Molex intros LED printed circuit assemblies

LIGHTFAIR International 2010, LISLE, FRANCE: Molex Inc. announced the availability of its LED Printed Circuit Assemblies.

Combining Molex’s LED and Printed Circuit Assembly design and manufacturing expertise, these dependable and efficient custom-lighting solutions work seamlessly for LED subassemblies across several industries.

The LED Printed Circuit Assemblies, which will be displayed at LIGHTFAIR International, booth 1741, May 12-14 in Las Vegas, support rigid and flexible circuits used in packaging LED products.

Molex’s custom LED assemblies support backlighting applications with polyester circuits that support lower power consumption applications and heat sinked polyimide and rigid boards to support high power consumption applications such as surgical and automotive lighting.

Molex design and manufacturing teams utilize in-house design, test and manufacturing capabilities to provide an LED assembly solution. Molex also provides expertise in BIN control, which is key to ensuring the consistent lot-by-lot LED luminosity output ranges, critical in a quality LED lighting product.

Molex’s LED design, assembly and manufacturing expertise continues to directly address customer requirements for energy efficiency, productivity and ease of use. “Molex has specialized in designing and manufacturing complex LED and printed circuit assemblies for over 20 years,” said Julian Ladron de Guevara, associate product manager at Molex.

“The new LED Printed Circuit Assemblies are the next step in Molex’s continued pursuit to provide high-quality, efficient LED solutions to a rapidly expanding market. Our experience and manufacturing expertise will help us be a key player in an exciting time in the lighting industry.”