THIEF RIVER FALLS, USA: Digi-Key Corp. announced the signing of a global distribution agreement with LeCroy, a leading provider of test and measurement solutions.
“LeCroy is a welcome addition to our expansive selection of quality suppliers,” said Jeff Shafer, vice president, global interconnect, passives, and electromechanical product, Digi-Key. “Adding a respected name such as LeCroy not only offers quality product to our global customers, but allows us to maintain our commitment to providing the most in-stock product available for immediate shipment.”
“Not only will our partnership with Digi-Key contribute to our global growth,” stated Roberto Petrillo, LeCroy worldwide VP of sales, “Digi-Key’s international communication technology and logistics expertise will provide any engineer looking for our products, anywhere in the world, the value of superior service in the key areas of product availability, on-time delivery, and responsiveness.”
Tuesday, January 31, 2012
Magnalight adds mega light tower for mobile large scale illumination
KEMP, USA: Larson Electronics announced the addition of a high power mega light tower to its extensive line of mobile lighting equipment. Designed to provide illumination for large scale projects and events, this mobile light tower produces over 2 million lumens and can effectively illuminate an area 10 acres in size.
Incorporating quality components and constructed of heavy duty materials, the WCDE-49-16X1500 Mega Light Tower 24000 is ideal for construction and mining projects, event illumination, and outdoor industrial applications.
The WCDE-49-16X1500 Mega Light Tower24000 is a trailer mounted lighting package that combines a self contained diesel engine and generator, extendable light tower, and mobile trailer platform to produce a unit capable of extreme illumination of large scale areas. This mobile tower produces 2,400,000 lumens and can run for extended periods without refueling to provide an ideal lighting solution for large scale projects where around the clock operation is necessary.
A single John Deere water cooled diesel engine producing 80 horsepower turns a Marathon 4 pole brushless generator to produce 49 KW/ 59KVA of power. The lighting assembly consists of sixteen 1,500 watt metal halide fixtures producing 150,000 lumens each, for a combined total of 2,400,000 lumens of light output. A single 113 gallon fuel tank provides ample fuel for operating up to 27 hours continuously, and an optional 95 gallon auxiliary fuel tank allows operators to increase runtimes substantially.
The lighting assembly is mounted to the end of a hydraulically raised and extended tower constructed of galvanized steel that can be raised to a maximum of 55 feet in height for excellent coverage of locations up to 10 acres or more in size.
Incorporating quality components and constructed of heavy duty materials, the WCDE-49-16X1500 Mega Light Tower 24000 is ideal for construction and mining projects, event illumination, and outdoor industrial applications.
The WCDE-49-16X1500 Mega Light Tower24000 is a trailer mounted lighting package that combines a self contained diesel engine and generator, extendable light tower, and mobile trailer platform to produce a unit capable of extreme illumination of large scale areas. This mobile tower produces 2,400,000 lumens and can run for extended periods without refueling to provide an ideal lighting solution for large scale projects where around the clock operation is necessary.
A single John Deere water cooled diesel engine producing 80 horsepower turns a Marathon 4 pole brushless generator to produce 49 KW/ 59KVA of power. The lighting assembly consists of sixteen 1,500 watt metal halide fixtures producing 150,000 lumens each, for a combined total of 2,400,000 lumens of light output. A single 113 gallon fuel tank provides ample fuel for operating up to 27 hours continuously, and an optional 95 gallon auxiliary fuel tank allows operators to increase runtimes substantially.
The lighting assembly is mounted to the end of a hydraulically raised and extended tower constructed of galvanized steel that can be raised to a maximum of 55 feet in height for excellent coverage of locations up to 10 acres or more in size.
Avnet intros Xilinx Kintex-7 FPGA DSP development kit with high-speed analog
DesignCon 2012, PHOENIX, USA: Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT), announced the Xilinx Kintex-7 FPGA DSP Development Kit with High-Speed Analog, supporting Xilinx’s 7 series Targeted Design Platforms.
As the demand for faster processing of wideband analog signals continues to rise, this digital signal processing (DSP) development kit offers engineers a proven platform to test, design and deliver a wide range of DSP enabled end products. The cost of this kit is $3,995. Order entry is open now and shipments will begin in mid-March. For more details visit the Xilinx Kintex-7 FPGA DSP Development Kit information page.
Designed in collaboration with Xilinx, Inc., the Xilinx Kintex-7 FPGA DSP Development Kit is comprised of two critical elements. The first is the Xilinx Kintex-7 FPGA KC705 base board. The KC705 features high-performance, serial connectivity and advanced memory interfacing, with the flexibility of the 28nm Kintex-7 field programmable gate array (FPGA) that delivers maximum power efficiency and up to 1200 GMACs of DSP processing bandwidth.
The second component of the Xilinx Kintex-7 FPGA DSP Development Kit is the 4DSP FMC 150, an integrated high-speed FPGA Mezzanine Card (FMC) that interfaces with signals from the outside world. Featuring dual-channel 800 MSPS 16-bit digital-to-analog converters (DACs) and dual-channel 250 MSPS 14-bit analog-to-digital converters (ADCs) from Texas Instruments (TI), the high-speed analog module delivers exceptional throughput when combined with the massively parallel processing bandwidth of the DSP48E1 arithmetic processing engines in the Kintex-7 FPGA.
Together, these components create a development kit that combines the performance of Xilinx’s 7 series FPGA with the high-speed data conversion of the FMC 150, enabling designers to focus on their application at the beginning of the design process. DSP designers will benefit from intuitive MathWorks tools for system modeling, simulation and auto-code generation. Target applications include wireless communications infrastructure, aerospace and defense, test and measurement, and medical imaging.
As the demand for faster processing of wideband analog signals continues to rise, this digital signal processing (DSP) development kit offers engineers a proven platform to test, design and deliver a wide range of DSP enabled end products. The cost of this kit is $3,995. Order entry is open now and shipments will begin in mid-March. For more details visit the Xilinx Kintex-7 FPGA DSP Development Kit information page.
Designed in collaboration with Xilinx, Inc., the Xilinx Kintex-7 FPGA DSP Development Kit is comprised of two critical elements. The first is the Xilinx Kintex-7 FPGA KC705 base board. The KC705 features high-performance, serial connectivity and advanced memory interfacing, with the flexibility of the 28nm Kintex-7 field programmable gate array (FPGA) that delivers maximum power efficiency and up to 1200 GMACs of DSP processing bandwidth.
The second component of the Xilinx Kintex-7 FPGA DSP Development Kit is the 4DSP FMC 150, an integrated high-speed FPGA Mezzanine Card (FMC) that interfaces with signals from the outside world. Featuring dual-channel 800 MSPS 16-bit digital-to-analog converters (DACs) and dual-channel 250 MSPS 14-bit analog-to-digital converters (ADCs) from Texas Instruments (TI), the high-speed analog module delivers exceptional throughput when combined with the massively parallel processing bandwidth of the DSP48E1 arithmetic processing engines in the Kintex-7 FPGA.
Together, these components create a development kit that combines the performance of Xilinx’s 7 series FPGA with the high-speed data conversion of the FMC 150, enabling designers to focus on their application at the beginning of the design process. DSP designers will benefit from intuitive MathWorks tools for system modeling, simulation and auto-code generation. Target applications include wireless communications infrastructure, aerospace and defense, test and measurement, and medical imaging.
Planar intros next-generation control room video walls
Integrated Systems Europe 2012, AMSTERDAM, THE NETHERLANDS: Planar Systems Inc., a global leader in digital display technology, launched an expanded line-up of rear-projection LED-lit video wall displays that deliver a new industry standard in visual performance.
Designed for mission-critical control rooms, the new Clarity LED Series displays feature next-generation LED engine technology with enhanced brightness and exceptional uniformity so that the video wall appears more seamless for any control room application, including military, energy, transportation, security and surveillance and visualization.
The Clarity LED Series offers a larger range of display sizes and resolutions in order to precisely fit the design requirements of more control rooms. The new displays support all leading image processing solutions and have been optimized to work with Planar’s Indisys Management Suite (IMS) 2.0, which features the new Indisys Desktop Service for network-based visual collaboration.
“We are pleased to build on our tradition of bringing unique and compelling solutions to the world’s most demanding and mission-critical control room environments,” said Steve Seminario, senior director of product marketing for Planar Systems. “The new Clarity LED Series displays and IMS 2.0 software represent Planar’s ongoing commitment to helping control room customers optimize their environment and work more productively.”
Designed for mission-critical control rooms, the new Clarity LED Series displays feature next-generation LED engine technology with enhanced brightness and exceptional uniformity so that the video wall appears more seamless for any control room application, including military, energy, transportation, security and surveillance and visualization.
The Clarity LED Series offers a larger range of display sizes and resolutions in order to precisely fit the design requirements of more control rooms. The new displays support all leading image processing solutions and have been optimized to work with Planar’s Indisys Management Suite (IMS) 2.0, which features the new Indisys Desktop Service for network-based visual collaboration.
“We are pleased to build on our tradition of bringing unique and compelling solutions to the world’s most demanding and mission-critical control room environments,” said Steve Seminario, senior director of product marketing for Planar Systems. “The new Clarity LED Series displays and IMS 2.0 software represent Planar’s ongoing commitment to helping control room customers optimize their environment and work more productively.”
Murata closes purchase of VTI Technologies
KYOTO, JAPAN: Murata Manufacturing Co. Ltd has completed the acquisition of VTI Technologies Oy by Murata Electronics Europe B.V., a full subsidiary of Murata Manufacturing Co. Ltd on January 30th.
MEMS (Micro Electro Mechanical Systems), a core technology of VTI, is key for reducing device size, increasing accuracy and reliability, extending service life, increasing robustness, achieving lower prices, and reducing power consumption of electronic devices and the end equipment in which they are contained. The MEMS market is rapidly expanding, including in a wide range of industrial and consumer applications such as automotive, information and communications equipment, energy, life care, and biotechnology.
By taking advantage of the synergies that result from acquiring VTI's leading 3D MEMS sensor products to supplement its own product lines, Murata plans to strengthen and expand its business in the rapidly growing MEMS sensor market.
While Murata has a strong presence in the consumer applications market, VTI has focused on building a business base in automotive and medical applications. This acquisition will therefore enhance Murata's product development and sales abilities.
MEMS (Micro Electro Mechanical Systems), a core technology of VTI, is key for reducing device size, increasing accuracy and reliability, extending service life, increasing robustness, achieving lower prices, and reducing power consumption of electronic devices and the end equipment in which they are contained. The MEMS market is rapidly expanding, including in a wide range of industrial and consumer applications such as automotive, information and communications equipment, energy, life care, and biotechnology.
By taking advantage of the synergies that result from acquiring VTI's leading 3D MEMS sensor products to supplement its own product lines, Murata plans to strengthen and expand its business in the rapidly growing MEMS sensor market.
While Murata has a strong presence in the consumer applications market, VTI has focused on building a business base in automotive and medical applications. This acquisition will therefore enhance Murata's product development and sales abilities.
Monday, January 30, 2012
Philips Lumileds announces LUXEON K
Strategies in Light 2012, SAN JOSE, USA: Philips Lumileds introduced LUXEON K, its illumination grade array that charts a new direction for downlights and retrofit bulbs so that solutions can come to market more quickly and at a price that drives market adoption.
LUXEON K arrays provide thousands of lumens of light output and will be available in three different CCTs with a typical CRI of 85, and with five configurations of 4-24 emitters per array, in early Q2 of this year.
“LUXEON K extends our portfolio of illumination grade LEDs engineered to optimize end-user satisfaction of specific applications,” said Rahul Bammi, VP Marketing at Philips Lumileds. “For downlights and retrofit bulbs, LUXEON K provides a unique approach that delivers the highest, most consistent quality of light in an easy-to-implement array. Our hot testing and specification at 85°C, and freedom from color, flux, and Vf binning, makes LUXEON K the simplest of LEDs to specify and use.”
LUXEON K arrays provide thousands of lumens of light output and will be available in three different CCTs with a typical CRI of 85, and with five configurations of 4-24 emitters per array, in early Q2 of this year.
“LUXEON K extends our portfolio of illumination grade LEDs engineered to optimize end-user satisfaction of specific applications,” said Rahul Bammi, VP Marketing at Philips Lumileds. “For downlights and retrofit bulbs, LUXEON K provides a unique approach that delivers the highest, most consistent quality of light in an easy-to-implement array. Our hot testing and specification at 85°C, and freedom from color, flux, and Vf binning, makes LUXEON K the simplest of LEDs to specify and use.”
Combining Molex connector solutions for future-proof end-to-end 25 Gbps channel interoperability
LISLE, USA: Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, Molex Incorporated offers a comprehensive portfolio of industry-leading end-to-end high-speed channel solutions for increased data rates with minimal crosstalk and maximum signal integrity in mobile telecom and data communications storage and networking applications.
“Today’s customers need faster and denser systems that will meet the demands of tomorrow’s bandwidth hungry users. They benefit from cost-effective future-proof solutions that can deliver high performance interoperability,” states Joe Dambach, global new product development manager, Molex. “Molex cables and connectors ensure that they can optimize the high-speed channel from end-to-end to achieve next-generation data rates.”
A typical channel for a high-speed network connection could start with zSFP+ (Small Form-factor Pluggable Plus) SMT I/O connectors receiving data (e.g., a signal) entering into the switch chassis. Enhanced zSFP+ 20-circuit connectors deliver superior performance in high-speed telecom and data communications equipment. Designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the scalable Molex zSFP+ interconnects provide optimal EMI and signal integrity. The signal could next route to a motherboard through a SEARAY† board-to-board mezzanine connector.
Traveling at data rates of up to 25Gbps, the signal could pass through the midplane and daughtercard via Impact Orthogonal and EdgeLine CoEdge connectors. Designed for a direct PCB connection, the Impact 100-Ohm orthogonal direct right-angle male connector and daughtercard system mitigates the performance constraints of backplane and midplane connections. The space-saving Impact technology supports high-speed 25 Gbps data rates and greatly reduces airflow restrictions, cross-talk, and capacitance constraints in high-speed channels. Impact connectors feature compliant-pin technology and the lowest mating force in the industry.
The EdgeLine CoEdge connector offers a low profile height interconnect solution that creates minimal wind resistance in an air-cooled chassis and an electrically optimized terminal to minimize noise for high speed transmissions in excess of 25Gbps. This scalable and cost-effective, one-piece EdgeLine connector allows designers to specify first-mate, last-break designations and shorter stubs for high-speed communications using a customizable card-edge interface.
As the signal exits the daughtercard, a zQSFP+ integrated cage and connector routes it through to a zQSFP+ breakout cable and into a router/switch. Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, the Molex zQSFP+ interconnect solution provides 28 Gbps data rates for up to 4km with excellent thermal cooling, signal integrity, EMI protection and the lowest optical power consumption in the industry.
Once at the router, a NeoScale 28 Gbps mezzanine connector could direct the signal to the motherboard and into the backplane to another Impact solution, so the signal is delivered quickly and cleanly. One of the highest performing mezzanine connections on the market, the recently launched Molex NeoScale mezzanine connector features a unique and patent pending triad design to group signals into electrically optimized structures.
The triad design not only offers a designer flexibility in mixing and matching different triad configurations based on the needs for high speed differential pairs, high speed single-ended transmission, low speed control links and power requirements, but it also optimizes the channel electrically, helping to provide a very clean signal channel.
The NeoScale connector’s PCB attach method comes in both Molex’s award winning Solder ChargeSMT attachment technology and the option for press-fit attach. The triads conform to a mirror image footprint to provide ease and flexibility of PCB routing in one or two PCB layers to minimize a designer’s PCB thickness, in turn decreasing PCB cost.
“Today’s customers need faster and denser systems that will meet the demands of tomorrow’s bandwidth hungry users. They benefit from cost-effective future-proof solutions that can deliver high performance interoperability,” states Joe Dambach, global new product development manager, Molex. “Molex cables and connectors ensure that they can optimize the high-speed channel from end-to-end to achieve next-generation data rates.”
A typical channel for a high-speed network connection could start with zSFP+ (Small Form-factor Pluggable Plus) SMT I/O connectors receiving data (e.g., a signal) entering into the switch chassis. Enhanced zSFP+ 20-circuit connectors deliver superior performance in high-speed telecom and data communications equipment. Designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the scalable Molex zSFP+ interconnects provide optimal EMI and signal integrity. The signal could next route to a motherboard through a SEARAY† board-to-board mezzanine connector.
Traveling at data rates of up to 25Gbps, the signal could pass through the midplane and daughtercard via Impact Orthogonal and EdgeLine CoEdge connectors. Designed for a direct PCB connection, the Impact 100-Ohm orthogonal direct right-angle male connector and daughtercard system mitigates the performance constraints of backplane and midplane connections. The space-saving Impact technology supports high-speed 25 Gbps data rates and greatly reduces airflow restrictions, cross-talk, and capacitance constraints in high-speed channels. Impact connectors feature compliant-pin technology and the lowest mating force in the industry.
The EdgeLine CoEdge connector offers a low profile height interconnect solution that creates minimal wind resistance in an air-cooled chassis and an electrically optimized terminal to minimize noise for high speed transmissions in excess of 25Gbps. This scalable and cost-effective, one-piece EdgeLine connector allows designers to specify first-mate, last-break designations and shorter stubs for high-speed communications using a customizable card-edge interface.
As the signal exits the daughtercard, a zQSFP+ integrated cage and connector routes it through to a zQSFP+ breakout cable and into a router/switch. Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, the Molex zQSFP+ interconnect solution provides 28 Gbps data rates for up to 4km with excellent thermal cooling, signal integrity, EMI protection and the lowest optical power consumption in the industry.
Once at the router, a NeoScale 28 Gbps mezzanine connector could direct the signal to the motherboard and into the backplane to another Impact solution, so the signal is delivered quickly and cleanly. One of the highest performing mezzanine connections on the market, the recently launched Molex NeoScale mezzanine connector features a unique and patent pending triad design to group signals into electrically optimized structures.
The triad design not only offers a designer flexibility in mixing and matching different triad configurations based on the needs for high speed differential pairs, high speed single-ended transmission, low speed control links and power requirements, but it also optimizes the channel electrically, helping to provide a very clean signal channel.
The NeoScale connector’s PCB attach method comes in both Molex’s award winning Solder ChargeSMT attachment technology and the option for press-fit attach. The triads conform to a mirror image footprint to provide ease and flexibility of PCB routing in one or two PCB layers to minimize a designer’s PCB thickness, in turn decreasing PCB cost.
Signal Transformer intros over 150 series of SMD power inductors
INWOOD, USA: Signal Transformer, a subsidiary of Bel Fuse Inc., announced the addition of over 150 series of SMD wire wound inductors to complement their offerings of standard and custom power transformers and high frequency magnetics.
The RoHS-compliant and PB-free series provide OEMs/ODMs with cost-effective solutions to an array of space-constrained applications requiring a wide range of inductance and high current. Available in low-profile versions, inductors exceed industry standards for thermal shock resistance, moisture, and shock/vibration. The inductors are designed with high efficiency in mind, and they demonstrate low DC resistance and high saturation current. To optimize design flexibility, a wide range of inductances can be chosen by selecting parts from different series while maintaining the same footprint.
Consisting of 2,700 standard part numbers, the shielded and unshielded devices in Signal Transformer's SMD inductor portfolio are ideally suited for a broad range of consumer and industrial power applications including test and measurement, automotive electronics, and industrial process control.
Parts are commonly specified for use in DC/DC converters, switching regulated power supplies, telecommunications equipment, mobile phones, pagers, computers, printers and other peripherals. They are also frequently employed in audio & video applications, and in such LC resonant circuits as oscillator and signal generators. The inductors are extensively utilized in impedance matching, circuit isolation, and RF filters.
Technical specifications for Signal Transformer's single- and dual-winding SMD inductor series include inductance from 0.01 µH to 10 mH and, current ratings from 4 mA to 70 A, DC resistance ranges from 2 mΩ to 140 Ω. Heights range from 1 to 12.3 mm.
The RoHS-compliant and PB-free series provide OEMs/ODMs with cost-effective solutions to an array of space-constrained applications requiring a wide range of inductance and high current. Available in low-profile versions, inductors exceed industry standards for thermal shock resistance, moisture, and shock/vibration. The inductors are designed with high efficiency in mind, and they demonstrate low DC resistance and high saturation current. To optimize design flexibility, a wide range of inductances can be chosen by selecting parts from different series while maintaining the same footprint.
Consisting of 2,700 standard part numbers, the shielded and unshielded devices in Signal Transformer's SMD inductor portfolio are ideally suited for a broad range of consumer and industrial power applications including test and measurement, automotive electronics, and industrial process control.
Parts are commonly specified for use in DC/DC converters, switching regulated power supplies, telecommunications equipment, mobile phones, pagers, computers, printers and other peripherals. They are also frequently employed in audio & video applications, and in such LC resonant circuits as oscillator and signal generators. The inductors are extensively utilized in impedance matching, circuit isolation, and RF filters.
Technical specifications for Signal Transformer's single- and dual-winding SMD inductor series include inductance from 0.01 µH to 10 mH and, current ratings from 4 mA to 70 A, DC resistance ranges from 2 mΩ to 140 Ω. Heights range from 1 to 12.3 mm.
Jays teams up with Samsung
SWEDEN: Jays has signed an agreement with Samsung, the world's largest manufacturer of smartphones. The deal sees Jays and Samsung team up for a number of joint promotional activities during February 2012.
The Swedish headphone manufacturer has long had a strong presence in Asia and the new partnership with Samsung will give Jays a further boost. Samsung is the world's largest manufacturer of smartphones by volume, with a 24 percent market share and 28 million phones sold in Q3 2011 alone.
The co-operation will see Jays’ award-winning v-JAYS being marketed together with selected products across Samsung´s 691 stores and with its other retailers in Korea during February.
“The agreement with Samsung is a great boost for our profile in a key target market. It’s also an incredible endorsement of Jays’ unrivalled quality and our continued success. Coming from the world's largest manufacturer of smartphones it’s a great compliment,” comments Rune Torbjörnsen, CEO of Jays AB (publ). “Our Mobile Music concept has proven to be a very popular initiative and the response has been staggering. We’re continuing with our mission to deliver the highest quality and most musical sound to any media player and this collaboration with Samsung takes us even closer to this goal.”
The Swedish headphone manufacturer has long had a strong presence in Asia and the new partnership with Samsung will give Jays a further boost. Samsung is the world's largest manufacturer of smartphones by volume, with a 24 percent market share and 28 million phones sold in Q3 2011 alone.
The co-operation will see Jays’ award-winning v-JAYS being marketed together with selected products across Samsung´s 691 stores and with its other retailers in Korea during February.
“The agreement with Samsung is a great boost for our profile in a key target market. It’s also an incredible endorsement of Jays’ unrivalled quality and our continued success. Coming from the world's largest manufacturer of smartphones it’s a great compliment,” comments Rune Torbjörnsen, CEO of Jays AB (publ). “Our Mobile Music concept has proven to be a very popular initiative and the response has been staggering. We’re continuing with our mission to deliver the highest quality and most musical sound to any media player and this collaboration with Samsung takes us even closer to this goal.”
Sigrity expands global sales and support operations
CAMPBELL, USA: Sigrity Inc., a market leader in signal and power integrity solutions, announced the opening of multiple offices to support the company’s ongoing growth worldwide. In southern California, Sigrity opened its fifth US office; in China it opened a second and a third office to support users in Shenzhen and Beijing; and in Israel, Sigrity established its first local sales and support operation in that region.
This expansion reflects the accelerating global adoption of Sigrity’s high-speed solutions for chip, package and board design teams. According to Dr. Jiayuan Fang, president and founder of Sigrity: “Sigrity achieved record bookings both in Q4 2011 and for the past year overall. This marks the 15th consecutive year of growth for the company. We are pleased to extend our local support capability for existing and future customers in these key locations.”
This expansion reflects the accelerating global adoption of Sigrity’s high-speed solutions for chip, package and board design teams. According to Dr. Jiayuan Fang, president and founder of Sigrity: “Sigrity achieved record bookings both in Q4 2011 and for the past year overall. This marks the 15th consecutive year of growth for the company. We are pleased to extend our local support capability for existing and future customers in these key locations.”
Friday, January 27, 2012
Viper Networks and LEDs America announce LED-O product to replace standard 100W incandescent bulbs
TROY, USA: Viper Networks Inc., in conjunction with LEDs America Inc., is pleased to announce the forthcoming market introduction of the 9W LED, their latest incandescent replacement lamp, which targets the replacement for 100W incandescent bulbs.
The 9W LED bulb from LEDs America (replaces 100W incandescent bulbs) will join the other two similar products, including the 5W LED (replaces 60W incandescent bulbs) and the 4W (to replace 40W incandescent bulbs).
The 9W LED lamp is just the newest product in a series of LED lights from LEDs America, to provide consumers a superior lighting option to any incandescent and fluorescent product available.
LEDs America’s superior ratio of lumens per watt reduces total cost of energy by approximately 90 percent compared to a standard 40W, 60W or 100W bulb. With an average life use of 50,000 hours, the company’s LED bulbs need far less replacing than traditional incandescents and CFLs (compact fluorescent lamps).
As of January 2012, US law requires that light bulbs must be at least 25 percent more energy efficient, which means that traditional incandescent bulbs will be phased out, starting with the 100-watt bulb. Although some of the replacements have been with compact fluorescent lamps (CFLs), many consumers do not like these ‘swirl’ bulbs for giving off what many say is inferior light.
Additionally, LEDs America has developed a breakthrough in creating an LCC- LED Cluster Chip technology light source to replace incandescent bulbs with a much more naturally emitting light.
All LEDS America bulbs and lamps are sold under the brand name LED-O, which with combined features will not only save 90 percent of the energy used in a standard bulb, but also save 50 percent compared to a CFL, while emitting no UV light and containing no mercury.
The LED-O fits all standard fixtures and lamps, is 100% recyclable and can be used with any voltage 85-265 V.
The 9W LED bulb from LEDs America (replaces 100W incandescent bulbs) will join the other two similar products, including the 5W LED (replaces 60W incandescent bulbs) and the 4W (to replace 40W incandescent bulbs).
The 9W LED lamp is just the newest product in a series of LED lights from LEDs America, to provide consumers a superior lighting option to any incandescent and fluorescent product available.
LEDs America’s superior ratio of lumens per watt reduces total cost of energy by approximately 90 percent compared to a standard 40W, 60W or 100W bulb. With an average life use of 50,000 hours, the company’s LED bulbs need far less replacing than traditional incandescents and CFLs (compact fluorescent lamps).
As of January 2012, US law requires that light bulbs must be at least 25 percent more energy efficient, which means that traditional incandescent bulbs will be phased out, starting with the 100-watt bulb. Although some of the replacements have been with compact fluorescent lamps (CFLs), many consumers do not like these ‘swirl’ bulbs for giving off what many say is inferior light.
Additionally, LEDs America has developed a breakthrough in creating an LCC- LED Cluster Chip technology light source to replace incandescent bulbs with a much more naturally emitting light.
All LEDS America bulbs and lamps are sold under the brand name LED-O, which with combined features will not only save 90 percent of the energy used in a standard bulb, but also save 50 percent compared to a CFL, while emitting no UV light and containing no mercury.
The LED-O fits all standard fixtures and lamps, is 100% recyclable and can be used with any voltage 85-265 V.
Molex strengthens commitment to medical industry with several strategic business developments
MD&M West 2012, LISLE, USA: Molex Inc. has initiated several strategic business developments to further demonstrate its commitment to developing innovative interconnect technologies for next-generation healthcare devices.
Molex has been delivering proven solutions to medical device manufacturers since 2005, and recently formed the new Medical Connector and Cable Assembly Business Unit to directly address the increasing demand for advanced interconnect products in this market.
The acquisition of Temp-Flex, a manufacturer of micro-miniature wire, cable and continuous coils using biomedical coating and medical grade base metals, supports the company’s goal of developing technologies that provide medical device manufacturers with the maximum in product efficiency, reliability and flexibility for the ultimate in patient care.
As director, Wayne Shockloss will lead a team that has already introduced several ground-breaking products under the MediSpec portfolio. These products specifically address the electronic design demands of medical equipment manufacturers engineering new and emerging healthcare products in diagnostic imaging, therapeutic, surgical, patient monitoring, hospital and patient care and healthcare IT applications. These, along with several new products will be demonstrated at MD&M West, February 14 - 16, Anaheim, CA, booth 2074.
“By converging our innovative interconnect solutions with Temp-Flex’s long-standing expertise in complex cable assembly design, Molex is in a unique position to incorporate unique and commercial electronic design ideas into next-generation medical applications,” said Shockloss.
Molex offers a diverse range of products and solutions for the medical field through MediSpec, as well as other business units that have applications in medical electronics. Several of these products will be on display at MD&M West, including:
* MediSpec Hybrid Circular MT Cable and Receptacle System: An integrated optical and electrical solution that reduces the number of connectors required in medical equipment and devices.
* MediSpec Medical Plastic Circular (MPC) Connector System: Featuring the world-class LFH (low force helix) contact design, the products provide a high-performance and affordable alternative to typical medical circular connectors.
MediSpec Molded Interconnect Device/Laser Direct Structuring (MID/LDS) Capabilities: Combines the versatility of the two-shot molding process and the speed and precision of LDS capabilities helping medical device designers integrate complex electrical and mechanical features into highly compact applications.
Mini-Fit Plus HMC (High-Mating Cycle): Achieves the greatest durability and current per circuit available today for mid-range power applications without increasing design dimensions.
Fiber Optic Product Families: As a leading supplier of advanced fiber optic solutions, Molex offers a broad range of high-density products, including interconnects and adapters, assemblies, backplanes and more.
Copper Flexible Circuit Products: The products provide a high-signal frequency and flexibility for advanced medical monitoring and diagnostic devices.
Capacitive Switches: Includes both integrated
and custom solutions to provide unlimited possibilities for the medical industry.
Polymicro Technologies (a subsidiary of Molex): Multiple medical applications are available from the world’s leading supplier of silica capillary tubing and specialty optical fibers, optical fiber and capillary assemblies, discrete micro components and quartz optical fiber ferrules.
Molex has been delivering proven solutions to medical device manufacturers since 2005, and recently formed the new Medical Connector and Cable Assembly Business Unit to directly address the increasing demand for advanced interconnect products in this market.
The acquisition of Temp-Flex, a manufacturer of micro-miniature wire, cable and continuous coils using biomedical coating and medical grade base metals, supports the company’s goal of developing technologies that provide medical device manufacturers with the maximum in product efficiency, reliability and flexibility for the ultimate in patient care.
As director, Wayne Shockloss will lead a team that has already introduced several ground-breaking products under the MediSpec portfolio. These products specifically address the electronic design demands of medical equipment manufacturers engineering new and emerging healthcare products in diagnostic imaging, therapeutic, surgical, patient monitoring, hospital and patient care and healthcare IT applications. These, along with several new products will be demonstrated at MD&M West, February 14 - 16, Anaheim, CA, booth 2074.
“By converging our innovative interconnect solutions with Temp-Flex’s long-standing expertise in complex cable assembly design, Molex is in a unique position to incorporate unique and commercial electronic design ideas into next-generation medical applications,” said Shockloss.
Molex offers a diverse range of products and solutions for the medical field through MediSpec, as well as other business units that have applications in medical electronics. Several of these products will be on display at MD&M West, including:
* MediSpec Hybrid Circular MT Cable and Receptacle System: An integrated optical and electrical solution that reduces the number of connectors required in medical equipment and devices.
* MediSpec Medical Plastic Circular (MPC) Connector System: Featuring the world-class LFH (low force helix) contact design, the products provide a high-performance and affordable alternative to typical medical circular connectors.
MediSpec Molded Interconnect Device/Laser Direct Structuring (MID/LDS) Capabilities: Combines the versatility of the two-shot molding process and the speed and precision of LDS capabilities helping medical device designers integrate complex electrical and mechanical features into highly compact applications.
Mini-Fit Plus HMC (High-Mating Cycle): Achieves the greatest durability and current per circuit available today for mid-range power applications without increasing design dimensions.
Fiber Optic Product Families: As a leading supplier of advanced fiber optic solutions, Molex offers a broad range of high-density products, including interconnects and adapters, assemblies, backplanes and more.
Copper Flexible Circuit Products: The products provide a high-signal frequency and flexibility for advanced medical monitoring and diagnostic devices.
Capacitive Switches: Includes both integrated
and custom solutions to provide unlimited possibilities for the medical industry.
Polymicro Technologies (a subsidiary of Molex): Multiple medical applications are available from the world’s leading supplier of silica capillary tubing and specialty optical fibers, optical fiber and capillary assemblies, discrete micro components and quartz optical fiber ferrules.
Digi-Key signs global distribution agreement with LEMO
THIEF RIVER FALLS, USA: Digi-Key Corp. and LEMO, a global leader in the design and manufacture of precision custom connection solutions, have signed an agreement in which Digi-Key will distribute LEMO’s products worldwide.
Offering more than 50,000 combinations of product that continues to grow through custom specific designs, LEMO’s high quality push-pull connectors are found in a variety of challenging application environments including medical, industrial control, test and measurement, audio-video, and telecommunications.
“Engineers are continually faced with the need for connectors to meet the challenges presented in a variety of applications,” said Jeff Shafer, Digi-Key’s VP of interconnect, passive, and electromechanical products. “LEMO is a leader in meeting this demand with the design and manufacture of their push-pull connectors and we are pleased to offer their products to our global customers.”
“LEMO strives to achieve the highest level of quality and customer satisfaction,” said Dean Pohwala, general manager, LEMO USA. “With the addition of Digi-Key, we can now offer customers extended customer service delivered with technical expertise, professionalism and speed. We are very happy to have Digi-Key as part of our distribution network and we look forward to a very successful partnership.”
Offering more than 50,000 combinations of product that continues to grow through custom specific designs, LEMO’s high quality push-pull connectors are found in a variety of challenging application environments including medical, industrial control, test and measurement, audio-video, and telecommunications.
“Engineers are continually faced with the need for connectors to meet the challenges presented in a variety of applications,” said Jeff Shafer, Digi-Key’s VP of interconnect, passive, and electromechanical products. “LEMO is a leader in meeting this demand with the design and manufacture of their push-pull connectors and we are pleased to offer their products to our global customers.”
“LEMO strives to achieve the highest level of quality and customer satisfaction,” said Dean Pohwala, general manager, LEMO USA. “With the addition of Digi-Key, we can now offer customers extended customer service delivered with technical expertise, professionalism and speed. We are very happy to have Digi-Key as part of our distribution network and we look forward to a very successful partnership.”
Thursday, January 26, 2012
LED Korea 2012 to showcase latest technology trends, apps and manufacturing solutions for high-power LEDs
SEOUL, S. KOREA: Global leaders in LED manufacturing, technology and applications will convene at LED Korea 2012 to discuss the latest market trends, R&D developments, customer needs, equipment solutions and advanced materials.
Co-located with SEMICON Korea (in Seoul, Feb. 7-9), the sold out exhibition will include a two-day conference with speakers from leading LED companies including Samsung LED, LG Innotek, Veeco, Korea Polytechnic University, Hanyang University, ETRI, Dow Electronic Materials, and Samsung Advanced Institute of Technology, and more. Presentations will include the latest developments in 8-inch GaN on silicon, advanced LED packaging, laser scribing, epitaxial processes, advanced materials, and quantum well design.
To meet the growing need for display backlighting and solid state lighting, global LED manufacturing capacity is expected to reach two million wafers in 2012 (4” equivalent per month), a 27 percent increase over 2011. Korea is one the global centers of advanced high-power LED products with 20 percent of the world’s capacity.
From 2010 through 2012, Korean spending on LED fab equipment is estimated to exceed $1.3 billion. Korea leads the world in LED backlighting for TVs and is expected to be among the leaders as the industry pivots towards solid-state lighting applications.
The event brings together worldwide and regional leaders in LED to share strategies for the industry’s further development while also covering hot topics such as LED front-end and back-end manufacturing, Test and Measurement, Solid State Lighting, OLED Lighting, Materials, and SEMI HB-LED Standards. On Tuesday, the conference provides insights on Front-end and Back-end LED manufacturing.
In the Front-end session, presenters represent SEMI, Iljin Display, Veeco, Samsung LED, and LG Innotek, while Back-end presenters include speakers from Sangji University, Lumens, and ESI. For the Test and Measurement session, presenters represent Etamax, QMC, ESI, and TSE.
Wednesday’s sessions include:
Solid State Lighting: With speakers from Posco, OREL, Mavericks, ICE PIPE, and Korea Polytechnic University.
Innovative Technology: With presenters from Korea Polytechnic University, ETRI, Veeco, Hanyang University, Brewer Science, Samsung Advanced Institute of Technology, and Synopsys Korea.
OLED Lighting: With speakers from DMS and ETRI.
Materials: with presenters from Dow Electronic Materials and Tokai Carbon Korea
SEMI HB-LED Standards: with presenters from SEMI and SILIAN
Co-located with SEMICON Korea (in Seoul, Feb. 7-9), the sold out exhibition will include a two-day conference with speakers from leading LED companies including Samsung LED, LG Innotek, Veeco, Korea Polytechnic University, Hanyang University, ETRI, Dow Electronic Materials, and Samsung Advanced Institute of Technology, and more. Presentations will include the latest developments in 8-inch GaN on silicon, advanced LED packaging, laser scribing, epitaxial processes, advanced materials, and quantum well design.
To meet the growing need for display backlighting and solid state lighting, global LED manufacturing capacity is expected to reach two million wafers in 2012 (4” equivalent per month), a 27 percent increase over 2011. Korea is one the global centers of advanced high-power LED products with 20 percent of the world’s capacity.
From 2010 through 2012, Korean spending on LED fab equipment is estimated to exceed $1.3 billion. Korea leads the world in LED backlighting for TVs and is expected to be among the leaders as the industry pivots towards solid-state lighting applications.
The event brings together worldwide and regional leaders in LED to share strategies for the industry’s further development while also covering hot topics such as LED front-end and back-end manufacturing, Test and Measurement, Solid State Lighting, OLED Lighting, Materials, and SEMI HB-LED Standards. On Tuesday, the conference provides insights on Front-end and Back-end LED manufacturing.
In the Front-end session, presenters represent SEMI, Iljin Display, Veeco, Samsung LED, and LG Innotek, while Back-end presenters include speakers from Sangji University, Lumens, and ESI. For the Test and Measurement session, presenters represent Etamax, QMC, ESI, and TSE.
Wednesday’s sessions include:
Solid State Lighting: With speakers from Posco, OREL, Mavericks, ICE PIPE, and Korea Polytechnic University.
Innovative Technology: With presenters from Korea Polytechnic University, ETRI, Veeco, Hanyang University, Brewer Science, Samsung Advanced Institute of Technology, and Synopsys Korea.
OLED Lighting: With speakers from DMS and ETRI.
Materials: with presenters from Dow Electronic Materials and Tokai Carbon Korea
SEMI HB-LED Standards: with presenters from SEMI and SILIAN
Mitsubishi Electric launches 1200V/50A large-type dual in-line package intelligent power module
TOKYO, JAPAN: Mitsubishi Electric Corp. announced the launch of the 1,200-volt large-type transfer-mold Dual In-line Package Intelligent Power Module (DIPIPM) Ver.4 (model PS22A79) with an industry-leading current rating of 50 amperes.
Sales of the power module, designed for use in package air conditioners and other industrial motors, will begin on January 31. To save energy and elevate performance, a variety of current ratings ranging between several amperes and hundreds of amperes are rapidly being adopted for inverter-based motor drive systems.
DIPIPM, transfer molded intelligent power modules commercialized globally by Mitsubishi Electric in 1997, are widely used in inverter-equipped appliances such as air conditioners, refrigerators and washing machines, as well as inverter motor drive systems for industrial applications. Mitsubishi Electric’s current 1,200V, large-type DIPIPM Ver.4 series with a current rating of 5–35 amperes, launched in 2008, is noted for helping to minimize inverter system size.
Sales of the power module, designed for use in package air conditioners and other industrial motors, will begin on January 31. To save energy and elevate performance, a variety of current ratings ranging between several amperes and hundreds of amperes are rapidly being adopted for inverter-based motor drive systems.
DIPIPM, transfer molded intelligent power modules commercialized globally by Mitsubishi Electric in 1997, are widely used in inverter-equipped appliances such as air conditioners, refrigerators and washing machines, as well as inverter motor drive systems for industrial applications. Mitsubishi Electric’s current 1,200V, large-type DIPIPM Ver.4 series with a current rating of 5–35 amperes, launched in 2008, is noted for helping to minimize inverter system size.
Mouser sharpens focus as Diamond Partner of APEC 2012
DALLAS & FORT WORTH, USA: Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced that it will support the Applied Power Electronics Conference and Exposition (APEC) 2012 through a Diamond Partner Sponsorship in Orlando, FL, February 5-9. The event highlights issues for the practicing power electronics engineer.
APEC '12 is an exciting event that focuses on the practical and applied aspects of the power electronics business, as well as addresses issues related to the industry. The conference will provide electronic expositions, courses taught by experts, special presentations, and the opportunity to network with other electronics professionals. APEC has been held every year since April 1986 and is now considered to be one of the world's leading conferences for the power electronics industry.
This Diamond Partner Sponsorship underscores Mouser's commitment to advancing technological innovation to the practicing power professional. The exhibitions of world-class experts will be displayed along with the widest selection of the latest power electronics creations. The event is geared towards providing technical content to anyone interested in the electronics industry. Other show sponsors include some of Mouser's top suppliers such as Cree, International Rectifier, and Vishay Intertechnology. More than 30 of Mouser's supplier partners will exhibit at the conference.
"We are excited to support the APEC 2012 Conference as a Diamond Partner," says Larry Johannes, Mouser VP of Strategic Marketing. "This is a great opportunity for anyone interested in the power supply industry to gain valuable knowledge, discover ideas, and network with professionals from all over the world. APEC 2012 is a conference design engineers cannot afford to miss."
"We are pleased to have Mouser Electronics as a Diamond Partner for this year's event," says Greg Evans, publicity chair for the 2012 APEC Conference. "Their contribution, along with that of our other partners, helps to make the show even more successful. This year's event is shaping up to be the best ever."
APEC '12 is an exciting event that focuses on the practical and applied aspects of the power electronics business, as well as addresses issues related to the industry. The conference will provide electronic expositions, courses taught by experts, special presentations, and the opportunity to network with other electronics professionals. APEC has been held every year since April 1986 and is now considered to be one of the world's leading conferences for the power electronics industry.
This Diamond Partner Sponsorship underscores Mouser's commitment to advancing technological innovation to the practicing power professional. The exhibitions of world-class experts will be displayed along with the widest selection of the latest power electronics creations. The event is geared towards providing technical content to anyone interested in the electronics industry. Other show sponsors include some of Mouser's top suppliers such as Cree, International Rectifier, and Vishay Intertechnology. More than 30 of Mouser's supplier partners will exhibit at the conference.
"We are excited to support the APEC 2012 Conference as a Diamond Partner," says Larry Johannes, Mouser VP of Strategic Marketing. "This is a great opportunity for anyone interested in the power supply industry to gain valuable knowledge, discover ideas, and network with professionals from all over the world. APEC 2012 is a conference design engineers cannot afford to miss."
"We are pleased to have Mouser Electronics as a Diamond Partner for this year's event," says Greg Evans, publicity chair for the 2012 APEC Conference. "Their contribution, along with that of our other partners, helps to make the show even more successful. This year's event is shaping up to be the best ever."
Philips Lumileds intros LUXEON M for outdoor and industrial LED lighting solutions
Strategies in Light 2012, SAN JOSE, USA: Philips Lumileds introduced LUXEON M, an illumination grade LED designed specifically to simplify solution design, reduce costs, and provide the optic control and quality of light required by outdoor lighting applications as well as high-bay and low-bay lighting solutions.
“LUXEON M performance fundamentally lowers the cost and design complexity for a wide range of applications in the outdoor and industrial markets and equips lighting fixture designers with a source that allows them to meet the ever increasing demands of customers and regulators,” said Rahul Bammi, VP of Marketing for Philips Lumileds.
LUXEON M will release with three different CCTs, 3000K, 4000K, and 5700K each with specified minimum CRI of 70. Each part is hot tested and specified at 85°C and delivers Freedom From Binning. LUXEON M will be broadly available in the second quarter of this year.
Initial specifications for LUXEON M include:
* More than 900 lumens at 700 mA and 85°C junction temperature.
* Efficacy greater than 120 lm/W at 350 mA and 85°C junction temperature.
* 12 Volt / 8 Watt package on AIN substrate.
Utilizing Philips Lumileds’ latest die and phosphor technologies, LUXEON M will deliver the industry’s best lumen/$ that can be realized using low cost, readily available drivers, optics and boards for design simplicity.
“LUXEON M performance fundamentally lowers the cost and design complexity for a wide range of applications in the outdoor and industrial markets and equips lighting fixture designers with a source that allows them to meet the ever increasing demands of customers and regulators,” said Rahul Bammi, VP of Marketing for Philips Lumileds.
LUXEON M will release with three different CCTs, 3000K, 4000K, and 5700K each with specified minimum CRI of 70. Each part is hot tested and specified at 85°C and delivers Freedom From Binning. LUXEON M will be broadly available in the second quarter of this year.
Initial specifications for LUXEON M include:
* More than 900 lumens at 700 mA and 85°C junction temperature.
* Efficacy greater than 120 lm/W at 350 mA and 85°C junction temperature.
* 12 Volt / 8 Watt package on AIN substrate.
Utilizing Philips Lumileds’ latest die and phosphor technologies, LUXEON M will deliver the industry’s best lumen/$ that can be realized using low cost, readily available drivers, optics and boards for design simplicity.
Wednesday, January 25, 2012
Sunstone Circuits partners with element14 to provide high quality PCB prototyping solutions through the Knode
MULINO, USA: Sunstone Circuits, the leading printed circuit board (PCB) prototype solutions provider, has partnered with Newark’s element14 to deliver bare printed circuit board (PCB) prototyping services to customers in the Americas through element14’s Knode, an intelligent search and knowledge tool helping engineers select and purchase the right solutions for designs.
Through this partnership, design engineers can access Sunstone’s prototyping products and services to create high quality test copies of unpopulated or “bare” PCBs prior to ordering the finished electronic product, allowing engineers to conserve resources through much shorter design cycles.
“For 40 years, Sunstone Circuits has been committed to meeting the needs of our customers by providing the best and most efficient PCB design experience from quote to delivery,” said Sunstone’s president and CEO, Terry Heilman. “In addition to Sunstone, this new partnership with element14 is just one more way Sunstone can help the design engineer streamline the overall design cycle and drastically improve productivity by offering solutions through one consolidated online resource, the element14 Knode.”
The partnership with element14 enables design engineers to boost productivity dramatically using the Knode, with instant access to quotes and high-quality printed circuit board prototypes in as little as 24 hours.
“Sunstone Circuits is the ideal PCB solutions partner for the element14 community and enhances an already vast portfolio of design solutions available through the element14 Knode,” said David Shen, group senior VP and global head of Technical Marketing, Premier Farnell. “Providing access to Sunstone’s quality, on-time prototyping solutions through our consolidated e-platform further underscores element14’s commitment to connecting engineers to relevant design components, information and the latest technologies.”
Through this partnership, design engineers can access Sunstone’s prototyping products and services to create high quality test copies of unpopulated or “bare” PCBs prior to ordering the finished electronic product, allowing engineers to conserve resources through much shorter design cycles.
“For 40 years, Sunstone Circuits has been committed to meeting the needs of our customers by providing the best and most efficient PCB design experience from quote to delivery,” said Sunstone’s president and CEO, Terry Heilman. “In addition to Sunstone, this new partnership with element14 is just one more way Sunstone can help the design engineer streamline the overall design cycle and drastically improve productivity by offering solutions through one consolidated online resource, the element14 Knode.”
The partnership with element14 enables design engineers to boost productivity dramatically using the Knode, with instant access to quotes and high-quality printed circuit board prototypes in as little as 24 hours.
“Sunstone Circuits is the ideal PCB solutions partner for the element14 community and enhances an already vast portfolio of design solutions available through the element14 Knode,” said David Shen, group senior VP and global head of Technical Marketing, Premier Farnell. “Providing access to Sunstone’s quality, on-time prototyping solutions through our consolidated e-platform further underscores element14’s commitment to connecting engineers to relevant design components, information and the latest technologies.”
element14 leads with 14 new product innovations for Asia Pacific in 2012
SINGAPORE: element14 (formerly Farnell), has renewed its commitment to continue to facilitate design innovations in 2012 by introducing the latest and best-selling components. Engineers in Asia Pacific will be able to keep themselves up to date with the latest solutions available from leading electronics specialists worldwide and select from a wide range of component categories.
"Amidst the economic uncertainty that surrounds 2012, major players in the electronics sectors are focusing more on innovations and new technologies to maintain their competitiveness," says Marc Grange, head of Product Management, element14, Asia Pacific. "element14's unique service propositions, including no minimal quantity order, together with our broad spectrum of the newest high performance solutions, provide engineers with an excellent platform to acquire the latest components to innovate design concepts and promote the adoption of new technologies."
14 new products in element14's portfolio
element14 continues to work closely with globally trusted manufacturers, such as Agilent, Arduino, Digilent, Freescale Semiconductor, Honeywell, Kentec, Lecroy, Microchip, ST Microelectronics and Texas Instruments, to expedite the availability and expand the range of new components in the region. Engineers will be able to find relevant and effective solutions to innovate their designs and address the challenges they face. The 14 of element14’s newest addition to their comprehensive portfolio are:
* element14's ATMEL SAM9G45 Board evaluation kit is an effective platform for evaluating chip performance and developing code for applications based on the AT91SAM9G45 microcontroller.
* Texas Instrument Stellaris DK-LM3S9D96 Development Kit accelerates development of Firestorm-class microcontrollers and includes extensive example applications and complete source code.
* Kentec Electronic's EB-STM3210E-LCD Expansion Board features a built-in LED backlight driver circuit and 60pin FPC connector for the Kentec LCDs of varying configurations.
* STMicroelectronics STM32F4DISCOVERY Discovery Board helps engineers discover the high-performance features of STM32F4 and to develop applications easily.
* Freescale Semiconductor's TWR-S08UNIV provides a Tower System-based development solution for pre-existing S08 and RS08 devices, and it is easy to switch between differing S08 & RS08 MCUs without purchasing the same development board again.
* Microchip's DM330015 Motor Control Starter Kit with mTouch Sensing is a complete hardware and software tool suite for evaluating Microchip’s ultra-low cost Motor Control Family dsPIC DSCs.
* Texas Instruments' 430BOOST-SENSE1 Capacitive Sense BoosterPack includes the MSP430G2452 device, which allows low-cost capacitive-sensing and approximation-sensing applications without the use of any external components.
* Arduino's A000047 Mega 2560 Microcontroller Board contains every feature needed to support microcontrollers by connecting it to a computer with a USB cable or powering it with a AC-to-DC adapter or battery.
* Digilent's chipKIT Max32 Development Board takes advantage of the powerful PIC32MX795F512 microcontroller to provide engineers with high performance functionalities.
* element14's DM3730-EVK DM3730-EVK evaluation kit accelerates time to market for more media-rich, portable applications, including navigation systems, medical patient monitoring devices, industrial test and measurement devices, and portable communications.
* Honeywell's SMART Position Sensor is one of the most durable, adaptable, and lightweight position sensors available in the industry and it provides engineers with highly accurate motion control, improving operation efficiency and safety.
* Agilent Technologies' U1230 Handheld Multimeter makes it safe and easy to work in dark, noisy or dangerous environments with its built-in flashlight, hot wires detection and unique combination of beeping alert and blinking display/LED feature, which allows engineers to take measurements in noisy environment.
* Lecroy's Waveace 101 Oscilloscope features long waveform memory and colour display, extensive measurement capabilities, advanced triggering and excellent connectivity to improve troubleshooting and shorten debug time.
* Circuitco's BeagleBoard-xM Development Kit features open hardware design which improves the laptop-like performance and expandability.
"Amidst the economic uncertainty that surrounds 2012, major players in the electronics sectors are focusing more on innovations and new technologies to maintain their competitiveness," says Marc Grange, head of Product Management, element14, Asia Pacific. "element14's unique service propositions, including no minimal quantity order, together with our broad spectrum of the newest high performance solutions, provide engineers with an excellent platform to acquire the latest components to innovate design concepts and promote the adoption of new technologies."
14 new products in element14's portfolio
element14 continues to work closely with globally trusted manufacturers, such as Agilent, Arduino, Digilent, Freescale Semiconductor, Honeywell, Kentec, Lecroy, Microchip, ST Microelectronics and Texas Instruments, to expedite the availability and expand the range of new components in the region. Engineers will be able to find relevant and effective solutions to innovate their designs and address the challenges they face. The 14 of element14’s newest addition to their comprehensive portfolio are:
* element14's ATMEL SAM9G45 Board evaluation kit is an effective platform for evaluating chip performance and developing code for applications based on the AT91SAM9G45 microcontroller.
* Texas Instrument Stellaris DK-LM3S9D96 Development Kit accelerates development of Firestorm-class microcontrollers and includes extensive example applications and complete source code.
* Kentec Electronic's EB-STM3210E-LCD Expansion Board features a built-in LED backlight driver circuit and 60pin FPC connector for the Kentec LCDs of varying configurations.
* STMicroelectronics STM32F4DISCOVERY Discovery Board helps engineers discover the high-performance features of STM32F4 and to develop applications easily.
* Freescale Semiconductor's TWR-S08UNIV provides a Tower System-based development solution for pre-existing S08 and RS08 devices, and it is easy to switch between differing S08 & RS08 MCUs without purchasing the same development board again.
* Microchip's DM330015 Motor Control Starter Kit with mTouch Sensing is a complete hardware and software tool suite for evaluating Microchip’s ultra-low cost Motor Control Family dsPIC DSCs.
* Texas Instruments' 430BOOST-SENSE1 Capacitive Sense BoosterPack includes the MSP430G2452 device, which allows low-cost capacitive-sensing and approximation-sensing applications without the use of any external components.
* Arduino's A000047 Mega 2560 Microcontroller Board contains every feature needed to support microcontrollers by connecting it to a computer with a USB cable or powering it with a AC-to-DC adapter or battery.
* Digilent's chipKIT Max32 Development Board takes advantage of the powerful PIC32MX795F512 microcontroller to provide engineers with high performance functionalities.
* element14's DM3730-EVK DM3730-EVK evaluation kit accelerates time to market for more media-rich, portable applications, including navigation systems, medical patient monitoring devices, industrial test and measurement devices, and portable communications.
* Honeywell's SMART Position Sensor is one of the most durable, adaptable, and lightweight position sensors available in the industry and it provides engineers with highly accurate motion control, improving operation efficiency and safety.
* Agilent Technologies' U1230 Handheld Multimeter makes it safe and easy to work in dark, noisy or dangerous environments with its built-in flashlight, hot wires detection and unique combination of beeping alert and blinking display/LED feature, which allows engineers to take measurements in noisy environment.
* Lecroy's Waveace 101 Oscilloscope features long waveform memory and colour display, extensive measurement capabilities, advanced triggering and excellent connectivity to improve troubleshooting and shorten debug time.
* Circuitco's BeagleBoard-xM Development Kit features open hardware design which improves the laptop-like performance and expandability.
New tech charging up mobile battery market
PHOENIX, USA: Battery life has always been a limiting issue when it comes to mobile electronics. Over the past two decades consumers have consistently complained about usable time with their smart phones, notebooks, etc. Ten years ago the introduction of Li-ion (lithium ion) batteries made a marked improvement in battery life. However, the same complaint continues to plague the mobile electronics industry.
New materials promise to increase the energy density per gram of Li-ion material. It is increasingly important that the industry continues to invest in research and development as our appetite for vehicles and electronics that run on Li-ion batteries continues to explode. Much of the current R&D is focused on reducing the amount of Li-ion material per device while increasing the energy capacity to run that device.
Semico's newest report, Batteries: The Mobile Market, looks at this current state of the industry and answers three important questions:
* How large is the mobile battery industry?
* What new technology can we look forward to?
* In five years, how will the mobile battery market compare with the electric vehicle battery market?
New materials promise to increase the energy density per gram of Li-ion material. It is increasingly important that the industry continues to invest in research and development as our appetite for vehicles and electronics that run on Li-ion batteries continues to explode. Much of the current R&D is focused on reducing the amount of Li-ion material per device while increasing the energy capacity to run that device.
Semico's newest report, Batteries: The Mobile Market, looks at this current state of the industry and answers three important questions:
* How large is the mobile battery industry?
* What new technology can we look forward to?
* In five years, how will the mobile battery market compare with the electric vehicle battery market?
Tuesday, January 24, 2012
Soitec and Sumitomo Electric in joint development of engineered GaN substrates
BERNIN, FRANCE & TOKYO, JAPAN: Soitec, a leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Sumitomo Electric Industries Ltd, a leading worldwide provider of compound semiconductor materials, have reached a major milestone in their strategic joint development program started in December 2010 by demonstrating four- and six-inch engineered gallium nitride (GaN) substrates and launching pilot production lines to enable wider market adoption.
These substrates - produced by transferring ultra-thin high quality GaN layers from a single GaN wafer to produce multiple engineered GaN substrates - are ideally suited for manufacturing advanced high-brightness light-emitting diodes (LEDs) for the lighting market and power-efficient controllers for the electric vehicles and energy markets.
Leveraging Sumitomo Electric's manufacturing technology for GaN wafers and Soitec's proven Smart Cut layer-transfer technology, this strategic alliance project had originally produced two-inch wafers. With the successful demonstration of GaN wafers' scalability, the partner companies are now proceeding with the next step to invest and establish pilot production lines in Itami, Japan, and Bernin, France. The pilot lines will initially fabricate four-inch wafers with six-inch wafer production to quickly follow to support customers demand.
Sumitomo Electric will manufacture bulk free-standing GaN substrates in Japan for shipment to France, where Soitec will apply its Smart Cut layer-transfer process to generate the final engineered wafers with the same thermal expansion (CTE) as GaN wafers. The resulting wafers have low defect density, enabling the manufacturing of advanced semiconductor devices at lower costs than bulk GaN wafers.
"Our partnership's successful demonstration of four- and six-inch engineered GaN substrates' scalability is a critical milestone, accomplished by applying very strong innovative capabilities from both sides," said Frédéric Dupont, VP of Soitec's Specialty Electronics Business Unit. "The advanced substrates we are developing will allow the introduction of a new materials platform with novel and advanced functionalities."
Yoshiki Miura, GM of Compound Semiconductor Materials Division at Sumitomo Electric, said: "With layer-transfer technology's production readiness now proven for larger wafers, the substrates can be made even more cost effectively for large-volume production. We look forward to continuing our successful collaboration with Soitec to fulfill the requirements of the LED and energy markets, which represent amazing business opportunities."
These substrates - produced by transferring ultra-thin high quality GaN layers from a single GaN wafer to produce multiple engineered GaN substrates - are ideally suited for manufacturing advanced high-brightness light-emitting diodes (LEDs) for the lighting market and power-efficient controllers for the electric vehicles and energy markets.
Leveraging Sumitomo Electric's manufacturing technology for GaN wafers and Soitec's proven Smart Cut layer-transfer technology, this strategic alliance project had originally produced two-inch wafers. With the successful demonstration of GaN wafers' scalability, the partner companies are now proceeding with the next step to invest and establish pilot production lines in Itami, Japan, and Bernin, France. The pilot lines will initially fabricate four-inch wafers with six-inch wafer production to quickly follow to support customers demand.
Sumitomo Electric will manufacture bulk free-standing GaN substrates in Japan for shipment to France, where Soitec will apply its Smart Cut layer-transfer process to generate the final engineered wafers with the same thermal expansion (CTE) as GaN wafers. The resulting wafers have low defect density, enabling the manufacturing of advanced semiconductor devices at lower costs than bulk GaN wafers.
"Our partnership's successful demonstration of four- and six-inch engineered GaN substrates' scalability is a critical milestone, accomplished by applying very strong innovative capabilities from both sides," said Frédéric Dupont, VP of Soitec's Specialty Electronics Business Unit. "The advanced substrates we are developing will allow the introduction of a new materials platform with novel and advanced functionalities."
Yoshiki Miura, GM of Compound Semiconductor Materials Division at Sumitomo Electric, said: "With layer-transfer technology's production readiness now proven for larger wafers, the substrates can be made even more cost effectively for large-volume production. We look forward to continuing our successful collaboration with Soitec to fulfill the requirements of the LED and energy markets, which represent amazing business opportunities."
MICRO INTERCONNECTS manufactures MICTOR coaxial cable assemblies
PORTLAND, USA: MICRO INTERCONNECTS now manufactures 50-ohm MICTOR cable assemblies in an effort to solve difficult signal routing challenges, reduce capacitive input loading, and improve isolation between adjacent channels when used with logic analyzers or oscilloscopes.
These MICTOR coaxial cable assemblies use MICRO INTERCONNECTS 38awg Super Micro Coax and are offered in both standard and custom configurations via the MICRO INTERCONNECTS™ online cable builder. MICRO INTERCONNECTS is a featured portfolio company under High Speed Interconnects, a holding company focused on growing exceptional interconnect technology companies.
These MICTOR coaxial cable assemblies use MICRO INTERCONNECTS 38awg Super Micro Coax and are offered in both standard and custom configurations via the MICRO INTERCONNECTS™ online cable builder. MICRO INTERCONNECTS is a featured portfolio company under High Speed Interconnects, a holding company focused on growing exceptional interconnect technology companies.
Annual global nanotech research funding running at $10 billion per year
MONTREAL, CANADA: ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announced the availability of a new report entitled "Metamaterials: Technologies and Global Markets".
The global market for metamaterials was worth $222.3 million in 2010 and $256.1 million in 2011. Analysts expect the market to grow to $758.7 million by 2016, a CAGR of 24.3 percent since 2011, and to reach $1.9 billion by 2021, a CAGR of 19.6 percent between 2016 and 2021.
In October 2006, David R. Smith of Duke University and other researchers announced that they had created an 'invisibility shield'. Using concentric rings of fiberglass, circuit boards that had been printed with millimeter-scale metal wires, and C-shaped split rings, the researchers were able to divert microwaves around a metal cylinder placed at the center of the ring. The microwaves behaved as though there was nothing there.
In principle, there is no reason why a similar device that cloaks an object from visible light could not be built, although such a visible-light cloak is probably years away from becoming a reality. While not yet exactly the stuff of science fiction, the invisibility cloak is probably the most dramatic demonstration so far of what can be achieved with metamaterials, which are composites made up of precisely arranged patterns of two or more distinct materials.
Metamaterials offer seemingly endless possibilities, but it is unlikely that all of these possibilities will become reality. The goal of this report is to survey emerging metamaterials technologies and applications, identify those that are most likely to achieve significant commercial sales in the next five to 10 years, and develop quantitative estimates of potential sales.
The global market for metamaterials was worth $222.3 million in 2010 and $256.1 million in 2011. Analysts expect the market to grow to $758.7 million by 2016, a CAGR of 24.3 percent since 2011, and to reach $1.9 billion by 2021, a CAGR of 19.6 percent between 2016 and 2021.
In October 2006, David R. Smith of Duke University and other researchers announced that they had created an 'invisibility shield'. Using concentric rings of fiberglass, circuit boards that had been printed with millimeter-scale metal wires, and C-shaped split rings, the researchers were able to divert microwaves around a metal cylinder placed at the center of the ring. The microwaves behaved as though there was nothing there.
In principle, there is no reason why a similar device that cloaks an object from visible light could not be built, although such a visible-light cloak is probably years away from becoming a reality. While not yet exactly the stuff of science fiction, the invisibility cloak is probably the most dramatic demonstration so far of what can be achieved with metamaterials, which are composites made up of precisely arranged patterns of two or more distinct materials.
Metamaterials offer seemingly endless possibilities, but it is unlikely that all of these possibilities will become reality. The goal of this report is to survey emerging metamaterials technologies and applications, identify those that are most likely to achieve significant commercial sales in the next five to 10 years, and develop quantitative estimates of potential sales.
Monday, January 23, 2012
Battery modules for hybrid and electric vehicles will be $47 billion market in 2020
LONDON, ENGLAND: In 2011, the first plug-in hybrid electric vehicles (PHEVs) went into production to add the next level of electric-only drive to the steadily growing popularity of the hybrid assist vehicle. Large lithium-ion battery production facilities came online in a number of countries around the world to support the anticipated demand fueled in many countries by generous subsidies and tax benefits. The battery module market is expected to grow from about $5 billion in 2010 to $47 billion in 2020, representing a healthy CAGR of 25% over 10 years.
“As well as the production vehicles that went on sale in 2011, announcements from all the major manufacturers make it clear that this segment will have much more competition in the next couple of years,” says principal analyst David Alexander. “Also, some existing hybrid vehicles will be fitted with larger batteries to improve their electric-only range.”
Continued demand for cleaner, more efficient vehicles, led by governments dealing with goals to cut emissions, means that financial incentives will be around for a long time. The recharging infrastructure is also developing rapidly in urban areas, which are being targeted as prime regions for electric vehicle adoption.
“Range anxiety is diminishing and consumer acceptance is growing, but the major obstacle for potential purchasers of an EV remains the high price,” says group director Dominique Bonte. “And while the costs of power electronics and electric motors are expected to drop significantly as production ramps up, no big price cuts are expected for the most expensive component, the battery pack.”
Alternative technologies such as hydraulic hybrid drive, ultracapacitors, and flywheel energy storage continue development and testing in niche applications, but it seems that the battery-electric solution will be the recipient of the majority of the production investment during the forecast period.
“As well as the production vehicles that went on sale in 2011, announcements from all the major manufacturers make it clear that this segment will have much more competition in the next couple of years,” says principal analyst David Alexander. “Also, some existing hybrid vehicles will be fitted with larger batteries to improve their electric-only range.”
Continued demand for cleaner, more efficient vehicles, led by governments dealing with goals to cut emissions, means that financial incentives will be around for a long time. The recharging infrastructure is also developing rapidly in urban areas, which are being targeted as prime regions for electric vehicle adoption.
“Range anxiety is diminishing and consumer acceptance is growing, but the major obstacle for potential purchasers of an EV remains the high price,” says group director Dominique Bonte. “And while the costs of power electronics and electric motors are expected to drop significantly as production ramps up, no big price cuts are expected for the most expensive component, the battery pack.”
Alternative technologies such as hydraulic hybrid drive, ultracapacitors, and flywheel energy storage continue development and testing in niche applications, but it seems that the battery-electric solution will be the recipient of the majority of the production investment during the forecast period.
Asheville boasts first large-scale LED street light deployment in North Carolina
DURHAM, USA: Taking steps to improve energy efficiency and reduce its overall carbon footprint, the City of Asheville has initiated North Carolina’s first large-scale deployment of LED street lights. There are 3,643 LEDway street lights from Durham-based manufacturer Cree Inc. being installed, with projected savings of $260,000 annually.
In the initial phase of the project, completed in June 2011, 730 street lights in Asheville’s River District and Kenilworth neighborhoods were replaced with 67-watt to 195-watt LEDway luminaires, estimated to save the City $45,000 in annual energy costs. An additional 2,913 LEDway street lights are currently being installed, and the City anticipates saving 50 percent of current energy use and maintenance costs due to the LED upgrade.
“Upgrading to LED street lights allows us to decrease energy consumption, increase energy efficiency and contribute to the sustainability of our community,” said Maggie Ullman, energy coordinator for the Asheville Office of Sustainability. “This exciting initiative helps affirm Asheville’s role as a leader in carbon footprint reduction.”
Asheville’s city-wide street light upgrade project complies with the City Council’s 2008 lighting ordinance, designed to reduce glare and light pollution. In 2009, Asheville City Council unanimously approved using Energy Efficiency and Conservation Block Grants, part of the American Recovery and Reinvestment Act (ARRA), to fund efficiency initiatives, including the first phase of the street light replacement. The revolving fund rolls energy savings back into the city’s green and efficiency initiatives.
Progress Energy, which serves the City of Asheville, provides N.C. Utilities Commission-approved rate tables to its customers that choose LED street lights. In addition to helping its customers understand the energy cost savings of LED technology, Progress Energy provides the option of renting or owning LED lighting fixtures.
“As more municipalities commit to replacing outdated, inefficient lighting with the support of their local utilities, LED adoption and consumer awareness continue to increase,” said Christopher Ruud, president of Ruud Lighting, a Cree Company. “We applaud the City of Asheville and Progress Energy for working together for the benefit of its citizens demonstrating the growing trend of cities and municipalities working together to join the LED lighting revolution.”
In the initial phase of the project, completed in June 2011, 730 street lights in Asheville’s River District and Kenilworth neighborhoods were replaced with 67-watt to 195-watt LEDway luminaires, estimated to save the City $45,000 in annual energy costs. An additional 2,913 LEDway street lights are currently being installed, and the City anticipates saving 50 percent of current energy use and maintenance costs due to the LED upgrade.
“Upgrading to LED street lights allows us to decrease energy consumption, increase energy efficiency and contribute to the sustainability of our community,” said Maggie Ullman, energy coordinator for the Asheville Office of Sustainability. “This exciting initiative helps affirm Asheville’s role as a leader in carbon footprint reduction.”
Asheville’s city-wide street light upgrade project complies with the City Council’s 2008 lighting ordinance, designed to reduce glare and light pollution. In 2009, Asheville City Council unanimously approved using Energy Efficiency and Conservation Block Grants, part of the American Recovery and Reinvestment Act (ARRA), to fund efficiency initiatives, including the first phase of the street light replacement. The revolving fund rolls energy savings back into the city’s green and efficiency initiatives.
Progress Energy, which serves the City of Asheville, provides N.C. Utilities Commission-approved rate tables to its customers that choose LED street lights. In addition to helping its customers understand the energy cost savings of LED technology, Progress Energy provides the option of renting or owning LED lighting fixtures.
“As more municipalities commit to replacing outdated, inefficient lighting with the support of their local utilities, LED adoption and consumer awareness continue to increase,” said Christopher Ruud, president of Ruud Lighting, a Cree Company. “We applaud the City of Asheville and Progress Energy for working together for the benefit of its citizens demonstrating the growing trend of cities and municipalities working together to join the LED lighting revolution.”
Molex's Stac64 product family certified to most stringent automotive OEM criteria
LISLE, USA: Molex Inc. has announced that its Stac64 Stackable Connection System is now validated against the most stringent specifications from the major key automotive original equipment manufacturers (OEMs) in Germany, France and Japan. In addition, new patents have been awarded for the Stac64 design.
“Since its launch two years ago, we have undertaken the validation of the Stac64 product line towards all key automotive OEM specifications surpassing the most stringent requirements,” said Selvan Wilhelm, global product manager, Molex. “We are the only connector manufacturer in the world to achieve such performance levels with certification from the major automotive OEMs. It is a testament to Molex’s immense knowledge and experience gained by working closely with global automotive manufacturers.”
Designed originally as a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications, the Stac64 design has since secured new patents relating to the stackable header. “This design evolution differentiates the Stac64 family from the standard products available on the market today, resulting in a new product specification for the Stac64 family, as well as a new Design Validation Plan Report (DVPR) worldwide,” added Wilhelm.
The Stac64 stackable connection system allows OEMs greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30.0A. It also allows the manufacturers to use header assemblies as stand-alone components or to gang multiple headers together to support a large range of signal and power needs for devices and modules.
“Since its launch two years ago, we have undertaken the validation of the Stac64 product line towards all key automotive OEM specifications surpassing the most stringent requirements,” said Selvan Wilhelm, global product manager, Molex. “We are the only connector manufacturer in the world to achieve such performance levels with certification from the major automotive OEMs. It is a testament to Molex’s immense knowledge and experience gained by working closely with global automotive manufacturers.”
Designed originally as a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications, the Stac64 design has since secured new patents relating to the stackable header. “This design evolution differentiates the Stac64 family from the standard products available on the market today, resulting in a new product specification for the Stac64 family, as well as a new Design Validation Plan Report (DVPR) worldwide,” added Wilhelm.
The Stac64 stackable connection system allows OEMs greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30.0A. It also allows the manufacturers to use header assemblies as stand-alone components or to gang multiple headers together to support a large range of signal and power needs for devices and modules.
IMS Nanofabrication announces electron multi-beam mask writer collaboration with DNP, Intel and Photronics
VIENNA, AUSTRIA: IMS Nanofabrication AG (IMS) announced that Dai Nippon Printing Co. Ltd (DNP), Intel Corp., Photronics Inc. and IMS are commencing a joint electron multi-beam mask writer tool collaboration to advance development of IMS’ electron multi-beam projection technology. The engagement of DNP, a leading merchant photomask supplier to the electronics industry, augments the recent equity funding round announced by IMS that included participation from Intel and Photronics.
“We are pleased with the support being provided by DNP, Intel and Photronics as we work to develop our electron mask exposure tool (eMET) technology for sub 22nm mask writing applications,” said Max Bayerl, CEO of IMS.
Naoya Hayashi, Research Fellow, Electronic Device Operations, DNP said, “We believe the development of IMS Nanofabrication's Multi-Beam Technology through the mutual global collaboration is quite significant as the next generation high efficient pattern writing platform."
“Intel is encouraged by the lithography capability demonstrated to date by IMS,” said Chiang Yang, VP and GM of Intel Mask Operations (IMO). “We believe that industry collaboration to develop promising photomask technologies leads to robust solutions that are critical to help extend Moore’s Law.”
DNP, Intel and Photronics are the first industry participants to sign the technology collaboration agreement with IMS to support its eMET development program.
Collaboration participants will provide input to IMS on mask manufacturing issues that are critical to leading-edge device manufacturers and to leading merchant mask makers. The participants expect to benefit from early access to the eMET technology and from eventual commercialization of the technology in partnership with additional industry players.
Christopher Progler, CTO, Photronics, said: “Formation of this collaboration is a timely and very positive step forward as IMS continues to build momentum toward commercialization of their multi-beam column. Photronics looks forward to strong participation as technology collaborator on this critical program.”
“We are pleased with the support being provided by DNP, Intel and Photronics as we work to develop our electron mask exposure tool (eMET) technology for sub 22nm mask writing applications,” said Max Bayerl, CEO of IMS.
Naoya Hayashi, Research Fellow, Electronic Device Operations, DNP said, “We believe the development of IMS Nanofabrication's Multi-Beam Technology through the mutual global collaboration is quite significant as the next generation high efficient pattern writing platform."
“Intel is encouraged by the lithography capability demonstrated to date by IMS,” said Chiang Yang, VP and GM of Intel Mask Operations (IMO). “We believe that industry collaboration to develop promising photomask technologies leads to robust solutions that are critical to help extend Moore’s Law.”
DNP, Intel and Photronics are the first industry participants to sign the technology collaboration agreement with IMS to support its eMET development program.
Collaboration participants will provide input to IMS on mask manufacturing issues that are critical to leading-edge device manufacturers and to leading merchant mask makers. The participants expect to benefit from early access to the eMET technology and from eventual commercialization of the technology in partnership with additional industry players.
Christopher Progler, CTO, Photronics, said: “Formation of this collaboration is a timely and very positive step forward as IMS continues to build momentum toward commercialization of their multi-beam column. Photronics looks forward to strong participation as technology collaborator on this critical program.”
Molex experts showcase complete high-speed interconnect solution
DesignCon 2012, LISLE, USA: Molex Inc. will bring its proven expertise in high-speed, high-density interconnect technology to DesignCon 2012, Jan. 30 – Feb. 2, Santa Clara, CA. At the show, Molex experts will participate in several technical paper presentations that feature new interconnect design developments. Additionally, the team will showcase the company’s interconnect solutions by displaying a range of products and conducting several live demonstrations in booth 109.
Technical paper presentations
The sessions highlight specific Molex technical and application expertise:
EMC/EMI correlation study for 25+ Gbps systems
Wed., Feb. 1, 11:05–11:45 a.m.: Peerouz Amleshi, director of signal integrity engineering, Molex, will use a 3D simulation tool to predict EM emission. This study will be done in two phases: far field emission correlation between the model and test results for a fabricated antenna (emission source) and correlation between the model versus test results with the emitter enclosed in a metallic chassis.
De-embedding in high speed design
Mon., Jan., 30, 9:00a.m.–12:00p.m.: David Dunham, director of signal integrity engineering, Molex, will conduct a tutorial that reviews the math behind de-embedding. He will also demonstrate how some of the most common de-embedding functions such as probe tip de-embedding, gating and TRL de-embedding are performed.
System Performance as a Function of Common Mode Metrics
Tues., Jan. 31, 11:05-11:45a.m.: Michael Rowlands, senior electrical engineer, Molex, will focus on system performance as a function of common mode metrics. Using analysis, simulation and measurement, he will estimate the bottom line bit-error-rate of a channel and give a set of common mode performance data.
There will be a host of product demonstrations as well:
* EXTreme Ten60Power high-current and EXTreme LPHPower connectors;
* zQSFP+ and zSFP+;
* NeoScale 28 Gbps speeds;
* Impact backplane connector system.
Technical paper presentations
The sessions highlight specific Molex technical and application expertise:
EMC/EMI correlation study for 25+ Gbps systems
Wed., Feb. 1, 11:05–11:45 a.m.: Peerouz Amleshi, director of signal integrity engineering, Molex, will use a 3D simulation tool to predict EM emission. This study will be done in two phases: far field emission correlation between the model and test results for a fabricated antenna (emission source) and correlation between the model versus test results with the emitter enclosed in a metallic chassis.
De-embedding in high speed design
Mon., Jan., 30, 9:00a.m.–12:00p.m.: David Dunham, director of signal integrity engineering, Molex, will conduct a tutorial that reviews the math behind de-embedding. He will also demonstrate how some of the most common de-embedding functions such as probe tip de-embedding, gating and TRL de-embedding are performed.
System Performance as a Function of Common Mode Metrics
Tues., Jan. 31, 11:05-11:45a.m.: Michael Rowlands, senior electrical engineer, Molex, will focus on system performance as a function of common mode metrics. Using analysis, simulation and measurement, he will estimate the bottom line bit-error-rate of a channel and give a set of common mode performance data.
There will be a host of product demonstrations as well:
* EXTreme Ten60Power high-current and EXTreme LPHPower connectors;
* zQSFP+ and zSFP+;
* NeoScale 28 Gbps speeds;
* Impact backplane connector system.
Friday, January 20, 2012
Mouser offering Qi (“chee”) solutions for wireless charging
TAIWAN: Mouser Electronics Inc. announced that it is stocking components in support of the Wireless Power Consortium’s Qi (pronounced “chee”) global standards for interoperability between wireless power transmitters and wireless power receivers.
The Wireless Power Consortium (WPC), consisting of 100 international, leading wireless technology companies, is dedicated to promoting wireless charging stations that are compatible across different companies and countries. Mouser is stocking new components that meet the new Qi standard.
Texas Instruments’ BQ500110 / BQ500210 Wireless Power Transmitter Managers
o Integrate the logic functions required to control wireless power transfer.
o Single channel WPC compliant contactless charging base station.
TI’s BQ51011 Gen 2 Wireless Power Receiver
o Provides AC/DC power conversion while integrating the digital control required to comply with the WPC v1.0 communication protocol.
These transmitters and receivers are designed for devices such as cell phones, smart phones, headsets, digital cameras, portable media players and hand-held devices. Both the TI transmitter and receiver are supported by robust development tools.
TI’s bqTESLA150LP Evaluation Kit
o Low power wireless development kit.
o Includes transmitter with a Qi-compliant controller and a Qi-compliant receiver IC.
Vishay’s IWAS Series Wireless Charging Receiving Coil/Shield
o First commercial Qi-compliant wireless receiver coil available.
o Incorporated into the Texas Instrument’s bq51013EVM-725.
o High permeability shielding, blocks charging flux from sensitive components or batteries.
The Wireless Power Consortium (WPC), consisting of 100 international, leading wireless technology companies, is dedicated to promoting wireless charging stations that are compatible across different companies and countries. Mouser is stocking new components that meet the new Qi standard.
Texas Instruments’ BQ500110 / BQ500210 Wireless Power Transmitter Managers
o Integrate the logic functions required to control wireless power transfer.
o Single channel WPC compliant contactless charging base station.
TI’s BQ51011 Gen 2 Wireless Power Receiver
o Provides AC/DC power conversion while integrating the digital control required to comply with the WPC v1.0 communication protocol.
These transmitters and receivers are designed for devices such as cell phones, smart phones, headsets, digital cameras, portable media players and hand-held devices. Both the TI transmitter and receiver are supported by robust development tools.
TI’s bqTESLA150LP Evaluation Kit
o Low power wireless development kit.
o Includes transmitter with a Qi-compliant controller and a Qi-compliant receiver IC.
Vishay’s IWAS Series Wireless Charging Receiving Coil/Shield
o First commercial Qi-compliant wireless receiver coil available.
o Incorporated into the Texas Instrument’s bq51013EVM-725.
o High permeability shielding, blocks charging flux from sensitive components or batteries.
Seoul Semiconductor registers 10,000 LED patents domestically and internationally
SEOUL, SOUTH KOREA: Seoul Semiconductor Co. Ltd has applied, registered and secured more than 10,000 patents for LED. Seoul Semiconductor is a leader in developing intellectual property in the global LED manufacturing industry.
Seoul Semiconductor has invested in strengthening its LED technology and increasing its number of patents. The company invests 10-20 percent of its annual revenue in Research and Development, including funding of an affiliate company. The company holds a patent portfolio across a broad range of technologies and processes, including material, design, manufacturing and methodology.
Notably, the company holds patent rights for Acrich, the semiconductor light source using a multi-cell architecture, as well as patent rights for deep UV LED technology. Seoul Semiconductor anticipates that deep UV LED technology will be commonly used in the future and it will be prepared to produce and sell this technology.
“With the large number of patents and cross-licenses with major LED corporations, Seoul Semiconductor has achieved technical independence and offers customers distinctive solutions not available elsewhere,” said Brian Wilcox, VP of Seoul Semiconductor. “R&D is our future and patents heighten our competitiveness. Starting this year, we expect increased business activity from our innovative LED lighting solution, Acrich2, as it goes into production.”
Seoul Semiconductor has invested in strengthening its LED technology and increasing its number of patents. The company invests 10-20 percent of its annual revenue in Research and Development, including funding of an affiliate company. The company holds a patent portfolio across a broad range of technologies and processes, including material, design, manufacturing and methodology.
Notably, the company holds patent rights for Acrich, the semiconductor light source using a multi-cell architecture, as well as patent rights for deep UV LED technology. Seoul Semiconductor anticipates that deep UV LED technology will be commonly used in the future and it will be prepared to produce and sell this technology.
“With the large number of patents and cross-licenses with major LED corporations, Seoul Semiconductor has achieved technical independence and offers customers distinctive solutions not available elsewhere,” said Brian Wilcox, VP of Seoul Semiconductor. “R&D is our future and patents heighten our competitiveness. Starting this year, we expect increased business activity from our innovative LED lighting solution, Acrich2, as it goes into production.”
Digi-Key and Synapse Wireless announce global distribution agreement
THIEF RIVER FALLS & HUNTSVILLE, USA: Digi-Key Corp. has signed a global distribution agreement with Synapse Wireless.
“We are excited to provide Synapse Wireless products to our growing global customer base,” said Mark Zack, vice president of semiconductors, Digi-Key. “Synapse Wireless offers state-of-the-art, intelligent wireless control innovations including Synapse’s Portal® and the SNAP® network operating system.”
“Digi-Key is a leader in bringing the latest and most reliable wireless technology to the engineering community,” said Wade Patterson, CEO of Synapse. “Synapse’s SNAP network operating system removes the worry of setting up machine-to-machine and machine-to-Internet connectivity, letting the customer focus on their application. Our intelligent, wireless control products will give Digi-Key’s customers faster time to revenue.
Synapse’s Portal and SNAP Connect products provide a complete software development environment for easy application development and fast time to revenue. Synapse RF Engine® modules include an increasing number of MCU choices for both interoperability and second sourcing.
“We are excited to provide Synapse Wireless products to our growing global customer base,” said Mark Zack, vice president of semiconductors, Digi-Key. “Synapse Wireless offers state-of-the-art, intelligent wireless control innovations including Synapse’s Portal® and the SNAP® network operating system.”
“Digi-Key is a leader in bringing the latest and most reliable wireless technology to the engineering community,” said Wade Patterson, CEO of Synapse. “Synapse’s SNAP network operating system removes the worry of setting up machine-to-machine and machine-to-Internet connectivity, letting the customer focus on their application. Our intelligent, wireless control products will give Digi-Key’s customers faster time to revenue.
Synapse’s Portal and SNAP Connect products provide a complete software development environment for easy application development and fast time to revenue. Synapse RF Engine® modules include an increasing number of MCU choices for both interoperability and second sourcing.
Thursday, January 19, 2012
Vishay's intros Power Metal Strip resistor in 2512 case size
MALVERN, USA: Vishay Intertechnology Inc. announced a new surface-mount Power Metal Strip resistor in a 2512 case size that combines a very high power capacity of 3 W with extremely low resistance values down to 0.0005 ohms.
The advanced construction of the WSLP2512 resistor incorporates a solid metal nickel-chrome or manganese-copper alloy resistive element with low TCR (less than 20 PPM/°C) and specially selected and stabilized material. This results in a high-power resistor with an operating temperature range of - 65 °C to + 170 °C while maintaining the superior electrical characteristics of the Power Metal Strip construction.
The new devices allow for the design of high-power circuits featuring the smallest possible resistor for higher-performance end products. Furthermore, the resistors' high-temperature capability allows the use of the WSLP2512 in harsh, high-temperature environments without sacrificing power rating or electrical performance.
The resistors are ideal for all types of current sensing and pulse applications, including switching and linear power supplies, instruments, power amplifiers, and shunts in automotive electronic controls such as engine, anti-lock brake, and climate controls; industrial controls, including down-hole test/measurement equipment for oil/gas well drilling; and consumer product controls such as inverter controls for HVAC systems.
The WSLP2512 resistor measures 0.250 in. by 0.125 in. by 0.025 in. [6.35 mm by 3.18 mm by 0.635 mm]. A proprietary processing technique produces extremely low resistance values ranging from 0.0005 to 0.01 ohms, with tight tolerances of 1 percent and 5 percent, respectively.
Like all Power Metal Strip resistors, the devices released today feature an all-welded construction that contributes to their superior electrical performance. The WSLP2512 provides very low inductance of 0.5 to 5 nanohenries and low thermal EMF (less than 3 microvolts/°C).
Samples and production quantities of the new resistors are available now, with a lead time of six to eight weeks for larger orders.
The advanced construction of the WSLP2512 resistor incorporates a solid metal nickel-chrome or manganese-copper alloy resistive element with low TCR (less than 20 PPM/°C) and specially selected and stabilized material. This results in a high-power resistor with an operating temperature range of - 65 °C to + 170 °C while maintaining the superior electrical characteristics of the Power Metal Strip construction.
The new devices allow for the design of high-power circuits featuring the smallest possible resistor for higher-performance end products. Furthermore, the resistors' high-temperature capability allows the use of the WSLP2512 in harsh, high-temperature environments without sacrificing power rating or electrical performance.
The resistors are ideal for all types of current sensing and pulse applications, including switching and linear power supplies, instruments, power amplifiers, and shunts in automotive electronic controls such as engine, anti-lock brake, and climate controls; industrial controls, including down-hole test/measurement equipment for oil/gas well drilling; and consumer product controls such as inverter controls for HVAC systems.
The WSLP2512 resistor measures 0.250 in. by 0.125 in. by 0.025 in. [6.35 mm by 3.18 mm by 0.635 mm]. A proprietary processing technique produces extremely low resistance values ranging from 0.0005 to 0.01 ohms, with tight tolerances of 1 percent and 5 percent, respectively.
Like all Power Metal Strip resistors, the devices released today feature an all-welded construction that contributes to their superior electrical performance. The WSLP2512 provides very low inductance of 0.5 to 5 nanohenries and low thermal EMF (less than 3 microvolts/°C).
Samples and production quantities of the new resistors are available now, with a lead time of six to eight weeks for larger orders.
Oclaro laser diodes enable development of industry's first 15 kW direct diode laser systems
SAN JOSE, USA: Oclaro Inc., a tier-one provider and innovator of optical communications and laser solutions, announced that its laser diodes have been designed into the industry's first 15 kilowatt (kW) direct diode fiber coupled laser systems.
Featuring the highest power levels, broadest wavelength range and leading brightness, the Oclaro laser diodes scale from 910nm to 1070nm at high power levels and leading brightness to uniquely meet the demanding performance requirements of these next generation 15kW systems. The company will be showcasing its complete line of laser diodes, which are currently shipping in volume to the industrial, semiconductor, automotive and materials processing markets, at next week's Photonics West Conference in the Oclaro booth #1101.
15kW and other multi-kilowatt systems are ideal for applications such as metal welding, cladding and cutting that continually require higher power to improve the performance of the laser system and process efficiency. Due to their output power, brightness and "colors", the Oclaro laser diodes have become a key technology that is driving the development of these next generation laser systems. As the power of these systems scales linearly with the number of wavelengths available for multiplexing, Oclaro's ability to provide lasers with wavelengths from 910nm up to 1070nm with high power levels and excellent brightness is the technology that is allowing customers – for the first time – to design commercial fiber coupled multi-kilowatt direct diode laser systems that can meet and exceed 15kW.
"Today's announcement highlights Oclaro's continued ability to advance the performance and features of our industry-leading laser diode platform," said Bernd Meyer, VP Product Management, High Power Laser Business for Oclaro. "Our customers are always looking for ways to expand their business into new markets and applications that require more power and brightness, and the 15kW laser systems being enabled by our laser diodes are key to their success."
One of the first Oclaro customers designing next generation 15kW laser systems is Laserline, the leading manufacturer of high power diode laser systems. Laserline chose the Oclaro direct diode solutions because they deliver the power, brightness and reliability needed to bring 15kW direct diode systems to market. In addition, Oclaro was able to provide Laserline with its in-house design and manufacturing expertise along with the capability to scale to volume quickly and cost effectively.
Featuring the highest power levels, broadest wavelength range and leading brightness, the Oclaro laser diodes scale from 910nm to 1070nm at high power levels and leading brightness to uniquely meet the demanding performance requirements of these next generation 15kW systems. The company will be showcasing its complete line of laser diodes, which are currently shipping in volume to the industrial, semiconductor, automotive and materials processing markets, at next week's Photonics West Conference in the Oclaro booth #1101.
15kW and other multi-kilowatt systems are ideal for applications such as metal welding, cladding and cutting that continually require higher power to improve the performance of the laser system and process efficiency. Due to their output power, brightness and "colors", the Oclaro laser diodes have become a key technology that is driving the development of these next generation laser systems. As the power of these systems scales linearly with the number of wavelengths available for multiplexing, Oclaro's ability to provide lasers with wavelengths from 910nm up to 1070nm with high power levels and excellent brightness is the technology that is allowing customers – for the first time – to design commercial fiber coupled multi-kilowatt direct diode laser systems that can meet and exceed 15kW.
"Today's announcement highlights Oclaro's continued ability to advance the performance and features of our industry-leading laser diode platform," said Bernd Meyer, VP Product Management, High Power Laser Business for Oclaro. "Our customers are always looking for ways to expand their business into new markets and applications that require more power and brightness, and the 15kW laser systems being enabled by our laser diodes are key to their success."
One of the first Oclaro customers designing next generation 15kW laser systems is Laserline, the leading manufacturer of high power diode laser systems. Laserline chose the Oclaro direct diode solutions because they deliver the power, brightness and reliability needed to bring 15kW direct diode systems to market. In addition, Oclaro was able to provide Laserline with its in-house design and manufacturing expertise along with the capability to scale to volume quickly and cost effectively.
Viper Networks to become key supplier for LEDs America
TROY, USA: The management of Viper Networks Inc. is involved in comprehensive talks for entering into a major “Manufacturing and Supply Agreement" with LEDs America Inc.
Under the expected terms of any agreement, Viper Networks as Supplier, will exclusively manufacture and package the products for LEDs America and deliver the products as required by purchase orders to certain regions and/or countries specified by LEDs America.
As a US based public company, Viper Networks intends to establish their manufacturing facilities in the continental United States and expects to announce the location shortly after finalizing the manufacturing and supply agreement as noted in this announcement.
If deemed necessary, Viper Networks will apply and maintain ISO 9001-2008 certification for all manufacturing facilities and any other certifications that will result in improved manufacturing techniques or practices, enabling manufacturers to achieve gains in the areas of quality, technology or profitability.
As a major supplier, the company will be expected to cooperate with LEDs America to identify components and sources of supply for components and parts, and to offer suggestions regarding the design and configuration of products and of new products under development.
Terms of any forthcoming agreement are expected to include; that the Supplier will not sell, market, offer, manufacture, produce, or otherwise make or distribute, any lamps, ballasts, light fixtures, LEDs or any other products or accessories that are otherwise competitive with LEDs America’s products.
With special circumstances noted, the term of the agreement shall be for five years commencing on the actual date of the signed agreement by both parties, with renewal terms to continue for additional five year terms unless terminated under certain conditions listed in a section(s) that will be detailed in any forthcoming agreement.
Under the expected terms of any agreement, Viper Networks as Supplier, will exclusively manufacture and package the products for LEDs America and deliver the products as required by purchase orders to certain regions and/or countries specified by LEDs America.
As a US based public company, Viper Networks intends to establish their manufacturing facilities in the continental United States and expects to announce the location shortly after finalizing the manufacturing and supply agreement as noted in this announcement.
If deemed necessary, Viper Networks will apply and maintain ISO 9001-2008 certification for all manufacturing facilities and any other certifications that will result in improved manufacturing techniques or practices, enabling manufacturers to achieve gains in the areas of quality, technology or profitability.
As a major supplier, the company will be expected to cooperate with LEDs America to identify components and sources of supply for components and parts, and to offer suggestions regarding the design and configuration of products and of new products under development.
Terms of any forthcoming agreement are expected to include; that the Supplier will not sell, market, offer, manufacture, produce, or otherwise make or distribute, any lamps, ballasts, light fixtures, LEDs or any other products or accessories that are otherwise competitive with LEDs America’s products.
With special circumstances noted, the term of the agreement shall be for five years commencing on the actual date of the signed agreement by both parties, with renewal terms to continue for additional five year terms unless terminated under certain conditions listed in a section(s) that will be detailed in any forthcoming agreement.
Opnext intros high power 660nm red laser diode
SPIE Photonics West 2012, FREMONT, USA: Opnext Inc. has introduced a 660nm high-power laser with a built-in monitor photo diode. Opnext’s HL65051DG red laser diode, which is designed for applications such as LIDAR (laser imaging detection and ranging) and plastic optical fiber (POF) communications applications, achieves optimal performance and output by enabling system designers to monitor the laser’s performance and adjust output power in real time.
Using a unique and proprietary design, the HL65051DG red laser diode is an addition to the Opnext laser diode product family, featuring the HL63142DG, which also offers a built-in monitoring capability, and was first announced in January 2011. The built-in monitoring allows a system designer to control the optical performance by monitoring the photo diode current and adjusting for temperature and power variants.
Performance monitoring capabilities are essential for maintaining constant laser output power in laser imaging detection and ranging applications as well as POF communications applications, such as the automotive market, where there are changes in the operating environment. The HL65051DG operates at a temperature range up to 60°C and 120mW in the 660nm wavelength band in a 5.6mm diameter TO industry standard package.
“We expect to see initial demand for this high-quality laser from industry applications where precise laser control is an important performance parameter,” said Tadayuki Kanno, president of Opnext’s devices business unit. “The industry trend is moving toward producing high-power laser diodes that consume less energy, and Opnext continues to innovate in bringing these key performance capabilities to market.”
Chris Gladding, CEO at Blue Sky Research, said: “We value the Opnext high-quality laser devices and the tremendous service and support they provide across a variety of applications for our broad customer base. The HL65051DG is another example of how Opnext stepped up to meet a need in the marketplace for a high-power red laser diode.”
Driven by more than 30 years of innovative laser heritage, Opnext offers one of the industry’s most comprehensive portfolios of laser diodes, spanning from 404nm to 852nm. Opnext high-quality, reliable red and infrared laser diodes are proven to consume a low operating current, which extends battery life, while still maintaining the integrity of the laser diode power in a variety of applications such as gun sights, rangefinders, line leveling construction systems and biomedical applications.
The HL65051DG is expected to be in mass production beginning in April 2012.
Using a unique and proprietary design, the HL65051DG red laser diode is an addition to the Opnext laser diode product family, featuring the HL63142DG, which also offers a built-in monitoring capability, and was first announced in January 2011. The built-in monitoring allows a system designer to control the optical performance by monitoring the photo diode current and adjusting for temperature and power variants.
Performance monitoring capabilities are essential for maintaining constant laser output power in laser imaging detection and ranging applications as well as POF communications applications, such as the automotive market, where there are changes in the operating environment. The HL65051DG operates at a temperature range up to 60°C and 120mW in the 660nm wavelength band in a 5.6mm diameter TO industry standard package.
“We expect to see initial demand for this high-quality laser from industry applications where precise laser control is an important performance parameter,” said Tadayuki Kanno, president of Opnext’s devices business unit. “The industry trend is moving toward producing high-power laser diodes that consume less energy, and Opnext continues to innovate in bringing these key performance capabilities to market.”
Chris Gladding, CEO at Blue Sky Research, said: “We value the Opnext high-quality laser devices and the tremendous service and support they provide across a variety of applications for our broad customer base. The HL65051DG is another example of how Opnext stepped up to meet a need in the marketplace for a high-power red laser diode.”
Driven by more than 30 years of innovative laser heritage, Opnext offers one of the industry’s most comprehensive portfolios of laser diodes, spanning from 404nm to 852nm. Opnext high-quality, reliable red and infrared laser diodes are proven to consume a low operating current, which extends battery life, while still maintaining the integrity of the laser diode power in a variety of applications such as gun sights, rangefinders, line leveling construction systems and biomedical applications.
The HL65051DG is expected to be in mass production beginning in April 2012.
MFLEX and AT&S to jointly manufacture high density interconnect rigid-flex printed circuits
NAHEIM, USA & LOEBEN, AUSTRIA: Multi-Fineline Electronix Inc., a global leader in flex circuit fabrication with complex electronic component assembly capabilities and Austria Technologie & Systemtechnik Aktiengesellschaft, a technology leader in HDI any-layer printed circuit boards, announced a strategic alliance agreement between the two parties.
The resulting alliance will enable the parties to offer best-in-class high density interconnect (HDI) rigid-flex printed circuits for electronic devices and positions both companies to tap new opportunities in additional applications beyond their current offerings.
Rigid-flex circuits are hybrid constructions consisting of rigid and flexible substrate sections that are laminated together into a single structure. HDI rigid-flex printed circuits integrate HDI PCB technology used for high density components with three dimensional flex circuits packaging solutions, eliminating connectors and thereby saving space and weight.
Both companies will continue to pursue increasing market opportunities in their core business, while providing this sophisticated solution as an addition to their product offerings. The alliance allows OEM's to fully utilize MFLEX and AT&S's expertise in complex flexible circuits and HDI rigid printed circuit board technology, respectively, to create technology demanding solutions for HDI rigid-flex printed circuits.
"As global technology leaders, AT&S and MFLEX are leveraging the strengths of each company to jointly manufacture best-in-class HDI rigid-flex printed circuits with assembly capabilities to meet the market needs for complex interconnect solutions. Having commenced initial production of HDI rigid-flex printed circuits, we are excited by the new business prospects this alliance opens to both companies as we expand into new applications with advanced technology products to serve both existing and new customers," said MFLEX CEO, Reza Meshgin.
"We are excited about the synergy between MFLEX's core strength in flex circuits and assemblies and AT&S's core strength in HDI printed circuit board technology to bring HDI rigid-flex printed circuits to market. This cooperation is another important step in our strategy to become an industry leader for technology and innovation. To our customers, this alliance offers new opportunities in design and applications," said AT&S CEO, Andreas Gerstenmayer.
The resulting alliance will enable the parties to offer best-in-class high density interconnect (HDI) rigid-flex printed circuits for electronic devices and positions both companies to tap new opportunities in additional applications beyond their current offerings.
Rigid-flex circuits are hybrid constructions consisting of rigid and flexible substrate sections that are laminated together into a single structure. HDI rigid-flex printed circuits integrate HDI PCB technology used for high density components with three dimensional flex circuits packaging solutions, eliminating connectors and thereby saving space and weight.
Both companies will continue to pursue increasing market opportunities in their core business, while providing this sophisticated solution as an addition to their product offerings. The alliance allows OEM's to fully utilize MFLEX and AT&S's expertise in complex flexible circuits and HDI rigid printed circuit board technology, respectively, to create technology demanding solutions for HDI rigid-flex printed circuits.
"As global technology leaders, AT&S and MFLEX are leveraging the strengths of each company to jointly manufacture best-in-class HDI rigid-flex printed circuits with assembly capabilities to meet the market needs for complex interconnect solutions. Having commenced initial production of HDI rigid-flex printed circuits, we are excited by the new business prospects this alliance opens to both companies as we expand into new applications with advanced technology products to serve both existing and new customers," said MFLEX CEO, Reza Meshgin.
"We are excited about the synergy between MFLEX's core strength in flex circuits and assemblies and AT&S's core strength in HDI printed circuit board technology to bring HDI rigid-flex printed circuits to market. This cooperation is another important step in our strategy to become an industry leader for technology and innovation. To our customers, this alliance offers new opportunities in design and applications," said AT&S CEO, Andreas Gerstenmayer.
UPS will provide key element in green IT efforts
BOULDER, USA: Uninterruptible power supply (UPS) systems, which use a built-in energy storage source such as a battery, flywheel or other device to supply clean and sufficient power during grid power outages, have demonstrated their value in preventing undesirable downtime, data loss, or even catastrophic failures.
Traditionally, however, most of these systems were point solutions designed to protect an individual PC, server, medical device, airport or factory. Today, new technologies and architectures are emerging that can more effectively integrate UPS systems into the larger power infrastructure and take advantage of the large amount of energy storage already installed worldwide.
In particular, as green IT becomes an important goal for many IT vendors and users, UPS systems that can fit into and augment existing IT infrastructures to support the vendors’ overall green IT objectives will be in increasing demand.
According to a recent report from Pike Research, these trends, along with significant growth in emerging economies, will lead to strong growth for the UPS sector in the next few years. The global market for UPS systems will expand from $8.2 billion in 2011 to $9.4 billion in 2012, a year-on-year growth rate of 14 percent, the cleantech market intelligence firm forecasts. Going forward, the market will grow to $13.2 billion by 2015.
“UPS systems are already an important energy storage feature in cost-efficient and smart buildings,” says VP of Research, Bob Gohn. “The emergence of hybrid topologies that automatically switch between different power modes can reduce energy costs over time without compromising power quality.”
Next generation UPS systems will combine several key features, including a built-in energy storage source, such as batteries, flywheels or compressed air, and circuitry to supply clean and sufficient power over periods lasting from a few seconds to several hours. Most leading UPS systems also have some form of surge protection or power filtering circuitry. These advanced features enable these systems to play a larger role in the overall smart energy infrastructure, making them indispensable to a holistic energy management strategy.
Traditionally, however, most of these systems were point solutions designed to protect an individual PC, server, medical device, airport or factory. Today, new technologies and architectures are emerging that can more effectively integrate UPS systems into the larger power infrastructure and take advantage of the large amount of energy storage already installed worldwide.
In particular, as green IT becomes an important goal for many IT vendors and users, UPS systems that can fit into and augment existing IT infrastructures to support the vendors’ overall green IT objectives will be in increasing demand.
According to a recent report from Pike Research, these trends, along with significant growth in emerging economies, will lead to strong growth for the UPS sector in the next few years. The global market for UPS systems will expand from $8.2 billion in 2011 to $9.4 billion in 2012, a year-on-year growth rate of 14 percent, the cleantech market intelligence firm forecasts. Going forward, the market will grow to $13.2 billion by 2015.
“UPS systems are already an important energy storage feature in cost-efficient and smart buildings,” says VP of Research, Bob Gohn. “The emergence of hybrid topologies that automatically switch between different power modes can reduce energy costs over time without compromising power quality.”
Next generation UPS systems will combine several key features, including a built-in energy storage source, such as batteries, flywheels or compressed air, and circuitry to supply clean and sufficient power over periods lasting from a few seconds to several hours. Most leading UPS systems also have some form of surge protection or power filtering circuitry. These advanced features enable these systems to play a larger role in the overall smart energy infrastructure, making them indispensable to a holistic energy management strategy.
China industrial lasers market worth around RMB 11 billion in 2010
DUBLIN, IRELAND: Research and Markets has announced the addition of the "Assessment of China's Market for Industrial Lasers" report to its offering.
The domestic industrial lasers market in China is valued at approximately RMB 11 billion in revenues as of year-end 2010, according to a recently published GCiS study. This study focuses on domestic sales of three major types of lasers: solid state, gas and semiconductor. The market grew by approximately 25 percent in 2010.
Improvements in user-friendliness, a growth in applications and increases in downstream industries such as photovoltaic manufacturing are driving this growth. Solid state lasers are the most widely sold technology. This is due to the large quantities of lower spec lasers that domestic suppliers are producing. Gas lasers are also prominently produced, with CO2 lasers making up the bulk of this supply.
But downstream overcapacity threatens to inhibit this growth. Lasers are beneficial in reducing batch downtimes. But where factories are 20-30 percent underutilized, there don't have the time and space constraints that justify spending the hundreds of thousands of RMB that a laser costs. Customers in China are also put off by these high price tags, especially as lasers have to compete against ultra cheap substitutes such as welding.
Nevertheless, lasers are helping local manufacturers by introducing higher quality and precision into value chain. One supplier interviewed by GCiS claimed that we are entering a golden age for industrial lasers in China.
The domestic industrial lasers market in China is valued at approximately RMB 11 billion in revenues as of year-end 2010, according to a recently published GCiS study. This study focuses on domestic sales of three major types of lasers: solid state, gas and semiconductor. The market grew by approximately 25 percent in 2010.
Improvements in user-friendliness, a growth in applications and increases in downstream industries such as photovoltaic manufacturing are driving this growth. Solid state lasers are the most widely sold technology. This is due to the large quantities of lower spec lasers that domestic suppliers are producing. Gas lasers are also prominently produced, with CO2 lasers making up the bulk of this supply.
But downstream overcapacity threatens to inhibit this growth. Lasers are beneficial in reducing batch downtimes. But where factories are 20-30 percent underutilized, there don't have the time and space constraints that justify spending the hundreds of thousands of RMB that a laser costs. Customers in China are also put off by these high price tags, especially as lasers have to compete against ultra cheap substitutes such as welding.
Nevertheless, lasers are helping local manufacturers by introducing higher quality and precision into value chain. One supplier interviewed by GCiS claimed that we are entering a golden age for industrial lasers in China.
Delta intros world’s lightest 1000lm LED bulb at only 130g
Lighting Japan 2012, TAIPEI, TAIWAN: Delta Electronics is introducing the world's lightest 1000lm light bulb at Lighting Japan 2012 — the new omni-directional LED bulb weighs only 130g. Delta is also exhibiting LED lighting products with new high-lumen and dimming technologies, as well as the group’s system integration capabilities in renewable energy, energy-saving and high-quality products. In addition, Delta is demonstrating new tube solutions for railway train stations and indoor applications for the Japanese market.
"We are putting Delta’s mission “To provide innovative, clean and energy-efficient solutions for a better tomorrow” into practice with our advanced LED lighting collection. With the addition of the 1000lm-bulb, we have not only expanded our product range but have also upgraded its features and technology depth," said Roland Chiang, Director of the Solid-state Lighting Business Unit, Delta Electronics.
"LightingJapan also offers us a great chance to demonstrate the capabilities of Delta as a group to evolve from a product provider to a system integration provider. Combining our in-house energy-saving, safe and reliable products, we have different teams within the company cooperating comprehensively to offer a total solution package that includes a user-friendly interface that ensures products and expertise perform to their maximum."
With a beam angle of 120° and 240° the new bulb aims to replace 100W and 80W incandescent bulbs. Delta’s renowned thermal expertise has succeeded in developing this remarkable product and technology. For the market, the new bulb’s light weight accompanies improved product performance and longer product life which also means higher energy-savings and lower greenhouse gas emissions.
Delta is also demonstrating its remarkable solar-LED streetlight and wind-powered LED streetlight solutions at the exhibition. The wind-powered LED streetlight solution includes a 400W-system with a safety breaker for wind speed exceeding an upper limit of 42.5m/s and a programmable controller.
Delta has transformed from a component provider to a solutions provider to ease the problems customers have in parceling out requirements to different suppliers and solving compatibility issues. Solutions include products, customized design to meet the application environment, as well as service and maintenance. The wind turbine generates 400W at a wind speed of 11m/s and may power up to 1300W to light up an LED streetlight of 6000lm. The entire system conforms to IP65 standards and may be dual-powered by both wind and the city power grid. You can now see several projects applying Delta’s solar-streetlight and wind-power streetlight in operation worldwide.
The solar-LED streetlight solution includes a solar panel to power a 5500lm LED streetlight that has an analog programmable dimming function. A 150W solar power input can support such a system of 90lm/W for three days autonomously. Similar to the wind-powered LED streetlight solution, this system may be dual-powered by both solar panel and the city power grid.
"We are putting Delta’s mission “To provide innovative, clean and energy-efficient solutions for a better tomorrow” into practice with our advanced LED lighting collection. With the addition of the 1000lm-bulb, we have not only expanded our product range but have also upgraded its features and technology depth," said Roland Chiang, Director of the Solid-state Lighting Business Unit, Delta Electronics.
"LightingJapan also offers us a great chance to demonstrate the capabilities of Delta as a group to evolve from a product provider to a system integration provider. Combining our in-house energy-saving, safe and reliable products, we have different teams within the company cooperating comprehensively to offer a total solution package that includes a user-friendly interface that ensures products and expertise perform to their maximum."
With a beam angle of 120° and 240° the new bulb aims to replace 100W and 80W incandescent bulbs. Delta’s renowned thermal expertise has succeeded in developing this remarkable product and technology. For the market, the new bulb’s light weight accompanies improved product performance and longer product life which also means higher energy-savings and lower greenhouse gas emissions.
Delta is also demonstrating its remarkable solar-LED streetlight and wind-powered LED streetlight solutions at the exhibition. The wind-powered LED streetlight solution includes a 400W-system with a safety breaker for wind speed exceeding an upper limit of 42.5m/s and a programmable controller.
Delta has transformed from a component provider to a solutions provider to ease the problems customers have in parceling out requirements to different suppliers and solving compatibility issues. Solutions include products, customized design to meet the application environment, as well as service and maintenance. The wind turbine generates 400W at a wind speed of 11m/s and may power up to 1300W to light up an LED streetlight of 6000lm. The entire system conforms to IP65 standards and may be dual-powered by both wind and the city power grid. You can now see several projects applying Delta’s solar-streetlight and wind-power streetlight in operation worldwide.
The solar-LED streetlight solution includes a solar panel to power a 5500lm LED streetlight that has an analog programmable dimming function. A 150W solar power input can support such a system of 90lm/W for three days autonomously. Similar to the wind-powered LED streetlight solution, this system may be dual-powered by both solar panel and the city power grid.
OLED display technology moving to compete in TV market
SANTA CLARA, USA: According to the recently-released NPD DisplaySearch OLED Technology Report, organic light emitting diodes (OLED) technology advanced rapidly in 2011, a trend that NPD DisplaySearch forecasts will continue through this decade. OLED technology has progressed in areas including organic materials, color patterning, electronic driving methods, and encapsulation.
However, the ability to scale OLED display manufacturing to fabs larger than the current Gen 5.5 has yet to be demonstrated, and the cost of larger panels is not yet clear.
OLED emerged in the 1980s from laboratories at Eastman Kodak in the US and Cambridge University in the UK, and was first commercialized in the late 1990s. Enthusiasm has increased recently as Samsung Mobile Displays has started manufacturing active matrix OLED (AMOLED) displays in a Gen 5.5 fab and announced plans to build a Gen 8 fab (as did LG Display), and several other suppliers entered or re-entered OLED display manufacturing, including AUO, CMI, IRICO, Tianma, and BOE.
The NPD DisplaySearch OLED Technology Report details how OLEDs offer a solid-state solution for displays, lighting, and organic electronics. OLED displays can provide high contrast ratio, fast response time, wide color gamut, and wide viewing angle, while operating in a broad temperature range at low power consumption. In addition, OLED technology enables thin devices that can be both flexible and transparent.
OLED display revenues are estimated to exceed $4 billion in 2011 (approximately 4 percent of flat panel display revenues), and are forecast to reach more than $20 billion (approximately 16 percent of the total display industry by 2018. In addition, OLED lighting gained momentum in 2011, and is forecast to reach revenues of approximately $6 billion by 2018.
“OLED displays operate through direct emission, as opposed to transmissive LCD or reflective displays, which enables area lighting,” said Jennifer Colegrove, VP of Emerging Display Technologies for NPD DisplaySearch. “The technology has made good progress and is ready to enter large-size applications, but low cost manufacturing for large sizes is still a challenge.”
OLED is now a mass-market technology in small/medium displays, particularly in smart phone applications. Investments in Gen 8 (2200 × 2500 mm) fabs indicate that AMOLED will compete in larger size applications, such as in TV and mobile PCs, within two years. Samsung released a 7.7” AMOLED tablet PC in December 2011, and more tablet and other mobile PCs are expected in 2012. LG is expected to enter the market in 2012 with a 55” AMOLED TV. With technology improvements, NPD DisplaySearch forecasts AMOLED will enter other applications as well.
While nearly all AMOLEDs on the market are currently based on LTPS, several companies are developing AMOLEDs using oxide or a-Si TFT backplanes, and are likely to start production in 2012.
Table 1: Comparison of LTPS, a-Si, and Oxide TFT for AMOLED
Source: NPD DisplaySearch OLED Technology Report, USA.
The NPD DisplaySearch OLED Technology Report includes some other key findings:
* Organic materials of all types have efficacies ranging from less than 10 to nearly 100 cd/A. Large increases in efficiency have been obtained with phosphorescent materials, especially in red and green.
* Nearly all AMOLED displays are made using thermal evaporation through a fine metal mask (FMM) for color patterning. However, this method has low material utilization and is limited to small substrate sizes. Manufacturing processes with higher material utilization and better uniformity, such as linear and area sources, are likely to be adopted.
* Other color patterning methods, such as white with color filter and solution-processed materials, are also evolving and ready to be adopted for mass production in larger generation fabs.
However, the ability to scale OLED display manufacturing to fabs larger than the current Gen 5.5 has yet to be demonstrated, and the cost of larger panels is not yet clear.
OLED emerged in the 1980s from laboratories at Eastman Kodak in the US and Cambridge University in the UK, and was first commercialized in the late 1990s. Enthusiasm has increased recently as Samsung Mobile Displays has started manufacturing active matrix OLED (AMOLED) displays in a Gen 5.5 fab and announced plans to build a Gen 8 fab (as did LG Display), and several other suppliers entered or re-entered OLED display manufacturing, including AUO, CMI, IRICO, Tianma, and BOE.
The NPD DisplaySearch OLED Technology Report details how OLEDs offer a solid-state solution for displays, lighting, and organic electronics. OLED displays can provide high contrast ratio, fast response time, wide color gamut, and wide viewing angle, while operating in a broad temperature range at low power consumption. In addition, OLED technology enables thin devices that can be both flexible and transparent.
OLED display revenues are estimated to exceed $4 billion in 2011 (approximately 4 percent of flat panel display revenues), and are forecast to reach more than $20 billion (approximately 16 percent of the total display industry by 2018. In addition, OLED lighting gained momentum in 2011, and is forecast to reach revenues of approximately $6 billion by 2018.
“OLED displays operate through direct emission, as opposed to transmissive LCD or reflective displays, which enables area lighting,” said Jennifer Colegrove, VP of Emerging Display Technologies for NPD DisplaySearch. “The technology has made good progress and is ready to enter large-size applications, but low cost manufacturing for large sizes is still a challenge.”
OLED is now a mass-market technology in small/medium displays, particularly in smart phone applications. Investments in Gen 8 (2200 × 2500 mm) fabs indicate that AMOLED will compete in larger size applications, such as in TV and mobile PCs, within two years. Samsung released a 7.7” AMOLED tablet PC in December 2011, and more tablet and other mobile PCs are expected in 2012. LG is expected to enter the market in 2012 with a 55” AMOLED TV. With technology improvements, NPD DisplaySearch forecasts AMOLED will enter other applications as well.
While nearly all AMOLEDs on the market are currently based on LTPS, several companies are developing AMOLEDs using oxide or a-Si TFT backplanes, and are likely to start production in 2012.
Table 1: Comparison of LTPS, a-Si, and Oxide TFT for AMOLED
Source: NPD DisplaySearch OLED Technology Report, USA.The NPD DisplaySearch OLED Technology Report includes some other key findings:
* Organic materials of all types have efficacies ranging from less than 10 to nearly 100 cd/A. Large increases in efficiency have been obtained with phosphorescent materials, especially in red and green.
* Nearly all AMOLED displays are made using thermal evaporation through a fine metal mask (FMM) for color patterning. However, this method has low material utilization and is limited to small substrate sizes. Manufacturing processes with higher material utilization and better uniformity, such as linear and area sources, are likely to be adopted.
* Other color patterning methods, such as white with color filter and solution-processed materials, are also evolving and ready to be adopted for mass production in larger generation fabs.
AMOLED display revenue to surge 169 percent Y/Y in 2011 from smart phone adoption
SANTA CLARA, USA: The year 2011 was pivotal for OLED (organic light-emitting diode) displays, particularly AMOLED (active matrix OLED) displays. With strong growth in smart phones, AMOLED shipments are estimated to have reached 90 million units in 2011, up 97 percent Y/Y, while revenue is expected to grow to $3.36 billion, up 169 percent Y/Y, according to the latest NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report.
As it competes with TFT LCDs, AMOLED penetration into the small/medium (9”and smaller) display market has been increasing. In 2010, AMOLEDs had a 6 percent share of small/medium active matrix flat panel displays (TFT LCD and AMOLED), and is expected to double its share to 12 percent in 2011.
The growth of AMOLED in the small/medium segment is dominated by smart phones. Revenues for the smart phone segment more than doubled in 2011, with increasing shipments and higher ASPs due to larger screen sizes and increased display performance.
Source: NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report, USA.
The success of AMOLED can particularly be seen in larger smart phone displays. In the first three quarters of 2011, shipments of AMOLED displays 3.5” and larger for smart phones reached 59.7 million units, up three-fold from the same period in 2010.
“Samsung Mobile Displays has been a key driver of the growth of AMOLEDs, with the company accounting for 97.5 percent of all AMOLED shipments,” notes Hiroshi Hayase, NPD DisplaySearch’s VP of Small/Medium Display Research. “Looking to capitalize on the growing market demand, LG Display, AUO, and CMI also are planning to ship AMOLEDs for smart phones in 2012.”
Samsung’s Galaxy line of smart phones has been the leading adopter of AMOLED displays with high contrast and motion picture response time, while Apple’s iPhone uses a high resolution TFT LCD with IPS technology. The competition between the iPhone and Galaxy has brought increased attention to the AMOLED displays, currently produced only by Samsung Mobile Display.
The NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report includes many other key findings:
* With the successful mass-production of AMOLEDs and a new Gen 5.5 fab running, Samsung Mobile Display is producing larger AMOLED displays for applications such as Samsung’s Galaxy Note and Tab tablet PCs, as well as supplying outside customers.
* AMOLEDs are also penetrating new market segments such as Sony’s PS-Vita portable game, which features a 5” AMOLED; LG Display is shipping AMOLEDs to LG Electronics for external mobile phone displays.
* In addition, LG Electronics announced plans to produce a 55” AMOLED TV in 2012.
As it competes with TFT LCDs, AMOLED penetration into the small/medium (9”and smaller) display market has been increasing. In 2010, AMOLEDs had a 6 percent share of small/medium active matrix flat panel displays (TFT LCD and AMOLED), and is expected to double its share to 12 percent in 2011.
The growth of AMOLED in the small/medium segment is dominated by smart phones. Revenues for the smart phone segment more than doubled in 2011, with increasing shipments and higher ASPs due to larger screen sizes and increased display performance.
Source: NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report, USA.The success of AMOLED can particularly be seen in larger smart phone displays. In the first three quarters of 2011, shipments of AMOLED displays 3.5” and larger for smart phones reached 59.7 million units, up three-fold from the same period in 2010.
“Samsung Mobile Displays has been a key driver of the growth of AMOLEDs, with the company accounting for 97.5 percent of all AMOLED shipments,” notes Hiroshi Hayase, NPD DisplaySearch’s VP of Small/Medium Display Research. “Looking to capitalize on the growing market demand, LG Display, AUO, and CMI also are planning to ship AMOLEDs for smart phones in 2012.”
Samsung’s Galaxy line of smart phones has been the leading adopter of AMOLED displays with high contrast and motion picture response time, while Apple’s iPhone uses a high resolution TFT LCD with IPS technology. The competition between the iPhone and Galaxy has brought increased attention to the AMOLED displays, currently produced only by Samsung Mobile Display.
The NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report includes many other key findings:
* With the successful mass-production of AMOLEDs and a new Gen 5.5 fab running, Samsung Mobile Display is producing larger AMOLED displays for applications such as Samsung’s Galaxy Note and Tab tablet PCs, as well as supplying outside customers.
* AMOLEDs are also penetrating new market segments such as Sony’s PS-Vita portable game, which features a 5” AMOLED; LG Display is shipping AMOLEDs to LG Electronics for external mobile phone displays.
* In addition, LG Electronics announced plans to produce a 55” AMOLED TV in 2012.
Murata intros type VK module to drive easy addition of Wi-Fi connectivity on MCU-based devices
PLANO, USA: Murata has announced the Type VK module: a self-contained 802.11 Wi-Fi module designed to enable connectivity features on low-cost, microcontroller-based devices. This module is part of a broad-market initiative that provides the latest wireless technology to the mass market, and enables new applications in smart energy, fitness, home, industrial automation, and M2M products.
The Type VK module is a highly integrated subsystem containing the new SimpleLink Wi-Fi CC3000 solution, announced today by Texas Instruments Inc. (TI). The SimpleLink Wi-Fi CC3000 is an easy-to-implement, self-contained 802.11 network processor, aimed at enabling the simple and quick addition of Internet connectivity to any embedded application. TI’s unique architecture allows the Wi-Fi driver and firmware to reside within the module memory, alleviating the need for extensive software effort or a high-level operating system.
With the SimpleLink Wi-Fi CC3000 solution inside, the Type VK module includes peripheral items, including clock sources, power management, signal conditioning, persistent memory, and the RF front-end. It also provides RF compliance in the United States, Canada and Europe (FCC, IC and ETSI), giving customers confidence in knowing that risks are mitigated for the regulatory phase of design implementation.
Moreover, the Type VK module’s feature set speeds time to market since downstream steps are completed upstream into the module. This back-end work, complimented by a full set of tools and support, greatly simplifies the process for customers to integrate Wi-Fi capabilities into new and existing applications without the need for deep technical expertise in embedded software, RF or regulatory engineering.
“The new Type VK Murata module containing TI’s SimpleLink Wi-Fi CC3000 solution allows our customers to enable IP connectivity on microprocessor-based designs in a very cost-effective way by maximizing module integration and reducing customer design cycles from months to just weeks. It also provides the opportunity to add Internet connectivity to the broad range of Murata’s sensor products, spurring many new use cases for wireless sensing applications,” said Mehul Udani, GM of Murata Wireless Solutions group.
“We are excited to work with Murata – a world leader in wireless modules and sensors – to release a complete RF-certified module based on TI’s SimpleLink Wi-Fi CC3000 solution. Together, TI and Murata can enable the simple and low-cost addition of Internet connectivity to a wide range of products based on microcontrollers, ASICs and DSPs. This SimpleLink module from Murata is well positioned to help lead the charge in expanding the Internet of Things,” said Eran Sandhaus, GM of TI’s emerging connectivity solutions business unit.
The Type VK module is a highly integrated subsystem containing the new SimpleLink Wi-Fi CC3000 solution, announced today by Texas Instruments Inc. (TI). The SimpleLink Wi-Fi CC3000 is an easy-to-implement, self-contained 802.11 network processor, aimed at enabling the simple and quick addition of Internet connectivity to any embedded application. TI’s unique architecture allows the Wi-Fi driver and firmware to reside within the module memory, alleviating the need for extensive software effort or a high-level operating system.
With the SimpleLink Wi-Fi CC3000 solution inside, the Type VK module includes peripheral items, including clock sources, power management, signal conditioning, persistent memory, and the RF front-end. It also provides RF compliance in the United States, Canada and Europe (FCC, IC and ETSI), giving customers confidence in knowing that risks are mitigated for the regulatory phase of design implementation.
Moreover, the Type VK module’s feature set speeds time to market since downstream steps are completed upstream into the module. This back-end work, complimented by a full set of tools and support, greatly simplifies the process for customers to integrate Wi-Fi capabilities into new and existing applications without the need for deep technical expertise in embedded software, RF or regulatory engineering.
“The new Type VK Murata module containing TI’s SimpleLink Wi-Fi CC3000 solution allows our customers to enable IP connectivity on microprocessor-based designs in a very cost-effective way by maximizing module integration and reducing customer design cycles from months to just weeks. It also provides the opportunity to add Internet connectivity to the broad range of Murata’s sensor products, spurring many new use cases for wireless sensing applications,” said Mehul Udani, GM of Murata Wireless Solutions group.
“We are excited to work with Murata – a world leader in wireless modules and sensors – to release a complete RF-certified module based on TI’s SimpleLink Wi-Fi CC3000 solution. Together, TI and Murata can enable the simple and low-cost addition of Internet connectivity to a wide range of products based on microcontrollers, ASICs and DSPs. This SimpleLink module from Murata is well positioned to help lead the charge in expanding the Internet of Things,” said Eran Sandhaus, GM of TI’s emerging connectivity solutions business unit.
Wednesday, January 18, 2012
2011 packaged GaN LED revenues to decline 6 percent to $8 billion on weakness in backlighting
ENGLAND, UK: After 60 percent growth in 2010, the gallium nitride (GaN) LED market is now expected to fall 6 percent in 2011 to $8 billion as shown in the figure and reported in IMS Research’s latest Quarterly GaN LED Supply/Demand Report which tracks and forecasts all aspects of the LED market quarterly.
The decline can be attributed to:
* A widening surplus resulting in significant pricing pressure as supply grew nearly 3X faster than demand from 2010 to 2011, resulting in depressed LED factory utilization levels. As quantified in this report, the LED surplus rose from a relatively healthy 7 percent in 2010 to 45 percent in 2011, and is predicted to widen further in 2012.
* With both panel shipments and LED penetration below expectations and average LED prices for backlighting declining 34 percent on a volume weighted average basis on depressed utilization, backlighting revenues fell 13 percent to $4.8 billion. ASPs for certain backlighting markets were down as much as 45 percent in 2011. As a result, backlighting fell from 64 percent of 2010 GaN LED revenues to 59 percent of 2011 GaN LED revenues and are likely to continue falling on a percentage basis in the future as backlight markets become saturated and the lighting market accelerates.
* LED revenues for TVs are expected to fall 5 percent in 2011 to $1.9 billion as the penetration is only expected to reach 39 percent, down from the previous estimate of 43 percent.
However, the GaN LED market is expected to recover, enjoying annual growth each year from 2012 to 2015 including double-digit growth in 2013 and 2014 as the lighting market accelerates. Highlights include:
* The 2012 market is expected to grow 5 percent, but still remain below 2010 levels.
* Backlighting is expected to be flat on slower unit growth and price reductions, while lighting is expected to be up 30% as LED lamp penetration jumps as prices continue to fall.
* Lighting revenues are expected to overtake TV revenues for GaN LEDs in 2012, a year earlier than previously predicted. This is a result of increasing LED lighting demand on lower pricing while reducing the LED outlook in TVs on lower penetration than previously predicted along with the use of low cost direct LED backlights in developing markets.
* The low cost direct LED backlights use around ½ the LED die area as conventional edge backlights due to significantly reducing the brightness specification along with adopting a thicker form factor that allows wide viewing angle packages to be adopted which further reduces the number of LEDs required. While the adoption of these new low cost direct-type backlights will narrow the cost differential with CCFL LCD TVs, the thicker form factor and reduced brightness capability will narrow their appeal.
* The lighting share of the GaN LED market is expected to surge from 21 percent in 2011 to 49 percent in 2016 with lighting LED revenues expected to grow >300 percent and units expected to grow >1500 percent over this period.
Source: IMS Research, UK.
The decline can be attributed to:
* A widening surplus resulting in significant pricing pressure as supply grew nearly 3X faster than demand from 2010 to 2011, resulting in depressed LED factory utilization levels. As quantified in this report, the LED surplus rose from a relatively healthy 7 percent in 2010 to 45 percent in 2011, and is predicted to widen further in 2012.
* With both panel shipments and LED penetration below expectations and average LED prices for backlighting declining 34 percent on a volume weighted average basis on depressed utilization, backlighting revenues fell 13 percent to $4.8 billion. ASPs for certain backlighting markets were down as much as 45 percent in 2011. As a result, backlighting fell from 64 percent of 2010 GaN LED revenues to 59 percent of 2011 GaN LED revenues and are likely to continue falling on a percentage basis in the future as backlight markets become saturated and the lighting market accelerates.
* LED revenues for TVs are expected to fall 5 percent in 2011 to $1.9 billion as the penetration is only expected to reach 39 percent, down from the previous estimate of 43 percent.
However, the GaN LED market is expected to recover, enjoying annual growth each year from 2012 to 2015 including double-digit growth in 2013 and 2014 as the lighting market accelerates. Highlights include:
* The 2012 market is expected to grow 5 percent, but still remain below 2010 levels.
* Backlighting is expected to be flat on slower unit growth and price reductions, while lighting is expected to be up 30% as LED lamp penetration jumps as prices continue to fall.
* Lighting revenues are expected to overtake TV revenues for GaN LEDs in 2012, a year earlier than previously predicted. This is a result of increasing LED lighting demand on lower pricing while reducing the LED outlook in TVs on lower penetration than previously predicted along with the use of low cost direct LED backlights in developing markets.
* The low cost direct LED backlights use around ½ the LED die area as conventional edge backlights due to significantly reducing the brightness specification along with adopting a thicker form factor that allows wide viewing angle packages to be adopted which further reduces the number of LEDs required. While the adoption of these new low cost direct-type backlights will narrow the cost differential with CCFL LCD TVs, the thicker form factor and reduced brightness capability will narrow their appeal.
* The lighting share of the GaN LED market is expected to surge from 21 percent in 2011 to 49 percent in 2016 with lighting LED revenues expected to grow >300 percent and units expected to grow >1500 percent over this period.
Source: IMS Research, UK.
Oclaro to showcase industry-leading high power laser diodes
Photonics West, SAN JOSE, USA: Oclaro Inc., a tier-one provider and innovator of optical communications and laser solutions, will be showcasing its latest innovations in high-power laser diodes at the Photonics West show on January 24-26 in San Francisco.
As the volume shipment leader in high power laser diodes and VCSELs, Oclaro offers one of the industry's broadest portfolios of flexible, customizable and cost-effective solutions for a wide range of markets such as medical, consumer, materials processing and industrial. This product leadership combined with Oclaro's economies of scale and expertise has enabled the company to continually deliver competitive cost savings, reliability, operational efficiencies and manufacturing excellence.
"Oclaro's proven ability to raise the bar on brightness and wavelength performance in our laser diode solutions is a critical component in helping our customers succeed in the market," said Yves LeMaitre, chief commercial officer at Oclaro. "This continued innovation alongside our global strengths in sales, R&D and manufacturing is what sets Oclaro apart from the competition and enables us to form powerful partnerships with our customers who need a full-service supplier with a comprehensive portfolio of product offerings."
Oclaro innovations on display at Photonics West
Following are a few of the innovations that Oclaro will be showcasing at the show:
* Several key technology advancements that have enabled Oclaro to deliver the broadest range of high-power, high-brightness diodes for direct diode laser systems ranging from 910nm to 1070nm.
* Sampling of a higher performing VCSEL (Vertical-Cavity Surface-Emitting Laser) and plans to continue raising the bar on performance.
* Oclaro innovations in laser diode solutions for the aesthetics and medical markets where lasers are increasingly being adopted to deliver innovative and new pain-free capabilities. Many of these applications are becoming possible because Oclaro lasers have reached the price/performance targets that enable their use in these high-volume areas.
* Increased investment in Oclaro's world-class manufacturing operations to ramp volume production of multiple single emitter fiber laser pump platforms to meet customer demands for high brightness, reliability, power conversion efficiency and cost effectiveness.
* Expanded Oclaro Orion and Prosario fiber coupled laser portfolios that deliver the highest power, reliability, brightness, power conversion efficiency, compact footprint and leading price/performance.
As the volume shipment leader in high power laser diodes and VCSELs, Oclaro offers one of the industry's broadest portfolios of flexible, customizable and cost-effective solutions for a wide range of markets such as medical, consumer, materials processing and industrial. This product leadership combined with Oclaro's economies of scale and expertise has enabled the company to continually deliver competitive cost savings, reliability, operational efficiencies and manufacturing excellence.
"Oclaro's proven ability to raise the bar on brightness and wavelength performance in our laser diode solutions is a critical component in helping our customers succeed in the market," said Yves LeMaitre, chief commercial officer at Oclaro. "This continued innovation alongside our global strengths in sales, R&D and manufacturing is what sets Oclaro apart from the competition and enables us to form powerful partnerships with our customers who need a full-service supplier with a comprehensive portfolio of product offerings."
Oclaro innovations on display at Photonics West
Following are a few of the innovations that Oclaro will be showcasing at the show:
* Several key technology advancements that have enabled Oclaro to deliver the broadest range of high-power, high-brightness diodes for direct diode laser systems ranging from 910nm to 1070nm.
* Sampling of a higher performing VCSEL (Vertical-Cavity Surface-Emitting Laser) and plans to continue raising the bar on performance.
* Oclaro innovations in laser diode solutions for the aesthetics and medical markets where lasers are increasingly being adopted to deliver innovative and new pain-free capabilities. Many of these applications are becoming possible because Oclaro lasers have reached the price/performance targets that enable their use in these high-volume areas.
* Increased investment in Oclaro's world-class manufacturing operations to ramp volume production of multiple single emitter fiber laser pump platforms to meet customer demands for high brightness, reliability, power conversion efficiency and cost effectiveness.
* Expanded Oclaro Orion and Prosario fiber coupled laser portfolios that deliver the highest power, reliability, brightness, power conversion efficiency, compact footprint and leading price/performance.
Avago enables thinner digital cameras with small-footprint auto-focus auxiliary flash LEDs
SAN JOSE, USA & SINGAPORE: Avago Technologies announced two series of compact LEDs that reduce space requirements for designing auto-focus auxiliary flash functionality into digital cameras. The new ASMT-FJ70 and ASMT-FG70 devices are available in one of the market’s thinnest, smallest-footprint packages for LEDs with the brightness needed for auto-focus functionality in dark settings.
The ASMT-Fx70 LEDs are available in a tiny, environmentally-friendly 3.6 (L) by 3.2 (W) by 3.4 (H) mm surface-mount package that helps meet market demand for thinner digital cameras. The LEDs use a clear, non-diffused lens to provide high luminous intensity within a narrow radiation pattern, providing smooth, consistent optical performance for precise auto-focus functionality. The ASMT-FJ70 devices are orange and the ASMT-FG70 devices are the industry’s first green auxiliary flash LEDs in this size range.
“Digital cameras continue to shrink in size while growing in functionality and capacity, and our new auxiliary flash LEDs address this challenge by allowing designers to pack in greater functionality per square inch of the camera,” said Francis Khor, director of marketing for the optoelectronics products at Avago. “The Avago ASMT-Fx70 LEDs provide the best of both worlds, as they offer a small design footprint without sacrificing auto-flash performance.”
The ASMT-FJ70 devices use Aluminum Indium Gallium Phosphate (AlInGaP) material technology and feature a 12 degree viewing angle, while the ASMT-FG70 devices use Indium Gallium Nitride (InGaN) material technology and provide a 14 degree viewing angle. Both technologies have very high luminous efficiency, producing high light output over a wide range of drive currents. The narrow viewing angles deliver the long distance illumination and narrow beam pattern required for auto-focus auxiliary flash functionality.
The ASMT-Fx70 LEDs are available in a tiny, environmentally-friendly 3.6 (L) by 3.2 (W) by 3.4 (H) mm surface-mount package that helps meet market demand for thinner digital cameras. The LEDs use a clear, non-diffused lens to provide high luminous intensity within a narrow radiation pattern, providing smooth, consistent optical performance for precise auto-focus functionality. The ASMT-FJ70 devices are orange and the ASMT-FG70 devices are the industry’s first green auxiliary flash LEDs in this size range.
“Digital cameras continue to shrink in size while growing in functionality and capacity, and our new auxiliary flash LEDs address this challenge by allowing designers to pack in greater functionality per square inch of the camera,” said Francis Khor, director of marketing for the optoelectronics products at Avago. “The Avago ASMT-Fx70 LEDs provide the best of both worlds, as they offer a small design footprint without sacrificing auto-flash performance.”
The ASMT-FJ70 devices use Aluminum Indium Gallium Phosphate (AlInGaP) material technology and feature a 12 degree viewing angle, while the ASMT-FG70 devices use Indium Gallium Nitride (InGaN) material technology and provide a 14 degree viewing angle. Both technologies have very high luminous efficiency, producing high light output over a wide range of drive currents. The narrow viewing angles deliver the long distance illumination and narrow beam pattern required for auto-focus auxiliary flash functionality.
PCTEL Secure files three patents on mobile device and industrial wireless security
BLOOMINGDALE, USA: PCTEL Inc., a leader in antenna and scanning receiver solutions, announced that its joint venture, PCTEL Secure LLC, had filed three patent applications describing inventions that ensure the security of mobile devices and that also protect the integrity of industrial wireless networks.
These inventions relate to PCTEL Secure’s ProsettaCore and a behavioral approach to securing mobile devices and fixed networks. Rather than identifying and categorizing various threats and viruses, ProsettaCore establishes a set of policies that define acceptable behavior and then monitors devices for aberrations.
PCTEL Secure has focused its efforts on Android-based devices but the invention applies to a variety of systems, including industrial wireless or SCADA (Supervisory Control and Data Acquisition) networks.
The three patents are "Systems and Methods for Enhanced Security in Wireless Communication" (serial no. 13/323,340); "Systems and Methods for Providing a Computing Device having a Secure Operating System Kernel" (serial no. 13/315,531), and Enhanced Security SCADA Systems and Method (serial no. 13/350,599). Two of the patents were filed in 2011 under the USPTO’s new, expedited process and the third was filed on January 13, 2012.
Separately, PCTEL announced that it negotiated a mechanism to accelerate the acquisition of PCTEL Secure. Additionally, the amended agreement lowers the overall cost of the acquisition and eliminates the right of PCTEL’s joint venture partner to participate in the proceeds from a future sale of PCTEL Secure. Currently, PCTEL owns 51 percent of PCTEL Secure.
“We have growing confidence in our ability to deliver a meaningful security solution to certain vertical markets,” said Marty Singer, PCTEL’s chairman and CEO. “We are pleased with our progress in protecting our inventions and last year’s delivery of a prototype. Now, we are fully engaged in delivering a commercial product and in the expansion of our business development efforts.”
PCTEL launched its security initiatives in early 2011. During that period, the company - through its joint venture – signed a supply agreement with an Android smart phone manufacturer, delivered and implemented threats to highlight the vulnerability of smart phones to exploits and threats, and, most importantly, designed and developed a prototype of its ProsettaCore software. Both PCTEL and PCTEL Secure have demonstrated the ProsettaCore prototype to several customers.
These inventions relate to PCTEL Secure’s ProsettaCore and a behavioral approach to securing mobile devices and fixed networks. Rather than identifying and categorizing various threats and viruses, ProsettaCore establishes a set of policies that define acceptable behavior and then monitors devices for aberrations.
PCTEL Secure has focused its efforts on Android-based devices but the invention applies to a variety of systems, including industrial wireless or SCADA (Supervisory Control and Data Acquisition) networks.
The three patents are "Systems and Methods for Enhanced Security in Wireless Communication" (serial no. 13/323,340); "Systems and Methods for Providing a Computing Device having a Secure Operating System Kernel" (serial no. 13/315,531), and Enhanced Security SCADA Systems and Method (serial no. 13/350,599). Two of the patents were filed in 2011 under the USPTO’s new, expedited process and the third was filed on January 13, 2012.
Separately, PCTEL announced that it negotiated a mechanism to accelerate the acquisition of PCTEL Secure. Additionally, the amended agreement lowers the overall cost of the acquisition and eliminates the right of PCTEL’s joint venture partner to participate in the proceeds from a future sale of PCTEL Secure. Currently, PCTEL owns 51 percent of PCTEL Secure.
“We have growing confidence in our ability to deliver a meaningful security solution to certain vertical markets,” said Marty Singer, PCTEL’s chairman and CEO. “We are pleased with our progress in protecting our inventions and last year’s delivery of a prototype. Now, we are fully engaged in delivering a commercial product and in the expansion of our business development efforts.”
PCTEL launched its security initiatives in early 2011. During that period, the company - through its joint venture – signed a supply agreement with an Android smart phone manufacturer, delivered and implemented threats to highlight the vulnerability of smart phones to exploits and threats, and, most importantly, designed and developed a prototype of its ProsettaCore software. Both PCTEL and PCTEL Secure have demonstrated the ProsettaCore prototype to several customers.
Arrow Electronics acquires TechTurn
ENGLEWOOD, USA: Arrow Electronics Inc. has agreed to acquire TechTurn Ltd, a leading provider of electronics asset disposition (EAD) services that specializes in the processing and sale of technology devices that are returned or recycled from businesses and consumers.
TechTurn offers a comprehensive portfolio of services, including asset retirement, data wipe, asset test and diagnostics, data sanitation, and refurbishment and remarketing. With offices in Texas and Virginia, as well as partner facilities in Europe and Canada, TechTurn provides EAD services to Fortune 500 customers, original equipment manufacturers, and large retailers.
“We are very excited to have the TechTurn team join the Arrow family. This acquisition will strengthen our existing portfolio of services and is a continuation of our global strategy to expand into faster growing services that span the full lifecycle of technology and complement our core businesses,” said Paul J. Reilly, executive VP, finance and operations and CFO of Arrow Electronics.
TechTurn is headquartered in Austin, Texas, and has 135 employees. The company’s sales are expected to exceed $50 million in 2012. This acquisition is subject to the customary regulatory approval process and is expected to close in the next 45 days.
TechTurn offers a comprehensive portfolio of services, including asset retirement, data wipe, asset test and diagnostics, data sanitation, and refurbishment and remarketing. With offices in Texas and Virginia, as well as partner facilities in Europe and Canada, TechTurn provides EAD services to Fortune 500 customers, original equipment manufacturers, and large retailers.
“We are very excited to have the TechTurn team join the Arrow family. This acquisition will strengthen our existing portfolio of services and is a continuation of our global strategy to expand into faster growing services that span the full lifecycle of technology and complement our core businesses,” said Paul J. Reilly, executive VP, finance and operations and CFO of Arrow Electronics.
TechTurn is headquartered in Austin, Texas, and has 135 employees. The company’s sales are expected to exceed $50 million in 2012. This acquisition is subject to the customary regulatory approval process and is expected to close in the next 45 days.
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