LeCroy announces USB 2.0 HSIC decode test solutions

CHESTNUT RIDGE, USA: LeCroy Corp., a leading supplier of oscilloscopes and serial data test solutions, announced the availability of USB 2.0 High Speed Inter-chip (HSIC) protocol decode annotation for its WaveSurfer, WaveRunner, WavePro, WaveMaster and LabMaster oscilloscope product lines.

HSIC technology is capable of communicating between microchips in an embedded sub-system, leveraging the traditional host-device topology of USB and, hence, the large amount of code that already exists. This makes HSIC extremely lucrative in areas demanding fast time-to-market, for example, the mobile industry which includes smart phones and tablets. Because LeCroy engineers are fully engaged with USB industry leaders and standards bodies, they have been able to work in parallel with the industry adoption of this rapidly emerging standard and ensure that test solutions are available at precisely the time they are needed.

LeCroy HSIC USB solutions consist of an intuitive HSIC decode annotation overlaid on the physical layer (analog) waveform signal on the oscilloscope display with corresponding tabular display of data and a quick zoom to a specific packet. In addition, WaveRunner, WavePro, WaveMaster and LabMaster support LeCroy's ProtoSync option, which takes the testing to an even higher level by providing a transaction and application level view of the HSIC traffic in the familiar CATC protocol analyzer view. The separate decode annotation on the oscilloscope physical layer signals and corresponding CATC protocol analyzer view is completely linked and time synchronized to provide the fastest possible debug.

Additionally, LeCroy's WaveRunner 6 Zi family of oscilloscopes will also provide future capability (late 2011) for HSIC protocol triggering using the on-board USB PHY in the oscilloscope that already supports USB1.x and 2.0 protocol triggering. This combination of HSIC physical layer decode annotation, hardware-based protocol triggering, and ProtoSync transaction and application layer views provides a unique test capability for USB 2.0 HSIC that is unmatched in the market.