Monday, September 26, 2011

CUI to demo Ericsson footprint-compatible digital power modules

Darnell’s Power Forum, TUALATIN, USA: CUI Global Inc., a platform company dedicated to the acquisition, development, and commercialization of new, innovative technologies, announced that its wholly owned subsidiary, CUI Inc will demonstrate their latest digital point of load dc-dc modules at Darnell’s Power Forum (DPF) in San Jose. The conference runs from September 26th to 28th.

The digital modules are the most recent addition to CUI’s Novum Advanced PowerTM division, which focuses solely on the design and development of next-generation power platforms. The NDM2 series modules are pin and function compatible with Ericsson Power Modules’ BMR46X series and will be initially available in 12A, 25A, and 50A configurations.

With the shift towards smarter, smaller, and “greener” power requirements, engineers are seeking innovative solutions that allow them to keep pace with lower core voltages, faster transient response needs, and increasing thermal issues that they face in their designs. The Novum NDM2 modules, with a full suite of digital features, specifically address these growing system complexities through intelligent power management.

The NDM2 series is the first to be designed by CUI as part of the Ericsson cooperation announced in July. The agreement formalizes a plan between the two companies to offer a multi-source digital POL platform based on the BMR46X series.

“We are extremely excited to showcase our first modules based on the multi-source platform agreement with Ericsson,” said Mark Adams, CUI’s VP of Advanced Power Marketing.

“Given the growing challenge associated with interoperability between discrete ICs and modules in the digital power space, we strongly believe that a multi-source solution will provide the most value to our customers as they work on their next generation designs,” Adams concluded.

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