Tektronix intros logic protocol analyzer test solution for PCI Express 3.0

BANGALORE, INDIA: Tektronix Inc. has announced a comprehensive test solution for PCI Express 3.0, the next generation PCIe specification, spanning protocol to physical analysis in a single tool.

The new Tektronix TLA7SA16 and TLA7SA08 Logic Protocol Analyzer modules, bus support software, and probes combine to give PCIe 3.0 developers an exclusive time-correlated view of system behavior, starting with protocol analysis and working down to the physical layer to debug the root cause of elusive problems.

The Tektronix PCIe 3.0 test solution builds on Tektronix’ previous generation PCIe protocol and logic analysis offerings broadly adopted across the industry by silicon vendors, system designers and high-performance embedded engineers. It also expands on previously announced offerings for PCIe 3.0 electrical test and validation including Serial Data Link Analysis (SDLA) Software for the DPO/DSA/MSO70000 Series oscilloscopes.

The Tektronix Logic Protocol Analyzer delivers the best of both a protocol analyzer and a logic analyzer for PCIe design, test and debug. Protocol analyzer capabilities include flexible, integrated data views for analyzing and displaying protocol traffic flow correlated with physical layer events.

Logic analyzer capabilities include a wide range of probing options, sophisticated triggering and time-correlated waveform and disassembled listing data displays of raw symbols and lane data. The new PCIe solution expands the TLA7000 Series high-performance logic analyzer family and works with TLA7000 mainframes including TLA7012 portable and TLA7016 benchtop models.

“As PCI Express bus speeds and complexity increase, it’s important that the protocol and physical layer testing tools keep pace,” said Jim Pappas, director of initiative marketing for Intel. “With its Logic Protocol Analyzer, Tektronix is among those companies expanding the approach to protocol analysis with a logic analyzer that can help continue timely delivery of PCIe 3.0 silicon and systems to consumers.”