Dow Electronic Materials presents innovative materials for PCBs

IPC/APEX Expo, MARLBOROUGH, USA: Dow Electronic Materials will present its innovative materials for printed circuit boards (PCB) at the IPC APEX Expo (Booth # 419, Mandalay Bay Resort & Convention Center, Las Vegas, USA) on April 6-8.

The new generation of products are specifically designed to meet the challenges of increasingly complex circuit boards, and deliver higher reliability and consistency for telecom, military, aerospace and medical applications.

For PCB Electrolytic Plating, MICROFILLTM EVF Via Fill provides greatly enhanced via filling at exceptionally low surface thicknesses and is capable of simultaneous through-hole plating. It is suitable for both HDI (High Density Interconnect) and IC (Integrated Circuit) substrate applications. More information can be found at http://go.rohmhaas.com/microfill.

For PCB Making Holes Conductive, CIRCUPOSITTM 7800 Desmear for SAP (Semi-additive Process) delivers uniform and stable adhesion promotion treatment and reliable via bottom cleaning. It provides excellent plating coverage, high peeling strength and reliability.

For PCB Final Finish, RONAMERSETM SMT Hole Conditioner and CONDITIONER BP are two products aimed at solving industry wide background plating and tooling-hole plating issues. RONAMERSETM SMT Hole Conditioner poisons the catalytic effect of residual palladium inside tooling holes. CONDITIONER BP can effectively lift off residual palladium from the surface, thereby eliminating background plating. Both products can be easily integrated into the existing Electroless Nickel Immersion Gold (ENIG) process.

For PCB Imaging, LAMINARTM E9200 Dry Film photoresist is a multi-functional Alkali etch that works with nearly all PCB processes including ENIG and immersion silver. It is capable of 1-to-1 resolution and available in various thicknesses. The LAMINARTM UD900 Series photoresist is the latest offering for Laser Direct Imaging (LDI) applications. This series of photoresist delivers fast photo speed, superior adhesion and exceptional performance in plating applications.

New products to be commercialized include LITHOJETTM 210 Etch Resist. This is a revolutionary product enabling digital fabrication of PCB inner layers. The digital process enables simplified manufacturing process, faster turnaround time, improved yield and cost effective manufacturing of large number of small batch PCBs.

"Materials that deliver reliability, consistency and reduced cost for PCBs are keys to success for telecom, military, aerospace and medical applications,” said Bob Ferguson, global general manager for Dow Electronic Materials.

“As a leader in metallization technologies, Dow Electronic Materials is pleased to present the high-performance and cost effective materials for the PCB industry. With our leading technology, excellent customer service and global footprint, we are committed to deliver innovative technologies for the electronic market,” he said.