Soraa adds several plasma-therm systems to fab

ST. PETERSBURG, USA: Soraa Inc., a leading LED and laser technology company has recently purchased three Plasma-Therm systems to provide plasma deposition and etch steps in their wafer fabrication process.

Founded by pioneering nitride researchers from the University of California at Santa Barbara professors Shuji Nakamura, Steve DenBaars, and Jim Speck, Soraa is developing a new class of LEDs and lasers for application in general lighting and projection display markets.

Led by CEO, Eric Kim, the company is rapidly expanding its US based manufacturing capacity in preparation for volume production.

The three systems purchased include a 790+ RIE, VERSALINE PECVD and VERSALINE ICP. By providing dielectric deposition and metal, dielectric, and active material patterning, they collectively deliver key front-end processing technologies, steps that are critical to the development and production of state-of-the-art photonic devices. Demand for LEDs and lasers continues to increase as they enter mainstream applications that include consumer lighting, displays, biotechnology, defense and industrial among others.

“As engineers apply their skills and knowledge to different semiconductor applications, they often keep the knowledge and experience they have from working with different equipment sets. Positive experiences with Plasma-Therm processing systems have repeatedly led to new orders and continued relationships,” stated Ed Ostan, executive VP of Sales and Marketing.

“The value previously experienced with Plasma-Therm equipment was instrumental in this manufacturer’s decision to purchase Plasma-Therm equipment. Our emphasis on building strong business relationships as well as the proven reliability and support of our systems is a key factor in repeat orders.”

Plasma-Therm, founded in 1974, is a supplier of advanced plasma process equipment offering etch and deposition technologies. Plasma-Therm systems support various specialty markets including solid state lighting, thin film head, MEMS, photomask and compound semiconductor.