DURHAM, USA: At the annual Cree shareholder meeting, Cree chairman and CEO Chuck Swoboda demonstrated an A-lamp LED light bulb with the highest lumen output and efficacy reported in the industry. The bulb produces 969 lumens at an impressive 102 lumens per watt, which is the light output equivalent to a 65-watt incandescent bulb, yet it uses only 9.5 watts.
The demonstration A-19-style bulb features the latest Cree production XLamp(R) XP-G LEDs and TrueWhite Technology, a patented method of delivering warm-white light with superior color rendering and efficiency. It delivers a 2800 K warm-white light with a 91 CRI. All data was verified by third-party testing under steady-state operating conditions.
"We are pushing the industry by demonstrating what's possible," said Swoboda. "With every improvement in LED components, new applications become achievable. We are excited to show the world not only what can be done, but what they should expect in an LED light bulb."
Friday, October 30, 2009
RFMD intros portfolio of ultra-linear push-pull amplifiers for multiple CATV infrastructure apps
DENVER, USA: RF Micro Devices Inc. has introduced a portfolio of push-pull amplifiers designed for multiple CATV infrastructure applications. The CGA/CGR product portfolio includes the CGA-1518Z and CGA-7718Z amplifiers for forward path, downstream applications and the CGR-0118Z and CGR-0218Z amplifiers for return path, upstream applications.
Each amplifier in RFMD's CGA/CGR product portfolio leverages the Company's proprietary HBT8D InGaP HBT process technology, combined with "push-pull" architecture, to deliver best-in-class Composite Second Order (CSO) distortion performance.
RFMD's push-pull amplifiers are designed for ultra-linear amplification in current and next generation CATV applications, including multiple dwelling unit (MDU) amplifiers, low cost line extenders (LE), and customer premises equipment (CPE).
The CGA-1518Z matches the gain of competing +12 Vdc push-pull amplifiers with lower multi-carrier distortion and a reduction of > 1.5 Watt in DC power consumption. The CGA-7718Z offers higher gain and lower multi-carrier distortion performance than the CGA-1518Z while consuming 1 Watt less DC power than competing +12Vdc push-pull amplifiers.
The CGA-1518Z and CGA-7718Z push-pull amplifiers are ideal for applications that require superior broadband amplification and must conserve DC power, such as CPE, MDUs and battery back-up cable and telephone networks carrying voice, data, and video.
The CGR-0118Z offers the broadband industry's only 25-dB gain surface mount device (SMD) return path amplifier capable of ultra-linear +50 dBmV RF output per channel performance from 5 to 65 MHz combined with low multi-carrier distortion, excellent modulation error ratio (MER) and low DC power consumption.
The CGR-0218Z provides unmatched 5 to 210 MHz bandwidth for ultra-linear return path applications requiring a SMD package, making it ready now for "mid-split" return path architectures and "future proof" for soon-to-be-implemented DOCSIS(R) 3.0 compliant 5 to 85 MHz return path networks. The CGR-0118Z and CGR-0218Z meet the performance requirements demanded by channel bonding capable return path networks, MDU class return amplifiers, and CPE cable modems.
RFMD leads the world in III-V semiconductor technology innovation and is the world's leading manufacturer of GaAs HBT and InGaP HBT process technologies.
Production quantities of the CGR-0118Z, CGR-0218Z, CGA-1518Z and CGA-7718Z are available immediately.
Each amplifier in RFMD's CGA/CGR product portfolio leverages the Company's proprietary HBT8D InGaP HBT process technology, combined with "push-pull" architecture, to deliver best-in-class Composite Second Order (CSO) distortion performance.
RFMD's push-pull amplifiers are designed for ultra-linear amplification in current and next generation CATV applications, including multiple dwelling unit (MDU) amplifiers, low cost line extenders (LE), and customer premises equipment (CPE).
The CGA-1518Z matches the gain of competing +12 Vdc push-pull amplifiers with lower multi-carrier distortion and a reduction of > 1.5 Watt in DC power consumption. The CGA-7718Z offers higher gain and lower multi-carrier distortion performance than the CGA-1518Z while consuming 1 Watt less DC power than competing +12Vdc push-pull amplifiers.
The CGA-1518Z and CGA-7718Z push-pull amplifiers are ideal for applications that require superior broadband amplification and must conserve DC power, such as CPE, MDUs and battery back-up cable and telephone networks carrying voice, data, and video.
The CGR-0118Z offers the broadband industry's only 25-dB gain surface mount device (SMD) return path amplifier capable of ultra-linear +50 dBmV RF output per channel performance from 5 to 65 MHz combined with low multi-carrier distortion, excellent modulation error ratio (MER) and low DC power consumption.
The CGR-0218Z provides unmatched 5 to 210 MHz bandwidth for ultra-linear return path applications requiring a SMD package, making it ready now for "mid-split" return path architectures and "future proof" for soon-to-be-implemented DOCSIS(R) 3.0 compliant 5 to 85 MHz return path networks. The CGR-0118Z and CGR-0218Z meet the performance requirements demanded by channel bonding capable return path networks, MDU class return amplifiers, and CPE cable modems.
RFMD leads the world in III-V semiconductor technology innovation and is the world's leading manufacturer of GaAs HBT and InGaP HBT process technologies.
Production quantities of the CGR-0118Z, CGR-0218Z, CGA-1518Z and CGA-7718Z are available immediately.
Thursday, October 29, 2009
LED chip supply couldn’t meet demand till earlier quarter next year
TAIWAN: LEDinside, the LED research institution, points out that chip supply hasn’t ramped up in time, and demand has not been met. LEDinside projects that the prices in Q4 will likely remain flat amid the supply shortage. Same with prices in white LED, the situation will maintain before the 1st quarter in 2010.
In Q3, the rapid upturn trend of LED-backlit applications in NB and TV stimulate chip shortage and stabilize its price. White LED prices also only see a slightly dip.
According to LEDinside statistics, high-power LED with efficiency upon 80 Lm/W earns better demand while the international leading suppliers mostly take its market share, and the prices are quite resilient. These high-power LEDs are priced at $1.5-$2 in Q3, falling slightly by 4 percent.
As the high-power LEDs with luminance efficacy of 60-70Lm/W are mature products with more abundant supply, their price drops were more substantial, down 8 percent QoQ, to $0.6~$1.1.
LEDinside adds that the strong demand of LEDs for large-sized backlight applications and general lighting purposes has caused a strain in the LED chip supply chain, and thus also stabilized the price of white LEDs; this was particularly evident in LED backlights for TVs -– not only were LED chips in short supply, white-LEDs also faced shortages.
In light of the above, LED prices will likely sustain. Yet, if we look into new application segments in the future, in order to expand the application of LED backlight, such as in monitors, LED prices may need to reduce more drastically to compete with that of CCFL.
LEDinside reported that in Q3, the penetration of LED backlight in notebooks has increased dramatically, thanks to NB brand vendors’ aggressive promotion. It is forecast that the penetration rate for the whole year will reach 52 percent.
Japanese LED makers are still the primary supplier for LED chips used in notebooks, and Nichia currently dominates the supply. The mainstream specification of LED for notebooks is between 2000 to 2300mcd, with prices ranging from $0.07 to $0.12. Due to short supply of high-brightness (In)GaN chips, and price strategy of Japanese chip makers, price of white LED used in notebooks only fell by 5 percent in Q3.
As for LED backlight in Netbooks, the current mainstream specification is between 1800 to 2000mcd, priced around $0.05-$0.07, a 10 percent decline in 3Q09. Despite its robust demand, the significant price drop was attributed to the aggressive sales promotion in China.
The increase in smartphone shipments not only improved the brightness requirement of LEDs, but also increased the shipment of LEDs for mobile applications. Moreover, LED chip shortage affected the supply chain, thus eased LED packager’s pressure to cut prices of white LEDs. In Q3, the price was between $0.03~0.07 with a 5 percent slide.
Despite the rapid improvements in its efficiency, prices of high power LEDs still saw a moderate drop. As upstream chip makers shifted their capacity to produce more mid-power LEDs because of the rising demand in TV backlight, supply of high-power LEDs was affected as a result; therefore, prices of high-power LEDs maintained in Q3.
Source: LEDinside
In Q3, the rapid upturn trend of LED-backlit applications in NB and TV stimulate chip shortage and stabilize its price. White LED prices also only see a slightly dip.
According to LEDinside statistics, high-power LED with efficiency upon 80 Lm/W earns better demand while the international leading suppliers mostly take its market share, and the prices are quite resilient. These high-power LEDs are priced at $1.5-$2 in Q3, falling slightly by 4 percent.
As the high-power LEDs with luminance efficacy of 60-70Lm/W are mature products with more abundant supply, their price drops were more substantial, down 8 percent QoQ, to $0.6~$1.1.
LEDinside adds that the strong demand of LEDs for large-sized backlight applications and general lighting purposes has caused a strain in the LED chip supply chain, and thus also stabilized the price of white LEDs; this was particularly evident in LED backlights for TVs -– not only were LED chips in short supply, white-LEDs also faced shortages.
In light of the above, LED prices will likely sustain. Yet, if we look into new application segments in the future, in order to expand the application of LED backlight, such as in monitors, LED prices may need to reduce more drastically to compete with that of CCFL.
LEDinside reported that in Q3, the penetration of LED backlight in notebooks has increased dramatically, thanks to NB brand vendors’ aggressive promotion. It is forecast that the penetration rate for the whole year will reach 52 percent.
Japanese LED makers are still the primary supplier for LED chips used in notebooks, and Nichia currently dominates the supply. The mainstream specification of LED for notebooks is between 2000 to 2300mcd, with prices ranging from $0.07 to $0.12. Due to short supply of high-brightness (In)GaN chips, and price strategy of Japanese chip makers, price of white LED used in notebooks only fell by 5 percent in Q3.
As for LED backlight in Netbooks, the current mainstream specification is between 1800 to 2000mcd, priced around $0.05-$0.07, a 10 percent decline in 3Q09. Despite its robust demand, the significant price drop was attributed to the aggressive sales promotion in China.
The increase in smartphone shipments not only improved the brightness requirement of LEDs, but also increased the shipment of LEDs for mobile applications. Moreover, LED chip shortage affected the supply chain, thus eased LED packager’s pressure to cut prices of white LEDs. In Q3, the price was between $0.03~0.07 with a 5 percent slide.
Despite the rapid improvements in its efficiency, prices of high power LEDs still saw a moderate drop. As upstream chip makers shifted their capacity to produce more mid-power LEDs because of the rising demand in TV backlight, supply of high-power LEDs was affected as a result; therefore, prices of high-power LEDs maintained in Q3.
Source: LEDinside
CXR Larus releases CXRPro GUI and DigiTime NTPv4/PTP IEEE-1588v2 modules for StarClock TiemPo 6400 timing platform
SAN JOSE, USA: CXR Larus, a leading manufacturer of advanced traditional and Next Generation timing and network access solutions, announced the availability of both the integrated CXRPro Graphical User Interface (GUI) and the accessory DigiTime Network Time Protocol (NTPv4)/ Precision Time Protocol (PTP) IEEE-1588v2 Module for the industry leading StarClock TiemPo 6400 Timing and Synchronization platform.
The http web browser based CXRPro GUI makes configuration, maintenance, and management of the TiemPo easier than ever, while the new DigiTime Module provides the TiemPo with advanced Network Time Server or PTP Grandmaster Clock timestamping capabilities far superior than competitive solutions costing much more.
Regarding the new releases, Larry Taillie, President of CXR Larus Corporation commented: “CXR Larus works continuously to ensure our flagship StarClock TiemPo 6400 stays well ahead of the competition in all respects. The “one-two punch” release of these new accessories after exhaustive beta and field testing shows our commitment to that philosophy, and proves again that we have the most versatile and cost effective timing solution for both traditional and IP based Next Generation networks.”
StarClock TiemPo 6400s equipped with either the CXRPro GUI and/or the DigiTime NTPv4/IEEE-1588v2 Modules are ready for immediate delivery. Existing customers can send their TiemPo timing systems to the factory for upgrades to the latest platform for a nominal fee.
The http web browser based CXRPro GUI makes configuration, maintenance, and management of the TiemPo easier than ever, while the new DigiTime Module provides the TiemPo with advanced Network Time Server or PTP Grandmaster Clock timestamping capabilities far superior than competitive solutions costing much more.
Regarding the new releases, Larry Taillie, President of CXR Larus Corporation commented: “CXR Larus works continuously to ensure our flagship StarClock TiemPo 6400 stays well ahead of the competition in all respects. The “one-two punch” release of these new accessories after exhaustive beta and field testing shows our commitment to that philosophy, and proves again that we have the most versatile and cost effective timing solution for both traditional and IP based Next Generation networks.”
StarClock TiemPo 6400s equipped with either the CXRPro GUI and/or the DigiTime NTPv4/IEEE-1588v2 Modules are ready for immediate delivery. Existing customers can send their TiemPo timing systems to the factory for upgrades to the latest platform for a nominal fee.
RFMD intros RFFC0085 frequency converter IC
DENVER, USA: RF Micro Devices Inc. has introduced the RFFC0085 frequency converter IC. The CMOS-based RFFC0085 frequency converter IC is designed for use as an Out-of-Band (OOB) receive circuit tuner in cable industry and SATCOM-DBS set-top boxes, DOCSIS(R) Set-Top Gateways, OpenCable Application Platform (OCAP) CableCards, Tru2Way(TM) products and CableCard-equipped HDTVs.
The RFFC0085, which consists of an input AGC amplifier, mixer and a video/AGC amplifier, delivers optimum performance with low power consumption and low distortion. The RFFC0085 delivers a >50% reduction in DC power dissipation and a 55 percent or greater reduction in printed circuit board assembly (PCBA) area, versus competitive solutions.
With +3.3VDC, it operates in its market segment's smallest package (3x3 mm QFN-16) with higher conversion gain and lower DC power dissipation than +5VDC tuners. The frequency converter's small footprint, combined with its industry-lowest external component count, make the RFFC0085 the ideal OOB receive circuit solution for space-constrained applications. This enables the cost-effective size reduction of consumer premises equipment (CPE), such as super-thin flat panel HDTVs and PCs.
The RFFC0085 is shipping in volume today and samples are available for immediate delivery.
The RFFC0085, which consists of an input AGC amplifier, mixer and a video/AGC amplifier, delivers optimum performance with low power consumption and low distortion. The RFFC0085 delivers a >50% reduction in DC power dissipation and a 55 percent or greater reduction in printed circuit board assembly (PCBA) area, versus competitive solutions.
With +3.3VDC, it operates in its market segment's smallest package (3x3 mm QFN-16) with higher conversion gain and lower DC power dissipation than +5VDC tuners. The frequency converter's small footprint, combined with its industry-lowest external component count, make the RFFC0085 the ideal OOB receive circuit solution for space-constrained applications. This enables the cost-effective size reduction of consumer premises equipment (CPE), such as super-thin flat panel HDTVs and PCs.
The RFFC0085 is shipping in volume today and samples are available for immediate delivery.
Wednesday, October 28, 2009
Tektronix adds MIPI support to DPO7000 series oscilloscopes
BANGALORE, INDIA: Tektronix Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, announced a series of enhancements to its popular DPO7000 Series Oscilloscopes, including support for the Mobile Industry Processor Interface (MIPI) D-PHY standard and new UART/RS-232 protocol analysis software.
Additionally, the DPO7000 Series now includes four passive probes and three analysis tools as part of standard configurations.
The MIPI D-PHY specification is gaining in use by manufacturers of wireless mobile devices as the communications bus across main components such as embedded controllers, cameras and displays.
The specification helps device manufacturers reduce time-to-market and device integration costs while taking advantage of richer feature sets with higher bit rates. By offering D-PHY characterization, compliance testing and debug in the DPO7000 Series, Tektronix delivers new and expanded test solutions for more efficiently implementing designs that include this important bus.
The new Tektronix MIPI solution (Option D-PHY) includes automated setup library and methods of implementation (MOI) for testing the D-PHY physical layer standard. Implemented on the DPO7000 Series, this new setup library for DPOJET jitter analysis software includes complete real-time scope measurements listed in the latest D-PHY conformance test spec (CTS).
Compared to other more limited alternatives on the market, the Tektronix solution allows users to perform a full range of tests from verification and pre-compliance testing to more in-depth characterization, with custom limits. The test reports provide comprehensive details of numerous parameters in each measurement. Further, Tektronix MIPI solution is scalable for early start on next generation of MIPI standards, such as M-PHY.
With the DPO7000 triggering capabilities for RS232 and the new UART/RS-232 Protocol Analysis Software (PDU-R), engineers can quickly link decoded data to captured waveforms by selecting data in a result table. This can save significant time for debug and verification tasks tied to these popular legacy standards.
“As demonstrated by these new capabilities, we are continuing to make steady enhancements to the world’s most popular Windows-based performance oscilloscopes, the DPO7000 Series, that bring more value to our customers,” said Brian Reich, vice president, Performance Oscilloscopes, Tektronix. “We’re providing more advanced capabilities out of the box, support for new standards and time-saving tools for debug and verification.”
In addition to boosting DPO7000 Series capabilities, Tektronix is also increasing value with the inclusion of four passive probes and three popular analysis tools including Waveform Limit Test, Advanced Search & Mark and Jitter Essentials. Tektronix is the first Windows-based oscilloscope vendor to provide this as part of a standard offering.
The new MIPI D-PHY and UART/RS-232 options are available now for the DPO7000 Series and DPO/DSA70000B Series. The new MIPI solution is available on the new MSO70000 Series as well.
Additionally, the DPO7000 Series now includes four passive probes and three analysis tools as part of standard configurations.
The MIPI D-PHY specification is gaining in use by manufacturers of wireless mobile devices as the communications bus across main components such as embedded controllers, cameras and displays.
The specification helps device manufacturers reduce time-to-market and device integration costs while taking advantage of richer feature sets with higher bit rates. By offering D-PHY characterization, compliance testing and debug in the DPO7000 Series, Tektronix delivers new and expanded test solutions for more efficiently implementing designs that include this important bus.
The new Tektronix MIPI solution (Option D-PHY) includes automated setup library and methods of implementation (MOI) for testing the D-PHY physical layer standard. Implemented on the DPO7000 Series, this new setup library for DPOJET jitter analysis software includes complete real-time scope measurements listed in the latest D-PHY conformance test spec (CTS).
Compared to other more limited alternatives on the market, the Tektronix solution allows users to perform a full range of tests from verification and pre-compliance testing to more in-depth characterization, with custom limits. The test reports provide comprehensive details of numerous parameters in each measurement. Further, Tektronix MIPI solution is scalable for early start on next generation of MIPI standards, such as M-PHY.
With the DPO7000 triggering capabilities for RS232 and the new UART/RS-232 Protocol Analysis Software (PDU-R), engineers can quickly link decoded data to captured waveforms by selecting data in a result table. This can save significant time for debug and verification tasks tied to these popular legacy standards.
“As demonstrated by these new capabilities, we are continuing to make steady enhancements to the world’s most popular Windows-based performance oscilloscopes, the DPO7000 Series, that bring more value to our customers,” said Brian Reich, vice president, Performance Oscilloscopes, Tektronix. “We’re providing more advanced capabilities out of the box, support for new standards and time-saving tools for debug and verification.”
In addition to boosting DPO7000 Series capabilities, Tektronix is also increasing value with the inclusion of four passive probes and three popular analysis tools including Waveform Limit Test, Advanced Search & Mark and Jitter Essentials. Tektronix is the first Windows-based oscilloscope vendor to provide this as part of a standard offering.
The new MIPI D-PHY and UART/RS-232 options are available now for the DPO7000 Series and DPO/DSA70000B Series. The new MIPI solution is available on the new MSO70000 Series as well.
NXP and Avni Energy Solutions to develop LED based street lighting solutions for India
BANGALORE, INDIA: NXP Semiconductors and Avni Energy Solutions Pvt. Ltd. have collaborated to develop innovative Light Emitting Diode (LED) based street lighting solutions for India that can replace the commonly used high-pressure sodium vapour lamps which consume substantially more electricity.
The LED street light installations have been deployed by the Tirupati and Pulivendula Municipal Corporations in the state of Andhra Pradesh. This lighting solution is based on NXP’s SSL1750 SMPS controller IC, a highly integrated IC and part of NXP’s GreenChip product portfolio that has helped achieve power savings in the range of 60-70 percent over the traditional lamps used, resulting in lower operating costs.
The pilot project was recently implemented in Andhra Pradesh, entailing the installation of 400 lamp posts in Pulivendula and 250 lamp posts in Tirupati respectively.
These lamps contain a set of 35–56 LEDs per panel (lamp), and consume between 50–70W of electricity. Furthermore, the NXP solution enables the flow of current to be accurately controlled, allowing for unprecedented dimming capabilities that save additional energy during periods when there is little or no traffic.
The SSL1750 IC offers a high level of integration that enables lighting manufacturers to create high-quality LEDs, maximizing energy efficiency and minimizing form factor through reduced heat generation, thereby enabling cost-effective power supply designs and extended lifetimes beyond 50,000 hours.
This solution has the potential to reduce carbon emissions by up to 115kg per lamp per year, and save approximately 160 W of power per lamp, which is enough to light up almost four homes using CFLs.
To illustrate the potential of this solution, replacing 5 million existing sodium vapour lamps equates to the power required to light up 20 million homes, which is a significant saving considering the acute power shortages in India. In addition, 5 million LED street lamps would reduce carbon emissions by 575,000 tonnes per year.
The market for LED lighting is expected to grow significantly in coming years. According to industry estimates, there is potential demand for up to 5 million units per state for street lighting solutions in India.
The lighting industry is going through some major changes driven largely by concerns over climate change and the desire to use energy resources more efficiently. There are ongoing efforts driven by governments, civic bodies and utilities to serve the public with better lighting and reduce carbon footprints while reducing energy costs.
Both governments and consumers are looking towards more efficient lighting options such as compact-fluorescent lamps (CFLs) and solid-state-lighting (SSL) to achieve these savings.
Ashok Chandak, senior director, global sales and marketing, NXP Semiconductors said: "The switch to low-energy solid state lighting is now a top priority for governments and enterprises across the world. The LED based street lighting solutions implemented in Andhra Pradesh is a case in point and illustrates the use of innovative semiconductor technologies to significantly help ease the burden that civic authorities face with regards to energy usage and maintenance of illuminated highways and streets.
"Using the NXP solution, sufficient lighting can now be maintained while operating at significantly lower levels of electrical consumption, without the authorities having to switch off street lighting (which creates safety hazards) to save energy consumption."
"NXP is indeed one of the first semiconductor companies to identify the importance of energy-efficient lighting, and has made lighting a focus for more than 15 years," added Chandak while launching the campaign to bring light to millions of homes and reduce our carbon footprint through the use of innovative lighting technology solutions.
Kiran Kumar Reddy, Managing Director, Avni Energy Solutions remarked: “We are pleased to partner with NXP, which has supported us in closely developing a highly competitive and energy-efficient solution based on Solid State Lighting technologies.
"SSL1750 is a highly innovative and integrated solution that allows cost-effective power supply designs and significant power factor correction in the range of 0.9 - 0.95*, which leads the industry in terms of efficiency. The functionalities available in this solution will help us garner a competitive edge in our product portfolio."
To date, NXP has sold over 300 million fluorescent lighting driver ICs, helping to save an estimated 500 million kg of CO2 per year, compared with more traditional lighting solutions.
As one of the first semiconductor companies to recognize the growing importance of energy-efficient lighting, NXP has been active in the development of ballast control and driver ICs since 1992, supporting the development of solutions for all markets – from residential, office, retail and architectural lighting, to lighting for cars, streets and roads.
The LED street light installations have been deployed by the Tirupati and Pulivendula Municipal Corporations in the state of Andhra Pradesh. This lighting solution is based on NXP’s SSL1750 SMPS controller IC, a highly integrated IC and part of NXP’s GreenChip product portfolio that has helped achieve power savings in the range of 60-70 percent over the traditional lamps used, resulting in lower operating costs.
The pilot project was recently implemented in Andhra Pradesh, entailing the installation of 400 lamp posts in Pulivendula and 250 lamp posts in Tirupati respectively.
These lamps contain a set of 35–56 LEDs per panel (lamp), and consume between 50–70W of electricity. Furthermore, the NXP solution enables the flow of current to be accurately controlled, allowing for unprecedented dimming capabilities that save additional energy during periods when there is little or no traffic.
The SSL1750 IC offers a high level of integration that enables lighting manufacturers to create high-quality LEDs, maximizing energy efficiency and minimizing form factor through reduced heat generation, thereby enabling cost-effective power supply designs and extended lifetimes beyond 50,000 hours.
This solution has the potential to reduce carbon emissions by up to 115kg per lamp per year, and save approximately 160 W of power per lamp, which is enough to light up almost four homes using CFLs.
To illustrate the potential of this solution, replacing 5 million existing sodium vapour lamps equates to the power required to light up 20 million homes, which is a significant saving considering the acute power shortages in India. In addition, 5 million LED street lamps would reduce carbon emissions by 575,000 tonnes per year.
The market for LED lighting is expected to grow significantly in coming years. According to industry estimates, there is potential demand for up to 5 million units per state for street lighting solutions in India.
The lighting industry is going through some major changes driven largely by concerns over climate change and the desire to use energy resources more efficiently. There are ongoing efforts driven by governments, civic bodies and utilities to serve the public with better lighting and reduce carbon footprints while reducing energy costs.
Both governments and consumers are looking towards more efficient lighting options such as compact-fluorescent lamps (CFLs) and solid-state-lighting (SSL) to achieve these savings.
Ashok Chandak, senior director, global sales and marketing, NXP Semiconductors said: "The switch to low-energy solid state lighting is now a top priority for governments and enterprises across the world. The LED based street lighting solutions implemented in Andhra Pradesh is a case in point and illustrates the use of innovative semiconductor technologies to significantly help ease the burden that civic authorities face with regards to energy usage and maintenance of illuminated highways and streets.
"Using the NXP solution, sufficient lighting can now be maintained while operating at significantly lower levels of electrical consumption, without the authorities having to switch off street lighting (which creates safety hazards) to save energy consumption."
"NXP is indeed one of the first semiconductor companies to identify the importance of energy-efficient lighting, and has made lighting a focus for more than 15 years," added Chandak while launching the campaign to bring light to millions of homes and reduce our carbon footprint through the use of innovative lighting technology solutions.
Kiran Kumar Reddy, Managing Director, Avni Energy Solutions remarked: “We are pleased to partner with NXP, which has supported us in closely developing a highly competitive and energy-efficient solution based on Solid State Lighting technologies.
"SSL1750 is a highly innovative and integrated solution that allows cost-effective power supply designs and significant power factor correction in the range of 0.9 - 0.95*, which leads the industry in terms of efficiency. The functionalities available in this solution will help us garner a competitive edge in our product portfolio."
To date, NXP has sold over 300 million fluorescent lighting driver ICs, helping to save an estimated 500 million kg of CO2 per year, compared with more traditional lighting solutions.
As one of the first semiconductor companies to recognize the growing importance of energy-efficient lighting, NXP has been active in the development of ballast control and driver ICs since 1992, supporting the development of solutions for all markets – from residential, office, retail and architectural lighting, to lighting for cars, streets and roads.
RFMD releases industry's first 'green' GaN CATV amplifier module portfolio
DENVER, USA: RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency systems and solutions, has released the industry's first "green" gallium nitride (GaN) based CATV amplifier modules.
The D10040200PL1 and D10040230PL1 are designed for use as power doubler amplifiers in current and next generation CATV infrastructure applications.
The D10040200PL1 and D10040230PL1 are hybrid power doubler amplifier modules designed to provide the final amplifier stage for CATV trunk amplifiers, line extenders, and optical nodes.
The parts employ GaAs pHEMT and GaN HEMT die and operate from 45 MHz to 1000 MHz. They provide high output capability, excellent linearity and superior return loss performance with low noise and optimal reliability. With low current and extremely low distortion, the D10040200PL1 and D10040230PL1 are unconditionally stable under all terminations.
The performance of this new family of CATV amplifiers is on par with other industry-leading GaAs CATV Power Doublers, also supplied by RFMD, but with 20% lower current consumption (24V/380mA).
With these "green" energy-saving benefits, these products enable designers to fulfill growing requirements for lower energy consumption and assist network operators in their drive to reduce the overall cost of operating CATV networks. The D10040200PL1 and D10040230PL1 are the best performing low-current CATV power doubler amplifiers on the market today.
Bob Van Buskirk, president of RFMD's Multi-Market Products Group (MPG), said: "Network operators worldwide are increasingly focused on reducing the energy costs of operating their wireless and wireline networks. RFMD's high-performance GaN technology satisfies the industry's drive for "green technology" by enabling advanced RF components and products that provide industry-leading power and operate at significantly lower power consumption levels."
RFMD leads the world in III-V semiconductor technology innovation and was first to introduce GaN CATV amplifier modules, with the launch of the D10040200PH1 and D10040230PH1 high output GaN power doubler CATV amplifier modules in June 2008.
Production quantities of D10040200PL1 and D10040230PL1 are available immediately.
The D10040200PL1 and D10040230PL1 are designed for use as power doubler amplifiers in current and next generation CATV infrastructure applications.
The D10040200PL1 and D10040230PL1 are hybrid power doubler amplifier modules designed to provide the final amplifier stage for CATV trunk amplifiers, line extenders, and optical nodes.
The parts employ GaAs pHEMT and GaN HEMT die and operate from 45 MHz to 1000 MHz. They provide high output capability, excellent linearity and superior return loss performance with low noise and optimal reliability. With low current and extremely low distortion, the D10040200PL1 and D10040230PL1 are unconditionally stable under all terminations.
The performance of this new family of CATV amplifiers is on par with other industry-leading GaAs CATV Power Doublers, also supplied by RFMD, but with 20% lower current consumption (24V/380mA).
With these "green" energy-saving benefits, these products enable designers to fulfill growing requirements for lower energy consumption and assist network operators in their drive to reduce the overall cost of operating CATV networks. The D10040200PL1 and D10040230PL1 are the best performing low-current CATV power doubler amplifiers on the market today.
Bob Van Buskirk, president of RFMD's Multi-Market Products Group (MPG), said: "Network operators worldwide are increasingly focused on reducing the energy costs of operating their wireless and wireline networks. RFMD's high-performance GaN technology satisfies the industry's drive for "green technology" by enabling advanced RF components and products that provide industry-leading power and operate at significantly lower power consumption levels."
RFMD leads the world in III-V semiconductor technology innovation and was first to introduce GaN CATV amplifier modules, with the launch of the D10040200PH1 and D10040230PH1 high output GaN power doubler CATV amplifier modules in June 2008.
Production quantities of D10040200PL1 and D10040230PL1 are available immediately.
Tuesday, October 27, 2009
Small/medium LCD market set for Q4 slowdown
EL SEGUNDO, USA: The last six months have been very strong for small/medium LCD panels mainly used in cell phones—but suppliers don’t expect the good times to last in the fourth quarter, spurring them to slow production and restrain inventories, according to iSuppli Corp.
Unit shipments from the top Taiwanese suppliers, which are growing to account for a significant portion of the small/medium display business, rose by 53.1 percent in the second quarter of 2009 compared to the first quarter.
During the first two months of the third quarter of 2009, these panel suppliers achieved 93 percent of the shipments they made for the entire third quarter of 2008.
The worldwide Average Selling Price (ASP) for small/medium displays rose to $11.40 at the end of the third quarter in September, up 1.3 percent from $11.20 at the end of the second quarter in June.
However, growth is decelerating in the fourth quarter, with iSuppli’s August forecast calling for a scant 0.2 percent rise in global revenue. This is causing small/medium display manufacturers to become more cautious in their approach to the market.
“Suppliers are preparing for what they believe will be a deceleration in demand in the fourth quarter, traditionally a slower period because of the end of the holiday buying rush,” said Vinita Jakhanwal, principal analyst for small and medium displays at iSuppli.
“Demand in the third quarter was boosted as tier-1 OEMs pulled in orders for the holiday season. This means that some orders that might have been placed in the fourth quarter occurred in the third quarter instead. Demand also was fueled by the arrival of the Chinese Golden Week. Given these factors, combined with ongoing economic concerns, panel suppliers in the fourth quarter are reducing capacity and keeping a tight reign on inventories in order to stabilize prices.”
The figure presents monthly ASPs for small/medium displays worldwide. iSuppli defines small/medium displays as those having a diagonal dimension of less than 10 inches.
Source: iSuppli, Oct. 2009
Strong August
In the small- to medium-sized display sector, panel shipments rose for most suppliers in August, but declined for three of the seven Taiwanese suppliers that iSuppli tracks on a monthly basis.
However, the drop suffered by these three suppliers was not due to any inherent weakness on their part. Rather, it was mainly because of the large numbers reported in July, which made August appear weak in comparison for these specific suppliers.
Overall, August shipments were strong compared to the earlier months. Also boosting Taiwanese supplier shipments was the strong demand for non-mobile medium-sized panels, which are used in low-cost netbook PCs, portable DVD players and Digital Photo Frames (DPFs).
The strong results experienced by the Taiwanese did not apply to Japanese LCD suppliers, which are being impacted by the slowdown in demand for mobile-phone displays. Financial restructuring among the Japanese, the closing of their old fabs and their reliance on Tier-1 OEMs will lead to about a 9 percent decline in shipments from Japan in 2009.
Source: iSuppli, USA
Unit shipments from the top Taiwanese suppliers, which are growing to account for a significant portion of the small/medium display business, rose by 53.1 percent in the second quarter of 2009 compared to the first quarter.
During the first two months of the third quarter of 2009, these panel suppliers achieved 93 percent of the shipments they made for the entire third quarter of 2008.
The worldwide Average Selling Price (ASP) for small/medium displays rose to $11.40 at the end of the third quarter in September, up 1.3 percent from $11.20 at the end of the second quarter in June.
However, growth is decelerating in the fourth quarter, with iSuppli’s August forecast calling for a scant 0.2 percent rise in global revenue. This is causing small/medium display manufacturers to become more cautious in their approach to the market.
“Suppliers are preparing for what they believe will be a deceleration in demand in the fourth quarter, traditionally a slower period because of the end of the holiday buying rush,” said Vinita Jakhanwal, principal analyst for small and medium displays at iSuppli.
“Demand in the third quarter was boosted as tier-1 OEMs pulled in orders for the holiday season. This means that some orders that might have been placed in the fourth quarter occurred in the third quarter instead. Demand also was fueled by the arrival of the Chinese Golden Week. Given these factors, combined with ongoing economic concerns, panel suppliers in the fourth quarter are reducing capacity and keeping a tight reign on inventories in order to stabilize prices.”
The figure presents monthly ASPs for small/medium displays worldwide. iSuppli defines small/medium displays as those having a diagonal dimension of less than 10 inches.
Source: iSuppli, Oct. 2009Strong August
In the small- to medium-sized display sector, panel shipments rose for most suppliers in August, but declined for three of the seven Taiwanese suppliers that iSuppli tracks on a monthly basis.
However, the drop suffered by these three suppliers was not due to any inherent weakness on their part. Rather, it was mainly because of the large numbers reported in July, which made August appear weak in comparison for these specific suppliers.
Overall, August shipments were strong compared to the earlier months. Also boosting Taiwanese supplier shipments was the strong demand for non-mobile medium-sized panels, which are used in low-cost netbook PCs, portable DVD players and Digital Photo Frames (DPFs).
The strong results experienced by the Taiwanese did not apply to Japanese LCD suppliers, which are being impacted by the slowdown in demand for mobile-phone displays. Financial restructuring among the Japanese, the closing of their old fabs and their reliance on Tier-1 OEMs will lead to about a 9 percent decline in shipments from Japan in 2009.
Source: iSuppli, USA
ON Semiconductor offers high-density Trench MOSFETs
PHOENIX, USA: ON Semiconductor, a leading global supplier of high performance, energy efficient, silicon solutions, has introduced 24 new 30 volt (V), N-channel Trench MOSFETs in DPAK, SO-8FL, µ8FL, and SOIC-8 packages featuring enhanced switching performance for synchronous buck converters in computing and game console applications.
The new series of MOSFETs utilize ON Semiconductor’s proven Trench technology to deliver superior on-state resistance [RDS(on)] and improved switching performance for synchronous DC-to-DC converters in PC, server, game console, VRM and point-of-load applications. DPAK, SO-8FL and SOIC-8 package solutions –- which are a drop-in replacement for NTD48x, NTMFS48x and NTMS48x series – and the new µ8FL 3.3 mm x 3.3 mm solution achieve industry-leading low RDS(on) in relation to packaging size.
“Power management design engineers in the computing and gaming segments can improve overall efficiency by using ON Semiconductor’'s newest 30 volt Trench MOSFET solutions,” said Paul Leonard, ON Semiconductor vice president and general manager of Power MOSFET products. “We utilized our expertise in power management and packaging technology to provide our customers with multiple solutions to meet design challenges such as improving efficiencies and saving space.”
ON Semiconductor'’s new MOSFETs feature optimized low gate charge and RDS(on) to improve switching performance and overall system efficiency in an advanced packaging portfolio. All devices are lead-free (Pb-free), Halogen free, and RoHs compliant.
The new series of MOSFETs utilize ON Semiconductor’s proven Trench technology to deliver superior on-state resistance [RDS(on)] and improved switching performance for synchronous DC-to-DC converters in PC, server, game console, VRM and point-of-load applications. DPAK, SO-8FL and SOIC-8 package solutions –- which are a drop-in replacement for NTD48x, NTMFS48x and NTMS48x series – and the new µ8FL 3.3 mm x 3.3 mm solution achieve industry-leading low RDS(on) in relation to packaging size.
“Power management design engineers in the computing and gaming segments can improve overall efficiency by using ON Semiconductor’'s newest 30 volt Trench MOSFET solutions,” said Paul Leonard, ON Semiconductor vice president and general manager of Power MOSFET products. “We utilized our expertise in power management and packaging technology to provide our customers with multiple solutions to meet design challenges such as improving efficiencies and saving space.”
ON Semiconductor'’s new MOSFETs feature optimized low gate charge and RDS(on) to improve switching performance and overall system efficiency in an advanced packaging portfolio. All devices are lead-free (Pb-free), Halogen free, and RoHs compliant.
Pulse intros thinnest active GPS antennas
SAN DIEGO, USA: Pulse, a Technitrol company, a worldwide leader in electronic component and subassembly design and manufacturing, announced the W4000 series of GPS active antennas.
These ultra-thin, oval-shaped antennas offer high performance and versatility in installation. The antenna can be positioned on the dashboard or window without concerns about orientation. Designed for in-vehicle mounting, Pulse GPS antennas combine a Pulse ceramic chip antenna with a low noise amplifier (LNA) resulting in an antenna profile that's more than 50 percent thinner than standard GPS antennas while still maintaining an excellent level of performance.
These antennas receive, amplify, and filter GPS signals for telematics applications such as in-car infotainment, navigation and location, intelligent vehicle safety, fleet management and tracking, asset monitoring, risk management, and pay-as-you-drive insurance applications.
Pulse’s W4000 GPS antennas are only 5.45 millimeters high and 50x30 millimeters at the widest points of the oval. The antenna is uniformly thin throughout. They operate at 1575.42 megahertz and 3 to 5 volts, with a maximum gain of 1.5 decibels (dB) isotropic and 28 dB with an LNA having 1 dB noise figure. The antennas are standard with 5 meters of RG-174 cable and come in four models with a variety of connectors.
* W4000D197 MMCX male straight connector.
* W4000G197 SMA male straight connector.
* W4000J197 MCX male straight connector.
* W4000L197 FME male straight connector.
Other cable and connector options are available upon request.
The antennas are individually packaged with double-sided tape for easy installation. The antenna can be installed with either side facing up. As a result, only one antenna is required for either glass or dashboard mount, making installation simple. The W4000 series is an ideal solution for after-market installations.
“Telematics devices are being used by insurance companies for risk assessment, by the navigation sector, and by freight companies for tracking and proof of regulatory compliance. In addition, GPS devices are more routinely integrated into consumer vehicles,” explained Beatrice Colbeau, product manager for Pulse. “Pulse has developed a cost-effective method for manufacturing these antennas while at the same time producing antennas that give consistent performance, have diverse uses, and are easily installed.”
Prices are around $4.29 in quantities greater than 100,000 antennas. Pricing may vary due to order configuration and destination. Lead-time is six to eight weeks.
These ultra-thin, oval-shaped antennas offer high performance and versatility in installation. The antenna can be positioned on the dashboard or window without concerns about orientation. Designed for in-vehicle mounting, Pulse GPS antennas combine a Pulse ceramic chip antenna with a low noise amplifier (LNA) resulting in an antenna profile that's more than 50 percent thinner than standard GPS antennas while still maintaining an excellent level of performance.
These antennas receive, amplify, and filter GPS signals for telematics applications such as in-car infotainment, navigation and location, intelligent vehicle safety, fleet management and tracking, asset monitoring, risk management, and pay-as-you-drive insurance applications.
Pulse’s W4000 GPS antennas are only 5.45 millimeters high and 50x30 millimeters at the widest points of the oval. The antenna is uniformly thin throughout. They operate at 1575.42 megahertz and 3 to 5 volts, with a maximum gain of 1.5 decibels (dB) isotropic and 28 dB with an LNA having 1 dB noise figure. The antennas are standard with 5 meters of RG-174 cable and come in four models with a variety of connectors.
* W4000D197 MMCX male straight connector.
* W4000G197 SMA male straight connector.
* W4000J197 MCX male straight connector.
* W4000L197 FME male straight connector.
Other cable and connector options are available upon request.
The antennas are individually packaged with double-sided tape for easy installation. The antenna can be installed with either side facing up. As a result, only one antenna is required for either glass or dashboard mount, making installation simple. The W4000 series is an ideal solution for after-market installations.
“Telematics devices are being used by insurance companies for risk assessment, by the navigation sector, and by freight companies for tracking and proof of regulatory compliance. In addition, GPS devices are more routinely integrated into consumer vehicles,” explained Beatrice Colbeau, product manager for Pulse. “Pulse has developed a cost-effective method for manufacturing these antennas while at the same time producing antennas that give consistent performance, have diverse uses, and are easily installed.”
Prices are around $4.29 in quantities greater than 100,000 antennas. Pricing may vary due to order configuration and destination. Lead-time is six to eight weeks.
Veeco MOCVD tools for capacity expansion at Xiamen Sanan OptoElectronics
PLAINVIEW, USA: Veeco Instruments Inc. announced that Sanan OptoElectronics of China has placed multiple tool orders for Veeco’s TurboDisc Metal Organic Chemical Vapor Deposition (MOCVD) Systems to expand its manufacturing capacity of high brightness light emitting diodes (HB-LEDs).
Simon Lin, CEO of Sanan, commented: "The addition of Veeco's high productivity MOCVD systems to our manufacturing facilities in Xiamen and Tianjin, China ensures that we can continue to increase output of our market-leading HB-LEDs. We are seeing increased demand for LEDs in such applications as general illumination, TV backlight and outdoor display.”
Bill Miller, Ph.D., Senior Vice President, General Manager of Veeco's MOCVD Operations commented: "We are pleased that Sanan, a key technology leader and the largest manufacturer of HB-LEDs in China, has chosen Veeco’s TurboDisc MOCVD Systems for its capacity expansion. We are looking forward to partnering with Sanan as they increase their high volume production of HB-LED devices."
Simon Lin, CEO of Sanan, commented: "The addition of Veeco's high productivity MOCVD systems to our manufacturing facilities in Xiamen and Tianjin, China ensures that we can continue to increase output of our market-leading HB-LEDs. We are seeing increased demand for LEDs in such applications as general illumination, TV backlight and outdoor display.”
Bill Miller, Ph.D., Senior Vice President, General Manager of Veeco's MOCVD Operations commented: "We are pleased that Sanan, a key technology leader and the largest manufacturer of HB-LEDs in China, has chosen Veeco’s TurboDisc MOCVD Systems for its capacity expansion. We are looking forward to partnering with Sanan as they increase their high volume production of HB-LED devices."
Ethertronics ships 200 millionth embedded antenna
SAN DIEGO, USA: Ethertronics, a leading provider of standard and customized embedded antenna solutions for wireless devices, announced that the company has shipped its 200 millionth antenna.
The company, which continues to ship antennas in high volume to the majority of the world's leading handset and wireless device manufacturers, hit the 200 million mark in the third quarter of this year.
"Shipping our 200 millionth antenna is a true testament to the scalability of our business, our understanding and expertise in embedded antenna design, and our continued success in expanding our product lines into a variety of vertical markets," said Laurent Desclos, president and CEO of Ethertronics.
"By leveraging our patented Isolated Magnetic Dipole and active antenna technology, we have gained significant traction with major wireless device manufacturers on a global basis. Designers and manufacturers know that they can rely on Ethertronics to solve their design needs and appreciate the flexibility and quicker time-to-market that we provide them. Whether they are looking for an off-the-shelf antenna or a custom design, we are able to quickly and efficiently deliver to them expanded functionality and high-quality performance - all in a compact design."
With the continued expansion of its product portfolio, Ethertronics is able to meet the needs of designers and manufacturers in a variety of vertical markets ranging from consumer electronics, including wireless phones, notebook computers and personal home networks, to industrial handhelds, automotive, healthcare, remote monitoring and more.
Earlier this month, Ethertronics announced a new Prestta penta-band stamped metal antenna ideal for M2M-oriented products. In addition to its Prestta line of stamped metal antennas, Ethertronics also offers Savvi ceramic and Tavvel(TM) active antennas, as well as custom antenna designs. These antennas are designed to support cellular, UMTS, WiFi, WiMAX, Bluetooth, GPS, FM, MediaFLO, CMMB, DVB-H/T, and other next-generation wireless applications.
Ethertronics is also expanding its products offering to support active and tunable IMD based antennas for main cellular multi-band, multi-mode and MIMO applications including LTE providing a small footprint antenna and outstanding performance in terms of high isolation, high efficiency, and low correlation.
The company, which continues to ship antennas in high volume to the majority of the world's leading handset and wireless device manufacturers, hit the 200 million mark in the third quarter of this year.
"Shipping our 200 millionth antenna is a true testament to the scalability of our business, our understanding and expertise in embedded antenna design, and our continued success in expanding our product lines into a variety of vertical markets," said Laurent Desclos, president and CEO of Ethertronics.
"By leveraging our patented Isolated Magnetic Dipole and active antenna technology, we have gained significant traction with major wireless device manufacturers on a global basis. Designers and manufacturers know that they can rely on Ethertronics to solve their design needs and appreciate the flexibility and quicker time-to-market that we provide them. Whether they are looking for an off-the-shelf antenna or a custom design, we are able to quickly and efficiently deliver to them expanded functionality and high-quality performance - all in a compact design."
With the continued expansion of its product portfolio, Ethertronics is able to meet the needs of designers and manufacturers in a variety of vertical markets ranging from consumer electronics, including wireless phones, notebook computers and personal home networks, to industrial handhelds, automotive, healthcare, remote monitoring and more.
Earlier this month, Ethertronics announced a new Prestta penta-band stamped metal antenna ideal for M2M-oriented products. In addition to its Prestta line of stamped metal antennas, Ethertronics also offers Savvi ceramic and Tavvel(TM) active antennas, as well as custom antenna designs. These antennas are designed to support cellular, UMTS, WiFi, WiMAX, Bluetooth, GPS, FM, MediaFLO, CMMB, DVB-H/T, and other next-generation wireless applications.
Ethertronics is also expanding its products offering to support active and tunable IMD based antennas for main cellular multi-band, multi-mode and MIMO applications including LTE providing a small footprint antenna and outstanding performance in terms of high isolation, high efficiency, and low correlation.
Monday, October 26, 2009
Bluetooth headset shipments to shrink 28 percent in 2009
BOSTON, USA: According to the latest research from Strategy Analytics, Bluetooth headset shipments will shrink a huge 28 percent in the United States in 2009. The economic downturn has caused the Bluetooth headset industry to register its worst period since our records began.
Bonny Joy, Senior Analyst at Strategy Analytics, said, “We forecast Bluetooth headset shipments to decline 28 percent in the United States during 2009. Shipments reached 19.2 million units in 2008, but they will fall to 13.9 million by the end of 2009. The economic downturn has caused consumers and businesses to buy fewer Bluetooth headsets and the industry is set to register its worst period since volumes began taking off in 2000.”
Neil Mawston, Director at Strategy Analytics, added: “The United States is the world’s largest market for Bluetooth headsets. Demand for mono headsets has slumped during 2009, although stereo headphones have been more robust. The stereo category is emerging and it continues to offer the brightest prospects for growth for companies such as Motorola, Jabra and Plantronics in 2010.”
Bonny Joy, Senior Analyst at Strategy Analytics, said, “We forecast Bluetooth headset shipments to decline 28 percent in the United States during 2009. Shipments reached 19.2 million units in 2008, but they will fall to 13.9 million by the end of 2009. The economic downturn has caused consumers and businesses to buy fewer Bluetooth headsets and the industry is set to register its worst period since volumes began taking off in 2000.”
Neil Mawston, Director at Strategy Analytics, added: “The United States is the world’s largest market for Bluetooth headsets. Demand for mono headsets has slumped during 2009, although stereo headphones have been more robust. The stereo category is emerging and it continues to offer the brightest prospects for growth for companies such as Motorola, Jabra and Plantronics in 2010.”
Microchip announces synchronous buck MOSFET drivers
CHANDLER, UAS: Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced the MCP14628 and MCP14700 synchronous Buck MOSFET drivers, which complement market trends toward “green” products by providing maximum efficiency in small packages.
With both available in small 8-pin SOIC and 3 mm x 3 mm DFN packages, the new devices drive two N-Channel MOSFETs arranged in a non-isolated, synchronous Buck converter topology.
They feature excellent latch-up immunity, enabling extremely robust applications in the consumer and computing markets, such as digital power conversion, DC-to-DC power supplies, three-phase BLDC motor control and telecom equipment.
The MCP14628 MOSFET driver includes an enhanced light-load efficiency mode that conserves energy when the power supply is not in full use. The dual-input MCP14700 driver is ideally suited for controllers that utilize 3.0V TTL/CMOS logic, and can control the high and low sides independently, which optimizes the timing between the two sides and further maximizes efficiency.
Additionally, the MCP14700 driver’s timing can be adjusted to a wide range of external MOSFETs, giving designers more flexibility to use different types of MOSFETs in their applications.
“Microchip has a full line of MOSFET drivers in popular packages, at competitive prices,” said Bryan J. Liddiard, vice president of marketing with Microchip’s Analog and Interface Products Division. “The MCP14628 and MCP14700 MOSFET drivers provide robustness, latch-up immunity, and small packages, making them ideally suited for space-constrained switching applications requiring the utmost efficiency.”
The MCP14628 and MCP14700 MOSFET drivers are available in 8-pin SOIC and 3 mm x 3 mm DFN packages, for $1.17 and $1.33 each respectively, in 10,000-unit quantities. Samples can be ordered today.
With both available in small 8-pin SOIC and 3 mm x 3 mm DFN packages, the new devices drive two N-Channel MOSFETs arranged in a non-isolated, synchronous Buck converter topology.
They feature excellent latch-up immunity, enabling extremely robust applications in the consumer and computing markets, such as digital power conversion, DC-to-DC power supplies, three-phase BLDC motor control and telecom equipment.
The MCP14628 MOSFET driver includes an enhanced light-load efficiency mode that conserves energy when the power supply is not in full use. The dual-input MCP14700 driver is ideally suited for controllers that utilize 3.0V TTL/CMOS logic, and can control the high and low sides independently, which optimizes the timing between the two sides and further maximizes efficiency.
Additionally, the MCP14700 driver’s timing can be adjusted to a wide range of external MOSFETs, giving designers more flexibility to use different types of MOSFETs in their applications.
“Microchip has a full line of MOSFET drivers in popular packages, at competitive prices,” said Bryan J. Liddiard, vice president of marketing with Microchip’s Analog and Interface Products Division. “The MCP14628 and MCP14700 MOSFET drivers provide robustness, latch-up immunity, and small packages, making them ideally suited for space-constrained switching applications requiring the utmost efficiency.”
The MCP14628 and MCP14700 MOSFET drivers are available in 8-pin SOIC and 3 mm x 3 mm DFN packages, for $1.17 and $1.33 each respectively, in 10,000-unit quantities. Samples can be ordered today.
Friday, October 23, 2009
Molex and Hon Hai announce litigation settlement
LISLE & SANTA CLARA, USA: Molex Inc. and Hon Hai Precision Industry Co. Ltd. and Foxconn Electronics Inc. announced the settlement of the litigation between them, pending in the United States District Court for the Northern District of Illinois, that included a dispute regarding the scope of a DisplayPort Standard License Agreement.
Neither party has admitted any wrongdoing with respect to the claims and counterclaims asserted in the litigation. As part of the settlement, Hon Hai has been granted a separate, worldwide, royalty-bearing license giving it the right to sell non-standard connectors using the DisplayPort* mating interface, and having a through-hole mounting interface.
No further information is available regarding the terms of the settlement.
Neither party has admitted any wrongdoing with respect to the claims and counterclaims asserted in the litigation. As part of the settlement, Hon Hai has been granted a separate, worldwide, royalty-bearing license giving it the right to sell non-standard connectors using the DisplayPort* mating interface, and having a through-hole mounting interface.
No further information is available regarding the terms of the settlement.
Thursday, October 22, 2009
Cree sets new standard for indoor LED lighting with XLamp MX-6 LED
DURHAM, USA: Cree Inc., a market leader in LED lighting, extends its lighting-class LED leadership into PLCC LEDs with the commercial availability of the new XLamp MX-6 LED. The MX-6 LED offers the performance and reliability that customers expect from Cree XLamp LEDs with enhanced light uniformity and low power consumption.
"We are impressed with the Cree XLamp MX-6 LED," said Sunny Tsai, CEO of TESS, an innovative LED light bulb manufacturer. "The LED's performance is striking, and Cree's small bins make it easy for us to deliver a consistent product for our customers."
"With the addition of the XLamp MX-6 LED, we now have the most diverse family of lighting-class LEDs in the industry," said Paul Thieken, Cree marketing director, LED components. "The XLamp MX-6 LED can provide better design options for indoor applications, including under-cabinet, retail displays, LED light bulbs and fluorescent replacements."
The XLamp MX-6 LED provides up to 130 lumens for cool white and 107 lumens for warm white at 350 mA. The XLamp MX-6 LED can also reduce luminaire and lamp manufacturing costs through an increased shelf life with reduced moisture sensitivity, and the smallest warm white bins in the industry, enhancing LED-to-LED color consistency.
XLamp MX-6 LEDs are available through Cree distributors in a full range of white ANSI chromaticity bins.
"We are impressed with the Cree XLamp MX-6 LED," said Sunny Tsai, CEO of TESS, an innovative LED light bulb manufacturer. "The LED's performance is striking, and Cree's small bins make it easy for us to deliver a consistent product for our customers."
"With the addition of the XLamp MX-6 LED, we now have the most diverse family of lighting-class LEDs in the industry," said Paul Thieken, Cree marketing director, LED components. "The XLamp MX-6 LED can provide better design options for indoor applications, including under-cabinet, retail displays, LED light bulbs and fluorescent replacements."
The XLamp MX-6 LED provides up to 130 lumens for cool white and 107 lumens for warm white at 350 mA. The XLamp MX-6 LED can also reduce luminaire and lamp manufacturing costs through an increased shelf life with reduced moisture sensitivity, and the smallest warm white bins in the industry, enhancing LED-to-LED color consistency.
XLamp MX-6 LEDs are available through Cree distributors in a full range of white ANSI chromaticity bins.
Wednesday, October 21, 2009
Auto-use battery key for automobile to switch to electrical power source
TAIWAN: Driven by tighter regulations of carbon dioxide emissions and environmental protection regulations, Electrical vehicle is becoming a worldwide focus. According to industry research institute Energy.com.tw, the power source of automobile is gradually switching from traditional engine to electrical battery module.
Therefore, the key for development of electrical vehicle lies in the auto-use batteries. The following factors should be considered when evaluating such batteries: power density, energy density, lifespan and cost.
Batteries currently applied in hybrid electric vehicle(HEV) and electric vehicle (EV) include lead-acid battery, NiMH battery, Li-ion battery, fuel cell and solar cell. The performance, cost and safety of auto-use batteries determine the evolvement of hybrids and pure electric vehicles.
According to Energy.com.tw, the auto-use batteries generally feature large capacity and high power output. There are a couple of factors to be observed when evaluating these batteries. Firstly, Power Density (W/kg), which represents the amount of power supplied by a unit (1kg) of battery, determines the maximum output power of the battery and the automobile’s accelerating ability and maximum speed, thus directly influencing the dynamism of the car.
The Energy Density (Wh/kg) generally represents the energy restored in a unit of battery. Energy Density can be calculated by dividing the total energy released by the chemical reaction inside the battery by the gross weight or volume of the battery. The Energy Density also represents the cruising ability of the car under pure electric-driven pattern.
Besides, the operation of auto-use battery is a recycling process of recharge and discharge. Every time the battery recharges or discharges, the chemicals in the battery are undergoing an inreversible chemical reaction.
As the times of discharge and recharge increase, the chemically reactive substances in the battery get aging, reducing the recharge and discharge efficiency of the battery. Therefore, Cycle Life is an important index to measure the lifespan of an auto-use battery, and is of direct influence on the use of the battery.
The cost of battery is related to its new technology content, material, manufacturing process and production volume. Currently, the newly-developed auto-use batteries are still high in cost. If the challenge of cost could be conquered in the future, the popularization of electric cars will be accelerated.
Therefore, the key for development of electrical vehicle lies in the auto-use batteries. The following factors should be considered when evaluating such batteries: power density, energy density, lifespan and cost.
Batteries currently applied in hybrid electric vehicle(HEV) and electric vehicle (EV) include lead-acid battery, NiMH battery, Li-ion battery, fuel cell and solar cell. The performance, cost and safety of auto-use batteries determine the evolvement of hybrids and pure electric vehicles.
According to Energy.com.tw, the auto-use batteries generally feature large capacity and high power output. There are a couple of factors to be observed when evaluating these batteries. Firstly, Power Density (W/kg), which represents the amount of power supplied by a unit (1kg) of battery, determines the maximum output power of the battery and the automobile’s accelerating ability and maximum speed, thus directly influencing the dynamism of the car.
The Energy Density (Wh/kg) generally represents the energy restored in a unit of battery. Energy Density can be calculated by dividing the total energy released by the chemical reaction inside the battery by the gross weight or volume of the battery. The Energy Density also represents the cruising ability of the car under pure electric-driven pattern.
Besides, the operation of auto-use battery is a recycling process of recharge and discharge. Every time the battery recharges or discharges, the chemicals in the battery are undergoing an inreversible chemical reaction.
As the times of discharge and recharge increase, the chemically reactive substances in the battery get aging, reducing the recharge and discharge efficiency of the battery. Therefore, Cycle Life is an important index to measure the lifespan of an auto-use battery, and is of direct influence on the use of the battery.
The cost of battery is related to its new technology content, material, manufacturing process and production volume. Currently, the newly-developed auto-use batteries are still high in cost. If the challenge of cost could be conquered in the future, the popularization of electric cars will be accelerated.
Philips Lumileds first to publish Lumen maintenance -- LM-80 — test report online
SAN JOSE, USA: Philips Lumileds announced that it is the first power LED manufacturer to publicly publish LM-80 test report data for use by luminaire manufacturers evaluating the merits of using different LEDs in their solid-state lighting solutions.
The data clearly demonstrates that lumen maintenance performance exceeds ENERGY STAR requirements by a wide margin as well as documenting lumen maintenance performance under various conditions. The test report is posted on the company’'s web site.
Philips Lumileds LM-80 test reports adhere to and are published in accordance with the Illuminating Engineering Society (IES) LM-80-08 standard.
“LUXEON Rebel's lumen maintenance clearly leads the industry. Using our LM-80 reports helps system designers meet ENERGY STAR® eligibility criteria and optimize solutions for a desired lumen maintenance level,” said Steve Barlow, Executive VP of Sales and Marketing for Philips Lumileds.
“These reports are just one of the many tools we make available in order to simplify the development and production of LED luminaires and we encourage other manufacturers to follow our lead to help simplify and accelerate solid-state lighting market development.”
Lumen maintenance performance of LEDs varies significantly from manufacturer to manufacturer due to differences in materials and manufacturing processes. Philips Lumileds has been studying the factors that affect power LED lumen maintenance longer than any other manufacturer in an ongoing effort to improve performance and more accurately describe lumen maintenance behavior for the lighting community.
“Reliance on generic LED lumen maintenance statements that are adopted by luminaire manufacturers is destined to lead to disappointment with LED solutions,” said Rudi Hechfellner, Director of Applications at Philips Lumileds. In order to appropriately design for optimum lumen maintenance, Philips Lumileds recommends that luminaire manufacturers and the lighting industry do the following:
1. Understand the specific lumen maintenance behavior of the LEDs they have selected.
2. Disregard generic statements about LED lumen maintenance performance and ask for information that’s appropriate for the anticipated current and temperature conditions.
The IES LM-80-08 standard describes the testing methodology and the test report format that LED manufacturers must follow. The IES standard does not make any assessment of the data or statements of appropriateness for any particular application.
Other industry programs, such as ENERGY STAR, establish performance criteria that can be determined from published LM-80 test reports. Data for the white LUXEON Rebel power LEDs clearly demonstrates that lumen maintenance performance exceeds the ENERGY STAR requirements by a wide margin.
The data clearly demonstrates that lumen maintenance performance exceeds ENERGY STAR requirements by a wide margin as well as documenting lumen maintenance performance under various conditions. The test report is posted on the company’'s web site.
Philips Lumileds LM-80 test reports adhere to and are published in accordance with the Illuminating Engineering Society (IES) LM-80-08 standard.
“LUXEON Rebel's lumen maintenance clearly leads the industry. Using our LM-80 reports helps system designers meet ENERGY STAR® eligibility criteria and optimize solutions for a desired lumen maintenance level,” said Steve Barlow, Executive VP of Sales and Marketing for Philips Lumileds.
“These reports are just one of the many tools we make available in order to simplify the development and production of LED luminaires and we encourage other manufacturers to follow our lead to help simplify and accelerate solid-state lighting market development.”
Lumen maintenance performance of LEDs varies significantly from manufacturer to manufacturer due to differences in materials and manufacturing processes. Philips Lumileds has been studying the factors that affect power LED lumen maintenance longer than any other manufacturer in an ongoing effort to improve performance and more accurately describe lumen maintenance behavior for the lighting community.
“Reliance on generic LED lumen maintenance statements that are adopted by luminaire manufacturers is destined to lead to disappointment with LED solutions,” said Rudi Hechfellner, Director of Applications at Philips Lumileds. In order to appropriately design for optimum lumen maintenance, Philips Lumileds recommends that luminaire manufacturers and the lighting industry do the following:
1. Understand the specific lumen maintenance behavior of the LEDs they have selected.
2. Disregard generic statements about LED lumen maintenance performance and ask for information that’s appropriate for the anticipated current and temperature conditions.
The IES LM-80-08 standard describes the testing methodology and the test report format that LED manufacturers must follow. The IES standard does not make any assessment of the data or statements of appropriateness for any particular application.
Other industry programs, such as ENERGY STAR, establish performance criteria that can be determined from published LM-80 test reports. Data for the white LUXEON Rebel power LEDs clearly demonstrates that lumen maintenance performance exceeds the ENERGY STAR requirements by a wide margin.
Clare intros 200V optically isolated, self biased gate driver
BEVERLY, USA: Clare Inc., a wholly owned subsidiary of IXYS Corp., announced the immediate production release of the CPC1590, an optically isolated MOSFET gate driver integrated circuit, which uses a bootstrap biasing technique to eliminate the load-side power supply.
An external power MOSFET is controlled by the application of a low input LED current (2.5 to 10mA) to the CPC1590 which activates the internal load-side driver circuit. The CPC1590 IC connected to the load, together with an external storage capacitor provides bias to the internal driver circuit which eliminates a costly power supply.
This device is specifically designed for low duty-cycle switching frequencies and offers isolated solid state control to replace large modules and multi-component discrete solutions.
The CPC1590 MOSFET driver couples an infrared LED with proprietary photovoltaic integrated circuits fabricated with Clare’s high voltage dielectrically isolated BCDMOS technology. The small 8-pin package provides 3750Vrms of input-to-output isolation.
The CPC1590 has a blocking voltage rating of 200V, which is paired with a corresponding external MOSFET for a variety of power switching applications. The IC features a typical turn-on time of 40 microseconds (Ton = 40us) and a typical turn-off time of 110 microseconds (Toff = 110us) with a 2.5mA LED input current.
The CPC1590 is an excellent choice for remote switching of DC and low frequency loads where isolated power is unavailable. The device is flexible and allows the user to select a specific MOSFET and external components to satisfy design switching requirements.
Used in conjunction with discrete MOSFETs, the CPC1590 is ideal for programmable control, process control, instrumentation and power distribution applications while reducing BOM count, board space and overall design complexity.
An external power MOSFET is controlled by the application of a low input LED current (2.5 to 10mA) to the CPC1590 which activates the internal load-side driver circuit. The CPC1590 IC connected to the load, together with an external storage capacitor provides bias to the internal driver circuit which eliminates a costly power supply.
This device is specifically designed for low duty-cycle switching frequencies and offers isolated solid state control to replace large modules and multi-component discrete solutions.
The CPC1590 MOSFET driver couples an infrared LED with proprietary photovoltaic integrated circuits fabricated with Clare’s high voltage dielectrically isolated BCDMOS technology. The small 8-pin package provides 3750Vrms of input-to-output isolation.
The CPC1590 has a blocking voltage rating of 200V, which is paired with a corresponding external MOSFET for a variety of power switching applications. The IC features a typical turn-on time of 40 microseconds (Ton = 40us) and a typical turn-off time of 110 microseconds (Toff = 110us) with a 2.5mA LED input current.
The CPC1590 is an excellent choice for remote switching of DC and low frequency loads where isolated power is unavailable. The device is flexible and allows the user to select a specific MOSFET and external components to satisfy design switching requirements.
Used in conjunction with discrete MOSFETs, the CPC1590 is ideal for programmable control, process control, instrumentation and power distribution applications while reducing BOM count, board space and overall design complexity.
Microchip unveils LDOs with wide input and output voltage ranges
CHANDLER, USA: Microchip Technology Inc. has announced the MCP1804 Low Dropout Regulators (LDOs), which deliver up to 150 mA of output current and support output voltages from 1.8 – 18V.
The LDOs’ input and output are stable, with 0.1 microfarads of input and output capacitance, and operate on a typical quiescent current of 50 microamperes. A shutdown function allows the output to be disabled, dropping the quiescent current to only 0.01 microamperes.
The LDOs are available in a space-saving SOT-23, and thermally capable SOT-89 and SOT-223 packages, and are well-suited for applications in the industrial and consumer markets, such as security systems, wireless communication systems, cordless phones and home appliances.
Designers must often drop the voltage from existing high-voltage rails, such as 12V and 24V rails, to power subsystem circuitry. The MCP1804 LDOs’ 28V input and wide output voltage range provide designers with a flexible means of doing this.
Additionally, because the LDOs only require 0.1 microfarads of input and output capacitance, smaller and lower-cost ceramic capacitors can be used. The small and thermally capable package options make the LDOs ideal for space-constrained and high-power designs.
“We are pleased to expand our high-voltage LDO portfolio with the MCP1804 family,” said Bryan J. Liddiard, vice president of marketing with Microchip’s Analog and Interface Products Division. “The flexibility of these 28V, 150 mA devices reinforces our goal of providing the complete product solutions that our customers have come to expect.”
The MCP1804 LDOs are available in 3-pin SOT-89 and SOT-223 packages, as well as a 5-pin SOT-89 package, for $0.50 each in 10,000-unit quantities. They are also available in a 5-pin SOT-23 package for $0.48 each in 10,000-unit quantities. Samples are available today.
The LDOs’ input and output are stable, with 0.1 microfarads of input and output capacitance, and operate on a typical quiescent current of 50 microamperes. A shutdown function allows the output to be disabled, dropping the quiescent current to only 0.01 microamperes.
The LDOs are available in a space-saving SOT-23, and thermally capable SOT-89 and SOT-223 packages, and are well-suited for applications in the industrial and consumer markets, such as security systems, wireless communication systems, cordless phones and home appliances.
Designers must often drop the voltage from existing high-voltage rails, such as 12V and 24V rails, to power subsystem circuitry. The MCP1804 LDOs’ 28V input and wide output voltage range provide designers with a flexible means of doing this.
Additionally, because the LDOs only require 0.1 microfarads of input and output capacitance, smaller and lower-cost ceramic capacitors can be used. The small and thermally capable package options make the LDOs ideal for space-constrained and high-power designs.
“We are pleased to expand our high-voltage LDO portfolio with the MCP1804 family,” said Bryan J. Liddiard, vice president of marketing with Microchip’s Analog and Interface Products Division. “The flexibility of these 28V, 150 mA devices reinforces our goal of providing the complete product solutions that our customers have come to expect.”
The MCP1804 LDOs are available in 3-pin SOT-89 and SOT-223 packages, as well as a 5-pin SOT-89 package, for $0.50 each in 10,000-unit quantities. They are also available in a 5-pin SOT-23 package for $0.48 each in 10,000-unit quantities. Samples are available today.
Tuesday, October 20, 2009
TI demos world's first coin cell demo for Bluetooth low energy apps
DALLAS, USA: At the Bluetooth low energy technology conference in Munich, Germany, on October 20, Texas Instruments Inc. (TI) will showcase the world's first coin cell demo for the new Bluetooth low energy open standard based on TI's upcoming CC2540 single-mode system-on-chip.
Bluetooth low energy enables applications, such as sports and fitness equipment, medical and health, home and office, and mobile accessories, to use coin cell and energy harvesting solutions to operate for more than a year on a tiny button cell battery without recharging.
Bluetooth low energy from TI
* TI supports both dual-mode and single-mode solutions.
-- Dual-mode devices can communicate with legacy Bluetooth as well as Bluetooth low energy devices and support both protocols.
-- Single-mode devices only support Bluetooth low energy and are optimized for low-power, low-cost applications.
* TI has demonstrated the world's first single-chip, single-mode Bluetooth low energy device featuring controller, host and application in a 6mm x 6mm package
CC2540 features and benefits
* One-chip integrated solution reduces physical size and cost.
* Flash-based device enables device firmware to be updated in the field and data can be stored on-chip, increasing flexibility for developers.
* Complete solution with low-power RF ICs, protocol stack, basic profile software and applications support.
* Ultra-low power consumption for very long battery life and use of coin cells or alkaline batteries (no need for rechargeable batteries).
* CC2540 customer samples will be available in early 2010.
Bluetooth low energy enables applications, such as sports and fitness equipment, medical and health, home and office, and mobile accessories, to use coin cell and energy harvesting solutions to operate for more than a year on a tiny button cell battery without recharging.
Bluetooth low energy from TI
* TI supports both dual-mode and single-mode solutions.
-- Dual-mode devices can communicate with legacy Bluetooth as well as Bluetooth low energy devices and support both protocols.
-- Single-mode devices only support Bluetooth low energy and are optimized for low-power, low-cost applications.
* TI has demonstrated the world's first single-chip, single-mode Bluetooth low energy device featuring controller, host and application in a 6mm x 6mm package
CC2540 features and benefits
* One-chip integrated solution reduces physical size and cost.
* Flash-based device enables device firmware to be updated in the field and data can be stored on-chip, increasing flexibility for developers.
* Complete solution with low-power RF ICs, protocol stack, basic profile software and applications support.
* Ultra-low power consumption for very long battery life and use of coin cells or alkaline batteries (no need for rechargeable batteries).
* CC2540 customer samples will be available in early 2010.
Monday, October 19, 2009
HB LED and LED packaging 2009 report -- One law for LED packaging industry
LYON, FRANCE: Yole Développement has released its new markets and technological study dedicated to HB LED and LED packaging industry: HB LED & LED Packaging 2009.
Yole’s report highlights the main technical challenges, current solutions and future trends dedicated to the LED devices. The analysis includes different packaging aspects: equipment, materials and services. In this report, Yole identified HB LED & LED packaging companies, collected their expertise and analyzed it.
HB LED & LED Packaging 2009 answers to the following questions: What are the technological challenges? How is organized the industrial chain? What are the emerging processes?
HB LED &LED devices market represents today about $ 5.56 billion, according to Yole Développement. In this context, many companies are thinking about the way to improve the devices with new properties, low costs, etc. Packaging is one way to think. Yole Développement analyses the main trends and segments the HB LED & LED packaging industry: in 2009, the material & equipment market should reach $ 1.2 billion (this figure does not include optics, leadframe, etc.).
HB LED & LED Packaging 2009 Report
Source: Yole Développement.
LED devices’ market, a large sector in semiconductor industry
The market is a high‐growth field in the semiconductor industry. The supply chain is filled with various players from LED die manufacturers (Epistar, Forepi, etc.), to LED assembly suppliers (Harvatek, Citizen, Liteon, Samsung, etc.), to fully integrated players (Lumileds, Osram, Toyoda Gosei).
In the wide range of LED packaging solutions, Yole Développement presents the existing packaging process flow, materials and equipment and the main evolution in the coming years.
For example, LED devices have been split in two categories:
• Regular LEDs or LED lamps: these devices are low‐end products.
• Added value LEDs: it means high brightness and ultra high brightness LEDs.
The main processes dedicated to the LEDs manufacturing are presented for both categories:
• Dicing
• Die bonding
• Electrical interconnect
• Thermal management
• Encapsulation
Main LED packaging challenges
“For the regular and added‐value LEDs, assembly approach is not the same”, explained Cyrille Chemama, Market Analyst at Yole Développement. The company has working with key players to identify and segment this industry. “Thanks to these different contacts, two main technological processes have been clearly identified”, said Cyrille Chemama:
• A standard process for low cost LEDs (LED lamps):
Regular LED packaging process flow is based on standard IC process and almost the same standard material. The main reason is cost because regular LEDs are low cost products: such devices cost less than $0.10.
• A specific process for LEDs with high technological added‐value:
As a future lighting source, HB/UHB LED packaging should have good optical properties, high thermal dissipation and high reliability. Finally, the better product is a right combination between optical, thermal and reliability.
“It is clearly sure that now we are able to make the perfect product, says Cyrille Chemama. But the cost would be so high that it will not be successful”. A choice has to be made for each application: for example, optical efficiency for LCD backlighting and thermal management for automotive lighting.
One product, one process
Unlike regular LEDs, no standards currently exist for packaging of HB‐LED. Each LED vendor has their own proprietary design for most aspects of the assembly process flow. Cost is the primary driver for this market: cheaper solutions with the best optical or thermal properties are under investigation. Main goals are the reduction of the number parts, use of less expensive materials.
A major issue today is 2 or 3 inches wafers. Indeed, if LEDs manufacturing process is made on 2 or 3 inches wafers; it creates handling issues on equipment. In this context, according to Yole Développement, the move to 4 then 6 or 8 inch wafers will allow more standardized solutions using regular processes and equipment.
In particular, there is a big trend for Wafer Level Packaging of silicon LED modules which aims at pushing LED to the general lighting market.
Yole’s report highlights the main technical challenges, current solutions and future trends dedicated to the LED devices. The analysis includes different packaging aspects: equipment, materials and services. In this report, Yole identified HB LED & LED packaging companies, collected their expertise and analyzed it.
HB LED & LED Packaging 2009 answers to the following questions: What are the technological challenges? How is organized the industrial chain? What are the emerging processes?
HB LED &LED devices market represents today about $ 5.56 billion, according to Yole Développement. In this context, many companies are thinking about the way to improve the devices with new properties, low costs, etc. Packaging is one way to think. Yole Développement analyses the main trends and segments the HB LED & LED packaging industry: in 2009, the material & equipment market should reach $ 1.2 billion (this figure does not include optics, leadframe, etc.).
HB LED & LED Packaging 2009 Report
Source: Yole Développement.LED devices’ market, a large sector in semiconductor industry
The market is a high‐growth field in the semiconductor industry. The supply chain is filled with various players from LED die manufacturers (Epistar, Forepi, etc.), to LED assembly suppliers (Harvatek, Citizen, Liteon, Samsung, etc.), to fully integrated players (Lumileds, Osram, Toyoda Gosei).
In the wide range of LED packaging solutions, Yole Développement presents the existing packaging process flow, materials and equipment and the main evolution in the coming years.
For example, LED devices have been split in two categories:
• Regular LEDs or LED lamps: these devices are low‐end products.
• Added value LEDs: it means high brightness and ultra high brightness LEDs.
The main processes dedicated to the LEDs manufacturing are presented for both categories:
• Dicing
• Die bonding
• Electrical interconnect
• Thermal management
• Encapsulation
Main LED packaging challenges
“For the regular and added‐value LEDs, assembly approach is not the same”, explained Cyrille Chemama, Market Analyst at Yole Développement. The company has working with key players to identify and segment this industry. “Thanks to these different contacts, two main technological processes have been clearly identified”, said Cyrille Chemama:
• A standard process for low cost LEDs (LED lamps):
Regular LED packaging process flow is based on standard IC process and almost the same standard material. The main reason is cost because regular LEDs are low cost products: such devices cost less than $0.10.
• A specific process for LEDs with high technological added‐value:
As a future lighting source, HB/UHB LED packaging should have good optical properties, high thermal dissipation and high reliability. Finally, the better product is a right combination between optical, thermal and reliability.
“It is clearly sure that now we are able to make the perfect product, says Cyrille Chemama. But the cost would be so high that it will not be successful”. A choice has to be made for each application: for example, optical efficiency for LCD backlighting and thermal management for automotive lighting.
One product, one process
Unlike regular LEDs, no standards currently exist for packaging of HB‐LED. Each LED vendor has their own proprietary design for most aspects of the assembly process flow. Cost is the primary driver for this market: cheaper solutions with the best optical or thermal properties are under investigation. Main goals are the reduction of the number parts, use of less expensive materials.
A major issue today is 2 or 3 inches wafers. Indeed, if LEDs manufacturing process is made on 2 or 3 inches wafers; it creates handling issues on equipment. In this context, according to Yole Développement, the move to 4 then 6 or 8 inch wafers will allow more standardized solutions using regular processes and equipment.
In particular, there is a big trend for Wafer Level Packaging of silicon LED modules which aims at pushing LED to the general lighting market.
Friday, October 16, 2009
LED chipmakers continue to post historic high revenues
TAIWAN: According to survey of the industry research institute LEDinside, Taiwan's listed LED manufacturers recorded total revenue of NT 6.927 billion in September 2009, a 7.2 percent growth from August and 18.9 percent growth YoY -– of which, LED chip makers’ total revenue in September gained 4.6 percent to NT 2.938 billion, while LED packagers posted NT 3.989 billion, 9.2 percent growth MoM.
Based on LEDinside’s observation of recent market dynamics, downstream packagers’ revenue in September continued to grow; however, as Q4 marks the beginning of a traditionally slow season, packagers’ order visibility was reduced by one to two weeks from the original five to six weeks.
Of all the orders, demand for small- to mid-sized handset backlight is expected to slide as shipments of handset gradually weaken. Mobile brand vendors have decreased LED orders while the demand from white brand handsets is still strong, though its order visibility is also low.
Source: LEDinside
As for mid- and large-sized backlight, panel makers are adjusting their LED inventory levels in Q4, which will deter the revenue growth in downstream packagers. Capacity utilization of upstream (In)GaN LED chipmakers is still fully-loaded, and revenue in Q4 is expected to see persistent growth as the new MOCVD equipment are installed by upstream chipmakers.
Taiwan chipmakers recorded total revenue of NT2.938 billion in September, a 4.6 percent growth MoM, and 30.1% YoY. Under the supply shortage in upstream chips, chipmakers that have the capacity to supply large quantities LEDs for backlight applications, such as Epistar, FOREPI, Huga Optotech, and Tekcore, continue to post high revenues in September.
Downstream LED packagers recorded total revenue of NT3.989 billion in September, (MoM +9.2 percent, YoY +11 percent) with output already surpassing the standard of the same period last year.
Leading LED packager Everlight hit a historic high as it recorded NT 1.170 billion in revenue. Unity Opto benefitted from strong backlight demand of mid- and large-sized models, and continued to record high revenue of NT 462 million (MoM +9.1 percent). Harvatek, with application in white-brand handsets accounting for a large part of the company’s revenue, posted sales revenue of NT 300 million in September (MoM +14.7 percent).
Source: LEDinside
Based on LEDinside’s observation of recent market dynamics, downstream packagers’ revenue in September continued to grow; however, as Q4 marks the beginning of a traditionally slow season, packagers’ order visibility was reduced by one to two weeks from the original five to six weeks.
Of all the orders, demand for small- to mid-sized handset backlight is expected to slide as shipments of handset gradually weaken. Mobile brand vendors have decreased LED orders while the demand from white brand handsets is still strong, though its order visibility is also low.
Source: LEDinsideAs for mid- and large-sized backlight, panel makers are adjusting their LED inventory levels in Q4, which will deter the revenue growth in downstream packagers. Capacity utilization of upstream (In)GaN LED chipmakers is still fully-loaded, and revenue in Q4 is expected to see persistent growth as the new MOCVD equipment are installed by upstream chipmakers.
Taiwan chipmakers recorded total revenue of NT2.938 billion in September, a 4.6 percent growth MoM, and 30.1% YoY. Under the supply shortage in upstream chips, chipmakers that have the capacity to supply large quantities LEDs for backlight applications, such as Epistar, FOREPI, Huga Optotech, and Tekcore, continue to post high revenues in September.
Downstream LED packagers recorded total revenue of NT3.989 billion in September, (MoM +9.2 percent, YoY +11 percent) with output already surpassing the standard of the same period last year.
Leading LED packager Everlight hit a historic high as it recorded NT 1.170 billion in revenue. Unity Opto benefitted from strong backlight demand of mid- and large-sized models, and continued to record high revenue of NT 462 million (MoM +9.1 percent). Harvatek, with application in white-brand handsets accounting for a large part of the company’s revenue, posted sales revenue of NT 300 million in September (MoM +14.7 percent).
Source: LEDinside
Thursday, October 15, 2009
Plug Power, SFO Technologies complete agreement for Gensys fuel cell units in India
LATHAM, NEW YORK & BANGALORE, INDIA: Plug Power Energy India Pvt. Ltd, an affiliate of the leading US-based fuel cell manufacturer, Plug Power Inc., and SFO Technologies, (A NeST Group Co.) announced that they have signed into a strategic manufacture and supply agreement for the build of Plug Power's GenSys fuel cell systems in India.
The companies have entered into a five-year agreement where NeST will manufacture Plug Power's fuel cell systems in India. NeST will also provide support for vendor development, procurement, manufacturing, testing and shipment of the GenSys systems. NeST provides Plug Power with world-class manufacturing and supply expertise in the Indian telecommunications market. At the same time, their ideal location allows for the export of products to other key markets in Africa and Asia.
The companies are currently preparing for the production of the first 200 GenSys units sold to WTTIL, the cell tower arm of Tata Teleservices Ltd (TTSL), announced in July of this year. Plug Power expects to have all 200 units shipped by the end of March, 2010 and install approximately 1,000 systems throughout India by the end of the same year. The Indian telecommunications market is expected to grow with the approximate addition of 50,000 towers annually over the next three to five years.
GenSys provides continuous power to cell tower sites with no or extremely unreliable electric grid service. An estimated ten percent of the cell towers in India currently operate completely off-grid where the primary power is provided by diesel generators. Plug Power's GenSys units are fueled by Liquid Petroleum Gas (LPG), allowing the customer to eliminate logistics associated with the delivery of pure hydrogen.
"This is a great opportunity for NeST to support the fast growing fuel cell market," said N. Jahangir, Vice Chairman and Managing Director of the NeST Group. "This is an ideal product for NeST to demonstrate its vertically integrated capability in electronics, wire harness, power supply, sheet metal, plastics and box build.
"NeST is grateful to Plug Power for selecting us as their manufacturing partner, which I consider as recognition of our demonstrated capability in global competitiveness, quality and fulfillment. NeST is committed to make Plug Power successful and grow in this product area."
"Plug Power is very impressed with the unique combination of significant vertical integration, quality manufacturing and focus on customer satisfaction provided by NeST," said Scott Egbert, Managing Director of Plug Power Energy India.
"NeST's stellar management team and globally diverse design and manufacturing services allowed Plug Power to confidently enter into this partnership as a way to offer the highest-quality and lowest-cost commercial product to customers."
The companies have entered into a five-year agreement where NeST will manufacture Plug Power's fuel cell systems in India. NeST will also provide support for vendor development, procurement, manufacturing, testing and shipment of the GenSys systems. NeST provides Plug Power with world-class manufacturing and supply expertise in the Indian telecommunications market. At the same time, their ideal location allows for the export of products to other key markets in Africa and Asia.
The companies are currently preparing for the production of the first 200 GenSys units sold to WTTIL, the cell tower arm of Tata Teleservices Ltd (TTSL), announced in July of this year. Plug Power expects to have all 200 units shipped by the end of March, 2010 and install approximately 1,000 systems throughout India by the end of the same year. The Indian telecommunications market is expected to grow with the approximate addition of 50,000 towers annually over the next three to five years.
GenSys provides continuous power to cell tower sites with no or extremely unreliable electric grid service. An estimated ten percent of the cell towers in India currently operate completely off-grid where the primary power is provided by diesel generators. Plug Power's GenSys units are fueled by Liquid Petroleum Gas (LPG), allowing the customer to eliminate logistics associated with the delivery of pure hydrogen.
"This is a great opportunity for NeST to support the fast growing fuel cell market," said N. Jahangir, Vice Chairman and Managing Director of the NeST Group. "This is an ideal product for NeST to demonstrate its vertically integrated capability in electronics, wire harness, power supply, sheet metal, plastics and box build.
"NeST is grateful to Plug Power for selecting us as their manufacturing partner, which I consider as recognition of our demonstrated capability in global competitiveness, quality and fulfillment. NeST is committed to make Plug Power successful and grow in this product area."
"Plug Power is very impressed with the unique combination of significant vertical integration, quality manufacturing and focus on customer satisfaction provided by NeST," said Scott Egbert, Managing Director of Plug Power Energy India.
"NeST's stellar management team and globally diverse design and manufacturing services allowed Plug Power to confidently enter into this partnership as a way to offer the highest-quality and lowest-cost commercial product to customers."
Premier Farnell and Exar sign global franchise agreement
FREMONT, USA & LONDON, UK: Premier Farnell plc (LSE: pfl), the leading multi-channel, high service distributor supporting millions of engineers and purchasing professionals worldwide, has signed a new global franchise agreement with Exar Corp., the company powering connectivity.
Based in Fremont, California, Exar is a technology leader providing highly-differentiated silicon solutions for the Interface, Power Management, Data Communications and Storage markets.
Under the agreement, Premier Farnell will stock a broad range of Exar's products, including transceivers and UARTs; power management ICs, LED drivers, LDO regulators, USBs; and communications products used in T/E Carrier and SONET/SDH applications, such as T1/E1 and T3/E3 framer combos, timing ICs, and transceivers.
"We are pleased to add Exar to our extensive semiconductor line card," said David Shen SVP and Global Head of eCommerce & Technical Marketing at Premier Farnell.
"Exar's broad array of power and communications products will be invaluable to our design engineering customers as they work with the latest technologies. Premier Farnell continues to invest in multi-dimensional technical support programs to ensure that electronic design engineers around the world receive the application information and support on the latest technologies and products from suppliers like Exar as quickly and effectively as possible.
"This investment provides designers with immediate access to our application and solutions information online, and the opportunity to collaborate with other designers on our leading community site, element14."
"Premier Farnell has extensive global market reach, a strong web presence and an excellent reputation for customer service, which we expect will provide new opportunities for Exar to expand our global customer base," said Paul Stafford, director of global channel sales, Exar.
"As a leading multi-channel high service distributor, Premier Farnell's focus on the design engineer community complements our current sales channels and will help accelerate the evaluation and adoption of Exar's products."
Based in Fremont, California, Exar is a technology leader providing highly-differentiated silicon solutions for the Interface, Power Management, Data Communications and Storage markets.
Under the agreement, Premier Farnell will stock a broad range of Exar's products, including transceivers and UARTs; power management ICs, LED drivers, LDO regulators, USBs; and communications products used in T/E Carrier and SONET/SDH applications, such as T1/E1 and T3/E3 framer combos, timing ICs, and transceivers.
"We are pleased to add Exar to our extensive semiconductor line card," said David Shen SVP and Global Head of eCommerce & Technical Marketing at Premier Farnell.
"Exar's broad array of power and communications products will be invaluable to our design engineering customers as they work with the latest technologies. Premier Farnell continues to invest in multi-dimensional technical support programs to ensure that electronic design engineers around the world receive the application information and support on the latest technologies and products from suppliers like Exar as quickly and effectively as possible.
"This investment provides designers with immediate access to our application and solutions information online, and the opportunity to collaborate with other designers on our leading community site, element14."
"Premier Farnell has extensive global market reach, a strong web presence and an excellent reputation for customer service, which we expect will provide new opportunities for Exar to expand our global customer base," said Paul Stafford, director of global channel sales, Exar.
"As a leading multi-channel high service distributor, Premier Farnell's focus on the design engineer community complements our current sales channels and will help accelerate the evaluation and adoption of Exar's products."
RFMD secures multiple design wins for GPS LNA module
GREENSBORO, USA: RF Micro Devices Inc. announced that it has secured multiple high-volume design wins for its RF2815 GPS LNA module. The design wins are in support of multiple upcoming 3G smartphones and 3G data cards, and volume production is expected to commence in RFMD's December 2009 quarter, with a significant increase in volume anticipated in calendar year 2010.
The design wins represent a significant milestone for RFMD as they supplement the Company's revenue growth in power amplifiers/transmit modules and highlight the ongoing positive design activity achieved by RFMD's Switch and Signal Conditioning product line (SSCPL) since its formation in 2007.
The incremental content opportunity available to RFMD's SSCPL is significantly expanding RFMD's total addressable market (TAM) and bolstering RFMD's customer and channel partner relationships by extending RFMD's support for the entire RF front end (transceiver to antenna interface).
RFMD's RF2815 is currently designed into 3G smartphones and 3G data cards manufactured by customers in China, Europe, Korea, North America and Taiwan. The positive design activity supports RFMD's market and customer diversification efforts and is currently expected to reach revenue levels of multiple millions of dollars per quarter as early as the March 2010 quarter.
RFMD is a leading provider of GSM/GPRS, EDGE and 3G transmit modules and power amplifiers to global manufacturers of handsets, smartphones and data cards. RFMD expects to expand its dollar content opportunity in both the power amplifier/transmit module and switch and signal conditioning segments in calendar year 2010.
The RF2815 integrates a low noise-figure LNA, output SAW filter and supporting components in a compact 3.3 x 2.1 x 1.0 mm module. The highly integrated RF2815 is optimized for both solution size and performance and is designed for battery-powered mobile devices, such as portable navigation devices (PNDs) and GPS-enabled handsets, requiring high sensitivity.
The design wins represent a significant milestone for RFMD as they supplement the Company's revenue growth in power amplifiers/transmit modules and highlight the ongoing positive design activity achieved by RFMD's Switch and Signal Conditioning product line (SSCPL) since its formation in 2007.
The incremental content opportunity available to RFMD's SSCPL is significantly expanding RFMD's total addressable market (TAM) and bolstering RFMD's customer and channel partner relationships by extending RFMD's support for the entire RF front end (transceiver to antenna interface).
RFMD's RF2815 is currently designed into 3G smartphones and 3G data cards manufactured by customers in China, Europe, Korea, North America and Taiwan. The positive design activity supports RFMD's market and customer diversification efforts and is currently expected to reach revenue levels of multiple millions of dollars per quarter as early as the March 2010 quarter.
RFMD is a leading provider of GSM/GPRS, EDGE and 3G transmit modules and power amplifiers to global manufacturers of handsets, smartphones and data cards. RFMD expects to expand its dollar content opportunity in both the power amplifier/transmit module and switch and signal conditioning segments in calendar year 2010.
The RF2815 integrates a low noise-figure LNA, output SAW filter and supporting components in a compact 3.3 x 2.1 x 1.0 mm module. The highly integrated RF2815 is optimized for both solution size and performance and is designed for battery-powered mobile devices, such as portable navigation devices (PNDs) and GPS-enabled handsets, requiring high sensitivity.
Wednesday, October 14, 2009
Advanced Battery Technologies announces new battery order
NEW YORK, USA: Advanced Battery Technologies Inc., a leading developer, manufacturer and distributor of rechargeable polymer Li-ion (PLI) batteries, has signed a polymer lithium-ion phosphate battery supply contract with Beijing-based U Long Run Sheng Technology Development Co. Ltd.
The contract amount is RMB60 million (approximately $8.7 million) and is deliverable over the next 12 months. ABAT will supply two kinds of polymer lithium-ion phosphate battery pack: 48V15Ah battery applied to electric motorcycles and 72V50Ah battery applied to other electric vehicles.
U Long Run Sheng is primarily engaged in lithium-battery pack assembly and power management system production and sales. Its products require the safety performance, superior discharge rate and longer cycle life (over 2,000 cycles) of ABAT's lithium-ion phosphate batteries.
Zhiguo Fu, Chairman and CEO of Advanced Battery Technologies, stated: "We are very excited about the new battery order. We believe that it speaks to the quality of our products and services. The management team at U Long Run Sheng compared similar products available in the market and determined that ABAT's polymer lithium-ion batteries provided the best performance and value. We view this as validation of our commitment to research and development, and will strive to create even better battery products and solutions."
The contract amount is RMB60 million (approximately $8.7 million) and is deliverable over the next 12 months. ABAT will supply two kinds of polymer lithium-ion phosphate battery pack: 48V15Ah battery applied to electric motorcycles and 72V50Ah battery applied to other electric vehicles.
U Long Run Sheng is primarily engaged in lithium-battery pack assembly and power management system production and sales. Its products require the safety performance, superior discharge rate and longer cycle life (over 2,000 cycles) of ABAT's lithium-ion phosphate batteries.
Zhiguo Fu, Chairman and CEO of Advanced Battery Technologies, stated: "We are very excited about the new battery order. We believe that it speaks to the quality of our products and services. The management team at U Long Run Sheng compared similar products available in the market and determined that ABAT's polymer lithium-ion batteries provided the best performance and value. We view this as validation of our commitment to research and development, and will strive to create even better battery products and solutions."
IXYS intros high voltage 2500V and 3000V BiMOSFETs
BIEL, SWITZERLAND & MILPITAS, USA: IXYS Corp. announced the expansion of its BiMOSFET product line portfolio with the release of its new High Voltage BiMOSFETs.
These unique devices are tailored to enhance system performance in both the areas of energy efficiency and reliability in high-voltage, high-current commercial and industrial applications.
The introduced HV BiMOSFETs feature blocking voltage capabilities of up to 3kV with corresponding collector current ratings of up to 130 Amperes and uniquely feature a “free” intrinsic body diode similar to that found in a conventional MOSFET.
This new family will compliment IXYS’ other high voltage lines, finding applications in a diverse range of products such as AC switches, circuit breakers, radar pulse modulators, switch-mode power supplies, capacitor discharge circuits, and laser and X-Ray generation systems.
Parallel operation of this new class of devices can be easily achieved due to the positive voltage temperature coefficient of both of its saturation voltage Vce(sat) and the forward voltage drop of its intrinsic diode Vf. Furthermore, this “free” intrinsic body diode serves as a protection diode, providing an alternative path for inductive load current during the turn-off transition of the device, suppressing high Ldi/dt voltage transients from inflicting damage on to the device.
IXYS’ HV BiMOSFETs represent excellent candidates for high-voltage, high current applications where traditional MOSFETs are typically utilized in series-parallel strings to overcome their voltage current and on-state limitations. Such device consolidation reduces the number of power devices and associated complex drive components, resulting in a much simpler system design, with improved reliability, and a lower system cost.
IXYS’ HV BiMOSFETs are available in various standard packages, including the surface mount TO-268 and the leaded TO-247, TO-264, and PLUS247. These devices are also available in IXYS’ proprietary ISOPLUS packaging, offering high isolation capability (up to 3000V) and superior thermal performance.
These unique devices are tailored to enhance system performance in both the areas of energy efficiency and reliability in high-voltage, high-current commercial and industrial applications.
The introduced HV BiMOSFETs feature blocking voltage capabilities of up to 3kV with corresponding collector current ratings of up to 130 Amperes and uniquely feature a “free” intrinsic body diode similar to that found in a conventional MOSFET.
This new family will compliment IXYS’ other high voltage lines, finding applications in a diverse range of products such as AC switches, circuit breakers, radar pulse modulators, switch-mode power supplies, capacitor discharge circuits, and laser and X-Ray generation systems.
Parallel operation of this new class of devices can be easily achieved due to the positive voltage temperature coefficient of both of its saturation voltage Vce(sat) and the forward voltage drop of its intrinsic diode Vf. Furthermore, this “free” intrinsic body diode serves as a protection diode, providing an alternative path for inductive load current during the turn-off transition of the device, suppressing high Ldi/dt voltage transients from inflicting damage on to the device.
IXYS’ HV BiMOSFETs represent excellent candidates for high-voltage, high current applications where traditional MOSFETs are typically utilized in series-parallel strings to overcome their voltage current and on-state limitations. Such device consolidation reduces the number of power devices and associated complex drive components, resulting in a much simpler system design, with improved reliability, and a lower system cost.
IXYS’ HV BiMOSFETs are available in various standard packages, including the surface mount TO-268 and the leaded TO-247, TO-264, and PLUS247. These devices are also available in IXYS’ proprietary ISOPLUS packaging, offering high isolation capability (up to 3000V) and superior thermal performance.
TI intros industry’s first 800-mA, 30-V linear battery chargers with automatic USB detection
BANGALORE, INDIA: Texas Instruments Inc. (TI) has introduced two families of 800-mA USB battery chargers with automatic USB detection for single-cell, lithium-ion (Li-Ion) battery-powered electronics.
The bq2404x and bq2405x battery charger integrated circuits have a high input-voltage range of up to 30 V, and 6.6-V overvoltage protection to support handheld devices, from entry-level feature phones to smartphones, and other low-power handheld devices, that may use low-cost adapters.
The bq2405x’s automatic USB detection feature can intelligently detect if a power source is a dedicated power adapter or USB port. This allows a system to start immediate fast charging if a USB transceiver is unavailable due to a discharged battery.
Key features
* Charging accuracy: one percent charge voltage and 10 percent current accuracy using single-output channel.
* USB compliance: USB current limiting and input voltage dynamic power management
System safety: complies with JEITA guidelines; 30-V input rating and overvoltage protection and includes a 10-hour safety timer.
* System flexibility: bq2405x has automatic input source detection of USB port or a dedicated power adapter.
New battery charger selection tool helps speed selection process
TI provides a broad range of battery charger ICs that support single-cell and multi-cell battery packs used in handheld, portable medical and portable industrial equipment.
Designers can select recommended products using TI’s new Battery charger selector tool, where one can choose criteria based on battery chemistry, number of cells, topology needed and battery voltage levels.
The bq2404x and bq2405x battery charger integrated circuits have a high input-voltage range of up to 30 V, and 6.6-V overvoltage protection to support handheld devices, from entry-level feature phones to smartphones, and other low-power handheld devices, that may use low-cost adapters.
The bq2405x’s automatic USB detection feature can intelligently detect if a power source is a dedicated power adapter or USB port. This allows a system to start immediate fast charging if a USB transceiver is unavailable due to a discharged battery.
Key features
* Charging accuracy: one percent charge voltage and 10 percent current accuracy using single-output channel.
* USB compliance: USB current limiting and input voltage dynamic power management
System safety: complies with JEITA guidelines; 30-V input rating and overvoltage protection and includes a 10-hour safety timer.
* System flexibility: bq2405x has automatic input source detection of USB port or a dedicated power adapter.
New battery charger selection tool helps speed selection process
TI provides a broad range of battery charger ICs that support single-cell and multi-cell battery packs used in handheld, portable medical and portable industrial equipment.
Designers can select recommended products using TI’s new Battery charger selector tool, where one can choose criteria based on battery chemistry, number of cells, topology needed and battery voltage levels.
Tuesday, October 13, 2009
China RoHS catalog published!
This information was sent to me this afternoon by Farnell's Gary Nevison!
The Chinese Government has published the first draft catalogue of Electronic Information Products that will be subject to China RoHS substance restrictions. This draft, published on 9 October 2009, is for consultation, which ends on 9 November 2009. The restrictions will come into force ten months after adoption of this legislation, unless changes are made.
Scope: The scope is limited to telephones and all types of printers that attach to a computer. All types of phones are covered including mobiles, landline telephones and networked handsets.
Substances: The restricted substances are the “RoHS 6” covered by EU RoHS -– lead, cadmium, mercury, hexavalent chromium, PBB and PBDE (excluding deca-BDE according to SJ/T 11363-2006).
Concentration limits: The maximum concentrations are specified by Chinese standard SJ/T 11363-2006. The limits are essentially the same as EU RoHS (0.1 percent in homogeneous materials except cadmium which is 0.01 percent), but these limits are also applicable to coatings (including multiple layers as one material) and for very small components (<4mm3 being regarded as one material).
Exemptions: A list of exemptions is provided for each of the three product categories in the catalogue. There are 10 of the EU RoHS exemptions that would be permitted for mobile handsets, the same ten for “telephones” and 12 permitted for computer printers (the same 10 as for telephones plus one allowing “mercury in straight fluorescent lamps for special purposes” and one for lead in flat fluorescent lamps for LCDs).
Testing: The catalogue refers to SJ/T 11363-2006 which is the maximum concentration limit standard and this standard in turn refers to SJ/T11365-2006 for test methods for RoHS analysis so these methods will need to be used to determine whether products comply.
Entry into force: These obligations will enter force 10 months after the legislation is adopted by the Chinese Government. This is not a long period of time as manufacturers and importers will have to have their products tested and certified by approved Chinese test labs before these can be sold in China.
There will be insufficient time to modify product designs to comply and so clearly it has been assumed that telephones and printers made by Chinese manufacturers will already meet these substance restriction obligations.
Our thanks to ERA Technology Ltd trading as Cobham Technical Services.
Translated from the original Chinese version via Google Translator
The Chinese Government has published the first draft catalogue of Electronic Information Products that will be subject to China RoHS substance restrictions. This draft, published on 9 October 2009, is for consultation, which ends on 9 November 2009. The restrictions will come into force ten months after adoption of this legislation, unless changes are made.
Scope: The scope is limited to telephones and all types of printers that attach to a computer. All types of phones are covered including mobiles, landline telephones and networked handsets.
Substances: The restricted substances are the “RoHS 6” covered by EU RoHS -– lead, cadmium, mercury, hexavalent chromium, PBB and PBDE (excluding deca-BDE according to SJ/T 11363-2006).
Concentration limits: The maximum concentrations are specified by Chinese standard SJ/T 11363-2006. The limits are essentially the same as EU RoHS (0.1 percent in homogeneous materials except cadmium which is 0.01 percent), but these limits are also applicable to coatings (including multiple layers as one material) and for very small components (<4mm3 being regarded as one material).
Exemptions: A list of exemptions is provided for each of the three product categories in the catalogue. There are 10 of the EU RoHS exemptions that would be permitted for mobile handsets, the same ten for “telephones” and 12 permitted for computer printers (the same 10 as for telephones plus one allowing “mercury in straight fluorescent lamps for special purposes” and one for lead in flat fluorescent lamps for LCDs).
Testing: The catalogue refers to SJ/T 11363-2006 which is the maximum concentration limit standard and this standard in turn refers to SJ/T11365-2006 for test methods for RoHS analysis so these methods will need to be used to determine whether products comply.
Entry into force: These obligations will enter force 10 months after the legislation is adopted by the Chinese Government. This is not a long period of time as manufacturers and importers will have to have their products tested and certified by approved Chinese test labs before these can be sold in China.
There will be insufficient time to modify product designs to comply and so clearly it has been assumed that telephones and printers made by Chinese manufacturers will already meet these substance restriction obligations.
Our thanks to ERA Technology Ltd trading as Cobham Technical Services.
Translated from the original Chinese version via Google Translator
At last – the China RoHS 'catalog'!
This information was sent to me by Farnell's Gary Nevison!
Some two years late the Ministry of Industry and Information Technology has just released the proposed first batch Key Administrative Catalogue for the Pollution Control of Electronic Information Products.
While Phase 1 which covered labelling and information was implemented in March 2007, the Phase 2 restriction requirements have slipped on several occasions.
Issued on 9 October, there will now be a one month consultation period.
The law goes into effect 10 months after the catalogue is promulgated.
Items covered include various types of phones and a wide range of printers. Some exemptions will be allowed.
Testing will be required as widely documented.
A more comprehensive report will follow.
Some two years late the Ministry of Industry and Information Technology has just released the proposed first batch Key Administrative Catalogue for the Pollution Control of Electronic Information Products.
While Phase 1 which covered labelling and information was implemented in March 2007, the Phase 2 restriction requirements have slipped on several occasions.
Issued on 9 October, there will now be a one month consultation period.
The law goes into effect 10 months after the catalogue is promulgated.
Items covered include various types of phones and a wide range of printers. Some exemptions will be allowed.
Testing will be required as widely documented.
A more comprehensive report will follow.
TomTom car kit for iPhone now available in Europe
AMSTERDAM, THE NETHERLANDS: TomTom announced that its TomTom car kit for iPhone can be purchased in TomTom web store and Apple online store starting today.
“With TomTom car kit for iPhone, we offer cutting-edge features which allow the most optimised driving and navigation experience with iPhone” said Benoit Simeray, Vice-president Mobile On-Board at TomTom. “It was designed with safety and quality in mind to offer iPhone users the best in car experience”.
TomTom car kit for iPhone key features
The TomTom car kit for iPhone provides a safe driving experience while enhancing your in-car navigation journey. Features include:
Secure docking
* Secure mount with unique design docks iPhone to the desired position on the car windshield or dashboard, using a twist-and-lock motion.
* Adjustable mount securely rotates iPhone to either portrait or landscape mode for optimal positioning and widescreen route display.
* Easily removed with one twist upon arrival at a destination.
Enhanced GPS performance
* Built-in GPS receiver reduces the chance of signal drop out in areas where GPS reception is limited like cities with tall buildings or forested areas.
* Significantly improved positioning accuracy in all areas.
Built-in loud speaker and microphone
* Clear voice instructions through the built-in speaker, so you’ll hear every direction loud and clear.
* Integrated microphone and speaker allowing hands-free calling while driving.
Additional features
* Charges iPhone while on the go, so it stays fully charged.
* Plays your iPhone music through the AUX OUT port over your car stereo.
The TomTom car kit for iPhone is now available on TomTom's web store (www.tomtom.com) and in Apple online store with a recommended retail price of 99,99 euro. It will be available in the US on the TomTom web store and in US Apple online and retail stores in the near future.
“With TomTom car kit for iPhone, we offer cutting-edge features which allow the most optimised driving and navigation experience with iPhone” said Benoit Simeray, Vice-president Mobile On-Board at TomTom. “It was designed with safety and quality in mind to offer iPhone users the best in car experience”.
TomTom car kit for iPhone key features
The TomTom car kit for iPhone provides a safe driving experience while enhancing your in-car navigation journey. Features include:
Secure docking
* Secure mount with unique design docks iPhone to the desired position on the car windshield or dashboard, using a twist-and-lock motion.
* Adjustable mount securely rotates iPhone to either portrait or landscape mode for optimal positioning and widescreen route display.
* Easily removed with one twist upon arrival at a destination.
Enhanced GPS performance
* Built-in GPS receiver reduces the chance of signal drop out in areas where GPS reception is limited like cities with tall buildings or forested areas.
* Significantly improved positioning accuracy in all areas.
Built-in loud speaker and microphone
* Clear voice instructions through the built-in speaker, so you’ll hear every direction loud and clear.
* Integrated microphone and speaker allowing hands-free calling while driving.
Additional features
* Charges iPhone while on the go, so it stays fully charged.
* Plays your iPhone music through the AUX OUT port over your car stereo.
The TomTom car kit for iPhone is now available on TomTom's web store (www.tomtom.com) and in Apple online store with a recommended retail price of 99,99 euro. It will be available in the US on the TomTom web store and in US Apple online and retail stores in the near future.
Avago's high performance touch screen interface technology for smart phones and portable electronic communications devices
SAN JOSE, USA & SINGAPORE: Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, today announced it has developed an innovative new touch screen interface that greatly enhances the operation and navigation of Smart Phones, portable media players, and a wide range of other portable electronic communications devices.
This new touch screen technology from Avago is a mutual capacitance, multi-touch controller that is capable of tracking up to four simultaneous touch points without the problem of ghost points that are found in most other competing capacitive sensing technologies.
A touch screen system typically consists of an LCD or organic light-emitting diode (OLED) display, a touch sensitive panel, a protective cover lens, and a touch screen controller. Avago’s multi-touch, capacitive touch screen controller has been specifically designed to offer highly-accurate, responsive and fluid on-screen navigation to greatly enhance the end-user’s experience.
Other key features of Avago’s touch screen interface include 500 dpi resolution for jitter free smooth tracking; hover rejection and palm detection to prevent false touch responses; good adjacent touch resolution for finer screen features and sensitivity; and 13-inch per second tracking speed to provide screen navigation that is fast, responsive and suitable for gaming applications.
Designed for ease of adoption and manufacturing, Avago’s touch screen interface does not require any touch sensitivity scaling, noise tuning or capacitive balancing. It also has a robust design that allows for flexible ASIC placement on flex or printed circuit boards.
To simplify the assembly process, this device has a patent pending, built-in self test for panel indium tin oxide (ITO) breakage ‘open/shorts,’ which means no application test fixture is required resulting in scalability and quick turnaround of sensor panel prototypes and efficient manufacturing.
Panel integrity tests can also be run on devices in the field. Moreover, this touch screen controller offers configurable registers for customization and debugging, and pairs with both glass and polyethylene terephthalate (PET) sensor panels.
In addition to these key product features, a complete development kit, which includes software and sensor panel design guides are provided to further ease the implementation of this capacitive touch panel into customer designs.
“The announcement of our new touch screen panel is yet another example of technology leadership in this market, and helps to reaffirm our position as a major supplier of navigation interfaces to all the major Smart Phone and mobile communications handset manufacturers,” said Khin-Mien Chong, vice president and general manager, Navigation Interface Division, Avago Technologies. “Our touch screen interface controller is designed to enhance the overall touch screen experience.”
Avago’s new capacitive touch panel controller is currently shipping to one of the world’s leading portable media player manufacturers and receiving excellent industry reviews for its multi-touch performance. Additionally, several key mobile handset manufacturers are currently sampling Avago’s touch screen controller for use in their next generation designs.
This new touch screen technology from Avago is a mutual capacitance, multi-touch controller that is capable of tracking up to four simultaneous touch points without the problem of ghost points that are found in most other competing capacitive sensing technologies.
A touch screen system typically consists of an LCD or organic light-emitting diode (OLED) display, a touch sensitive panel, a protective cover lens, and a touch screen controller. Avago’s multi-touch, capacitive touch screen controller has been specifically designed to offer highly-accurate, responsive and fluid on-screen navigation to greatly enhance the end-user’s experience.
Other key features of Avago’s touch screen interface include 500 dpi resolution for jitter free smooth tracking; hover rejection and palm detection to prevent false touch responses; good adjacent touch resolution for finer screen features and sensitivity; and 13-inch per second tracking speed to provide screen navigation that is fast, responsive and suitable for gaming applications.
Designed for ease of adoption and manufacturing, Avago’s touch screen interface does not require any touch sensitivity scaling, noise tuning or capacitive balancing. It also has a robust design that allows for flexible ASIC placement on flex or printed circuit boards.
To simplify the assembly process, this device has a patent pending, built-in self test for panel indium tin oxide (ITO) breakage ‘open/shorts,’ which means no application test fixture is required resulting in scalability and quick turnaround of sensor panel prototypes and efficient manufacturing.
Panel integrity tests can also be run on devices in the field. Moreover, this touch screen controller offers configurable registers for customization and debugging, and pairs with both glass and polyethylene terephthalate (PET) sensor panels.
In addition to these key product features, a complete development kit, which includes software and sensor panel design guides are provided to further ease the implementation of this capacitive touch panel into customer designs.
“The announcement of our new touch screen panel is yet another example of technology leadership in this market, and helps to reaffirm our position as a major supplier of navigation interfaces to all the major Smart Phone and mobile communications handset manufacturers,” said Khin-Mien Chong, vice president and general manager, Navigation Interface Division, Avago Technologies. “Our touch screen interface controller is designed to enhance the overall touch screen experience.”
Avago’s new capacitive touch panel controller is currently shipping to one of the world’s leading portable media player manufacturers and receiving excellent industry reviews for its multi-touch performance. Additionally, several key mobile handset manufacturers are currently sampling Avago’s touch screen controller for use in their next generation designs.
Genius Electronic Optical addresses street lighting apps in China with LUXEON Rebel power LEDs
SHANGHAI, CHINA: Philips Lumileds and Genius Electronic Optical Co. (GSEO) announced that GSEO is developing new solid-state street lights and street light modules with LUXEON Rebel for use on roadways throughout China.
The first installations of GSEO’s new streetlights are expected in early 2010. GSEO’s LED specification for its most advanced street lights—using LUXEON Rebel—prioritized reliability, efficacy, ease of integration and thermal capabilities, the primary factors that allow their solid-state solution to achieve a lower total cost of ownership and lower energy consumption than conventional light sources.
Selecting a proven and reliable power LED allowed GSEO’s engineers to create a design that delivers 70 lumens per watt, minimize the number of LEDs required, and minimize or eliminate glare that can be a visual disturbance. The company uses a patented thermal design that ensures the lifetime performance of the LUXEON Rebel LEDs. In fact, the cooling system is guaranteed for the life of the product.
“The solutions that GSEO is developing can bring great benefit to the cities that adopt and implement the new street lights,” said Alvin Tse, VP Asia Pacific Sales. “We expect that their design will deliver high quality, reliable street lighting for many years to come.”
“GSEO’s approach to creating new solutions is to choose the highest quality LEDs and to implement an optimized system design to ensure that the new luminaire is the best overall solution for its designated application,” said Calvin Chen, Director of LED Lighting BU at GSEO.
“The result is a high quality, long life street light with uniform light distribution. GSEO intends to provide its solution using Philips LUXEON Rebel LEDs to municipalities and organizations globally.”
GSEO (Genius Electronic Optical) Co., Ltd was established in 1990, and in addition to street lights is developing tunnel lights, flood lights and other solid-state lighting solutions designed to save energy and help reduce CO2 emissions.
With tremendous experience in injection mold design and production, GSEO specializes in high precision optical component design, development and manufacture. Together these capabilities allow GSEO to provide customers with a complete design and manufacturing process solution.
The first installations of GSEO’s new streetlights are expected in early 2010. GSEO’s LED specification for its most advanced street lights—using LUXEON Rebel—prioritized reliability, efficacy, ease of integration and thermal capabilities, the primary factors that allow their solid-state solution to achieve a lower total cost of ownership and lower energy consumption than conventional light sources.
Selecting a proven and reliable power LED allowed GSEO’s engineers to create a design that delivers 70 lumens per watt, minimize the number of LEDs required, and minimize or eliminate glare that can be a visual disturbance. The company uses a patented thermal design that ensures the lifetime performance of the LUXEON Rebel LEDs. In fact, the cooling system is guaranteed for the life of the product.
“The solutions that GSEO is developing can bring great benefit to the cities that adopt and implement the new street lights,” said Alvin Tse, VP Asia Pacific Sales. “We expect that their design will deliver high quality, reliable street lighting for many years to come.”
“GSEO’s approach to creating new solutions is to choose the highest quality LEDs and to implement an optimized system design to ensure that the new luminaire is the best overall solution for its designated application,” said Calvin Chen, Director of LED Lighting BU at GSEO.
“The result is a high quality, long life street light with uniform light distribution. GSEO intends to provide its solution using Philips LUXEON Rebel LEDs to municipalities and organizations globally.”
GSEO (Genius Electronic Optical) Co., Ltd was established in 1990, and in addition to street lights is developing tunnel lights, flood lights and other solid-state lighting solutions designed to save energy and help reduce CO2 emissions.
With tremendous experience in injection mold design and production, GSEO specializes in high precision optical component design, development and manufacture. Together these capabilities allow GSEO to provide customers with a complete design and manufacturing process solution.
Monday, October 12, 2009
Global nanotech thin film Li-ion battery market shares, strategies, and forecasts, 2009-2015
NEW YORK, USA: Reportlinker.com announces that a new market research report is available in its catalog -- Worldwide Nanotechnology Thin Film Lithium-Ion Battery Market Shares, Strategies, and Forecasts, 2009-2015.
WinterGreen Research announces that it has a new study on Worldwide nanotechnology thin film lithium-ion battery markets. The 2009 study has 412 pages, 112 Tables and Figures. Worldwide nanotechnology Li-ion batteries are poised to achieve significant growth as units become smaller and less expensive broadening the types of energy applications in which they are included.
Worldwide nanotechnology thin film Li-ion batteries are poised to achieve significant growth as units become more able to achieve deliver of power to electric vehicles efficiently. Less expensive Li-ion batteries allow leveraging economies of scale and proliferation of devices into a wide range of applications.
According to Susan Eustis, lead author of the study: "Economies of scale leverage the Li-ion battery nanotechnology advances needed to make lithium-ion batteries competitive. Nanotechnology provided by Li-ion research solves the issues poised by the need to store renewable energy. Li-ion batteries switch price reductions are poised to drive market adoption by making units affordable."
Nanotechnology results obtained in the laboratory are being translated into commercial products. The processes of translating the nanotechnology science into thin film Li-ion batteries are anticipated to be ongoing. The breakthroughs of science in the laboratory have only begun to be translated into life outside the lab, with a long way to go in improving the functioning of the Li-ion batteries.
Unlike any other battery technology, thin film solid-state batteries show very high cycle life. Using very thin cathodes (0.05 micron) batteries have been cycled in excess of 45,000 cycles with very limited loss in capacity. After 45,000 cycles, 95 percent of the original capacity remained.
Then, there is the problem of translating the evolving technology into manufacturing process. What this means is that the market will be very dynamic, with the market leaders continuously being challenged by innovators, large and small that develop more cost efficient units. Systems integration and manufacturing capabilities have developed a broad family of high-power lithium-ion batteries and battery systems.
A family of battery products, combined with strategic partner relationships in the transportation, electric grid services and portable power markets, position vendors to address these markets for Li-ion batteries.
Electric vehicles depend on design, development, manufacture, and support of advanced, rechargeable Li-ion batteries. Batteries provide a combination of power, safety and life. Next-generation energy storage solutions are evolving as commercially available batteries. Li-ion batteries will play an increasingly important role in facilitating a shift toward cleaner forms of energy.
Innovative approaches to materials science and battery engineering are available from a large number of very significant companies -- GE, Panasonic Sanyo / Matsushita Industrial Co., Ltd., NEC, Saft, Toshiba, BYD / Berkshire Hathaway, LG Chem, Altair Nanotechnologies, Samsung, Sony, A123 Systems with MIT technology, and Altair Nanotechnologies.
Markets for Li-ion batteries at $911 million in 2008 are anticipated to reach $9.1 billion by 2015, growing in response to decreases in unit costs and increases. Li-ion batteries used in cell phones and PCs, and in cordless power tools are proving the technology.
Units are shipped into military markets and are used in satellites, proving the feasibility of systems. Small, Li-ion prismatic batteries prove the feasibility of this technology. The large emerging markets are for hybrid and electric vehicles powered by renewable energy systems.
WinterGreen Research announces that it has a new study on Worldwide nanotechnology thin film lithium-ion battery markets. The 2009 study has 412 pages, 112 Tables and Figures. Worldwide nanotechnology Li-ion batteries are poised to achieve significant growth as units become smaller and less expensive broadening the types of energy applications in which they are included.
Worldwide nanotechnology thin film Li-ion batteries are poised to achieve significant growth as units become more able to achieve deliver of power to electric vehicles efficiently. Less expensive Li-ion batteries allow leveraging economies of scale and proliferation of devices into a wide range of applications.
According to Susan Eustis, lead author of the study: "Economies of scale leverage the Li-ion battery nanotechnology advances needed to make lithium-ion batteries competitive. Nanotechnology provided by Li-ion research solves the issues poised by the need to store renewable energy. Li-ion batteries switch price reductions are poised to drive market adoption by making units affordable."
Nanotechnology results obtained in the laboratory are being translated into commercial products. The processes of translating the nanotechnology science into thin film Li-ion batteries are anticipated to be ongoing. The breakthroughs of science in the laboratory have only begun to be translated into life outside the lab, with a long way to go in improving the functioning of the Li-ion batteries.
Unlike any other battery technology, thin film solid-state batteries show very high cycle life. Using very thin cathodes (0.05 micron) batteries have been cycled in excess of 45,000 cycles with very limited loss in capacity. After 45,000 cycles, 95 percent of the original capacity remained.
Then, there is the problem of translating the evolving technology into manufacturing process. What this means is that the market will be very dynamic, with the market leaders continuously being challenged by innovators, large and small that develop more cost efficient units. Systems integration and manufacturing capabilities have developed a broad family of high-power lithium-ion batteries and battery systems.
A family of battery products, combined with strategic partner relationships in the transportation, electric grid services and portable power markets, position vendors to address these markets for Li-ion batteries.
Electric vehicles depend on design, development, manufacture, and support of advanced, rechargeable Li-ion batteries. Batteries provide a combination of power, safety and life. Next-generation energy storage solutions are evolving as commercially available batteries. Li-ion batteries will play an increasingly important role in facilitating a shift toward cleaner forms of energy.
Innovative approaches to materials science and battery engineering are available from a large number of very significant companies -- GE, Panasonic Sanyo / Matsushita Industrial Co., Ltd., NEC, Saft, Toshiba, BYD / Berkshire Hathaway, LG Chem, Altair Nanotechnologies, Samsung, Sony, A123 Systems with MIT technology, and Altair Nanotechnologies.
Markets for Li-ion batteries at $911 million in 2008 are anticipated to reach $9.1 billion by 2015, growing in response to decreases in unit costs and increases. Li-ion batteries used in cell phones and PCs, and in cordless power tools are proving the technology.
Units are shipped into military markets and are used in satellites, proving the feasibility of systems. Small, Li-ion prismatic batteries prove the feasibility of this technology. The large emerging markets are for hybrid and electric vehicles powered by renewable energy systems.
Saturday, October 10, 2009
Reportlinker's global and China OLED industry report, 2009
NEW YORK, USA: Reportlinker.com has announced a new market research report -- Global And China OLED Industry Report, 2009.
Compared with TFT-LCD, cost on raw materials of OLED is at least 70 percent lower; because OLED needs not polarizing plate, backlight module or color filter. However, OLED is still in a dilemma. In 2009, Active Matrix OLED emerged, and OLED TV also made its debut. The growth of OLED speeds up, but bottleneck still exists.
OLED has very weak anti-oxidation ability, which restricts its development. Moreover, OLED equipment has to be driven by high electric current; therefore LTPS-TFT substrate is a must for it.
LTPS keeps cost of OLED at a high level. At present, OLED suffers losses in business. Most TFT-LCD manufactures have finished amortization of old production lines. LTPS TFT is controlled by a few large-sized TFT-LCD manufactures; therefore their attitude towards OLED is a key for development of OLED.
Unless they have a full command of OLED production techniques, they will not involve in OLED production. In consequence, OLED is currently controlled by few giants such as Samsung; which is unfavorable for OELD industry.
OLED must break away from LTPS TFT substrate, and also improve resolution for competing with traditional TFT-LCD. With the same size, resolution of OLED is much weaker than that of TFT-LCD. Therefore, OLED fits for large-sized screen (above 3 inches), yet, the bigger size is, the more cost will be.
SMD monopolizes the small-sized OLED market; therefore other producers try to develop large-sized OLED market, but LTPS technology is not suitably employed to large-sized OLED. Even LTPS technology gets improved even high up to sixth generation or seventh generation, it is still rather poor in cost efficiency.
SMD controls most resources, so OLED display market is also dominated by Samsung. Small-sized AM OLED will not see greater development in the future. As a mobile phone producer Samsung doesn’t possess upstream resources of AM OLED. Due to higher cost of OLED, it is forecasted that mobile phone with OLED display will just account for 5 percent market share.
Sony 11-inch and LG 15-inch OLED TV have been commercialized, but their prices are extremely high due to their low rate of finished products (below 30 percent); while rate of TFT-LCD finished products can reach above 99 percent. Just a few TFT-LCD giants can produce OLED TV sets. However, they will not be completely involved in OLED TV production until they take back all investment.
At present, only TOKKI and ULVAC produce OLED equipments. TOKKI is an important one, its largest glass substrate size is 370mm*470mm. DuPont, BASF and IDEMITSU KOSAN are the key producers of luminescent materials, but these chemical giants are not interested in this market, just 1 percent of TFT-LCD market.
Nearly 75 percent cost of TFT-LCD originates from raw materials, while cost of OLED on raw materials just accounts for less than 25 percent. TFT-LCD has had no means to reduce cost efficiently today; once the rate of finished OLED products improves to 70 percent, there will be no room for TFT-LCD in the future. Therefore, OLED industry has a bright future.
Compared with TFT-LCD, cost on raw materials of OLED is at least 70 percent lower; because OLED needs not polarizing plate, backlight module or color filter. However, OLED is still in a dilemma. In 2009, Active Matrix OLED emerged, and OLED TV also made its debut. The growth of OLED speeds up, but bottleneck still exists.
OLED has very weak anti-oxidation ability, which restricts its development. Moreover, OLED equipment has to be driven by high electric current; therefore LTPS-TFT substrate is a must for it.
LTPS keeps cost of OLED at a high level. At present, OLED suffers losses in business. Most TFT-LCD manufactures have finished amortization of old production lines. LTPS TFT is controlled by a few large-sized TFT-LCD manufactures; therefore their attitude towards OLED is a key for development of OLED.
Unless they have a full command of OLED production techniques, they will not involve in OLED production. In consequence, OLED is currently controlled by few giants such as Samsung; which is unfavorable for OELD industry.
OLED must break away from LTPS TFT substrate, and also improve resolution for competing with traditional TFT-LCD. With the same size, resolution of OLED is much weaker than that of TFT-LCD. Therefore, OLED fits for large-sized screen (above 3 inches), yet, the bigger size is, the more cost will be.
SMD monopolizes the small-sized OLED market; therefore other producers try to develop large-sized OLED market, but LTPS technology is not suitably employed to large-sized OLED. Even LTPS technology gets improved even high up to sixth generation or seventh generation, it is still rather poor in cost efficiency.
SMD controls most resources, so OLED display market is also dominated by Samsung. Small-sized AM OLED will not see greater development in the future. As a mobile phone producer Samsung doesn’t possess upstream resources of AM OLED. Due to higher cost of OLED, it is forecasted that mobile phone with OLED display will just account for 5 percent market share.
Sony 11-inch and LG 15-inch OLED TV have been commercialized, but their prices are extremely high due to their low rate of finished products (below 30 percent); while rate of TFT-LCD finished products can reach above 99 percent. Just a few TFT-LCD giants can produce OLED TV sets. However, they will not be completely involved in OLED TV production until they take back all investment.
At present, only TOKKI and ULVAC produce OLED equipments. TOKKI is an important one, its largest glass substrate size is 370mm*470mm. DuPont, BASF and IDEMITSU KOSAN are the key producers of luminescent materials, but these chemical giants are not interested in this market, just 1 percent of TFT-LCD market.
Nearly 75 percent cost of TFT-LCD originates from raw materials, while cost of OLED on raw materials just accounts for less than 25 percent. TFT-LCD has had no means to reduce cost efficiently today; once the rate of finished OLED products improves to 70 percent, there will be no room for TFT-LCD in the future. Therefore, OLED industry has a bright future.
Shin-Etsu Chemical develops low-hardness, high-thermally conductive silicone soft pad
TOKYO, JAPAN: Shin-Etsu Chemical Co. Ltd has developed and begun to market a low-hardness, high-thermally conductive silicone soft pad, the "TC-CA Series," that offers excellent cost-performance.
The newly developed series of products have both high thermal conductivity and excellent electrical insulation properties, which stem from Shin-Etsu’s advanced polymer and thermally conductive filler composite material technologies.
In addition, compared to conventional products, the new silicone soft pad product combines such superior properties as: (1) high thermal conductivity, (2) low-hardness that makes for good compressibility and a stress-relaxation property that can reduce stress to heat modules, (3) an excellent workability and processibility, and (4) low specific gravity.
The main application of this new series of silicone soft pad products will be for countermeasures against the heat emanating from various electronics devices, such as those mounted in notebook PCs, LED lighting, hybrid cars and electric cars, and it meets the need for thinner and lighter weight device applications.
The TC-CA Series has a line-up of four kinds of products – the TC-CAS, TC-CAB, TC-CAD, and TC-CAT. One can choose the most appropriate product depending on your application or usage conditions. Commercial production is scheduled to begin in December 2009.
These heat-dissipating thermal interface materials are thermally conductive compounds fitted between the heat-generating unit, such as a computer’s CPU, and the heat sink. Demand for thermally conductive silicone rubber sheet is expanding for such heat-dissipation applications as in the growing number of electronic components in automobiles and LEDs as well as in PCs, home appliances, and electronic game units. Moreover, due to the increasing miniaturization and higher performance of electronic devices, the need for more effective heat-dissipation materials is further increasing.
Shin-Etsu Chemical has a line-up of various thermally conductive silicone materials such as soft pad, insulating rubber, phase-change materials, two-sided adhesive tapes, greases, gels and adhesive agents. Depending on the application, it is possible to meet diverse heat-dissipation requirements, and Shin-Etsu will go forward with product development to meet the future needs of a market that will have even more sophisticated needs.
Silicones are highly functional materials that combine characteristics of both organic and inorganic materials. They are materials that provide high-value-added features for products in a wide range of industrial fields, including electrical and electronic applications, automobiles, construction, cosmetics and chemicals.
The newly developed series of products have both high thermal conductivity and excellent electrical insulation properties, which stem from Shin-Etsu’s advanced polymer and thermally conductive filler composite material technologies.
In addition, compared to conventional products, the new silicone soft pad product combines such superior properties as: (1) high thermal conductivity, (2) low-hardness that makes for good compressibility and a stress-relaxation property that can reduce stress to heat modules, (3) an excellent workability and processibility, and (4) low specific gravity.
The main application of this new series of silicone soft pad products will be for countermeasures against the heat emanating from various electronics devices, such as those mounted in notebook PCs, LED lighting, hybrid cars and electric cars, and it meets the need for thinner and lighter weight device applications.
The TC-CA Series has a line-up of four kinds of products – the TC-CAS, TC-CAB, TC-CAD, and TC-CAT. One can choose the most appropriate product depending on your application or usage conditions. Commercial production is scheduled to begin in December 2009.
These heat-dissipating thermal interface materials are thermally conductive compounds fitted between the heat-generating unit, such as a computer’s CPU, and the heat sink. Demand for thermally conductive silicone rubber sheet is expanding for such heat-dissipation applications as in the growing number of electronic components in automobiles and LEDs as well as in PCs, home appliances, and electronic game units. Moreover, due to the increasing miniaturization and higher performance of electronic devices, the need for more effective heat-dissipation materials is further increasing.
Shin-Etsu Chemical has a line-up of various thermally conductive silicone materials such as soft pad, insulating rubber, phase-change materials, two-sided adhesive tapes, greases, gels and adhesive agents. Depending on the application, it is possible to meet diverse heat-dissipation requirements, and Shin-Etsu will go forward with product development to meet the future needs of a market that will have even more sophisticated needs.
Silicones are highly functional materials that combine characteristics of both organic and inorganic materials. They are materials that provide high-value-added features for products in a wide range of industrial fields, including electrical and electronic applications, automobiles, construction, cosmetics and chemicals.
Friday, October 9, 2009
Verical launches Electronic Components Marketplace
SAN FRANCISCO, USA: Verical Inc., the Electronic Components Marketplace, announced the production launch of its online trading platform for global high tech manufacturers and distributors of electronic components.
Countering major risks to the high tech supply chain, the Verical Marketplace uses information and technology to create a unique pedigree scoring system for component parts available in its catalog at www.verical.com.
As the economy rebounds, buyers and sellers are growing more and more vulnerable to the risks of inventory excess and shortages that drive grey market activity and increasingly sophisticated counterfeit methods. In either a rebounding or floundering market, the Verical Marketplace optimizes transactions within the industrial supply chain for sellers faced with disposing of excess inventory and buyers faced with shortage purchasing.
Market opportunity: of the $600 billion annual market for electronic components, the time-critical segment is an estimated $22 billion, approximately $12 billion of which is serviced by unauthorized distributors, and 13 percent of which is counterfeit, according to the trade association IPC.
The US Department of Defense found that 15 percent of the shortage parts in its supply chain were fakes, with the number growing at a compound annual growth rate of 25 percent from 2005-2008.
“Today, the electronic component secondary market is fraught with risk and inefficiencies — buyers have no visibility into the true source of their components; they can only guess at a part’s authenticity or warranty, and have incomplete information about what the part really is and what a fair price is,” explained Stephen P. Kaufman, senior lecturer of Business Administration at Harvard Business School, and former chairman and CEO of giant distributor Arrow Electronics.
“At the same time, sellers have to worry about not getting a decent price for their surplus inventory, protecting their brands, and the hassle of not having a single place in which to sell their parts. There is a significant opportunity to upgrade the entire supply chain by addressing the current flaws of the secondary market, and Verical is addressing this challenge head on.”
Growing exponentially since its beta introduction in January, the Verical Marketplace currently serves 3,200+ buyers from small electronics firms to global high tech manufacturers, with 27,000+ unique part numbers from 230+ manufacturers, including IDT, Molex, NXP Semiconductors, Texas Instruments, and Tyco Electronics.
Verical redefines electronic components marketplace
To redefine the electronic components marketplace, Verical relies on a deep leadership team in supply chain software that includes industry veterans from Solectron, Agile Software, Dept. of Homeland Security, Classic Components, and Lockheed-Martin.
Company president, CEO and co-founder Josef T. Ruef has over 16 years of experience with the secondary market, specifically in developing anti-counterfeiting best practices. John P. Brown, Verical’s vice president of marketing and strategy and company co-founder, has a wide range of experience in operations and the management of information-sharing networks between organizations.
Additionally, VP of supply chain and operations Chris Cookson brings more than 20 years of supply chain and consulting experience; VP of sales and community development Bill Aston brings 20 years in enterprise supply chain software; and VP of Engineering Jes Lefcourt has 15 years in software management.
“The secondary market is being exploited by fraudsters and profiteers,” said Ruef. “Our deep experience with systemic failures in the secondary market led us to build the Verical Marketplace as an extension of the primary market.
“We believe ‘information’ and ‘traceability’ are the keys to retaining component part value for sound decision-making and confident transactions. By providing buyers and sellers with the pedigree scoring of component parts, a measure of each part’s traceability, we are uniquely positioned to complement franchise distribution as a trustworthy source of inventory when traditional sources cannot fulfill demand.”
Unlike third party auction houses and consignment sales, the Verical Marketplace permits only authorized channels and original owners of component parts to sell pedigreed inventory. Its innovative pedigree system assigns a score to each component part based on how far back Verical is able trace its chain of custody.
The higher the pedigree score, the further up the supply chain the component is traceable. The end result is sellers can monetize unused assets at a greater return on their inventory investment, and buyers can manage their purchase risk and expedite their shortage fulfillment.
“For sellers, writing off excess inventory equals lost revenue. Typically, sellers of excess inventory get 4-8 percent return. Today in the Verical Marketplace, they’re getting 8-10 times that with the average seller recovering 60 percent of the historical cost,” noted Cookson.
Countering major risks to the high tech supply chain, the Verical Marketplace uses information and technology to create a unique pedigree scoring system for component parts available in its catalog at www.verical.com.
As the economy rebounds, buyers and sellers are growing more and more vulnerable to the risks of inventory excess and shortages that drive grey market activity and increasingly sophisticated counterfeit methods. In either a rebounding or floundering market, the Verical Marketplace optimizes transactions within the industrial supply chain for sellers faced with disposing of excess inventory and buyers faced with shortage purchasing.
Market opportunity: of the $600 billion annual market for electronic components, the time-critical segment is an estimated $22 billion, approximately $12 billion of which is serviced by unauthorized distributors, and 13 percent of which is counterfeit, according to the trade association IPC.
The US Department of Defense found that 15 percent of the shortage parts in its supply chain were fakes, with the number growing at a compound annual growth rate of 25 percent from 2005-2008.
“Today, the electronic component secondary market is fraught with risk and inefficiencies — buyers have no visibility into the true source of their components; they can only guess at a part’s authenticity or warranty, and have incomplete information about what the part really is and what a fair price is,” explained Stephen P. Kaufman, senior lecturer of Business Administration at Harvard Business School, and former chairman and CEO of giant distributor Arrow Electronics.
“At the same time, sellers have to worry about not getting a decent price for their surplus inventory, protecting their brands, and the hassle of not having a single place in which to sell their parts. There is a significant opportunity to upgrade the entire supply chain by addressing the current flaws of the secondary market, and Verical is addressing this challenge head on.”
Growing exponentially since its beta introduction in January, the Verical Marketplace currently serves 3,200+ buyers from small electronics firms to global high tech manufacturers, with 27,000+ unique part numbers from 230+ manufacturers, including IDT, Molex, NXP Semiconductors, Texas Instruments, and Tyco Electronics.
Verical redefines electronic components marketplace
To redefine the electronic components marketplace, Verical relies on a deep leadership team in supply chain software that includes industry veterans from Solectron, Agile Software, Dept. of Homeland Security, Classic Components, and Lockheed-Martin.
Company president, CEO and co-founder Josef T. Ruef has over 16 years of experience with the secondary market, specifically in developing anti-counterfeiting best practices. John P. Brown, Verical’s vice president of marketing and strategy and company co-founder, has a wide range of experience in operations and the management of information-sharing networks between organizations.
Additionally, VP of supply chain and operations Chris Cookson brings more than 20 years of supply chain and consulting experience; VP of sales and community development Bill Aston brings 20 years in enterprise supply chain software; and VP of Engineering Jes Lefcourt has 15 years in software management.
“The secondary market is being exploited by fraudsters and profiteers,” said Ruef. “Our deep experience with systemic failures in the secondary market led us to build the Verical Marketplace as an extension of the primary market.
“We believe ‘information’ and ‘traceability’ are the keys to retaining component part value for sound decision-making and confident transactions. By providing buyers and sellers with the pedigree scoring of component parts, a measure of each part’s traceability, we are uniquely positioned to complement franchise distribution as a trustworthy source of inventory when traditional sources cannot fulfill demand.”
Unlike third party auction houses and consignment sales, the Verical Marketplace permits only authorized channels and original owners of component parts to sell pedigreed inventory. Its innovative pedigree system assigns a score to each component part based on how far back Verical is able trace its chain of custody.
The higher the pedigree score, the further up the supply chain the component is traceable. The end result is sellers can monetize unused assets at a greater return on their inventory investment, and buyers can manage their purchase risk and expedite their shortage fulfillment.
“For sellers, writing off excess inventory equals lost revenue. Typically, sellers of excess inventory get 4-8 percent return. Today in the Verical Marketplace, they’re getting 8-10 times that with the average seller recovering 60 percent of the historical cost,” noted Cookson.
Thursday, October 8, 2009
Universal Display bags two DOE SBIR Phase I grants for white phosphorescent OLED lighting
EWING, USA: Universal Display Corp., an innovator behind today’s and tomorrow’s displays and lighting through its UniversalPHOLED phosphorescent OLED technology and materials, announced that the company has been awarded two new Small Business Innovation Research (SBIR) Phase I $100,000 programs from the US Department of Energy (DOE).
Under these two contracts, Universal Display will seek to demonstrate further advances in the performance of white OLEDs and continue to work towards achieving the DOE’s solid-state lighting commercial targets.
In the first of the two contracts, Universal Display proposes to demonstrate a very high-efficiency white PHOLED lighting device. Through the use of its highly-efficient UniversalPHOLED technology and materials, enhanced host and transport materials, and high index substrates, Universal Display’s goal is to demonstrate further gains in power efficiency, exceeding its prior research milestone of 102 lumens per watt.
In the second award, Universal Display proposes to demonstrate a white PHOLED using the company’s novel OLED permeation barrier technology. The Company, working with Princeton University, recently demonstrated a material system that forms an ultra-hermetic, flexible and transparent environmental barrier for OLEDs. This may provide a cost-effective packaging solution for high-volume, low-cost manufacture of white OLED lighting devices.
“Based on our proprietary high-efficiency phosphorescent OLED technology, white OLEDs have demonstrated the potential to meet the requirements of a growing number of specialty lighting applications,” said Steven V. Abramson, President and Chief Executive Officer of Universal Display. “These two new programs are intended to support continued advances in white OLED performance as well as the drive to lower the OLED cost structure toward the U.S. Department of Energy’s longer-term commercial targets for general lighting.”
The DOE has made a long-term commitment to advance the development and introduction of energy-efficient white lighting sources for general illumination. According to industry estimates, electric bills for lighting alone are over $200 billion per year on a worldwide basis.
It has been estimated that by 2016, white OLEDs could generate well over $20 billion in worldwide savings of electricity costs and could save over nine million metric tons of carbon emissions from the US alone.
Under these two contracts, Universal Display will seek to demonstrate further advances in the performance of white OLEDs and continue to work towards achieving the DOE’s solid-state lighting commercial targets.
In the first of the two contracts, Universal Display proposes to demonstrate a very high-efficiency white PHOLED lighting device. Through the use of its highly-efficient UniversalPHOLED technology and materials, enhanced host and transport materials, and high index substrates, Universal Display’s goal is to demonstrate further gains in power efficiency, exceeding its prior research milestone of 102 lumens per watt.
In the second award, Universal Display proposes to demonstrate a white PHOLED using the company’s novel OLED permeation barrier technology. The Company, working with Princeton University, recently demonstrated a material system that forms an ultra-hermetic, flexible and transparent environmental barrier for OLEDs. This may provide a cost-effective packaging solution for high-volume, low-cost manufacture of white OLED lighting devices.
“Based on our proprietary high-efficiency phosphorescent OLED technology, white OLEDs have demonstrated the potential to meet the requirements of a growing number of specialty lighting applications,” said Steven V. Abramson, President and Chief Executive Officer of Universal Display. “These two new programs are intended to support continued advances in white OLED performance as well as the drive to lower the OLED cost structure toward the U.S. Department of Energy’s longer-term commercial targets for general lighting.”
The DOE has made a long-term commitment to advance the development and introduction of energy-efficient white lighting sources for general illumination. According to industry estimates, electric bills for lighting alone are over $200 billion per year on a worldwide basis.
It has been estimated that by 2016, white OLEDs could generate well over $20 billion in worldwide savings of electricity costs and could save over nine million metric tons of carbon emissions from the US alone.
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