LISLE, USA: Molex Inc. has released a white paper for design engineers, process engineers, product technicians and processing operators interested in applying Solder Charge technology, a new Surface Mount Technology (SMT) concept.
The whitepaper will be presented by Molex Product Manager Adam Stanczak and Molex Senior Design Engineer Kirk Peloza at the SMTA International Electronics Exhibition on October 6th in San Diego.
SMT innovation is critical as printed circuit board (PCB) assemblies become increasingly dense with components causing real estate to be at a premium. In July 2008 Molex successfully launched its patent-pending Solder Charge SMT technology for printed circuit board (PCB), which was named Product of the Year by Electronic Products magazine and won the 2008 Chicago Innovation Award.
Molex’s Solder Charge SMT technology provides better compliancy, less solder-joint stress, higher yields, improved fatigue strength and bonds that are three times stronger than traditional ball-grid array (BGA) technology.
“The goal of the whitepaper is to lay out the many considerations of developing a new solder attach process,” said Stanczak. “The new technology must be thoroughly examined -- from concept to completion -- so that it can easily and effectively be integrated into the current manufacturing process.”
Some areas of expertise covered in the white paper include:
Grass Roots Design and Research: A close look at the process Molex initiated to conceptualize and design the new SMT.
* Proof of Concept Studies and Expert Validation: A look at Molex’s work with an accredited manufacturer to help identify unique challenges and provide feedback on how to improve the new SMT process.
* Reliability Testing: A review of the various industry standard tests to measure reliability under extreme environmental conditions and evaluate mechanical robustness and strength of the solder joints.
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