DesignCon 2012, PHOENIX, USA: Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT), announced the Xilinx Kintex-7 FPGA DSP Development Kit with High-Speed Analog, supporting Xilinx’s 7 series Targeted Design Platforms.
As the demand for faster processing of wideband analog signals continues to rise, this digital signal processing (DSP) development kit offers engineers a proven platform to test, design and deliver a wide range of DSP enabled end products. The cost of this kit is $3,995. Order entry is open now and shipments will begin in mid-March. For more details visit the Xilinx Kintex-7 FPGA DSP Development Kit information page.
Designed in collaboration with Xilinx, Inc., the Xilinx Kintex-7 FPGA DSP Development Kit is comprised of two critical elements. The first is the Xilinx Kintex-7 FPGA KC705 base board. The KC705 features high-performance, serial connectivity and advanced memory interfacing, with the flexibility of the 28nm Kintex-7 field programmable gate array (FPGA) that delivers maximum power efficiency and up to 1200 GMACs of DSP processing bandwidth.
The second component of the Xilinx Kintex-7 FPGA DSP Development Kit is the 4DSP FMC 150, an integrated high-speed FPGA Mezzanine Card (FMC) that interfaces with signals from the outside world. Featuring dual-channel 800 MSPS 16-bit digital-to-analog converters (DACs) and dual-channel 250 MSPS 14-bit analog-to-digital converters (ADCs) from Texas Instruments (TI), the high-speed analog module delivers exceptional throughput when combined with the massively parallel processing bandwidth of the DSP48E1 arithmetic processing engines in the Kintex-7 FPGA.
Together, these components create a development kit that combines the performance of Xilinx’s 7 series FPGA with the high-speed data conversion of the FMC 150, enabling designers to focus on their application at the beginning of the design process. DSP designers will benefit from intuitive MathWorks tools for system modeling, simulation and auto-code generation. Target applications include wireless communications infrastructure, aerospace and defense, test and measurement, and medical imaging.
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