Cinterion LGA modules achieve production status

MUNICH, GERMANY: Cinterion Wireless Modules, the global leader in cellular machine-to-machine (M2M) communication modules, announced that its land grid array (LGA) modules have achieved state of production status, an important milestone for mass market manufacturing, along with all necessary approvals for worldwide coverage on GSM networks.

Part of Cinterion’s Evolution Platform, the LGA modules include: EES3, EGS5, EGS3 and BGS3 and feature efficient and reliable surface mount technology enabling fully automated “pick-and-place” manufacturing for mass production of M2M solutions such as in the automotive and security industries.

In addition to scalability from basic GSM/GPRS via enhanced GPRS and Java up to EDGE functionality, the modules feature optimized pad size and layout and enable customer specific overprinting and full flexibility for soldering paste selection.

The first four customers to successfully implement Cinterion LGA modules include Quanta and Virtec in Brazil, which both integrated BGS3, Kostal in Brazil, which integrated EGS5 and PassTime in the US, which integrated BGS3.

“Cinterion continues to innovate our module offerings to provide customers with the most reliable and future-oriented product portfolio in the market. With our new LGA platform, Cinterion has a whole new approach to solderable surface mount technology which has proved very successful right from the start,” said Norbert Muhrer, CEO, Cinterion Wireless Modules.

“It is part of Cinterion’s DNA to deliver on its commitments. Our customer’s roadmap and go-to-market strategies rely on our ongoing product innovation. We are aware of this responsibility at all levels of our organization and we are proud to help our customers excel.”