniformity across the PCB translates to improved capability to fabricate complex features with higher quality and reliability as compared to baseline processes. It also provides productivity improvements, which reduce costs.”
This work exemplifies Viasystems’ commitment to customer satisfaction through advancements in manufacturing technology that increase capability, improve quality and lower the costs of PCBs manufactured by Viasystems.
The FARADAYIC ElectroCell technology is a drop-in technology, anticipated to streamline implementation and reduce costs traditionally associated with incorporation of new technology into existing manufacturing lines.
Dr. E. Jennings Taylor, Faraday’s founder and VP, said, “The tank design, including all tank components, is a drop-in replacement meant to cost-effectively address the continuing miniaturization and sophistication of PCBs for current and next-generation electronic modules.”
Funding for this work was provided in part by the United States National Science Foundation through the competitive SBIR program with the goal of advancing and strengthening the United States’ manufacturing sector.
FARADAYIC ElectroCell: US Patent Number 7,553,401 (6-30-09), pending Divisional Patent, application number 12/431,030 (filed 4-28-09) and pending Continuation-In-Part, application number 11/836,903 (filed 8-10-07).
The patented ElectroCell technology has been shown to plate copper features rapidly with greater copper uniformity than achieved with the standard plating cell geometries used throughout the industry today.
Dr. Craig Davidson, Viasystems’ VP of Engineering and Technology, stated: “Improved thickness uniformity across the PCB translates to improved capability to fabricate complex features with higher quality and reliability as compared to baseline processes. It also provides productivity improvements, which reduce costs.”
This work exemplifies Viasystems’ commitment to customer satisfaction through advancements in manufacturing technology that increase capability, improve quality and lower the costs of PCBs manufactured by Viasystems.
The FARADAYIC ElectroCell technology is a drop-in technology, anticipated to streamline implementation and reduce costs traditionally associated with incorporation of new technology into existing manufacturing lines.
Dr. E. Jennings Taylor, Faraday’s founder and VP, said, “The tank design, including all tank components, is a drop-in replacement meant to cost-effectively address the continuing miniaturization and sophistication of PCBs for current and next-generation electronic modules.”
Funding for this work was provided in part by the United States National Science Foundation through the competitive SBIR program with the goal of advancing and strengthening the United States’ manufacturing sector.
FARADAYIC ElectroCell: US Patent Number 7,553,401 (6-30-09), pending Divisional Patent, application number 12/431,030 (filed 4-28-09) and pending Continuation-In-Part, application number 11/836,903 (filed 8-10-07).
RFMD expands portfolio of GaN-based CATV components
NEW ORLEANS, USA: RF Micro Devices Inc. announced availability of the RFPD2650, a new gallium nitride-based hybrid power doubler amplifier that delivers industry-best low distortion performance with the flexibility to optimize for supply current or energy consumption.
The RFPD2650 hybrid power doubler amplifier module is specifically designed for CATV infrastructure applications including hybrid fiber coaxial (HFC) optical nodes.
Power doublers are used in HFC networks to extend the range of signal transmission from the head-end to the consumer. To minimize the cost of delivering the signal to the edge of their networks, multi system operators (MSOs) prefer to use as few amplifiers as possible.
MSOs are also increasingly seeking to minimize the operational expenses associated with the HFC network, most notably power consumption and reliability. The RFPD2650 power doubler addresses both of these customer concerns, as does the entire line-up of RFMD's GaN-based amplifiers.
The RFPD2650 supplies a minimum gain of 21dB over the entire 45-1003MHz frequency range. It can deliver up to 20% power or energy savings with no performance penalty in HFC networks, or it can be configured to provide 3dB higher distortion level performance with the same power consumption.
With this unique blend of performance attributes, the RFPD2650 enables MSO system designers to select either industry-leading or energy saving ("green") performance – all while maintaining the ease of use infrastructure OEMs have come to expect from industry-standard SOT115J packaged amplifier modules.
The RFPD2650 leverages GaN HEMT and GaAs pHEMT technology to provide the industry's best distortion performance, enabling longer range transmission. Maximum current is 450mA, and current consumption can be reduced dramatically to less than 370mA for applications requiring reduced distortion performance. Programmed to match the distortion level of competitive devices, RFMD's RFPD2650 delivers two watts of power consumption savings.
The RFPD2650 is available now in sample or production quantities and is priced at $26.50 in quantities of 5,000.
The RFPD2650 hybrid power doubler amplifier module is specifically designed for CATV infrastructure applications including hybrid fiber coaxial (HFC) optical nodes.
Power doublers are used in HFC networks to extend the range of signal transmission from the head-end to the consumer. To minimize the cost of delivering the signal to the edge of their networks, multi system operators (MSOs) prefer to use as few amplifiers as possible.
MSOs are also increasingly seeking to minimize the operational expenses associated with the HFC network, most notably power consumption and reliability. The RFPD2650 power doubler addresses both of these customer concerns, as does the entire line-up of RFMD's GaN-based amplifiers.
The RFPD2650 supplies a minimum gain of 21dB over the entire 45-1003MHz frequency range. It can deliver up to 20% power or energy savings with no performance penalty in HFC networks, or it can be configured to provide 3dB higher distortion level performance with the same power consumption.
With this unique blend of performance attributes, the RFPD2650 enables MSO system designers to select either industry-leading or energy saving ("green") performance – all while maintaining the ease of use infrastructure OEMs have come to expect from industry-standard SOT115J packaged amplifier modules.
The RFPD2650 leverages GaN HEMT and GaAs pHEMT technology to provide the industry's best distortion performance, enabling longer range transmission. Maximum current is 450mA, and current consumption can be reduced dramatically to less than 370mA for applications requiring reduced distortion performance. Programmed to match the distortion level of competitive devices, RFMD's RFPD2650 delivers two watts of power consumption savings.
The RFPD2650 is available now in sample or production quantities and is priced at $26.50 in quantities of 5,000.
Tuesday, October 19, 2010
RoHS vs. REACH approach to substance restrictions
Gary Nevison, Premier Farnell
UK: The basis for RoHS and REACH substance restrictions are quite different.
Restrictions in the original RoHS directive were based on hazards - if a substance is hazardous and there are alternatives, then it could be banned REACH restrictions are introduced only if a risk to human health or the environment can be proven, it cannot be controlled and safer substitutes exist.
The original six RoHS restrictions were imposed without a full assessment of the impact of the possible alternatives even though some were not fully tested. It was enough to show that there is a potential risk without evidence of an actual risk. For example, lead is banned by RoHS but there is no evidence that its presence in electronics has, or is, harming human health or the environment (except at end-of-life where unsafe recycling is carried out).
Also, the possible substitutes had not been identified when this restriction was imposed in 2002, and although less hazardous substitute solder alloys have since become available, their impact was not known until some years after the RoHS lead ban.
The impact of lead solder substitutes is now known because the US EPA carried out a life cycle assessment which shows that neither lead solders nor lead-free solders are clear "winners" overall as they each have different properties and impact. Too late for the politicians I fear, but it would have been interesting if this data had been available in 2002.
REACH restrictions are based on lengthy risk assessments that consider research into the impact of the substance in its entire life cycle and also the possible alternatives. This also considers the control measures used by industry to minimise risk and social and economic issues. REACH restrictions are likely to be application specific where a risk is identified, although total bans are also possible.
The other main difference is that RoHS bans substances present in electrical and electronic equipment that fall within the scope of the 8 product categories (currently) of the directive. REACH affects all chemicals including those used to make the equipment (alloys, solvents, paints, etc.) and chemicals present in finished products of all types. There are very few exclusions and exemptions.
In Europe, the industry is starting to prefer the REACH approach and there increasingly appears to be a consensus by both industry, the EC and many politicians that this approach should be used for future RoHS restrictions once the recast enters force.
UK: The basis for RoHS and REACH substance restrictions are quite different.
Restrictions in the original RoHS directive were based on hazards - if a substance is hazardous and there are alternatives, then it could be banned REACH restrictions are introduced only if a risk to human health or the environment can be proven, it cannot be controlled and safer substitutes exist.
The original six RoHS restrictions were imposed without a full assessment of the impact of the possible alternatives even though some were not fully tested. It was enough to show that there is a potential risk without evidence of an actual risk. For example, lead is banned by RoHS but there is no evidence that its presence in electronics has, or is, harming human health or the environment (except at end-of-life where unsafe recycling is carried out).
Also, the possible substitutes had not been identified when this restriction was imposed in 2002, and although less hazardous substitute solder alloys have since become available, their impact was not known until some years after the RoHS lead ban.
The impact of lead solder substitutes is now known because the US EPA carried out a life cycle assessment which shows that neither lead solders nor lead-free solders are clear "winners" overall as they each have different properties and impact. Too late for the politicians I fear, but it would have been interesting if this data had been available in 2002.
REACH restrictions are based on lengthy risk assessments that consider research into the impact of the substance in its entire life cycle and also the possible alternatives. This also considers the control measures used by industry to minimise risk and social and economic issues. REACH restrictions are likely to be application specific where a risk is identified, although total bans are also possible.
The other main difference is that RoHS bans substances present in electrical and electronic equipment that fall within the scope of the 8 product categories (currently) of the directive. REACH affects all chemicals including those used to make the equipment (alloys, solvents, paints, etc.) and chemicals present in finished products of all types. There are very few exclusions and exemptions.
In Europe, the industry is starting to prefer the REACH approach and there increasingly appears to be a consensus by both industry, the EC and many politicians that this approach should be used for future RoHS restrictions once the recast enters force.
Monday, October 18, 2010
TV backlight orders see no improvement while revenues of LED vendors generally slipped in September
TAIWAN: Based on the analysis and statistics of LEDinside, a research division under TrendForce, in September this year, listed LED manufacturers in Taiwan have total revenue of 9.736 billion NTD, an 8.1 percent decline compared with August revenue of 10.593 billion NTD and 45.8 percent rise in YoY.
The revenue for LED chip manufacturers in September reached 4.554 billion NTD, down 6.9 percent from August. The revenue for LED package manufacturers in September amounted to 5.182 billion NTD, down 9.1 percent from August.
Compiled by LEDinside, LED index (LEDX) observes the industry through the performance of the LED industry market value.
Currently, the Chip LEDX is at 4140.9 points, while the Package LEDX has come to 4849.1 points, reflecting a lack of market confidence in the LED industry. September revenue in the LED industry was further widely affected by the inventory problem of LCD TV vendors.
LED backlight market analysis
Although the hot LCD TV sales of National Day Holidays in China is expected to solve part of the inventory problem, most brand vendors only offered low-priced promotion on CCFL TVs.
The sales performance of LED backlit TVs is good as well but it mainly digests the inventory prepared by TV or panel manufacturers in the beginning of Q3. Therefore, for LED industry players, TV backlight orders haven’t improved and most of them still expect the LED backlight TV to grow fast in next year.
LEDinside predicts the LED TV market size will reach 92 million sets in 2011, nearly tripling the 2010 growth. The edge-type LED backlit LCD TV has greater potential than the direct type. It has advantages both in the cost and shape with thinner size.
As for the IT product backlight, WitsView, the other research division under TrendForce, says that due to the panel cost for LCD monitors and notebooks, manufacturers are unwilling to slash price and have waged the price protection battle. Since October, the price has stopped falling. In light of revenue generated by LED manufacturers, as the market, previously over pessimistic about the IT product shipment, has started to revise the shipment forecast, IT product backlight orders for some LED vendors show positive signs.
Revenue of chip manufacturers in September
The revenue of Taiwan’s chip manufacturers in September is observed to slip 6.9 percent from August and rise 55 percent YoY. Total revenue of chip manufacturers in Q3 still grew 11.6 percent compared with Q2.
Because of the inventory adjustment by the Korean panel makers, backlight orders for large-sized panels started to suffer from its impact. Besides, as MO source material shortage was tighter and the price of sapphire substrates was rising, profits were shrinking. Various factors led to a small reshuffle in September revenue ranking which had remained stable for over the past six months.
The revenue for LED chip manufacturers in September reached 4.554 billion NTD, down 6.9 percent from August. The revenue for LED package manufacturers in September amounted to 5.182 billion NTD, down 9.1 percent from August. Compiled by LEDinside, LED index (LEDX) observes the industry through the performance of the LED industry market value.
Currently, the Chip LEDX is at 4140.9 points, while the Package LEDX has come to 4849.1 points, reflecting a lack of market confidence in the LED industry. September revenue in the LED industry was further widely affected by the inventory problem of LCD TV vendors.LED backlight market analysis
Although the hot LCD TV sales of National Day Holidays in China is expected to solve part of the inventory problem, most brand vendors only offered low-priced promotion on CCFL TVs.
The sales performance of LED backlit TVs is good as well but it mainly digests the inventory prepared by TV or panel manufacturers in the beginning of Q3. Therefore, for LED industry players, TV backlight orders haven’t improved and most of them still expect the LED backlight TV to grow fast in next year.
LEDinside predicts the LED TV market size will reach 92 million sets in 2011, nearly tripling the 2010 growth. The edge-type LED backlit LCD TV has greater potential than the direct type. It has advantages both in the cost and shape with thinner size.
As for the IT product backlight, WitsView, the other research division under TrendForce, says that due to the panel cost for LCD monitors and notebooks, manufacturers are unwilling to slash price and have waged the price protection battle. Since October, the price has stopped falling. In light of revenue generated by LED manufacturers, as the market, previously over pessimistic about the IT product shipment, has started to revise the shipment forecast, IT product backlight orders for some LED vendors show positive signs.
Revenue of chip manufacturers in September
The revenue of Taiwan’s chip manufacturers in September is observed to slip 6.9 percent from August and rise 55 percent YoY. Total revenue of chip manufacturers in Q3 still grew 11.6 percent compared with Q2.
Because of the inventory adjustment by the Korean panel makers, backlight orders for large-sized panels started to suffer from its impact. Besides, as MO source material shortage was tighter and the price of sapphire substrates was rising, profits were shrinking. Various factors led to a small reshuffle in September revenue ranking which had remained stable for over the past six months.Sunday, October 17, 2010
LNAs with multiple gain states optimize HSPA/LTE system performance
SUNNYVALE, USA: Maxim Integrated Products has introduced the MAX2666/MAX2668 low-noise amplifiers (LNAs) for high-data-rate wireless protocols such as HSPA and LTE.
Each LNA features three programmable gain states, allowing customers to dynamically adjust linearity and sensitivity to optimize system performance in the face of varying input-signal strengths.
If interference from adjacent signals is particularly high, as is often the case with mobile devices, the gain can be increased to maintain optimum blocker performance. Ensuring peak system performance regardless of signal conditions, the MAX2666/MAX2668 are well suited for HSPA/LTE-based radio systems such as smartphones and tablets.
Maxim's advanced SiGe BiCMOS process enables these broadband LNAs to combine superior performance characteristics with an ultra-compact footprint. They deliver 15dB of gain; feature a low 1.0dB noise figure for improved receive sensitivity over discrete or CMOS solutions; and operate over the I, IV, V, VI, VII, and X UMTS frequency bands.
Maxim's innovative design enables a tiny package (1.5mm x 1.0mm x 0.55mm), thereby facilitating their use in space-constrained applications such as handheld devices and cellular-based data cards. Only one external component is required to complete the board-level design.
As is common with Maxim's LNAs, customers can expect longer battery life in their end equipment due to low power consumption and low supply voltage. The MAX2666/MAX2668 operate with a low 3.8mA (typ) supply current and less than 100microamps in the lowest gain mode. They run off of a 2.7V to 3.3V supply.
Fully specified over the -40 degrees Celsius to +85 degrees Celsius extended temperature range, the MAX2666/MAX2668 are available in a 6-pin, ultra-thin land-grid array (LGA) package. Prices start at $0.65 (1000-up, FOB USA).
Each LNA features three programmable gain states, allowing customers to dynamically adjust linearity and sensitivity to optimize system performance in the face of varying input-signal strengths.
If interference from adjacent signals is particularly high, as is often the case with mobile devices, the gain can be increased to maintain optimum blocker performance. Ensuring peak system performance regardless of signal conditions, the MAX2666/MAX2668 are well suited for HSPA/LTE-based radio systems such as smartphones and tablets.
Maxim's advanced SiGe BiCMOS process enables these broadband LNAs to combine superior performance characteristics with an ultra-compact footprint. They deliver 15dB of gain; feature a low 1.0dB noise figure for improved receive sensitivity over discrete or CMOS solutions; and operate over the I, IV, V, VI, VII, and X UMTS frequency bands.
Maxim's innovative design enables a tiny package (1.5mm x 1.0mm x 0.55mm), thereby facilitating their use in space-constrained applications such as handheld devices and cellular-based data cards. Only one external component is required to complete the board-level design.
As is common with Maxim's LNAs, customers can expect longer battery life in their end equipment due to low power consumption and low supply voltage. The MAX2666/MAX2668 operate with a low 3.8mA (typ) supply current and less than 100microamps in the lowest gain mode. They run off of a 2.7V to 3.3V supply.
Fully specified over the -40 degrees Celsius to +85 degrees Celsius extended temperature range, the MAX2666/MAX2668 are available in a 6-pin, ultra-thin land-grid array (LGA) package. Prices start at $0.65 (1000-up, FOB USA).
Saturday, October 16, 2010
T/R switches integrate clamping diodes to protect ultrasound imaging systems
SUNNYVALE, USA: Maxim Integrated Products has introduced the MAX4936/MAX4937 fully integrated octal high-voltage transmit/receive (T/R) switches. These switches integrate clamping diodes to isolate the low-voltage receive path from the high-voltage transmit path, thus protecting the receiver input from voltage spikes due to leakage currents flowing through the T/R switches.
Maxim's integrated solution uses > 50 percent less board space than discrete circuits while providing high bandwidth, low jitter, and low signal distortion. The MAX4936/MAX4937 are ideal for use in ultrasound imaging and industrial flaw-detection probes, in which board space is at a premium.
The MAX4936/MAX4937 feature eight individually programmable switches controlled through an SPI(TM) interface with a 12-bit shift register and transparent latch. These features simplify device operation when updating the states of the T/R switch; they ensure that all switches are off at power-on; and they reduce noise due to clock feedthrough.
The MAX4936/MAX4937 T/R are based on the conventional diode topology, but include adjustable current biasing through the serial interface. The devices are specified over the 0 degrees Celsius to +70 degrees Celsius commercial temperature range, and are packaged in a small, 5mm x 11mm, 56-pin TQFN. Prices start at $12.00 (1000-up, FOB USA).
Maxim's integrated solution uses > 50 percent less board space than discrete circuits while providing high bandwidth, low jitter, and low signal distortion. The MAX4936/MAX4937 are ideal for use in ultrasound imaging and industrial flaw-detection probes, in which board space is at a premium.
The MAX4936/MAX4937 feature eight individually programmable switches controlled through an SPI(TM) interface with a 12-bit shift register and transparent latch. These features simplify device operation when updating the states of the T/R switch; they ensure that all switches are off at power-on; and they reduce noise due to clock feedthrough.
The MAX4936/MAX4937 T/R are based on the conventional diode topology, but include adjustable current biasing through the serial interface. The devices are specified over the 0 degrees Celsius to +70 degrees Celsius commercial temperature range, and are packaged in a small, 5mm x 11mm, 56-pin TQFN. Prices start at $12.00 (1000-up, FOB USA).
Friday, October 15, 2010
GigOptix delivers industry’s first thin film polymer on silicon (TFPS) optical modulator production samples
PALO ALTO, USA: GigOptix, a leading supplier of high performance electronic and electro-optic components that enable next generation 40G and 100G optical networks, has announced the availability of production samples of the GigOptix TFPS Mach Zehnder Modulator (MZM) production samples produced at Sanmina-SCI, a leading Electronics Manufacturing Services (EMS) provider, at its Shenzhen, China facility.
The first product is the LX8401, a 40Gb/s Differential Phase Shift Key (DPSK) TFPS modulator that GigOptix is now shipping to fulfill Tier-1 telecom customer orders for evaluation units.
The LX8401 was designed using GigOpitx' proprietary and protected TFPS™ technology that enables an industry leading low Vpi and small form factor modulator. TFPS technology’s lower Vpi that reduces power consumption by more than 20 percent compared with competing modulator technologies.
Moreover, at just 84mm in length, the LX8401 is significantly smaller than comparable Lithium Niobate modulators and easily fits into a 3.5" by 4.5" small form factor 300pin transponder. GigOptix is also planning to release production samples of other TFPS™ modulators in the near term with similar power and size savings.
“Today’s announcement is the proud culmination of over 10 years of development of our TFPS technology to enable electro-optical polymer MZMs that set new performance thresholds in our industry in terms of size and power,” said Raluca Dinu, Vice president and GM of GigOptix Bothell.
“Following six months of close cooperation between GigOptix and Sanmina-SCI, we are delighted to introduce GigOptix’ first high bandwidth TFPS MZM designed for mass production and optimized for thermal and optical stability to the telecom requirements of 85C for 25 years.”
“The increase in consumer demand for bandwidth and the advent of cloud computing are driving network operators to upgrade from 10Gb/s links to larger 40Gb/s and 100Gb/s links to keep pace. Network operators are not only looking for faster solutions but also for smaller and more power efficient ones to replace older technologies,” stated Dr. Avi Katz, CEO and chairman of the Board of Directors for GigOptix.
“The introduction of our first production TFPS MZM ideally addresses networks operators’ needs for faster, smaller and lower power solutions for their bandwidth demands. Furthermore, our TFPS MZM significantly strengthens GigOptix’ comprehensive solution portfolio of 40G and 100G drivers and receiver TIAs while also bolstering our strategy of providing our customers with a Bundled Solution that offers a one-stop-shop for their 40G and 100G DWDM electro-optical requirements.
“GigOptix is unique in the industry as the only pure player for electronic ICs for high speed optical communications. We provide an extremely attractive value proposition of driver, receiver TIA and modulator that will not only reduce customers’ costs via supply chain optimization but also ease their interoperability challenges during development.
“Our solid partnership with Sanmina-SCI coupled with the production of our TFPS family of products in their Shenzhen manufacturing facility, has enabled an exceptional product with competitive cost structure to benefit our customers. I want to extend my congratulations to the Sanmina-SCI team for bringing up this leading production line in record time and I am thankful for their solid partnering in enabling our revolutionary TFPS modulators,” concluded Dr. Katz.
“Our partnership with GigOptix highlights Sanmina-SCI’s commitment to providing significant value-added manufacturing services that enable innovative, quality and cost-effective solutions for our customers,” said Bradley Kolb, senior VP, Optical Solutions Sanmina-SCI.
“We offer the most technologically comprehensive service capability in the optical manufacturing segment and we are delighted to have provided GigOptix with our industry leading design, process development, test development, manufacturing and supply chain management services across Sanmina-SCI’s global optical infrastructure, including our optical manufacturing capability in China.”
The first product is the LX8401, a 40Gb/s Differential Phase Shift Key (DPSK) TFPS modulator that GigOptix is now shipping to fulfill Tier-1 telecom customer orders for evaluation units.
The LX8401 was designed using GigOpitx' proprietary and protected TFPS™ technology that enables an industry leading low Vpi and small form factor modulator. TFPS technology’s lower Vpi that reduces power consumption by more than 20 percent compared with competing modulator technologies.
Moreover, at just 84mm in length, the LX8401 is significantly smaller than comparable Lithium Niobate modulators and easily fits into a 3.5" by 4.5" small form factor 300pin transponder. GigOptix is also planning to release production samples of other TFPS™ modulators in the near term with similar power and size savings.
“Today’s announcement is the proud culmination of over 10 years of development of our TFPS technology to enable electro-optical polymer MZMs that set new performance thresholds in our industry in terms of size and power,” said Raluca Dinu, Vice president and GM of GigOptix Bothell.
“Following six months of close cooperation between GigOptix and Sanmina-SCI, we are delighted to introduce GigOptix’ first high bandwidth TFPS MZM designed for mass production and optimized for thermal and optical stability to the telecom requirements of 85C for 25 years.”
“The increase in consumer demand for bandwidth and the advent of cloud computing are driving network operators to upgrade from 10Gb/s links to larger 40Gb/s and 100Gb/s links to keep pace. Network operators are not only looking for faster solutions but also for smaller and more power efficient ones to replace older technologies,” stated Dr. Avi Katz, CEO and chairman of the Board of Directors for GigOptix.
“The introduction of our first production TFPS MZM ideally addresses networks operators’ needs for faster, smaller and lower power solutions for their bandwidth demands. Furthermore, our TFPS MZM significantly strengthens GigOptix’ comprehensive solution portfolio of 40G and 100G drivers and receiver TIAs while also bolstering our strategy of providing our customers with a Bundled Solution that offers a one-stop-shop for their 40G and 100G DWDM electro-optical requirements.
“GigOptix is unique in the industry as the only pure player for electronic ICs for high speed optical communications. We provide an extremely attractive value proposition of driver, receiver TIA and modulator that will not only reduce customers’ costs via supply chain optimization but also ease their interoperability challenges during development.
“Our solid partnership with Sanmina-SCI coupled with the production of our TFPS family of products in their Shenzhen manufacturing facility, has enabled an exceptional product with competitive cost structure to benefit our customers. I want to extend my congratulations to the Sanmina-SCI team for bringing up this leading production line in record time and I am thankful for their solid partnering in enabling our revolutionary TFPS modulators,” concluded Dr. Katz.
“Our partnership with GigOptix highlights Sanmina-SCI’s commitment to providing significant value-added manufacturing services that enable innovative, quality and cost-effective solutions for our customers,” said Bradley Kolb, senior VP, Optical Solutions Sanmina-SCI.
“We offer the most technologically comprehensive service capability in the optical manufacturing segment and we are delighted to have provided GigOptix with our industry leading design, process development, test development, manufacturing and supply chain management services across Sanmina-SCI’s global optical infrastructure, including our optical manufacturing capability in China.”
IXYS intros largest single die Schottky diode for increased efficiency in power rectification
BIEL, SWITZERLAND: IXYS Corp. announced its successful development of a new range of single Schottky diodes in the MINIBLOC package.
The combination of a new Schottky diode chip design and the MINIBLOCTM packaging offers the designer the highest power and current density that allows permanent currents of 300A with breakdown voltages in the range of 45 volts to 200 volts.
“Our new high power Schottky reduces the need for our customers to use multiple devices in parallel for higher power rectification applications which not only simplifies designs, but increases efficiency and facilitates space saving initiatives,” commented Bradley Green, VP of International Sales of IXYS.
The new DSA300 diode range features lowest on-state losses by design and includes the minimal reverse recovery losses inherent in a Schottky diode construction. Its smooth switching characteristic makes the Schottky irreplaceable in applications that are sensitive to Electromagnetic Interference (EMI) and noise.
IXYS has optimized the design of its in-house Direct Copper Bonded (DCB) ceramic isolation substrate in the MINIBLOC package to provide an extremely rugged and easy to mount solution.
Traditional solutions for high power rectification applications have the necessity to connect two legs in parallel in order to reach high current density. Due to the negative temperature co-efficient and the risk of thermal runaway there is the need to de-rate the operational current by over 20 percent. This new single chip design eliminates the need from competitive sources to reduce the power handling per component and thus using more components which increases system cost and size.
The product range starts with three products (DSA300I45NA, DSA300I100NA and DSA300I200NA) for the voltages classes 45, 100 and 200 Volts.
Common applications for the DSA300 series are output rectification for Switch Mode Power Supplies (SMPS), OR-ing circuits for the paralleling of multiple power supply modules, redundancy OR-ing in UPS, freewheeling diodes and bypass diodes for solar panels.
The use of this highly integrated Schottky diode range also includes industrial power conversion such as welding, battery and capacitor charging circuits, especially solar powered battery chargers.
The combination of a new Schottky diode chip design and the MINIBLOCTM packaging offers the designer the highest power and current density that allows permanent currents of 300A with breakdown voltages in the range of 45 volts to 200 volts.
“Our new high power Schottky reduces the need for our customers to use multiple devices in parallel for higher power rectification applications which not only simplifies designs, but increases efficiency and facilitates space saving initiatives,” commented Bradley Green, VP of International Sales of IXYS.
The new DSA300 diode range features lowest on-state losses by design and includes the minimal reverse recovery losses inherent in a Schottky diode construction. Its smooth switching characteristic makes the Schottky irreplaceable in applications that are sensitive to Electromagnetic Interference (EMI) and noise.
IXYS has optimized the design of its in-house Direct Copper Bonded (DCB) ceramic isolation substrate in the MINIBLOC package to provide an extremely rugged and easy to mount solution.
Traditional solutions for high power rectification applications have the necessity to connect two legs in parallel in order to reach high current density. Due to the negative temperature co-efficient and the risk of thermal runaway there is the need to de-rate the operational current by over 20 percent. This new single chip design eliminates the need from competitive sources to reduce the power handling per component and thus using more components which increases system cost and size.
The product range starts with three products (DSA300I45NA, DSA300I100NA and DSA300I200NA) for the voltages classes 45, 100 and 200 Volts.
Common applications for the DSA300 series are output rectification for Switch Mode Power Supplies (SMPS), OR-ing circuits for the paralleling of multiple power supply modules, redundancy OR-ing in UPS, freewheeling diodes and bypass diodes for solar panels.
The use of this highly integrated Schottky diode range also includes industrial power conversion such as welding, battery and capacitor charging circuits, especially solar powered battery chargers.
Thursday, October 14, 2010
Universal Display announces significant advances in solution-processible phosphorescent OLED material systems
EWING, USA: Universal Display Corp., enabling energy-efficient displays and lighting with its UniversalPHOLED technology and materials, announced significant advances in the performance of its UniversalP2OLED solution-processible, phosphorescent OLED material systems for use with solution-based manufacturing processes.
Display and lighting manufacturers are evaluating solution-based manufacturing techniques as an additional path for the cost-effective production of large-area OLED displays and lighting devices. These developments were announced during the 10th International Meeting on Information Display (IMID 2010), being held from October 11 to 15, 2010 at the KINTEX in Ilsan, Gyeonggi, Korea.
In a paper, Dr. Kwang Ohk Cheon, Senior Research Scientist at Universal Display, reported that the performance of Universal Display’s solution-processible P2OLED technology and materials have advanced significantly through the continued development of enhanced materials and device structures using its proprietary solution-processed, small-molecular emitter systems. These systems are now approaching the performance of PHOLEDs made by vacuum-evaporated techniques.
During his talk, Dr. Cheon reported on a new green system with 66 candelas per Ampere (cd/A) and 130,000 hours of operating lifetime to 50 percent of an initial luminance of 1000 nits - representing approximately a two times improvement in luminous efficiency and lifetime over Universal Display’s results reported a year ago.
In addition, the company’s red P2OLED system now offers 15 cd/A and 62,000 hours, and its light blue P2OLED offers 18 cd/A and 5,000 hours. These results are achieved without using any burn-in or pre-aging methods.
Through the development of optimized ink formulations, the company has also demonstrated ink-jet printed P2OLED devices with comparable performance to devices made by spin-coating. While spin coating is a technique generally only used for research purposes, ink-jet printing is one of the leading solution-processing candidates for use in large-area manufacturing settings.
“The recent performance advances of our solution-processed, phosphorescent OLED material systems, achieved by our Universal Display team, represent significant progress over the past year,” said Steven V. Abramson, president and CEO of Universal Display.
“Universal Display’s highly energy-efficient PHOLED technology and materials are already considered to be critical to the manufacture of OLED displays and lighting produced by vacuum-based manufacturing processes today. These recent P2OLED results move us a major step closer to enabling the industry to produce energy-efficient OLED displays and lighting devices on larger-area manufacturing platforms by cost-effective, solution-processing manufacturing methods.”
Display and lighting manufacturers are evaluating solution-based manufacturing techniques as an additional path for the cost-effective production of large-area OLED displays and lighting devices. These developments were announced during the 10th International Meeting on Information Display (IMID 2010), being held from October 11 to 15, 2010 at the KINTEX in Ilsan, Gyeonggi, Korea.
In a paper, Dr. Kwang Ohk Cheon, Senior Research Scientist at Universal Display, reported that the performance of Universal Display’s solution-processible P2OLED technology and materials have advanced significantly through the continued development of enhanced materials and device structures using its proprietary solution-processed, small-molecular emitter systems. These systems are now approaching the performance of PHOLEDs made by vacuum-evaporated techniques.
During his talk, Dr. Cheon reported on a new green system with 66 candelas per Ampere (cd/A) and 130,000 hours of operating lifetime to 50 percent of an initial luminance of 1000 nits - representing approximately a two times improvement in luminous efficiency and lifetime over Universal Display’s results reported a year ago.
In addition, the company’s red P2OLED system now offers 15 cd/A and 62,000 hours, and its light blue P2OLED offers 18 cd/A and 5,000 hours. These results are achieved without using any burn-in or pre-aging methods.
Through the development of optimized ink formulations, the company has also demonstrated ink-jet printed P2OLED devices with comparable performance to devices made by spin-coating. While spin coating is a technique generally only used for research purposes, ink-jet printing is one of the leading solution-processing candidates for use in large-area manufacturing settings.
“The recent performance advances of our solution-processed, phosphorescent OLED material systems, achieved by our Universal Display team, represent significant progress over the past year,” said Steven V. Abramson, president and CEO of Universal Display.
“Universal Display’s highly energy-efficient PHOLED technology and materials are already considered to be critical to the manufacture of OLED displays and lighting produced by vacuum-based manufacturing processes today. These recent P2OLED results move us a major step closer to enabling the industry to produce energy-efficient OLED displays and lighting devices on larger-area manufacturing platforms by cost-effective, solution-processing manufacturing methods.”
Wednesday, October 13, 2010
Philips announces LED bulbs range for Indian households
BANGALORE, INDIA: Philips Lighting India, the leading Lighting Company in India, today announced a breakthrough innovation in Lighting technology – the Philips LED consumer bulb range for the Indian market.
As part of this launch, the first indigenously developed LED bulb for India was unveiled. The new LED bulb which signifies the expansion of Philips Energy Efficient lighting portfolio will be available at the most competitive price in India or anywhere else globally.
Murali Sivaraman, vice chairman and MD, Philips Electronics India Ltd, said: “This is a milestone launch not just for Philips but also for India, as the new range gives India its first home-grown LED bulb and takes the country a step further in LED revolution. This new LED bulb will enable millions of Indian households to switch to the Future of Lighting and save on electricity bills and replacement costs, all with the highest quality standards.”
A pioneer in LED lighting technology in India, Philips has invested considerably in producing the most appropriate, tailor-made lighting solution for Indian homes. Developed at the Philips R&D center in Noida, the bulb adheres to India-specific environmental and infrastructural challenges such as voltage fluctuations, energy spikes and intermittent power supply.
In addition, the new bulb is a retrofit bulb that can conveniently replace the GLS bulb and be installed on the existing lighting fixtures in India without any additional expense. The bulb is a significant R&D achievement within Philips as it is the fastest innovation at Philips, globally – from the conceptualization till the actual production.
Talking about the key features of this bulb, Nirupam Sahay, senior director, Marketing, Philips Lighting India, said: “Unlike other lighting technologies that are analog, LED bulbs are completely digital. These are based on low-voltage technology and offer up to 80% energy savings compared to the traditional incandescent bulbs. The new bulb emits better quality and more versatile lighting and has an extra long life of more than 15 years. The bulb, like other LED sources, is one of the most sustainable lighting solutions.”
Light Emitting Diode (LED) is a revolutionary technology and has completely transformed the lighting industry worldwide and in India. The newly launched bulb makes the latest LED technology available to home users in India.
The newly launched portfolio includes the 5W retrofit bulb along with the 2W Candle and 7W Spotlight bulbs for various lighting applications inside homes. The 5W retrofit LED bulb is competitively priced at Rs. 649. Given that the life of the bulb is over 15 years and that there is 80 percent energy saving vis-Ă -vis incandescent bulbs, this is an extremely attractive price.
Presently, the bulb is being launched in the major metros such as Bangalore, Hyderabad, Chennai, Delhi, Mumbai, Pune and Kolkata, and will be available in the top electrical outlets in each city, as well as through Philips Light Lounges and key modern retail outlets in these cities.
As part of this launch, the first indigenously developed LED bulb for India was unveiled. The new LED bulb which signifies the expansion of Philips Energy Efficient lighting portfolio will be available at the most competitive price in India or anywhere else globally.Murali Sivaraman, vice chairman and MD, Philips Electronics India Ltd, said: “This is a milestone launch not just for Philips but also for India, as the new range gives India its first home-grown LED bulb and takes the country a step further in LED revolution. This new LED bulb will enable millions of Indian households to switch to the Future of Lighting and save on electricity bills and replacement costs, all with the highest quality standards.”
A pioneer in LED lighting technology in India, Philips has invested considerably in producing the most appropriate, tailor-made lighting solution for Indian homes. Developed at the Philips R&D center in Noida, the bulb adheres to India-specific environmental and infrastructural challenges such as voltage fluctuations, energy spikes and intermittent power supply.
In addition, the new bulb is a retrofit bulb that can conveniently replace the GLS bulb and be installed on the existing lighting fixtures in India without any additional expense. The bulb is a significant R&D achievement within Philips as it is the fastest innovation at Philips, globally – from the conceptualization till the actual production.
Talking about the key features of this bulb, Nirupam Sahay, senior director, Marketing, Philips Lighting India, said: “Unlike other lighting technologies that are analog, LED bulbs are completely digital. These are based on low-voltage technology and offer up to 80% energy savings compared to the traditional incandescent bulbs. The new bulb emits better quality and more versatile lighting and has an extra long life of more than 15 years. The bulb, like other LED sources, is one of the most sustainable lighting solutions.”
Light Emitting Diode (LED) is a revolutionary technology and has completely transformed the lighting industry worldwide and in India. The newly launched bulb makes the latest LED technology available to home users in India.
The newly launched portfolio includes the 5W retrofit bulb along with the 2W Candle and 7W Spotlight bulbs for various lighting applications inside homes. The 5W retrofit LED bulb is competitively priced at Rs. 649. Given that the life of the bulb is over 15 years and that there is 80 percent energy saving vis-Ă -vis incandescent bulbs, this is an extremely attractive price.
Presently, the bulb is being launched in the major metros such as Bangalore, Hyderabad, Chennai, Delhi, Mumbai, Pune and Kolkata, and will be available in the top electrical outlets in each city, as well as through Philips Light Lounges and key modern retail outlets in these cities.
Tuesday, October 12, 2010
Premier Farnell strengthens partnership with Tyco to better meet customer requirements in Apac
BANGALORE, INDIA: Premier Farnell has strengthened its global distribution agreement with Tyco Electronics, the leading provider of engineered electronic components for thousands of consumer and industrial products; network solutions and systems for telecom and energy markets; undersea telecommunication systems and specialty products.
Enhanced green solutions portfolio from Tyco
Premier Farnell will offer an expanded range of new solutions and leading products from Tyco Electronics, including its SOLARLOK photovoltaic connector system. Tyco Electronics is one of the world’s largest suppliers of passive electronic components, including connectors and interconnect systems as well as one of the leading manufacturers of wiring systems for photovoltaics.
The SOLARLOK interconnection system delivers interconnections from photovoltaic modules to the DC/AC converter. The flexible, open system structure allows serial and parallel interconnection via direct wire connect or separable connectors. The SOLARLOK system is able to accommodate a wide operation temperature range and is approved for use in many countries.
According to iSuppli, a market research firm, solar installations are expected to rise to 13.6 Gigawatts (GW) in 2010, and to 20.3GW in 2011. Premier Farnell is committed to increase its product offerings in anticipation of growing demand for alternative energy technologies and green, sustainable solutions in the Asia Pacific region.
In addition to SOLARLOK products, other specialised product lines such as Tyco Electronic’s VITA 46 avionics and vehtronics connectors, as well as its CFP MSA connectors for telecoms applications, will also be made available to customers throughout Asia Pacific, via Premier Farnell.
Premier Farnell’s online purchase management solutions drive efficiencies
Tyco Electronics’ products and solutions are set to become even more easily available to the engineering community. The brand will leverage on Premier Farnell’s innovative e-commerce capabilities such as i-Buy and eProcurement to fulfil its sample requests from Data Communications Electronics Manufacturing Services (EMS) companies in China.
Premier Farnell’s suite of eProcurement solutions has gained such widespread popularity in Asia that sales from its i-Buy solution is growing close to 440 percent year on year. This bodes well for electronic design engineers who hope to achieve complete cost control, reduce administration and still receive their goods quickly.
In particular, Data Communications Electronics Manufacturing Services (EMS) companies in China will find Premier Farnell’s value-added tools useful. According to research firm In-Stat, China will account for over 75 percent of the Asian Electronic Manufacturing Services / Original Design Manufacturing (EMS/ODM) market in 2011.
Henry Ko, Director of Alternative Energy, Tyco Electronics, Asia Pacific said: “In fiscal 2009, we generated $1.4 billion of net sales in China and through our stronger relationship with Premier Farnell, we expect this trend of high growth to continue. Collaborating effectively with world-class companies such as Premier Farnell enables us to offer the most innovative solutions to our customers, globally and within China.
“Together with Premier Farnell’s high-service, multi-channel distribution model, powerful ecommerce engine and state-of-the-art eProcurement systems, we have arrived at a winning arrangement for electronic design engineers around the world. The online purchase management system i-Buy is an example of the enhanced portfolio of services available to our growing customer base.”
William Chong, Regional Director of Supplier, Product & Purchasing Management, Premier Farnell, Asia Pacific said: “At Premier Farnell, we are constantly striving to offer our customers and valued partners enhanced services and innovative solutions to better meet their requirements. By strengthening our long-standing partnership with Tyco Electronics, one of the world’s most highly respected manufacturers of precision engineered electronic components, we are taking this agreement to the next level and expanding our portfolio of cutting-edge solutions.
“This partnership comes at a timely moment, as the development of environmentally-friendly technologies in Asia and other parts of the world is expected to intensify in response to market demand. We are also excited to demonstrate the convenience and efficiency that electronic design engineers can enjoy, with our online purchasing management tools, and look forward to even greater collaboration with Tyco Electronics.”
Same day despatch throughout the Asia Pacific
Customers, particularly electronic design engineers, who require high-quality, reliable and innovative connector solutions can benefit from Premier Farnell’s high-service, multi-channel distribution network which enables same day despatch to customers throughout Asia Pacific.
These products are available for order via Premier Farnell’s website and customer contact centres, with no minimum order quantity or value required. The website provides real-time stock levels and saves the customers from checking with multiple parties to ascertain product availability.
Premier Farnell has availed full and accurate technical information for Tyco Electronics products on element14. Design tips, news, software, ask-an-expert, information on electronics legislation, product presentations, local community groups and user-contributed resources offer valuable insight to designing with Tyco Electronics’ products.
Enhanced green solutions portfolio from Tyco
Premier Farnell will offer an expanded range of new solutions and leading products from Tyco Electronics, including its SOLARLOK photovoltaic connector system. Tyco Electronics is one of the world’s largest suppliers of passive electronic components, including connectors and interconnect systems as well as one of the leading manufacturers of wiring systems for photovoltaics.
The SOLARLOK interconnection system delivers interconnections from photovoltaic modules to the DC/AC converter. The flexible, open system structure allows serial and parallel interconnection via direct wire connect or separable connectors. The SOLARLOK system is able to accommodate a wide operation temperature range and is approved for use in many countries.
According to iSuppli, a market research firm, solar installations are expected to rise to 13.6 Gigawatts (GW) in 2010, and to 20.3GW in 2011. Premier Farnell is committed to increase its product offerings in anticipation of growing demand for alternative energy technologies and green, sustainable solutions in the Asia Pacific region.
In addition to SOLARLOK products, other specialised product lines such as Tyco Electronic’s VITA 46 avionics and vehtronics connectors, as well as its CFP MSA connectors for telecoms applications, will also be made available to customers throughout Asia Pacific, via Premier Farnell.
Premier Farnell’s online purchase management solutions drive efficiencies
Tyco Electronics’ products and solutions are set to become even more easily available to the engineering community. The brand will leverage on Premier Farnell’s innovative e-commerce capabilities such as i-Buy and eProcurement to fulfil its sample requests from Data Communications Electronics Manufacturing Services (EMS) companies in China.
Premier Farnell’s suite of eProcurement solutions has gained such widespread popularity in Asia that sales from its i-Buy solution is growing close to 440 percent year on year. This bodes well for electronic design engineers who hope to achieve complete cost control, reduce administration and still receive their goods quickly.
In particular, Data Communications Electronics Manufacturing Services (EMS) companies in China will find Premier Farnell’s value-added tools useful. According to research firm In-Stat, China will account for over 75 percent of the Asian Electronic Manufacturing Services / Original Design Manufacturing (EMS/ODM) market in 2011.
Henry Ko, Director of Alternative Energy, Tyco Electronics, Asia Pacific said: “In fiscal 2009, we generated $1.4 billion of net sales in China and through our stronger relationship with Premier Farnell, we expect this trend of high growth to continue. Collaborating effectively with world-class companies such as Premier Farnell enables us to offer the most innovative solutions to our customers, globally and within China.
“Together with Premier Farnell’s high-service, multi-channel distribution model, powerful ecommerce engine and state-of-the-art eProcurement systems, we have arrived at a winning arrangement for electronic design engineers around the world. The online purchase management system i-Buy is an example of the enhanced portfolio of services available to our growing customer base.”
William Chong, Regional Director of Supplier, Product & Purchasing Management, Premier Farnell, Asia Pacific said: “At Premier Farnell, we are constantly striving to offer our customers and valued partners enhanced services and innovative solutions to better meet their requirements. By strengthening our long-standing partnership with Tyco Electronics, one of the world’s most highly respected manufacturers of precision engineered electronic components, we are taking this agreement to the next level and expanding our portfolio of cutting-edge solutions.
“This partnership comes at a timely moment, as the development of environmentally-friendly technologies in Asia and other parts of the world is expected to intensify in response to market demand. We are also excited to demonstrate the convenience and efficiency that electronic design engineers can enjoy, with our online purchasing management tools, and look forward to even greater collaboration with Tyco Electronics.”
Same day despatch throughout the Asia Pacific
Customers, particularly electronic design engineers, who require high-quality, reliable and innovative connector solutions can benefit from Premier Farnell’s high-service, multi-channel distribution network which enables same day despatch to customers throughout Asia Pacific.
These products are available for order via Premier Farnell’s website and customer contact centres, with no minimum order quantity or value required. The website provides real-time stock levels and saves the customers from checking with multiple parties to ascertain product availability.
Premier Farnell has availed full and accurate technical information for Tyco Electronics products on element14. Design tips, news, software, ask-an-expert, information on electronics legislation, product presentations, local community groups and user-contributed resources offer valuable insight to designing with Tyco Electronics’ products.
Monday, October 11, 2010
FCI Microconnections inaugurates latest facility in Singapore
SINGAPORE: FCI Microconnections, a leader in flexible printed circuits for smart cards will officially inaugurate its latest plant in Changi, Singapore, on October 12, 2010.
With the Asia Pacific region being one of FCI’s most important in terms of growth, consisting of 14 different locations spread out over seven countries, FCI’s presence in the area has been further strengthened by the opening of its latest plant in Singapore.
This plant, strategically located in Changi area, consists of state-of-the-art R&D and manufacturing capabilities. The plant, spread out over about 18,000sqm of space, employs more 330 personnel.
“We are very pleased with today’s grand opening of our latest facility in Changi, Singapore. This event marks another break through for FCI in building a world class manufacturing organisation”, says Christophe Duverne, corporate VP and GM, FCI Microconnections division.”We are very thankful to our key partners whose presence today is a testimony of their trust in our continued leadership.”
“We are delighted with FCI’s decision to expand its Microconnections manufacturing and R&D operations in Singapore. FCI Microconnections has also been a catalyst in the upgrading of Singapore’s supplier capabilities, and a technology innovator in product and solutions development”, says Dr Beh Swan Gin, MD, Singapore Economic Development Board.
With the Asia Pacific region being one of FCI’s most important in terms of growth, consisting of 14 different locations spread out over seven countries, FCI’s presence in the area has been further strengthened by the opening of its latest plant in Singapore.
This plant, strategically located in Changi area, consists of state-of-the-art R&D and manufacturing capabilities. The plant, spread out over about 18,000sqm of space, employs more 330 personnel.
“We are very pleased with today’s grand opening of our latest facility in Changi, Singapore. This event marks another break through for FCI in building a world class manufacturing organisation”, says Christophe Duverne, corporate VP and GM, FCI Microconnections division.”We are very thankful to our key partners whose presence today is a testimony of their trust in our continued leadership.”
“We are delighted with FCI’s decision to expand its Microconnections manufacturing and R&D operations in Singapore. FCI Microconnections has also been a catalyst in the upgrading of Singapore’s supplier capabilities, and a technology innovator in product and solutions development”, says Dr Beh Swan Gin, MD, Singapore Economic Development Board.
Saturday, October 9, 2010
Vishay's MIL-PRF-55342-qualified thin film SMD resistor chips offer 'T' reliability level for space apps
MALVERN, USA: Vishay Intertechnology Inc. has extended its E/H MIL-PRF-55342-qualified Thin Film surface-mount resistor chips in the 0505, 1005, 1505, 0705, 1206, and 1010 case sizes to offer a "T" reliability level for space applications. Qualification on larger cases sizes is pending.
The enhanced resistors' established reliability is assured through 100 percent screening and extensive environmental testing that includes 100 % group A, power conditioning, and Group B lot testing, through which the devices have been rated and approved for a "T" reliability level.
The Mil-PRF-55342 Thin Film resistors were verified in qualification for the American Society for Testing and Materials (ASTM E-595) standard test method for total mass loss (TML) and collected volatile condensable materials (CVCM) from outgassing in a vacuum environment for space-level requirements. In addition, the resistors undergo a burn-in period prior to shipment.
Intended for high-reliability military and aerospace applications with stringent performance requirements, the resistors' all-sputtered wraparound terminations ensure excellent adhesion and dimensional uniformity. The Mil-PRF-55342 Thin Film devices feature a passivated Nichrome resistive element, while their high-purity alumina substrate allows for high power ratings to 500 mW.
In addition to very low noise of less than - 25 dB and a low voltage coefficient of less than 0.1 ppm/V, the resistors offer an absolute TCR down to 25 ppm/deg. C, tolerances down to 0.1 %, and a resistance range from 10 ohms to 1.69 megohms depending on case size and characteristics. The Mil-PRF-55342 Thin Film devices provide a shelf-life stability of 0.01 % and operate over a temperature range of - 55 to + 125 deg. C.
Offered in waffle pack or tape-and-reel packaging, production quantities of the new devices are available now, with lead times of 16 to 20 weeks.
The enhanced resistors' established reliability is assured through 100 percent screening and extensive environmental testing that includes 100 % group A, power conditioning, and Group B lot testing, through which the devices have been rated and approved for a "T" reliability level.
The Mil-PRF-55342 Thin Film resistors were verified in qualification for the American Society for Testing and Materials (ASTM E-595) standard test method for total mass loss (TML) and collected volatile condensable materials (CVCM) from outgassing in a vacuum environment for space-level requirements. In addition, the resistors undergo a burn-in period prior to shipment.
Intended for high-reliability military and aerospace applications with stringent performance requirements, the resistors' all-sputtered wraparound terminations ensure excellent adhesion and dimensional uniformity. The Mil-PRF-55342 Thin Film devices feature a passivated Nichrome resistive element, while their high-purity alumina substrate allows for high power ratings to 500 mW.
In addition to very low noise of less than - 25 dB and a low voltage coefficient of less than 0.1 ppm/V, the resistors offer an absolute TCR down to 25 ppm/deg. C, tolerances down to 0.1 %, and a resistance range from 10 ohms to 1.69 megohms depending on case size and characteristics. The Mil-PRF-55342 Thin Film devices provide a shelf-life stability of 0.01 % and operate over a temperature range of - 55 to + 125 deg. C.
Offered in waffle pack or tape-and-reel packaging, production quantities of the new devices are available now, with lead times of 16 to 20 weeks.
Friday, October 8, 2010
Philips Lumileds expands LUXEON Rebel white LED portfolio
SAN JOSE, USA: Philips Lumileds has added a new 4000K CCT ANSI binned part to its award winning LUXEON Rebel product portfolio and raised the top flux bin for its cool and neutral white LUXEON Rebel by 20 percent.
The new part delivers improved color rendering and tight binning to simplify luminaire designers’ engineering efforts. In addition, flux bin increases for cool and neutral white LUXEON Rebel parts to a minimum 120 lumen flux bin at 350 mA demonstrates continued flux and efficacy improvements that are part of the company’s technology development path.
Coupled with the recent introduction of LUXEON Rebel ES, Philips Lumileds LEDs provide high performance options for a wide variety of applications.
“As the market for solid-state lighting solutions takes hold, feedback from lighting engineers, designers, and end-users is playing a critical role in the development of the LUXEON LED portfolio,” said Frank Harder, VP Marketing LUXEON Product Lines at Philips Lumileds.
“The new 4000K CCT part addresses specific needs in the office lighting segment where light output, efficacy and quality of light must meet certain levels. And our light output increases coupled with superior performance at application conditions means that our LUXEON Rebel LEDs will outperform virtually any similar product available today.”
In addition to its LUXEON Rebel white portfolio, Philips Lumileds offers a broad color portfolio including the recently upgraded red and red-orange, royal blue, blue, cyan, amber, green, and PC amber. The entire LUXEON Rebel portfolio is available directly from Future Lighting Solutions.
Ordering of small quantities is available on-line for immediate delivery. Future Lighting Solutions provides design in resources including engineering support (thermal, lumen maintenance, manufacturing) and prototyping.
The new part delivers improved color rendering and tight binning to simplify luminaire designers’ engineering efforts. In addition, flux bin increases for cool and neutral white LUXEON Rebel parts to a minimum 120 lumen flux bin at 350 mA demonstrates continued flux and efficacy improvements that are part of the company’s technology development path.
Coupled with the recent introduction of LUXEON Rebel ES, Philips Lumileds LEDs provide high performance options for a wide variety of applications.
“As the market for solid-state lighting solutions takes hold, feedback from lighting engineers, designers, and end-users is playing a critical role in the development of the LUXEON LED portfolio,” said Frank Harder, VP Marketing LUXEON Product Lines at Philips Lumileds.
“The new 4000K CCT part addresses specific needs in the office lighting segment where light output, efficacy and quality of light must meet certain levels. And our light output increases coupled with superior performance at application conditions means that our LUXEON Rebel LEDs will outperform virtually any similar product available today.”
In addition to its LUXEON Rebel white portfolio, Philips Lumileds offers a broad color portfolio including the recently upgraded red and red-orange, royal blue, blue, cyan, amber, green, and PC amber. The entire LUXEON Rebel portfolio is available directly from Future Lighting Solutions.
Ordering of small quantities is available on-line for immediate delivery. Future Lighting Solutions provides design in resources including engineering support (thermal, lumen maintenance, manufacturing) and prototyping.
IR intros 30 W radiation hardened POL regulators for space apps requiring high output current and low supply voltage
EL SEGUNDO, USA: International Rectifier (IR) has introduced the SBB Series of non-isolated, radiation hardened (RAD-Hard) Point-of-Load (POL) voltage regulators.
The new devices are designed to maximize efficiency in space applications including satellites requiring long mission life up to 15 years or 100Krads of total ionizing dose (TID).
The SBB Series delivers high efficiency of up to 89 percent, allowing the use of a smaller heatsink to reduce overall size and weight of the system. The new devices, suitable for designs using new digital signal processors, ASIC and FPGA technologies, feature 30 W output power or output current of 14 A.
Standard outputs of 1.0 V, 1.2 V, 1.5 V. 1.8 V, 2.5 V, and 3.3 V can each be adjusted to ±10 percent of a nominal output for precise output setting. Integrated input and output filters are also featured to ensure low noise performance for stand-alone operation without the need for external filter components.
Tiva Bussarakons, marketing director, IR’s HiRel DC-DC Converter Products, said: “With high efficiency performance well suited to the high power requirements of two-stage distributed power architecture design applications, the SBB Series addresses the ongoing need to reduce size and weight, as well as the increasing needs of FPGA and other digital circuitries for increased bandwidth, data processing speed, and the higher processing power requirements of digital electronics onboard spacecraft.”
The SBB Series was developed using proven space-level design methodology that includes IR’s proprietary discrete-based PWM controller and components with known radiation performance fully de-rated to the requirements of MIL-STD-1547.
Weighing less than 55 g in a compact form factor, other key features of the new devices include 4.5 V to 5.5 V input range, SEE LET (Heavy Ions) greater than 82 MeV.cm2 /mg, under voltage lockout (UVLO), remote sense compensation, adjustable output voltage, power OK (POK) status, and remote on and off control.
The new devices are designed to maximize efficiency in space applications including satellites requiring long mission life up to 15 years or 100Krads of total ionizing dose (TID).
The SBB Series delivers high efficiency of up to 89 percent, allowing the use of a smaller heatsink to reduce overall size and weight of the system. The new devices, suitable for designs using new digital signal processors, ASIC and FPGA technologies, feature 30 W output power or output current of 14 A.
Standard outputs of 1.0 V, 1.2 V, 1.5 V. 1.8 V, 2.5 V, and 3.3 V can each be adjusted to ±10 percent of a nominal output for precise output setting. Integrated input and output filters are also featured to ensure low noise performance for stand-alone operation without the need for external filter components.
Tiva Bussarakons, marketing director, IR’s HiRel DC-DC Converter Products, said: “With high efficiency performance well suited to the high power requirements of two-stage distributed power architecture design applications, the SBB Series addresses the ongoing need to reduce size and weight, as well as the increasing needs of FPGA and other digital circuitries for increased bandwidth, data processing speed, and the higher processing power requirements of digital electronics onboard spacecraft.”
The SBB Series was developed using proven space-level design methodology that includes IR’s proprietary discrete-based PWM controller and components with known radiation performance fully de-rated to the requirements of MIL-STD-1547.
Weighing less than 55 g in a compact form factor, other key features of the new devices include 4.5 V to 5.5 V input range, SEE LET (Heavy Ions) greater than 82 MeV.cm2 /mg, under voltage lockout (UVLO), remote sense compensation, adjustable output voltage, power OK (POK) status, and remote on and off control.
Molex announces new Mini-LC duplex cabling solutions to support Avago's Mini-SFP transceiver line
LISLE, USA: Molex Inc. has announced its new Mini-LC Duplex Cables, which are designed to mate with Avago Technologies’ Mini-SFP transceiver.
The assemblies were developed with a reduced ferrule pitch over standard LC duplex connectors to enable a higher density deployment of active devices per blade and a cleaner cable-management solution when mated with Avago Technologies’ Mini-SFP transceiver.
“Molex’s new Mini-LC will enable our customers to offer higher port densities and improved cable management over standard SFP interfaces increasing available bandwidth per blade,” said Eve Leal, program manager, Molex.
Ideal for data communications and networking applications, the Mini-LC Duplex cables come in standard lengths of 1, 2, 3, 5 and 10 meters with variations that include Mini-LC to Mini-LC cables as well as Mini-LC to standard LC duplex cables. Molex also offers custom lengths and fiber optic breakout cables if transitions are needed from MPO based QSFP modules to Mini-SFP transceivers supported by Avago Technologies.
Additional product features include:
* Utilizes 50/125µm OM3 fiber for longer reach and higher speeds optimized at 850nm or 1300nm.
* Complies with RoHS requirements meeting EU environmental requirements for electronic equipment and accessories.
* Utilizes industry standard LC connector / RJ-45 latching style mechanism with a press-to-release design for ease-of-use.
* Black color-coded latches differentiate the standard LC Duplex connector versus the new Mini-LC Duplex connector.
The assemblies were developed with a reduced ferrule pitch over standard LC duplex connectors to enable a higher density deployment of active devices per blade and a cleaner cable-management solution when mated with Avago Technologies’ Mini-SFP transceiver.
“Molex’s new Mini-LC will enable our customers to offer higher port densities and improved cable management over standard SFP interfaces increasing available bandwidth per blade,” said Eve Leal, program manager, Molex.
Ideal for data communications and networking applications, the Mini-LC Duplex cables come in standard lengths of 1, 2, 3, 5 and 10 meters with variations that include Mini-LC to Mini-LC cables as well as Mini-LC to standard LC duplex cables. Molex also offers custom lengths and fiber optic breakout cables if transitions are needed from MPO based QSFP modules to Mini-SFP transceivers supported by Avago Technologies.
Additional product features include:
* Utilizes 50/125µm OM3 fiber for longer reach and higher speeds optimized at 850nm or 1300nm.
* Complies with RoHS requirements meeting EU environmental requirements for electronic equipment and accessories.
* Utilizes industry standard LC connector / RJ-45 latching style mechanism with a press-to-release design for ease-of-use.
* Black color-coded latches differentiate the standard LC Duplex connector versus the new Mini-LC Duplex connector.
Thursday, October 7, 2010
Renesas Electronics intros new control IC for automotive LED headlights
SANTA CLARA, USA: Renesas Electronics Corp., a premier provider of advanced semiconductor solutions, announced the availability of its new control IC (part number ÎĽPD168891) for automotive light-emitting diode (LED) headlights.
The main features of the ÎĽPD168891 IC are:
(1) an integrated current-control function for constant-current drive of LEDs and a pre-driver function for driving external metal-oxide-semiconductor field-effect transistors (MOSFETs);
(2) integrated protection functions essential for automotive applications, including LED current and external MOSFET overcurrent protection; and
(3) a newly developed compact package with low thermal resistance. The new device can be combined with other devices, such as MOSFETs, Schottky diodes, and choke coils to build electronic-control units for LED headlights in automobiles.
The ÎĽPD168891 device is designed to satisfy the requirements of automotive headlight applications by integrating functions required for LED constant-current drive as well as other functions.
Main functions of the control IC:
Integration of functions specifically for automotive LED headlight applications
The ÎĽPD168891 device can provide constant-current drive control for up to 12 power LEDs connected in a series. The voltage-boost switching frequency can be set to a maximum of 500 kilohertz (kHz), a rate slightly lower than the AM radio frequency band to prevent interference with the car audio system.
LED drive is supported for power-supply voltages ranging from 6 volts (V) to 28V. An integrated pre-driver circuit can drive two power MOSFETs used for voltage-boost drive and current-line cutoff in case of protection works.
Integration of multiple protection functions
The ÎĽPD168891 device incorporates several protection functions including overcurrent protection for the LED current and external MOSFETs, over voltage/load (LED) open protection, LED pin short-circuit protection and overheating protection.
A diagnostic function can output information on the device state when a protection function is triggered by a malfunction, and a shutoff function controls external power MOSFETs to disable current lines. These functions enable a higher-level unit, such as a body control module, to monitor the state of the electronic-control unit and prevent secondary problems due to continuing current flow.
Newly developed compact VQFN package with low thermal resistance
To reduce heat generation and board dimensions, the ÎĽPD168891 control IC uses a newly designed compact package (48-pin VQFN, 7×7mm, lead-free) with low thermal resistance, making it possible to build automotive control units that are more compact and lightweight.
Samples of Renesas Electronics' new ÎĽPD168891 control IC are currently available. Sample pricing begins at US$5.00 for 100-piece quantities. Mass production is scheduled for first half fiscal 2012.
The main features of the ÎĽPD168891 IC are:
(1) an integrated current-control function for constant-current drive of LEDs and a pre-driver function for driving external metal-oxide-semiconductor field-effect transistors (MOSFETs);
(2) integrated protection functions essential for automotive applications, including LED current and external MOSFET overcurrent protection; and
(3) a newly developed compact package with low thermal resistance. The new device can be combined with other devices, such as MOSFETs, Schottky diodes, and choke coils to build electronic-control units for LED headlights in automobiles.
The ÎĽPD168891 device is designed to satisfy the requirements of automotive headlight applications by integrating functions required for LED constant-current drive as well as other functions.
Main functions of the control IC:
Integration of functions specifically for automotive LED headlight applications
The ÎĽPD168891 device can provide constant-current drive control for up to 12 power LEDs connected in a series. The voltage-boost switching frequency can be set to a maximum of 500 kilohertz (kHz), a rate slightly lower than the AM radio frequency band to prevent interference with the car audio system.
LED drive is supported for power-supply voltages ranging from 6 volts (V) to 28V. An integrated pre-driver circuit can drive two power MOSFETs used for voltage-boost drive and current-line cutoff in case of protection works.
Integration of multiple protection functions
The ÎĽPD168891 device incorporates several protection functions including overcurrent protection for the LED current and external MOSFETs, over voltage/load (LED) open protection, LED pin short-circuit protection and overheating protection.
A diagnostic function can output information on the device state when a protection function is triggered by a malfunction, and a shutoff function controls external power MOSFETs to disable current lines. These functions enable a higher-level unit, such as a body control module, to monitor the state of the electronic-control unit and prevent secondary problems due to continuing current flow.
Newly developed compact VQFN package with low thermal resistance
To reduce heat generation and board dimensions, the ÎĽPD168891 control IC uses a newly designed compact package (48-pin VQFN, 7×7mm, lead-free) with low thermal resistance, making it possible to build automotive control units that are more compact and lightweight.
Samples of Renesas Electronics' new ÎĽPD168891 control IC are currently available. Sample pricing begins at US$5.00 for 100-piece quantities. Mass production is scheduled for first half fiscal 2012.
TOKO to demo wireless power supply
SAITAMA, JAPAN: TOKO Inc., a developer/manufacturer of electronic components focused on coil-based products, announced that it will give a demonstration of a self-developed wireless power supply system at CEATEC JAPAN 2010.
Visitors will have an opportunity to witness TOKO's technology that contributes to improving convenience and at the same time saving energy consumption by minimizing power transmission losses.
Wireless power supply offers many advantages, including convenience, reliability, waterproofing property and dust prevention. This technology has found widespread applications in various fields, particularly cordless phones. TOKO has shipped a cumulative total of more than 12 million wireless power supply products.
It expects to have them employed for small portable devices such as mobile phones and digital cameras. TOKO has joined the Wireless Power Consortium (WPC) to step up R&D in this area.
It is 11 years since TOKO launched commercialization and mass production of wireless power supply equipment. Based on its own technology, the company is pushing ahead with improvement in transmission efficiency.
It has displayed a particular strength in the coil portion that is the key to wireless power supply, achieving coil-to-coil transmission efficiency of 93 percent by taking advantage of its winding and RF techniques in which TOKO is strong. At CEATEC JAPAN 2010, wireless power supply using a 4.0-watt class transmission cable will be demonstrated.
As a time-honored coil manufacturer, TOKO possesses a wide array of cutting-edge technologies, including those for winding and electromagnetic/materials analyses. Taking advantage of its technological development capabilities accumulated continuously since its foundation in 1955, TOKO is set to continue commercialization of wireless power supply equipment with further improved transmission efficiency.
Visitors will have an opportunity to witness TOKO's technology that contributes to improving convenience and at the same time saving energy consumption by minimizing power transmission losses.
Wireless power supply offers many advantages, including convenience, reliability, waterproofing property and dust prevention. This technology has found widespread applications in various fields, particularly cordless phones. TOKO has shipped a cumulative total of more than 12 million wireless power supply products.
It expects to have them employed for small portable devices such as mobile phones and digital cameras. TOKO has joined the Wireless Power Consortium (WPC) to step up R&D in this area.
It is 11 years since TOKO launched commercialization and mass production of wireless power supply equipment. Based on its own technology, the company is pushing ahead with improvement in transmission efficiency.
It has displayed a particular strength in the coil portion that is the key to wireless power supply, achieving coil-to-coil transmission efficiency of 93 percent by taking advantage of its winding and RF techniques in which TOKO is strong. At CEATEC JAPAN 2010, wireless power supply using a 4.0-watt class transmission cable will be demonstrated.
As a time-honored coil manufacturer, TOKO possesses a wide array of cutting-edge technologies, including those for winding and electromagnetic/materials analyses. Taking advantage of its technological development capabilities accumulated continuously since its foundation in 1955, TOKO is set to continue commercialization of wireless power supply equipment with further improved transmission efficiency.
Diodes Inc.'s multi-topology LED driver raises performance of HB lighting systems
DALLAS, USA: Diodes Inc., a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, has announced a multi-topology LED driver designed to increase the performance of high brightness automotive, industrial and commercial lighting systems.
Operating in buck, boost and buck-boost modes, the ZXLD1374 LED driver’s integrated 60V power MOSFET switch is capable of producing a maximum LED current of 1.5A. The IC uses high-side current sensing and patent pending control loops to achieve high accuracy current control of LED strings.
An extended input voltage range of 6V to 60V combined with a typical 1 percent output current tolerance in all topologies means the driver readily supports the high current levels and tight inter-lamp luminance-matching needed by high brightness LED systems.
The inclusion of active LED thermal management, achieved via a dedicated external thermistor input, and through fault diagnosis outputs reporting LED driver and load status, results in greater LED reliability and longevity.
With dedicated DC dimming and PWM dimming pins, the ZXLD1374 provides a 1000:1 dynamic dimming range at 500Hz, ensuring highly accurate control of color mixing and excellent resolution at low brightness levels. The IC’s 1MHz switching frequency capability with 100kHz low frequency clamp also helps reduce the size of the external inductor and simplify the design of any input EMI filters.
Operating in buck, boost and buck-boost modes, the ZXLD1374 LED driver’s integrated 60V power MOSFET switch is capable of producing a maximum LED current of 1.5A. The IC uses high-side current sensing and patent pending control loops to achieve high accuracy current control of LED strings.
An extended input voltage range of 6V to 60V combined with a typical 1 percent output current tolerance in all topologies means the driver readily supports the high current levels and tight inter-lamp luminance-matching needed by high brightness LED systems.
The inclusion of active LED thermal management, achieved via a dedicated external thermistor input, and through fault diagnosis outputs reporting LED driver and load status, results in greater LED reliability and longevity.
With dedicated DC dimming and PWM dimming pins, the ZXLD1374 provides a 1000:1 dynamic dimming range at 500Hz, ensuring highly accurate control of color mixing and excellent resolution at low brightness levels. The IC’s 1MHz switching frequency capability with 100kHz low frequency clamp also helps reduce the size of the external inductor and simplify the design of any input EMI filters.
Avnet launches web-based design resource for USB 3.0
PHOENIX, USA: Avnet Electronics Marketing Americas, a business region of Avnet Inc. has launched a dedicated web resource for design engineers focusing on the emerging technology of USB 3.0 or SuperSpeed USB. The website is www.em.avnet.com/usb3.
As new uses for technology, media and storage emerge, design engineers are pressured to keep up with the evolving expectations of today’s consumer. Avnet Electronics Marketing Americas has launched a new website focused solely on USB 3.0 to keep design engineers up to speed on the latest products, news and best-practices for integrating and designing for this emerging technology.
“We’ve seen a significant increase in OEMs looking to capitalize on the significant performance enhancements of SuperSpeed USB,” said Jim Beneke, vice president of global technical marketing for Avnet Electronics Marketing.
“Avnet’s SuperSpeed USB site was designed with our customers in mind. As each new facet of this technology emerges, Avnet is committed to ensuring our customers have access to the information they need to accelerate their time to market.”
As new uses for technology, media and storage emerge, design engineers are pressured to keep up with the evolving expectations of today’s consumer. Avnet Electronics Marketing Americas has launched a new website focused solely on USB 3.0 to keep design engineers up to speed on the latest products, news and best-practices for integrating and designing for this emerging technology.
“We’ve seen a significant increase in OEMs looking to capitalize on the significant performance enhancements of SuperSpeed USB,” said Jim Beneke, vice president of global technical marketing for Avnet Electronics Marketing.
“Avnet’s SuperSpeed USB site was designed with our customers in mind. As each new facet of this technology emerges, Avnet is committed to ensuring our customers have access to the information they need to accelerate their time to market.”
Wednesday, October 6, 2010
Comings and goings of RoHS recast
Gary Nevison, Premier Farnell
UK: Progress towards agreement on the proposed RoHS recast has hit troubled waters and a first reading approval now seems unlikely.
Belgium, who holds the EU presidency, has proposed to abandon a list of priority substances which could potentially face restriction. This list includes many of the Substances of Very High Concern (SVHC) on the REACH Candidate List as well as the likes of arsenic compounds, beryllium compounds and PVC.
The original proposal from the European Commission was to include just four SVHCs, but in June the European Parliament’s environment committee voted to expand the list to 37 substances. The latest Belgian proposal states that the original four substances (HBCDD, DEHP, BBP and DBP) should have their risks assessed in the future.
The Belgian proposal does not include a restriction on nanosilver, which had been voted for by MEPs, nor is there any labelling or safety data sheet obligations mentioned previously.
Finally, there is still disagreement over the start date for an “open scope” with Belgium now proposing 2019 (previously 2017) and the European Parliament environment committee wanting all electrical and electronic equipment, unless specifically excluded, covered by 2014.
Discussions are ongoing.
UK: Progress towards agreement on the proposed RoHS recast has hit troubled waters and a first reading approval now seems unlikely.
Belgium, who holds the EU presidency, has proposed to abandon a list of priority substances which could potentially face restriction. This list includes many of the Substances of Very High Concern (SVHC) on the REACH Candidate List as well as the likes of arsenic compounds, beryllium compounds and PVC.
The original proposal from the European Commission was to include just four SVHCs, but in June the European Parliament’s environment committee voted to expand the list to 37 substances. The latest Belgian proposal states that the original four substances (HBCDD, DEHP, BBP and DBP) should have their risks assessed in the future.
The Belgian proposal does not include a restriction on nanosilver, which had been voted for by MEPs, nor is there any labelling or safety data sheet obligations mentioned previously.
Finally, there is still disagreement over the start date for an “open scope” with Belgium now proposing 2019 (previously 2017) and the European Parliament environment committee wanting all electrical and electronic equipment, unless specifically excluded, covered by 2014.
Discussions are ongoing.
America II to distribute VaOpto lighting solutions
ST. PETERSBURG, USA: America II Electronics Inc., one of the world’s largest independent distributors of semiconductors and passive components, has finalized an authorized distribution agreement with Virginia Optoelectronics Inc., a world-class manufacturer of lighting solutions.
Through this agreement, America II strengthens its line card and remains committed to meeting the needs of its customers.
“Delivering new solutions to our customers is always a top priority,” said Jim Magee, President of America II Electronics. “VaOpto offers a complete product portfolio of lighting components, while specializing in both high-power and high-output LEDs. This makes them a significant supplier in the lighting market and a great addition to the America II line card. We’re pleased to be offering their products to our customers.”
Under the agreement, America II will have global distribution rights, excluding Canada.
“VaOpto is excited to be partnering with America II,” said Virginia Optoelectronics President, Charles Li. “We selected America II because of their worldwide presence and considerable field sales coverage across the US. This is the perfect opportunity to help us extend the VaOpto brand into new markets and provide customers with long-term inventory support.”
With over three billion parts in stock and available to sell at their St. Petersburg facility, America II Electronics has one of the largest inventories in the industry. Specializing in hard-to-find and allocated products, as well as stocking long lead-time semiconductors from the top manufacturers, America II Electronics will now provide even more options for their worldwide customers.
Through this agreement, America II strengthens its line card and remains committed to meeting the needs of its customers.
“Delivering new solutions to our customers is always a top priority,” said Jim Magee, President of America II Electronics. “VaOpto offers a complete product portfolio of lighting components, while specializing in both high-power and high-output LEDs. This makes them a significant supplier in the lighting market and a great addition to the America II line card. We’re pleased to be offering their products to our customers.”
Under the agreement, America II will have global distribution rights, excluding Canada.
“VaOpto is excited to be partnering with America II,” said Virginia Optoelectronics President, Charles Li. “We selected America II because of their worldwide presence and considerable field sales coverage across the US. This is the perfect opportunity to help us extend the VaOpto brand into new markets and provide customers with long-term inventory support.”
With over three billion parts in stock and available to sell at their St. Petersburg facility, America II Electronics has one of the largest inventories in the industry. Specializing in hard-to-find and allocated products, as well as stocking long lead-time semiconductors from the top manufacturers, America II Electronics will now provide even more options for their worldwide customers.
Avago intros HB surface-mount LEDs in tiny PLCC-6 packages
CEATEC JAPAN 2010, TOKYO, JAPAN: Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, has announced a new family of high-brightness LEDs in ultra-small packages at the Combined Exhibition of Advanced Technologies (CEATEC) Japan 2010.
The new ASMT-YTx2 tricolor surface-mount devices are available in 3.4- by 2.8- by 1.8-mm Plastic Leaded Chip Carrier (PLCC)-6 packages. The small footprint, high-brightness performance and robust contrast ratio of the devices all address demand for improved screen resolution in video screens and advertising signs used in transit malls, airports, stadium scoreboards and more, and also target gaming machines and decorative lighting.
Designers are choosing surface-mount LEDs because of their ease of assembly, compact footprint, and manufacturing flexibility, which reduce overall system development costs.
The ASMT-YTx2 surface-mount devices are encapsulated in a heat-resistant silicone material, enabling them to operate in a wide range of environmental conditions with high reliability and long operating life.
The LEDs have six leads that provide flexible color control for each chip to display a multitude of colors, including white. The devices are also water-resistant (compliance with IPx6), which reduces the cost and overall weight of signs by eliminating the need for protective covers.
“The market for indoor and outdoor displays presents a significant growth opportunity for LEDs over the coming years,” said Francis Khor, director of marketing for the Optoelectronics Product Division at Avago. “Avago’s ASMT-YTx2 LEDs are engineered to meet the display market’s demand for reliable high-brightness, high-resolution performance, all at a competitive cost.”
The new ASMT-YTx2 tricolor surface-mount devices are available in 3.4- by 2.8- by 1.8-mm Plastic Leaded Chip Carrier (PLCC)-6 packages. The small footprint, high-brightness performance and robust contrast ratio of the devices all address demand for improved screen resolution in video screens and advertising signs used in transit malls, airports, stadium scoreboards and more, and also target gaming machines and decorative lighting.
Designers are choosing surface-mount LEDs because of their ease of assembly, compact footprint, and manufacturing flexibility, which reduce overall system development costs.
The ASMT-YTx2 surface-mount devices are encapsulated in a heat-resistant silicone material, enabling them to operate in a wide range of environmental conditions with high reliability and long operating life.
The LEDs have six leads that provide flexible color control for each chip to display a multitude of colors, including white. The devices are also water-resistant (compliance with IPx6), which reduces the cost and overall weight of signs by eliminating the need for protective covers.
“The market for indoor and outdoor displays presents a significant growth opportunity for LEDs over the coming years,” said Francis Khor, director of marketing for the Optoelectronics Product Division at Avago. “Avago’s ASMT-YTx2 LEDs are engineered to meet the display market’s demand for reliable high-brightness, high-resolution performance, all at a competitive cost.”
Tuesday, October 5, 2010
Vishay intros TM8 series of MicroTan high-reliability solid tantalum chip capacitors
MALVERN, USA: Vishay Intertechnology Inc. has introduced the new TM8 series of high-reliability, surface-mount tantalum capacitors with very low DC leakage current (DCL) down to 200 nA.
DC leakage levels in early medical device platforms were at tolerable levels; however, lower levels are now required. By utilizing Vishay's proprietary multi-array packaging (MAP), the new TM8 devices realize significant reduction in DC leakage and better stability. Leveraging the patented MAP assembly technology, the TM8 capacitors offer a robust design for the highest possible reliability and efficiency in these applications. In addition, the devices go through rigorous processing and testing patterned after MIL-PRF-55365.
The TM8 series offers a wide range of capacitance-voltage (CV) ratings from 1 microfarad / 40 V to 47 microfarads / 10 V in seven compact case sizes. The capacitors are well suited for long-term performance in critical applications including implantable medical devices, medical instrumentation, and military/aerospace systems. Special screening and custom application-specific options are also available for the TM8 devices.
The devices released today are optimized for filtering, coupling/decoupling, DC blocking, and energy storage applications in medical devices such as pacemakers, ICD, neurological stimulators, hearing aids, and cochlear implants; medical instrumentation including patient monitoring equipment, automated drug administration systems, and imaging and diagnostic equipment; and military and aerospace hybrid microcircuit/multichip modules, smart munitions, GPS systems, sensors, and handheld portable electronic systems.
To ensure reliable, long-term performance in demanding environments, reliability level screening options include a 40-hour burn-in period at 85 deg. C or Weibull grading level B, which screens for a 0.1 % failure rate. Surge current options include option A (10 cycles at + 25 deg. C) and option B (10 cycles at - 55 / + 85 deg. C). Vishay offers a dedicated production facility with highly skilled staff to ensure quality in all phases of production.
The capacitors' compact L, M, N, P, R, T, and W case codes are ideal for space-constrained portable/implantable applications, while their low DCL ensures efficient operation and extended battery life. The TM8's L-shaped terminations allow for superior board mounting and visual inspection (or automated optical inspection) of the solder fillet in the end user's production.
The RoHS-compliant devices feature an operating temperature of - 55 to + 85 deg. C, + 125 deg. C with voltage derating, over a voltage range of 2 WVDC to 40 WVDC.
Offered in tape-and-reel packaging per EIA-481-1, samples and production quantities of the TM8 capacitors are available now, with lead times of 10 weeks for larger orders.
DC leakage levels in early medical device platforms were at tolerable levels; however, lower levels are now required. By utilizing Vishay's proprietary multi-array packaging (MAP), the new TM8 devices realize significant reduction in DC leakage and better stability. Leveraging the patented MAP assembly technology, the TM8 capacitors offer a robust design for the highest possible reliability and efficiency in these applications. In addition, the devices go through rigorous processing and testing patterned after MIL-PRF-55365.
The TM8 series offers a wide range of capacitance-voltage (CV) ratings from 1 microfarad / 40 V to 47 microfarads / 10 V in seven compact case sizes. The capacitors are well suited for long-term performance in critical applications including implantable medical devices, medical instrumentation, and military/aerospace systems. Special screening and custom application-specific options are also available for the TM8 devices.
The devices released today are optimized for filtering, coupling/decoupling, DC blocking, and energy storage applications in medical devices such as pacemakers, ICD, neurological stimulators, hearing aids, and cochlear implants; medical instrumentation including patient monitoring equipment, automated drug administration systems, and imaging and diagnostic equipment; and military and aerospace hybrid microcircuit/multichip modules, smart munitions, GPS systems, sensors, and handheld portable electronic systems.
To ensure reliable, long-term performance in demanding environments, reliability level screening options include a 40-hour burn-in period at 85 deg. C or Weibull grading level B, which screens for a 0.1 % failure rate. Surge current options include option A (10 cycles at + 25 deg. C) and option B (10 cycles at - 55 / + 85 deg. C). Vishay offers a dedicated production facility with highly skilled staff to ensure quality in all phases of production.
The capacitors' compact L, M, N, P, R, T, and W case codes are ideal for space-constrained portable/implantable applications, while their low DCL ensures efficient operation and extended battery life. The TM8's L-shaped terminations allow for superior board mounting and visual inspection (or automated optical inspection) of the solder fillet in the end user's production.
The RoHS-compliant devices feature an operating temperature of - 55 to + 85 deg. C, + 125 deg. C with voltage derating, over a voltage range of 2 WVDC to 40 WVDC.
Offered in tape-and-reel packaging per EIA-481-1, samples and production quantities of the TM8 capacitors are available now, with lead times of 10 weeks for larger orders.
Subscribe to:
Posts (Atom)
