SAN JOSE, USA: Toshiba America Electronic Components Inc. (TAEC) has announced its newest 1.12-micron CMOS image sensor (CIS) for high-end mobile handsets and smartphones with 20-megapixel (MP) resolution.
With an optical size of 1/2.4 inch, the T4KA7 sensor enables development of camera modules with a z-height of 6mm or less to meet consumer demand for thinner, lighter mobile devices.
The new sensor joins Toshiba's recently announced 8MP and 13MP 1.12-micron back-side illuminated CIS solutions, which enable low-power, high-performance image capture and video recording for handheld mobile devices.
The T4KA7 employs high-speed circuit technology that delivers a frame rate of 22 frames per second (fps) at full-resolution image capture – an improvement of 83 percent compared to the company's previous 20MP sensor.
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