IRVINE, USA: Microsemi Corp., a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, announced that DSCC qualification has been granted on a family of five new surface mount power Schottky diode devices.
These center tap and single diode constructions are designed to meet the rugged demands of high reliability applications. The U3 (SMD-0.5) ceramic package has an ultra efficient thermal path to keep the chip cool.
This enables the Schottky diodes, which unlike conventional rectifiers have little-to-no stored charge, to perform with low power losses in high speed switching circuits.
Features include:
* Schottky barrier construction for instantaneous switching speed.
* New lightweight surface mount hermetic package.
* Military temperature ratings: -65*C to +150*C.
* Low reverse leakage current & forward voltage drop ratings.
* Low thermal resistance
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