Combining Molex connector solutions for future-proof end-to-end 25 Gbps channel interoperability

LISLE, USA: Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, Molex Incorporated offers a comprehensive portfolio of industry-leading end-to-end high-speed channel solutions for increased data rates with minimal crosstalk and maximum signal integrity in mobile telecom and data communications storage and networking applications.

“Today’s customers need faster and denser systems that will meet the demands of tomorrow’s bandwidth hungry users. They benefit from cost-effective future-proof solutions that can deliver high performance interoperability,” states Joe Dambach, global new product development manager, Molex. “Molex cables and connectors ensure that they can optimize the high-speed channel from end-to-end to achieve next-generation data rates.”

A typical channel for a high-speed network connection could start with zSFP+ (Small Form-factor Pluggable Plus) SMT I/O connectors receiving data (e.g., a signal) entering into the switch chassis. Enhanced zSFP+ 20-circuit connectors deliver superior performance in high-speed telecom and data communications equipment. Designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the scalable Molex zSFP+ interconnects provide optimal EMI and signal integrity. The signal could next route to a motherboard through a SEARAY† board-to-board mezzanine connector.

Traveling at data rates of up to 25Gbps, the signal could pass through the midplane and daughtercard via Impact Orthogonal and EdgeLine CoEdge connectors. Designed for a direct PCB connection, the Impact 100-Ohm orthogonal direct right-angle male connector and daughtercard system mitigates the performance constraints of backplane and midplane connections. The space-saving Impact technology supports high-speed 25 Gbps data rates and greatly reduces airflow restrictions, cross-talk, and capacitance constraints in high-speed channels. Impact connectors feature compliant-pin technology and the lowest mating force in the industry.

The EdgeLine CoEdge connector offers a low profile height interconnect solution that creates minimal wind resistance in an air-cooled chassis and an electrically optimized terminal to minimize noise for high speed transmissions in excess of 25Gbps. This scalable and cost-effective, one-piece EdgeLine connector allows designers to specify first-mate, last-break designations and shorter stubs for high-speed communications using a customizable card-edge interface.

As the signal exits the daughtercard, a zQSFP+ integrated cage and connector routes it through to a zQSFP+ breakout cable and into a router/switch. Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, the Molex zQSFP+ interconnect solution provides 28 Gbps data rates for up to 4km with excellent thermal cooling, signal integrity, EMI protection and the lowest optical power consumption in the industry.

Once at the router, a NeoScale 28 Gbps mezzanine connector could direct the signal to the motherboard and into the backplane to another Impact solution, so the signal is delivered quickly and cleanly. One of the highest performing mezzanine connections on the market, the recently launched Molex NeoScale mezzanine connector features a unique and patent pending triad design to group signals into electrically optimized structures.

The triad design not only offers a designer flexibility in mixing and matching different triad configurations based on the needs for high speed differential pairs, high speed single-ended transmission, low speed control links and power requirements, but it also optimizes the channel electrically, helping to provide a very clean signal channel.

The NeoScale connector’s PCB attach method comes in both Molex’s award winning Solder ChargeSMT attachment technology and the option for press-fit attach. The triads conform to a mirror image footprint to provide ease and flexibility of PCB routing in one or two PCB layers to minimize a designer’s PCB thickness, in turn decreasing PCB cost.