Molex experts showcase complete high-speed interconnect solution

DesignCon 2012, LISLE, USA: Molex Inc. will bring its proven expertise in high-speed, high-density interconnect technology to DesignCon 2012, Jan. 30 – Feb. 2, Santa Clara, CA. At the show, Molex experts will participate in several technical paper presentations that feature new interconnect design developments. Additionally, the team will showcase the company’s interconnect solutions by displaying a range of products and conducting several live demonstrations in booth 109.

Technical paper presentations

The sessions highlight specific Molex technical and application expertise:

EMC/EMI correlation study for 25+ Gbps systems
Wed., Feb. 1, 11:05–11:45 a.m.: Peerouz Amleshi, director of signal integrity engineering, Molex, will use a 3D simulation tool to predict EM emission. This study will be done in two phases: far field emission correlation between the model and test results for a fabricated antenna (emission source) and correlation between the model versus test results with the emitter enclosed in a metallic chassis.

De-embedding in high speed design
Mon., Jan., 30, 9:00a.m.–12:00p.m.: David Dunham, director of signal integrity engineering, Molex, will conduct a tutorial that reviews the math behind de-embedding. He will also demonstrate how some of the most common de-embedding functions such as probe tip de-embedding, gating and TRL de-embedding are performed.
System Performance as a Function of Common Mode Metrics

Tues., Jan. 31, 11:05-11:45a.m.: Michael Rowlands, senior electrical engineer, Molex, will focus on system performance as a function of common mode metrics. Using analysis, simulation and measurement, he will estimate the bottom line bit-error-rate of a channel and give a set of common mode performance data.

There will be a host of product demonstrations as well:
* EXTreme Ten60Power high-current and EXTreme LPHPower connectors;
* zQSFP+ and zSFP+;
* NeoScale 28 Gbps speeds;
* Impact backplane connector system.