PHOENIX, USA: ON Semiconductor, a premier supplier of high performance, energy efficient silicon solutions for green electronics, has introduced the NCP508 – a low current voltage regulator that offers an efficient and economical solution to generating a low power voltage rail.
The new regulator provides a solution that supports low power, space efficient and cost-effective designs in applications such as touch screens, keypads, smart phones, portable meters, printers and remote controls.
The NCP508 can drive currents in excess of 50 mA and is housed in a compact SC-88A package with a footprint measuring 2.2 mm x 2.2 mm with an overall height of 1.10 mm. The new device offers high ripple rejection of 70 dB typical (at 1 kHz) that makes it an effective filter for voltage supplies.
Excellent noise performance of 40 µVrms (at 1.5 V) contributes to a very clean output voltage, and when disabled a current consumption of less than 1 µA helps to further extend battery life in portable equipment. Low voltage dropout performance of 140 mV at 30 mA load provides flexibility in designing auxiliary power rails.
A switch on time of less than 20 µs is significantly faster than most competing products and allows designers to maximize energy savings by powering down the device when the functionality it supports is not in use. The NCP508 can be used with low-cost ceramic capacitors, further enhancing its appeal as an economical voltage regulator solution.
The NCP508 has a maximum operating voltage of 7 V, though it can withstand high voltage transients of up to 13 V, thus saving cost by alleviating the need for external protection circuitry. Standard output voltage versions of 1.5 V, 1.8 V, 2.5 V, 2.8 V, and 3.3 V are offered with other voltage values available in 100 mV steps. Each device incorporates both current limit and over temperature protection circuits. The operating temperature range is -40 °C to +85 °C.
“These new voltage regulation solutions offer a cost-effective alternative to discrete components that also use more board space and consume more power,” said Mike Paquette, director of the Regulation products at ON Semiconductor. “The NCP508 meets all the requirements involved in the design and development of small, battery powered products that need an economical, robust, reliable and easy-to-use voltage regulation solution with minimal power consumption.”
Offered in an SC-88A package, the NCP508 is budgetary priced at $0.20 per unit for quantities of 3,000 units. A 1.5mm x 1.5mm DFN option is expected to be available later this year.
Wednesday, March 31, 2010
Diodes Inc. intros high frequency buck converter to save space, increase efficiency
DALLAS, USA: Diodes Inc., a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete and analog semiconductor markets, has released its AP5100 step-down converter.
It has been designed to bring space savings and efficiency improvements to set-top box, modem and distributed power applications. Provided in the compact 6-pin SOT26 package, this low-cost converter features a built-in power MOSFET and internal compensation to limit external component requirements.
Operating at a fixed switching frequency of 1.4Mhz, the AP5100 also enables a reduction in the overall size of external components, particularly the inductor. With its low series on-resistance power MOSFET switch, the converter is capable of delivering a constant current output of up to 1.2A at 90 percent efficiency over a wide input supply range, from 4.75V to 24V. The output is adjustable via a resistor divider, from 0.81V to 15V.
The device’s current mode operation provides for a fast transient response over the full operating input voltage and temperature range. The AP5100 has an enable pin allowing it to be put into standby mode where it consumes just 0.1µA. The AP5100 is self-protected, featuring on-chip thermal shutdown and cycle-by-cycle over-current protection to help ensure long-term product reliability.
It has been designed to bring space savings and efficiency improvements to set-top box, modem and distributed power applications. Provided in the compact 6-pin SOT26 package, this low-cost converter features a built-in power MOSFET and internal compensation to limit external component requirements.
Operating at a fixed switching frequency of 1.4Mhz, the AP5100 also enables a reduction in the overall size of external components, particularly the inductor. With its low series on-resistance power MOSFET switch, the converter is capable of delivering a constant current output of up to 1.2A at 90 percent efficiency over a wide input supply range, from 4.75V to 24V. The output is adjustable via a resistor divider, from 0.81V to 15V.
The device’s current mode operation provides for a fast transient response over the full operating input voltage and temperature range. The AP5100 has an enable pin allowing it to be put into standby mode where it consumes just 0.1µA. The AP5100 is self-protected, featuring on-chip thermal shutdown and cycle-by-cycle over-current protection to help ensure long-term product reliability.
Tuesday, March 30, 2010
CUI announces advanced power topology license agreement with California Power Research
TUALATIN, USA: CUI Inc., a subsidiary of Waytronx Inc., has entered into an exclusive Field of Use Agreement with California Power Research Inc to license their BPS-5 advanced power topology.
BPS-5 provides advantages across a wide range of ac-dc and dc-dc power conversion applications through a significant reduction in switching losses within PWM circuits. This switching loss reduction translates to a potential for improved energy efficiency, faster transient response and increased power density when compared to the leading designs currently on the market.
“We are pleased to license our BPS-5 technology to CUI Inc.,” said Fred Barthold, Vice President of Engineering at California Power Research. “We feel this technology aligns well with CUI’s recent entrance into the digital power market and their commitment to bringing advanced power solutions to their expanding customer base,” explained Barthold.
Through its power product line, V-Infinity, CUI manufactures a range of embedded and external power electronics devices for OEM manufacturers.
Waytronx’s President and CEO, William Clough, said: “We are very excited to partner with California Power Research to incorporate their BPS-5 technology into our line of products. Our team has developed a road map based on this technology that we feel will take full advantage of its benefits. This partnership continues our mission to bring the latest advances in power technology to market.”
“This relationship continues to demonstrate our commitment to partner with ‘best-of-breed,’ world-class companies in order to acquire, develop, and commercialize leading-edge technology,” Clough concluded.
BPS-5 provides advantages across a wide range of ac-dc and dc-dc power conversion applications through a significant reduction in switching losses within PWM circuits. This switching loss reduction translates to a potential for improved energy efficiency, faster transient response and increased power density when compared to the leading designs currently on the market.
“We are pleased to license our BPS-5 technology to CUI Inc.,” said Fred Barthold, Vice President of Engineering at California Power Research. “We feel this technology aligns well with CUI’s recent entrance into the digital power market and their commitment to bringing advanced power solutions to their expanding customer base,” explained Barthold.
Through its power product line, V-Infinity, CUI manufactures a range of embedded and external power electronics devices for OEM manufacturers.
Waytronx’s President and CEO, William Clough, said: “We are very excited to partner with California Power Research to incorporate their BPS-5 technology into our line of products. Our team has developed a road map based on this technology that we feel will take full advantage of its benefits. This partnership continues our mission to bring the latest advances in power technology to market.”
“This relationship continues to demonstrate our commitment to partner with ‘best-of-breed,’ world-class companies in order to acquire, develop, and commercialize leading-edge technology,” Clough concluded.
Mitsubishi Electric adds V1 series to high output intelligent power modules lineup
TOKYO, JAPAN: Mitsubishi Electric Corp. has launched the new V1 Series of high output intelligent power modules (IPM), mainly for use in motors to control industrial machinery.
The V1 Series features low power loss and a compact package for inverters with volumes of 37 kilowatts (kW) or greater and servo systems with volumes of 15kW or greater. Shipments will begin in March 2010 through Mitsubishi Electric sales sites in the Americas, Europe, China and Korea.
An IPM is a type of power device with multiple chips combined into one package, including power chips using IGBTs and their driving circuits, as well as a variety of protection circuits. To use energy more efficiently, variable frequency inverters have recently become widely employed in motor control systems.
In the output stage of these inverters, IPMs are commonly used for switching electric current at high speeds. There is growing demand for IPMs with lower power loss, higher output volume and smaller package size.
In 1998, Mitsubishi Electric launched the V Series, which has 2 IGBT chips embedded into one module. With the addition of the V1 Series, motor control system manufacturers will be able to choose from the two series to best suit their needs.
The V1 Series features low power loss and a compact package for inverters with volumes of 37 kilowatts (kW) or greater and servo systems with volumes of 15kW or greater. Shipments will begin in March 2010 through Mitsubishi Electric sales sites in the Americas, Europe, China and Korea.
An IPM is a type of power device with multiple chips combined into one package, including power chips using IGBTs and their driving circuits, as well as a variety of protection circuits. To use energy more efficiently, variable frequency inverters have recently become widely employed in motor control systems.
In the output stage of these inverters, IPMs are commonly used for switching electric current at high speeds. There is growing demand for IPMs with lower power loss, higher output volume and smaller package size.
In 1998, Mitsubishi Electric launched the V Series, which has 2 IGBT chips embedded into one module. With the addition of the V1 Series, motor control system manufacturers will be able to choose from the two series to best suit their needs.
SAFC Hitech well positioned for HB LED manufacturing boom
ST. LOUIS, USA: SAFC Hitech, a business segment within SAFC, a division of the Sigma-Aldrich Group, announced it plans to invest $2m (approximately £1.2m) in expanding production of trimethylgallium (TMG) at its Bromborough, Wirral, UK manufacturing plant.
The investment, which was supported by Wirral Council and The Mersey Partnership (TMP), who helped secure additional funding of £300,000 from the Northwest Regional Development Agency (NWDA), is expected to enable SAFC Hitech to strengthen its position as a leading global supplier of TMG and satisfy the growing demand for the material in the production of high brightness LEDs (HBLEDs) for use in applications such as backlighting in flat panel television sets and energy efficient lighting.
Reducing energy consumption and extending energy efficiency are trends driving the global electronics industry to provide more energy-efficient products and systems. Demand in the lighting industry, for example, has seen improvement with the deployment of LEDs to replace currently ubiquitous systems - incandescent light bulbs, fluorescent lighting and its compact fluorescent lamp (CFL) derivative. As a result, the electronics market is at the start of a phase where mass manufacture of HBLEDs is occurring.
TMG has been manufactured at SAFC Hitech’s Bromborough facility for a number of years, primarily for supply to the global semiconductor industry. However, as TMG also fulfills the technical criteria for devices designed for the LED, laser, communication and other markets, the boom in demand for LEDs has led to the conclusion that expanding the plant - with its expertise and specific manufacturing knowledge for this process - was the ideal business solution to meet customer demand.
The £300,000 Grant for Business Investment (GBI), which was awarded by the NWDA, is part of ‘Solutions for Business’, the UK Government's package of publicly-funded business support designed to help companies start and grow.
“Expanding our TMG capacity not only draws on our Bromborough facility’s core competencies, but also reinforces Sigma-Aldrich’s overall strategy of leveraging proprietary technologies and capabilities into new, fast growing market segments, thus differentiating ourselves and our materials offerings through technical innovation,” commented Dr. Geoff Irvine, VP, Business Development, SAFC Hitech.
“This investment is expected to accelerate the delivery of TMG to a growing market position and reinforce our position as a leading global manufacturing and distributor for the growing LED market worldwide, as well as create jobs in the area, which is positive news given the current economic climate.”
The investment, which was supported by Wirral Council and The Mersey Partnership (TMP), who helped secure additional funding of £300,000 from the Northwest Regional Development Agency (NWDA), is expected to enable SAFC Hitech to strengthen its position as a leading global supplier of TMG and satisfy the growing demand for the material in the production of high brightness LEDs (HBLEDs) for use in applications such as backlighting in flat panel television sets and energy efficient lighting.
Reducing energy consumption and extending energy efficiency are trends driving the global electronics industry to provide more energy-efficient products and systems. Demand in the lighting industry, for example, has seen improvement with the deployment of LEDs to replace currently ubiquitous systems - incandescent light bulbs, fluorescent lighting and its compact fluorescent lamp (CFL) derivative. As a result, the electronics market is at the start of a phase where mass manufacture of HBLEDs is occurring.
TMG has been manufactured at SAFC Hitech’s Bromborough facility for a number of years, primarily for supply to the global semiconductor industry. However, as TMG also fulfills the technical criteria for devices designed for the LED, laser, communication and other markets, the boom in demand for LEDs has led to the conclusion that expanding the plant - with its expertise and specific manufacturing knowledge for this process - was the ideal business solution to meet customer demand.
The £300,000 Grant for Business Investment (GBI), which was awarded by the NWDA, is part of ‘Solutions for Business’, the UK Government's package of publicly-funded business support designed to help companies start and grow.
“Expanding our TMG capacity not only draws on our Bromborough facility’s core competencies, but also reinforces Sigma-Aldrich’s overall strategy of leveraging proprietary technologies and capabilities into new, fast growing market segments, thus differentiating ourselves and our materials offerings through technical innovation,” commented Dr. Geoff Irvine, VP, Business Development, SAFC Hitech.
“This investment is expected to accelerate the delivery of TMG to a growing market position and reinforce our position as a leading global manufacturing and distributor for the growing LED market worldwide, as well as create jobs in the area, which is positive news given the current economic climate.”
Avnet to Acquire Bell Microproducts
PHOENIX, USA: Avnet Inc. has entered into a definitive agreement to acquire Bell Microproducts Inc. in an all cash merger for $7.00 per share, which equates to an equity value of approximately $252 million and a transaction value of approximately $594 million assuming a net debt position for Bell of $342 million at face value as of December 31, 2009.
The acquisition has been approved by the Boards of Directors of both companies and is subject to the approval of Bell's shareholders as well as customary regulatory approvals. The transaction is expected to close in 60 to 120 days, deliver at least 12.5 percent ROCE post integration and should be immediately accretive to earnings excluding integration and transaction costs.
Founded in 1988, Bell, with sales of approximately $3.0 billion in calendar year 2009, is a leading value-added distributor of storage and computing technology. With over 1,900 employees, the company offers a broad suite of integration and support services to OEMs, VARs, system builders and end users through 55 offices in the United States, Canada, Europe and Latin America.
The company, which operates both a distribution and single tier reseller business, offers a portfolio of storage, computing, software and networking products from industry-leading suppliers. In calendar year 2009, the single tier business represented approximately 15 percent of total sales while revenues from North America, EMEA and Latin America were 42 percent, 41 percent and 17 percent, respectively.
Roy Vallee, Avnet's chairman and CEO, commented: "We are very excited about the opportunity to build additional scale and scope in storage and computing solutions as well as increase our presence in the fast-growing Latin America market. Bell's position in datacenter products and embedded systems complements Avnet's current strategies and creates opportunities for cross selling. Bell's position as one of the leaders in hard disk drive distribution substantially increases Avnet's exposure to this product segment which is currently focused on embedded computing.
"In support of our focus on value-added solutions distribution in North America, we intend to explore strategic alternatives for the single tier reseller business. The combination of Bell's strong customer/supplier relationships and talented employees, coupled with our value based management culture and discipline, should allow us to achieve our stated return on capital goals on this transaction following the completion of the integration."
Don Bell, founder and CEO of Bell, commented: "This transaction delivers excellent value to our shareholders while providing an enhanced platform from which our employees can continue Bell's heritage of helping suppliers reach our served markets with increasingly complex solutions. Given the rising demands of global technology markets, the investment required to deliver leading edge technical support and competitive supply chain networks continues to grow. Avnet's financial resources and global infrastructure will allow the Bell organization to deliver industry-leading value to our customers and continue our long history of growth and market share gains."
BofA Merrill Lynch acted as a financial advisor and Squire, Sanders & Dempsey L.L.P. and Allen & Overy LLP acted as legal counsel to Avnet in connection with this transaction.
The acquisition has been approved by the Boards of Directors of both companies and is subject to the approval of Bell's shareholders as well as customary regulatory approvals. The transaction is expected to close in 60 to 120 days, deliver at least 12.5 percent ROCE post integration and should be immediately accretive to earnings excluding integration and transaction costs.
Founded in 1988, Bell, with sales of approximately $3.0 billion in calendar year 2009, is a leading value-added distributor of storage and computing technology. With over 1,900 employees, the company offers a broad suite of integration and support services to OEMs, VARs, system builders and end users through 55 offices in the United States, Canada, Europe and Latin America.
The company, which operates both a distribution and single tier reseller business, offers a portfolio of storage, computing, software and networking products from industry-leading suppliers. In calendar year 2009, the single tier business represented approximately 15 percent of total sales while revenues from North America, EMEA and Latin America were 42 percent, 41 percent and 17 percent, respectively.
Roy Vallee, Avnet's chairman and CEO, commented: "We are very excited about the opportunity to build additional scale and scope in storage and computing solutions as well as increase our presence in the fast-growing Latin America market. Bell's position in datacenter products and embedded systems complements Avnet's current strategies and creates opportunities for cross selling. Bell's position as one of the leaders in hard disk drive distribution substantially increases Avnet's exposure to this product segment which is currently focused on embedded computing.
"In support of our focus on value-added solutions distribution in North America, we intend to explore strategic alternatives for the single tier reseller business. The combination of Bell's strong customer/supplier relationships and talented employees, coupled with our value based management culture and discipline, should allow us to achieve our stated return on capital goals on this transaction following the completion of the integration."
Don Bell, founder and CEO of Bell, commented: "This transaction delivers excellent value to our shareholders while providing an enhanced platform from which our employees can continue Bell's heritage of helping suppliers reach our served markets with increasingly complex solutions. Given the rising demands of global technology markets, the investment required to deliver leading edge technical support and competitive supply chain networks continues to grow. Avnet's financial resources and global infrastructure will allow the Bell organization to deliver industry-leading value to our customers and continue our long history of growth and market share gains."
BofA Merrill Lynch acted as a financial advisor and Squire, Sanders & Dempsey L.L.P. and Allen & Overy LLP acted as legal counsel to Avnet in connection with this transaction.
BetaLED illuminates value of green design with SolidWorks sustainability software
CONCORD, USA: Although choosing green products like hybrid cars can certainly help the environment, the real green action occurs in the product design stage. That’s when companies such as BetaLED make far-reaching decisions about sustainability, such as:
Which materials will we use for this product?
Where will they come from?
Can they be reused or recycled?
How much energy will the finished product consume?
The environmental impact of these decisions across thousands, millions, or billions of manufactured products can be monumental.
“Our job is to make lighting products that are both economical and sustainable,” says Brian Kinnune, engineering manager for BetaLED, a division of Ruud Lighting. “SolidWorks' Sustainability software is helping us document our achievements and develop even greener products in the future. This is good for our business and good for the planet.”
The Sturtevant, Wisconsin, company has used the software to document the environmental and performance advantages of its BetaLED 304 Series commercial outdoor lighting systems. They use less than half the carbon-producing energy than a traditional metal halide lamp while providing better illumination. They provide a 60 percent reduction in carbon footprint, acid rain-causing air acidification, and algae-causing water contamination during their operating life.
SolidWorks Sustainability software’s intuitive dashboard details a design’s expected carbon footprint, air and water impact, and energy consumption. It rolls up the probable impact of an entire designed product across its environmental life cycle.
All BetaLED components are recyclable or landfill friendly and RoHS compliant. In fact, BetaLED exceeds RoHS requirements by producing products that are mercury free. The lights comply with IESNA and Dark Sky standards for curbing light pollution. And life expectancy is more than twice traditional lights – 11.5 years based on around-the-clock operation, or 23 years running 12 hours per day. Combined with superior energy efficiency, this longevity makes LED a smart investment both environmentally and economically.
BetaLED recently set the industry standard for LED efficiency by shattering the 100 delivered lumens per watt (LPW) barrier. This breakthrough can reduce energy consumption by as much as 70 percent – and even more when the customer uses the dimming option.
Demand for green products
Municipalities and large commercial buyers in the lighting industry are increasingly demanding eco-friendly products. For example, Los Angeles is undertaking the largest LED lighting project ever with a goal of replacing 209,000 lights over a five-year span. The project will pay for itself in energy and maintenance savings and spare the environment 40,500 tons of carbon per year, according to the city’s Bureau of Street Lighting.
Like many lighting customers, Los Angeles is enforcing strict regulations and industry standards like IESNA and RoHS. BetaLED, a supplier for the current phase of the project, consistently meets the standards.
Preference for green products is perhaps most obvious at the consumer level. More than one in three consumers opt for green products, even in a recession, and seven in 10 Americans pay continuous attention to the green steps companies take. Designing green products and documenting their advantages satisfies this market need.
“Design and engineering teams play a critical role in the fate of the planet,” said Kishore Boyalakuntla, manger of simulation product management at Dassault Systèmes SolidWorks Corp. “Our goal is to help them exercise that power in ways that helps their businesses, too. SolidWorks Sustainability software makes sustainable and economical design accessible, credible, and simple.”
Which materials will we use for this product?
Where will they come from?
Can they be reused or recycled?
How much energy will the finished product consume?
The environmental impact of these decisions across thousands, millions, or billions of manufactured products can be monumental.
“Our job is to make lighting products that are both economical and sustainable,” says Brian Kinnune, engineering manager for BetaLED, a division of Ruud Lighting. “SolidWorks' Sustainability software is helping us document our achievements and develop even greener products in the future. This is good for our business and good for the planet.”
The Sturtevant, Wisconsin, company has used the software to document the environmental and performance advantages of its BetaLED 304 Series commercial outdoor lighting systems. They use less than half the carbon-producing energy than a traditional metal halide lamp while providing better illumination. They provide a 60 percent reduction in carbon footprint, acid rain-causing air acidification, and algae-causing water contamination during their operating life.
SolidWorks Sustainability software’s intuitive dashboard details a design’s expected carbon footprint, air and water impact, and energy consumption. It rolls up the probable impact of an entire designed product across its environmental life cycle.
All BetaLED components are recyclable or landfill friendly and RoHS compliant. In fact, BetaLED exceeds RoHS requirements by producing products that are mercury free. The lights comply with IESNA and Dark Sky standards for curbing light pollution. And life expectancy is more than twice traditional lights – 11.5 years based on around-the-clock operation, or 23 years running 12 hours per day. Combined with superior energy efficiency, this longevity makes LED a smart investment both environmentally and economically.
BetaLED recently set the industry standard for LED efficiency by shattering the 100 delivered lumens per watt (LPW) barrier. This breakthrough can reduce energy consumption by as much as 70 percent – and even more when the customer uses the dimming option.
Demand for green products
Municipalities and large commercial buyers in the lighting industry are increasingly demanding eco-friendly products. For example, Los Angeles is undertaking the largest LED lighting project ever with a goal of replacing 209,000 lights over a five-year span. The project will pay for itself in energy and maintenance savings and spare the environment 40,500 tons of carbon per year, according to the city’s Bureau of Street Lighting.
Like many lighting customers, Los Angeles is enforcing strict regulations and industry standards like IESNA and RoHS. BetaLED, a supplier for the current phase of the project, consistently meets the standards.
Preference for green products is perhaps most obvious at the consumer level. More than one in three consumers opt for green products, even in a recession, and seven in 10 Americans pay continuous attention to the green steps companies take. Designing green products and documenting their advantages satisfies this market need.
“Design and engineering teams play a critical role in the fate of the planet,” said Kishore Boyalakuntla, manger of simulation product management at Dassault Systèmes SolidWorks Corp. “Our goal is to help them exercise that power in ways that helps their businesses, too. SolidWorks Sustainability software makes sustainable and economical design accessible, credible, and simple.”
Monday, March 29, 2010
Cypress extends lighting portfolio with AC-DC power controller family for dimmable LED lighting
Light+Building 2010, SAN JOSE, USA: Cypress Semiconductor Corp. introduced new AC-DC digital power controllers for LED lighting.
The CY8CLEDAC01/02 controllers offer a cost-effective solution for both non-dimmable and dimmable LED lighting, delivering high efficiency while meeting EnergyStar requirements. They provide automatic dimmer detection, so they work with the majority of the existing installed base of wall dimmers, providing dimming down to 2 percent with no flicker.
The new AC-DC controllers offer primary-side sensing with tight LED current regulation, eliminating the need for opto-isolation and other secondary-side control circuitry. This technique minimizes component count to reduce board space, power consumption, and overall BOM costs compared to other isolated solutions.
The new controllers also feature circuit protection not normally available with other primary-side control solutions. The built-in protection features include over-voltage protection (OVP), output short circuit protection (OSCP), peak current limit protection (PCLP), current-sense resistor short protection (CSSP), and over-temperature protection (OTP).
Reference designs for both the CY8CLEDAC01 and CY8CLEDAC02, including all schematics, BOM, gerber files, and documentation to create a power supply for a fully functional LED retrofit bulb, are available at www.cypress.com/go/acdc.
The new AC-DC controllers expand Cypress’ lighting portfolio to effectively cover LED retrofit bulbs. They complement the PowerPSoC family of embedded power controllers, the industry’s first single-chip solution for both controlling and driving high-power LEDs.
Together, the AC-DC family and Cypress’s PowerPSoC family cover a wide range of LED applications, from LED retrofit bulbs to high-end LED luminaires that require a variety of functions (communications, diagnostics, color-changing, etc).
Cypress will demonstrate the AC-DC controllers, the PowerPSoC solution and its newly announced Powerline Communication solution at the Light+Building exhibition from April 11-16 in Hall 4, Stand E15 at the Frankfurt Fair and Exhibition Center in Frankfurt, Germany.
“Cypress offers differentiated products that meet the unique needs of the growing LED lighting market,” said Curtis Davis, Vice President of Cypress’s PowerPSoC Business Unit. “The AC-DC controllers offer a strong combination of features and performance for LED retrofit bulbs.”
Both the CY8CLEDAC01 (non-dimmable) and CY8CLEDAC02 (dimmable) controllers are available today from Cypress and authorized distribution partners. They are both offered in 8-pin SOIC packages.
The CY8CLEDAC01/02 controllers offer a cost-effective solution for both non-dimmable and dimmable LED lighting, delivering high efficiency while meeting EnergyStar requirements. They provide automatic dimmer detection, so they work with the majority of the existing installed base of wall dimmers, providing dimming down to 2 percent with no flicker.
The new AC-DC controllers offer primary-side sensing with tight LED current regulation, eliminating the need for opto-isolation and other secondary-side control circuitry. This technique minimizes component count to reduce board space, power consumption, and overall BOM costs compared to other isolated solutions.
The new controllers also feature circuit protection not normally available with other primary-side control solutions. The built-in protection features include over-voltage protection (OVP), output short circuit protection (OSCP), peak current limit protection (PCLP), current-sense resistor short protection (CSSP), and over-temperature protection (OTP).
Reference designs for both the CY8CLEDAC01 and CY8CLEDAC02, including all schematics, BOM, gerber files, and documentation to create a power supply for a fully functional LED retrofit bulb, are available at www.cypress.com/go/acdc.
The new AC-DC controllers expand Cypress’ lighting portfolio to effectively cover LED retrofit bulbs. They complement the PowerPSoC family of embedded power controllers, the industry’s first single-chip solution for both controlling and driving high-power LEDs.
Together, the AC-DC family and Cypress’s PowerPSoC family cover a wide range of LED applications, from LED retrofit bulbs to high-end LED luminaires that require a variety of functions (communications, diagnostics, color-changing, etc).
Cypress will demonstrate the AC-DC controllers, the PowerPSoC solution and its newly announced Powerline Communication solution at the Light+Building exhibition from April 11-16 in Hall 4, Stand E15 at the Frankfurt Fair and Exhibition Center in Frankfurt, Germany.
“Cypress offers differentiated products that meet the unique needs of the growing LED lighting market,” said Curtis Davis, Vice President of Cypress’s PowerPSoC Business Unit. “The AC-DC controllers offer a strong combination of features and performance for LED retrofit bulbs.”
Both the CY8CLEDAC01 (non-dimmable) and CY8CLEDAC02 (dimmable) controllers are available today from Cypress and authorized distribution partners. They are both offered in 8-pin SOIC packages.
Elcoteq, Philips Lighting agree on global co-operation
THE NETHERLANDS & LUXEMBOURG: In line with its strategy of leveraging its capabilities into new product segments with growth potential, Elcoteq has recently successfully started serving customers in selected lighting segments.
Philips Lighting, a leading provider of solutions and applications for both professional and consumer markets, has chosen Elcoteq for a global growth partner of its Solid-State Lighting business. Under the agreement, Elcoteq will provide Philips Lighting with global manufacturing services and related sourcing and supply chain management as well as product development services.
Solid-State Lighting (SSL) is type of energy-efficient lighting that uses semiconductor LEDs, organic LEDs (OLEDs), or polymer light-emitting diodes (PLEDs) as sources of illumination. With worldwide electrical lighting using 19 percent of all electricity, the use of energy-efficient lighting will significantly reduce energy consumption around the world and thereby cut harmful CO2 emissions.
"We are very pleased to expand our partnership with Philips and to commence the cooperation with Philips Lighting. This deal marks our entrance into a new fast growing market segment - Solid-State Lighting - that fits into our capabilities and our manufacturing network extremely well. We are looking forward to building a global cooperation with Philips also in this new market segment", says Vesa Keränen, President of Elcoteq’s Consumer Electronics Business Unit.
Elcoteq has already started the production of SSL products in its factory in Dongguan, China. Production will expand to other Elcoteq locations including Mexico and Hungary still during the year 2010.
The lighting business will be undergoing significant transition when new LED-based lighting products replace conventional light sources. These new lighting product applications provide significant growth opportunities for EMS companies. The value of LED-based lighting products is estimated to reach 80 billion euros by the year 2020.
These trends create a solid basis for developing Elcoteq’s Consumer Electronics business toward serving a wider and more balanced business and customer portfolio.
Philips Lighting, a leading provider of solutions and applications for both professional and consumer markets, has chosen Elcoteq for a global growth partner of its Solid-State Lighting business. Under the agreement, Elcoteq will provide Philips Lighting with global manufacturing services and related sourcing and supply chain management as well as product development services.
Solid-State Lighting (SSL) is type of energy-efficient lighting that uses semiconductor LEDs, organic LEDs (OLEDs), or polymer light-emitting diodes (PLEDs) as sources of illumination. With worldwide electrical lighting using 19 percent of all electricity, the use of energy-efficient lighting will significantly reduce energy consumption around the world and thereby cut harmful CO2 emissions.
"We are very pleased to expand our partnership with Philips and to commence the cooperation with Philips Lighting. This deal marks our entrance into a new fast growing market segment - Solid-State Lighting - that fits into our capabilities and our manufacturing network extremely well. We are looking forward to building a global cooperation with Philips also in this new market segment", says Vesa Keränen, President of Elcoteq’s Consumer Electronics Business Unit.
Elcoteq has already started the production of SSL products in its factory in Dongguan, China. Production will expand to other Elcoteq locations including Mexico and Hungary still during the year 2010.
The lighting business will be undergoing significant transition when new LED-based lighting products replace conventional light sources. These new lighting product applications provide significant growth opportunities for EMS companies. The value of LED-based lighting products is estimated to reach 80 billion euros by the year 2020.
These trends create a solid basis for developing Elcoteq’s Consumer Electronics business toward serving a wider and more balanced business and customer portfolio.
Sunday, March 28, 2010
Global and China CMOS camera module industry report 2009-10
DUBLIN, IRELAND: Research and Markets has announced the addition of the "Global and China CMOS Camera Module Industry Report, 2009-2010" report to its offering.
Cell phone camera module characterizes an exceptionally complicated industrial chain which has three cores, namely CMOS image sensors, optical lens, module assembly factories. With the growing pixels of cell phone camera, packaging manufacturers have been playing increasingly important roles, while module assembly factories are on the wane.
CMOS image sensor manufacturers can not only deliver products to cell phone manufacturers directly by integrating optical components and adopting special packaging; but also deliver products to module assembly factories after professional packaging firms fulfill packaging; besides, they can choose to deliver products in the form of uncut wafers to COB module manufacturers. Yet, part of optical component manufacturers also have the ability to assemble COB modules.
Usually, CMOS image sensor manufacturers can be grouped into the three. First, the associated companies of wafer giants; second, large IDM companies; third, traditional digital camera manufacturers. Omnivision and the world's largest wafer foundry have a close relationship, and they own two joint ventures. Aptina was formerly a subsidiary of MICRON that is a large memory vendor, and MICRON is a wafer OEM of Aptina now.
SETI is an affiliated company of Dongbu Anamy. Samsung, Toshiba, STMICRO are IDMs. Traditional digital camera manufacturers, including Sony, Canon, Sharp, Kodak, Fuji, produce high-performance CMOS image sensors at small quantities and high prices.
Only wafer fabs can guarantee the production of CMOS image sensors and help reduce the costs. Wafer fabs can make use of CMOS image sensor business to supplement the production capacity of 8-inch wafer fabs, so that both of them can win.
A pure IC design company has no competitiveness at all. Lens is included in optical components of which the production needs rich experience in the manufacturing process. It is difficult to enter the field, though it will bring high gross profit margin.
Many super-large electronics manufacturers try to get through vertical supply chain, but it is particularly difficult to do so in an optical field. Additionally, optical manufacturers are highly dependent on human resources and rarely willing to be acquired. FUJINON which is subject to Fuji Film enjoys over 50 percent shares in 3-megapixel (or above) mobile phone camera market.
KMOT is the optical components division of Konica Minolta; just like Fuji film, it is also a well-known optics maker and focuses on high-end products. Both Largan and Asia Optical are supported by Japanese manufacturers in technology. Particularly, Japan's Sekon, Olympus, Ricoh, Nikon and Sony have given technical guidance to Asia Optical or established joint ventures with them. Largan is closely related to smart camera manufacturers; the three smart phone giants APPLE, HTC and RIM are Largan's loyal clients. KANKATSU, TAMRON and Hitachi Maxell are Japanese manufacturers, and the former two are traditional camera lens manufacturers.
Market Shares of Cell Phone Camera Lens Manufacturers, 2009 Mobile phone camera module manufacturers are normally divided into three groups.
First, CMOS image sensor giants establish module factories in order to integrate resources and expand vertical systems. Before the end of 2007, Toshiba entrusted most of its camera module business to other manufacturers. After 2008, it has always completed its camera module business in the semiconductor plant in Iwate.
Sharp is a big producer of CCD camera module, with rich experience and monthly output of about 9.8 million units. STMICRO holds advanced CMOS image sensor technology. Samsung entrusts part of module business to Samsung Electro-Mechanics, while it fulfills the remaining part by itself.
Second, cell phone OEMs, mobile phone or laptop component manufacturers. Foxconn, BYD and VISTAPIONT are big cell phone OEMs. Besides, small manufacturers of cell phone components are as usual adept in LCD field, with resources in dust-free rooms, such as LG INNOTEK, Truly Semiconductors, and ALPS. Chicony is the world's largest laptop keyboard manufacturer which almost monopolizes the laptop and camera module business.
Third, professional optoelectronic manufacturers, such as KMOT and Liteon.
Cell phone camera module characterizes an exceptionally complicated industrial chain which has three cores, namely CMOS image sensors, optical lens, module assembly factories. With the growing pixels of cell phone camera, packaging manufacturers have been playing increasingly important roles, while module assembly factories are on the wane.
CMOS image sensor manufacturers can not only deliver products to cell phone manufacturers directly by integrating optical components and adopting special packaging; but also deliver products to module assembly factories after professional packaging firms fulfill packaging; besides, they can choose to deliver products in the form of uncut wafers to COB module manufacturers. Yet, part of optical component manufacturers also have the ability to assemble COB modules.
Usually, CMOS image sensor manufacturers can be grouped into the three. First, the associated companies of wafer giants; second, large IDM companies; third, traditional digital camera manufacturers. Omnivision and the world's largest wafer foundry have a close relationship, and they own two joint ventures. Aptina was formerly a subsidiary of MICRON that is a large memory vendor, and MICRON is a wafer OEM of Aptina now.
SETI is an affiliated company of Dongbu Anamy. Samsung, Toshiba, STMICRO are IDMs. Traditional digital camera manufacturers, including Sony, Canon, Sharp, Kodak, Fuji, produce high-performance CMOS image sensors at small quantities and high prices.
Only wafer fabs can guarantee the production of CMOS image sensors and help reduce the costs. Wafer fabs can make use of CMOS image sensor business to supplement the production capacity of 8-inch wafer fabs, so that both of them can win.
A pure IC design company has no competitiveness at all. Lens is included in optical components of which the production needs rich experience in the manufacturing process. It is difficult to enter the field, though it will bring high gross profit margin.
Many super-large electronics manufacturers try to get through vertical supply chain, but it is particularly difficult to do so in an optical field. Additionally, optical manufacturers are highly dependent on human resources and rarely willing to be acquired. FUJINON which is subject to Fuji Film enjoys over 50 percent shares in 3-megapixel (or above) mobile phone camera market.
KMOT is the optical components division of Konica Minolta; just like Fuji film, it is also a well-known optics maker and focuses on high-end products. Both Largan and Asia Optical are supported by Japanese manufacturers in technology. Particularly, Japan's Sekon, Olympus, Ricoh, Nikon and Sony have given technical guidance to Asia Optical or established joint ventures with them. Largan is closely related to smart camera manufacturers; the three smart phone giants APPLE, HTC and RIM are Largan's loyal clients. KANKATSU, TAMRON and Hitachi Maxell are Japanese manufacturers, and the former two are traditional camera lens manufacturers.
Market Shares of Cell Phone Camera Lens Manufacturers, 2009 Mobile phone camera module manufacturers are normally divided into three groups.
First, CMOS image sensor giants establish module factories in order to integrate resources and expand vertical systems. Before the end of 2007, Toshiba entrusted most of its camera module business to other manufacturers. After 2008, it has always completed its camera module business in the semiconductor plant in Iwate.
Sharp is a big producer of CCD camera module, with rich experience and monthly output of about 9.8 million units. STMICRO holds advanced CMOS image sensor technology. Samsung entrusts part of module business to Samsung Electro-Mechanics, while it fulfills the remaining part by itself.
Second, cell phone OEMs, mobile phone or laptop component manufacturers. Foxconn, BYD and VISTAPIONT are big cell phone OEMs. Besides, small manufacturers of cell phone components are as usual adept in LCD field, with resources in dust-free rooms, such as LG INNOTEK, Truly Semiconductors, and ALPS. Chicony is the world's largest laptop keyboard manufacturer which almost monopolizes the laptop and camera module business.
Third, professional optoelectronic manufacturers, such as KMOT and Liteon.
Novaled to intro ultraflat OLED luminaires
Light+Building 2010, DRESDEN, GERMANY: Novaled AG - a pioneer in the field of OLED (Organic Light Emitting Diode) technologies for lighting and display applications - will be exhibiting OLEDs and OLED applications at the Light + Building fair in Frankfurt.
At the 2010 Light + Building in Frankfurt, Novaled will be introducing its innovative long life organic LEDs. These new area light sources not only deliver unique design possibilities, but also enable completely new lighting applications by emitting light from a surface.
OLED light is perceived as being very natural due to the broad emission spectra of the organic materials. In addition, Novaled OLEDs provide a very high quality light with a CRI of up to 95. A range of OLED lighting from warm white to clear cold white will be exhibited.
Furthermore, colours such as deep orange, rich red and intense blue will be shown. Colour tunable OLEDs which cover a broad span of colours from light blue through clear white and all the way to orange will also be introduced.
The OLED devices which are manufactured on glass and metal substrates, are extremely thin, lightweight and come in various sizes from 25 cm2 up to 225 cm2 active area. Depending on the substrate material and device structure chosen, OLEDs can be transparent, have a diffuse appearance or behave like a mirror in the off state.
“We are at the forefront of a lighting revolution” states Gildas Sorin, CEO of Novaled AG. “OLEDs are like providing a new set of tones to composers, enabling them to create a breathtaking new world of music. Novaled is eagerly anticipating the exciting future of light and encourages the lighting industry to not only use but also experiment further with OLEDs.”
Together with its different partners, the company will also introduce a variety of futuristic OLED luminaires, artistic light sculptures and signage at its booth to clearly emphasize the immense potential of this new area light source. Visitors will be welcome to experience the beauty of OLED lighting and understand the creative potential of OLED lighting design at the Novaled booth, which can be found in Hall 4.1, J51.
At the 2010 Light + Building in Frankfurt, Novaled will be introducing its innovative long life organic LEDs. These new area light sources not only deliver unique design possibilities, but also enable completely new lighting applications by emitting light from a surface.
OLED light is perceived as being very natural due to the broad emission spectra of the organic materials. In addition, Novaled OLEDs provide a very high quality light with a CRI of up to 95. A range of OLED lighting from warm white to clear cold white will be exhibited.
Furthermore, colours such as deep orange, rich red and intense blue will be shown. Colour tunable OLEDs which cover a broad span of colours from light blue through clear white and all the way to orange will also be introduced.
The OLED devices which are manufactured on glass and metal substrates, are extremely thin, lightweight and come in various sizes from 25 cm2 up to 225 cm2 active area. Depending on the substrate material and device structure chosen, OLEDs can be transparent, have a diffuse appearance or behave like a mirror in the off state.
“We are at the forefront of a lighting revolution” states Gildas Sorin, CEO of Novaled AG. “OLEDs are like providing a new set of tones to composers, enabling them to create a breathtaking new world of music. Novaled is eagerly anticipating the exciting future of light and encourages the lighting industry to not only use but also experiment further with OLEDs.”
Together with its different partners, the company will also introduce a variety of futuristic OLED luminaires, artistic light sculptures and signage at its booth to clearly emphasize the immense potential of this new area light source. Visitors will be welcome to experience the beauty of OLED lighting and understand the creative potential of OLED lighting design at the Novaled booth, which can be found in Hall 4.1, J51.
Saturday, March 27, 2010
TSMC breaks ground for LED lighting fab
HSINCHU, TAIWAN: TSMC held a groundbreaking ceremony for its LED lighting R&D center and fab in Hsinchu Science Park, setting an important milestone for the company’s entry into green energy.
“To further strengthen long-term growth in TSMC’s revenues and profits, we not only continue to pursue excellence in the field of dedicated IC foundry, we are also developing new businesses such as LED lighting and solar power,” said TSMC Chairman and CEO Dr. Morris Chang.
“With the leadership of President Dr. Rick Tsai and the hard work of all the colleagues involved, the strategy, goals, and execution of our new businesses have developed very successfully in the past several months. The groundbreaking for our LED lighting R&D center and fab is an excellent example, and I look forward to even more progress once construction is complete.”
“LED lighting is a promising industry, and we will make full use of TSMC’s technology leadership and manufacturing excellence in semiconductors to develop and integrate LED technology, process, and packaging and testing,” said Dr. Rick Tsai, TSMC President of New Businesses. “ We will enter the market next year by offering LED light sources and light engines to pursue the broad business opportunities of the LED lighting industry.”
This LED fab is located on Li-Hsin Road 4 of the Hsinchu Science Park and will be built in two phases. Investment in plant and equipment for the first phase is expected to reach NT$5.5 billion, and equipment move-in is scheduled for fourth quarter of 2010 with volume production in the first quarter of 2011. TSMC will make decisions on construction of the second phase depending on future business needs.
TSMC is actively recruiting for its LED lighting business and welcomes talent in areas including technology development, process integration, product mechanical engineering, packaging, testing, equipment engineering, facilities, and business development.
“To further strengthen long-term growth in TSMC’s revenues and profits, we not only continue to pursue excellence in the field of dedicated IC foundry, we are also developing new businesses such as LED lighting and solar power,” said TSMC Chairman and CEO Dr. Morris Chang.
“With the leadership of President Dr. Rick Tsai and the hard work of all the colleagues involved, the strategy, goals, and execution of our new businesses have developed very successfully in the past several months. The groundbreaking for our LED lighting R&D center and fab is an excellent example, and I look forward to even more progress once construction is complete.”
“LED lighting is a promising industry, and we will make full use of TSMC’s technology leadership and manufacturing excellence in semiconductors to develop and integrate LED technology, process, and packaging and testing,” said Dr. Rick Tsai, TSMC President of New Businesses. “ We will enter the market next year by offering LED light sources and light engines to pursue the broad business opportunities of the LED lighting industry.”
This LED fab is located on Li-Hsin Road 4 of the Hsinchu Science Park and will be built in two phases. Investment in plant and equipment for the first phase is expected to reach NT$5.5 billion, and equipment move-in is scheduled for fourth quarter of 2010 with volume production in the first quarter of 2011. TSMC will make decisions on construction of the second phase depending on future business needs.
TSMC is actively recruiting for its LED lighting business and welcomes talent in areas including technology development, process integration, product mechanical engineering, packaging, testing, equipment engineering, facilities, and business development.
Thursday, March 25, 2010
Report on Chinese electronic component and device industry, 2010-2011
NEW YORK, USA: Reportlinker.com announced that a new market research report is available in its catalogue: Research Report on Chinese Electronic Component & Device Industry, 2010-2011.
Since 2009H2, the electronic component and device industry begins to restore with the rebound of the global economy. Especially, the semiconductor industry shows a prominent recovery trend – the global productivity utilization rate has exceeded the expectation; the leading indicators of the industry have been beyond the prosperous range; the monthly sales revenue begins to rise. It is forecast that the output value growth rate of the global semiconductor industry will reach 10 percent with the promotion of the downstream market in 2010.
In 2009, Chinese electronic component and device application market was in a high-speed development with rising demand thanks to the release of the 3G licenses and governmental supporting policies for investment and domestic demand expansion (industry revitalization plans and policy of "home appliances going to the countryside", etc), Meanwhile, considering the opening characteristic of the electronic component & device industry, the recovery in the export will also bring favorable effectiveness for this industry.
In 2009, Chinese electronic component and device manufacturing industry realized the aggregate sales revenue of CNY 1.21 trillion with the YOY growth rate of 134.88 percent; the growth rate was raised by 115.17 percent YOY. Besides, the total assets growth rate and the capital maintenance and appreciation rate amounted to 118.69 percent and 214.15 percent, rising by 104.83 percent YOY and 99.90 percent YOY, respectively.
In 2009, the decrease rate of the production of major electronic component and device products in China was reduced; some products even realized the positive growth rate in production. The production of discrete semiconductor devices reached 263.74 billion with the YOY growth rate of 3.02 percent.
The production of the semiconductor integrated circuit totaled 41.59 billion with the YOY decrease rate of 6.56 percent; the decrease rate was cut down by 24.42 percent compared with that at the beginning of 2009. The production of these products in 2009Q4 all realized the positive growth.
In December 2009, Chinese semiconductor integrated circuit production was 4.59 billion with the YOY growth rate of 49.84%; the growth rate was increased by 69.34 percent YOY.
In 2009, Chinese integrated circuit export volume was 56.61 billion, rising by 16.8 percent YOY. The export value came up to $23.30 billion, dropping by 4.2 percent YOY; the decrease rate was cut down by 7.5 percent compared with that at the beginning of 2009, indicating the significant decline in the YOY decrease rate.
With the recovery of Chinese economy, Chinese electronic component and device industry will further restore. In 2010, the Chinese semiconductor industry will realize the growth rate of about 10 percent.
Since 2009H2, the electronic component and device industry begins to restore with the rebound of the global economy. Especially, the semiconductor industry shows a prominent recovery trend – the global productivity utilization rate has exceeded the expectation; the leading indicators of the industry have been beyond the prosperous range; the monthly sales revenue begins to rise. It is forecast that the output value growth rate of the global semiconductor industry will reach 10 percent with the promotion of the downstream market in 2010.
In 2009, Chinese electronic component and device application market was in a high-speed development with rising demand thanks to the release of the 3G licenses and governmental supporting policies for investment and domestic demand expansion (industry revitalization plans and policy of "home appliances going to the countryside", etc), Meanwhile, considering the opening characteristic of the electronic component & device industry, the recovery in the export will also bring favorable effectiveness for this industry.
In 2009, Chinese electronic component and device manufacturing industry realized the aggregate sales revenue of CNY 1.21 trillion with the YOY growth rate of 134.88 percent; the growth rate was raised by 115.17 percent YOY. Besides, the total assets growth rate and the capital maintenance and appreciation rate amounted to 118.69 percent and 214.15 percent, rising by 104.83 percent YOY and 99.90 percent YOY, respectively.
In 2009, the decrease rate of the production of major electronic component and device products in China was reduced; some products even realized the positive growth rate in production. The production of discrete semiconductor devices reached 263.74 billion with the YOY growth rate of 3.02 percent.
The production of the semiconductor integrated circuit totaled 41.59 billion with the YOY decrease rate of 6.56 percent; the decrease rate was cut down by 24.42 percent compared with that at the beginning of 2009. The production of these products in 2009Q4 all realized the positive growth.
In December 2009, Chinese semiconductor integrated circuit production was 4.59 billion with the YOY growth rate of 49.84%; the growth rate was increased by 69.34 percent YOY.
In 2009, Chinese integrated circuit export volume was 56.61 billion, rising by 16.8 percent YOY. The export value came up to $23.30 billion, dropping by 4.2 percent YOY; the decrease rate was cut down by 7.5 percent compared with that at the beginning of 2009, indicating the significant decline in the YOY decrease rate.
With the recovery of Chinese economy, Chinese electronic component and device industry will further restore. In 2010, the Chinese semiconductor industry will realize the growth rate of about 10 percent.
Luminus’ PhlatLight LEDs light new Martin entertainment fixture
Pro Light & Sound, FRANKFURT, GERMANY & BILLERICA, USA: Luminus Devices, developer and manufacturer of big-chip PhlatLight LEDs, announced that it provides the light source inside Martin Professional’s new MAC 350 Entour, the world’s first high output LED-based, mercury-free, profile light.
The MAC 350 Entour comes equipped with seven CBT-90 white PhlatLight LEDs and has a total light output of 6,500 lumens, light levels previously achieved only with high energy discharge lamps. The MAC 350 Entour has a lifespan of more than 25,000 hours.
The MAC 350 Entour is well suited for touring and event environments, and permanent venues such as theatres, TV studios, sporting arenas, education facilities, night clubs, ballrooms and cruise ships, where high-brightness and performance is needed. Until now, profile lights have used traditional high intensity discharge (HID) lamps, that are costly to replace, contain mercury and have a life span of only 3,000 hours, necessitating frequent replacement.
“With superior lumen output the CBT-90 PhlatLight LED provides lighting designers an ultra-bright, point-source of white light with superior optical coupling enabling new applications with better optical system efficiency,” said Don McDaniel, director, global entertainment, Luminus Devices. “Big-chip PhlatLight LEDs are ideally suited for spot lights such as the MAC 350 Entour because they provide superior brightness and a lifetime of use for companies such as Martin.”
“The MAC 350 Entour is the entertainment lighting industry’s first LED alternative to traditional HID-based profile fixtures and it exceeds traditional 300 watt fixtures in brightness,” said Peter Skytte, product manager, Martin. “Award-winning PhlatLight LEDs are energy-efficient, contain no mercury and give Martin the ability to develop new, more cost-effective entertainment industry based lights that are ideal for a host of temporary and permanent environments.”
The MAC 350 Entour comes equipped with seven CBT-90 white PhlatLight LEDs and has a total light output of 6,500 lumens, light levels previously achieved only with high energy discharge lamps. The MAC 350 Entour has a lifespan of more than 25,000 hours.
The MAC 350 Entour is well suited for touring and event environments, and permanent venues such as theatres, TV studios, sporting arenas, education facilities, night clubs, ballrooms and cruise ships, where high-brightness and performance is needed. Until now, profile lights have used traditional high intensity discharge (HID) lamps, that are costly to replace, contain mercury and have a life span of only 3,000 hours, necessitating frequent replacement.
“With superior lumen output the CBT-90 PhlatLight LED provides lighting designers an ultra-bright, point-source of white light with superior optical coupling enabling new applications with better optical system efficiency,” said Don McDaniel, director, global entertainment, Luminus Devices. “Big-chip PhlatLight LEDs are ideally suited for spot lights such as the MAC 350 Entour because they provide superior brightness and a lifetime of use for companies such as Martin.”
“The MAC 350 Entour is the entertainment lighting industry’s first LED alternative to traditional HID-based profile fixtures and it exceeds traditional 300 watt fixtures in brightness,” said Peter Skytte, product manager, Martin. “Award-winning PhlatLight LEDs are energy-efficient, contain no mercury and give Martin the ability to develop new, more cost-effective entertainment industry based lights that are ideal for a host of temporary and permanent environments.”
Sumitomo Electric Lightwave launches next generation Lynx2 splice connector
RESEARCH TRIANGLE PARK, USA: Sumitomo Electric Lightwave, a leader in fiber optic product manufacturing, announced the introduction of the Lynx2 CustomFit Splice-On Connector, the first splice connector in the industry to offer the three leading connector types, SC, LC, and FC for single-mode, 50 and 62.5 micron multimode, and gigabit laser optimized multimode fiber types.
The latest design of the Lynx2 Splice Connector eliminates the need for crimping, making splice connectorizations easier and more cost effective for customized FTTx, outside plant, and inside plant field terminations. The splice-on connector is ideal also for central office, enterprise network, fiber distribution hub, data center, and other fiber optic network applications.
Lynx2 features a fast and easy to use screw-on collar to secure the Kevlar and jacket, eliminating the crimping process and the use of high priced crimping tools. The method of termination provided by Sumitomo’s Lynx2 CustomFit Connector eliminates the guess work in predetermining the length of preterminated jumpers required for a given application, allowing the field technician to customize the termination in the field, ensuring quick, accurate, and permanent connectorizations.
The Lynx2 also eliminates the necessity and associated costs of hand polishing, and maintaining an inventory of splice trays, index matching gels, and varying lengths of preterminated jumpers.
“At Sumitomo, we’re committed to continuous innovation, striving to make our next generation products significantly better than the last,” says Josh Seawell, Sumitomo Electric Lightwave’s product manager for its Lightwave Network Products division. “The Lynx2 CustomFit Connector ensures that our customers achieve faster deployments, increased productivity, and reduced costs.”
Lynx2 has passed independent testing for GR-326-CORE and GR-1081-CORE compliance. The new splice-on connector provides APC, UPC, and PC (MMF) polishing options, and yields average insertion losses of only 0.15dB for single-mode fiber and 0.10dB for multimode fiber.
The new splice-on connector is compatible with Sumitomo’s FastCat Type-39FH, TuffCat Type-66 Mass, TomCat Type-25e fusion splicers, and earlier models, and can also be used with other splicer brands. The Lynx2 CustomFit Connector is currently available for order.
The latest design of the Lynx2 Splice Connector eliminates the need for crimping, making splice connectorizations easier and more cost effective for customized FTTx, outside plant, and inside plant field terminations. The splice-on connector is ideal also for central office, enterprise network, fiber distribution hub, data center, and other fiber optic network applications.
Lynx2 features a fast and easy to use screw-on collar to secure the Kevlar and jacket, eliminating the crimping process and the use of high priced crimping tools. The method of termination provided by Sumitomo’s Lynx2 CustomFit Connector eliminates the guess work in predetermining the length of preterminated jumpers required for a given application, allowing the field technician to customize the termination in the field, ensuring quick, accurate, and permanent connectorizations.
The Lynx2 also eliminates the necessity and associated costs of hand polishing, and maintaining an inventory of splice trays, index matching gels, and varying lengths of preterminated jumpers.
“At Sumitomo, we’re committed to continuous innovation, striving to make our next generation products significantly better than the last,” says Josh Seawell, Sumitomo Electric Lightwave’s product manager for its Lightwave Network Products division. “The Lynx2 CustomFit Connector ensures that our customers achieve faster deployments, increased productivity, and reduced costs.”
Lynx2 has passed independent testing for GR-326-CORE and GR-1081-CORE compliance. The new splice-on connector provides APC, UPC, and PC (MMF) polishing options, and yields average insertion losses of only 0.15dB for single-mode fiber and 0.10dB for multimode fiber.
The new splice-on connector is compatible with Sumitomo’s FastCat Type-39FH, TuffCat Type-66 Mass, TomCat Type-25e fusion splicers, and earlier models, and can also be used with other splicer brands. The Lynx2 CustomFit Connector is currently available for order.
Cree LEDs light up Dallas American Airlines center video screens
DURHAM, USA: Cree Inc. announced that its high brightness LEDs are used in Lighthouse Technologies’ high definition video screens installed this season in the American Airlines Center, the Dallas home to both the NBA’s Mavericks and NHL’s Stars.
Cree’s versatile 3-in-1 high-brightness LEDs are delivering crystal-clear, high definition images to fans throughout the arena.
In addition to hosting thousands of NBA and NHL fans, the American Airlines Center also features numerous concerts and live entertainment throughout the year. Opened nearly 10 years ago and seating up to 20,000, the installation of 25 Lighthouse LED video screens is part of a large-scale technological renovation project at the arena.
This includes the first 1080x1920 high-definition video screen in any NBA or NHL facility. Overall, the new digital screens will increase video visibility throughout the facility, providing spectators with dramatic instant replays, important scoring information and dynamic ad content in vivid color and ultra-sharp detail.
“Cree’s Screen Master high-brightness LEDs provide excellent quality and performance, helping Lighthouse Technologies deliver vibrant color and crisp detail,” said Paul Thieken, Cree director of marketing, LED components. “Sports fans and concert attendees alike are sure to appreciate the stunning views, on-screen statistics and high-resolution action offered by the state-of-the-art Lighthouse video screens.”
“Cree’s broad product portfolio of LEDs featuring high-intensity output and wide viewing angles were the optimal solution for all the video screens, including the 4mm high resolution, high definition video screens Lighthouse designed for the American Airlines Center,” said Ed Whitaker, Lighthouse Technologies North American Sales Director.
The arena’s core display consists of four Lighthouse LED screens, each producing high-quality, superior-focus images to keep basketball and hockey fans front and center with all the action, and providing advertising screens on the top and bottom sections of the screen. At each end of the arena, two stadium-sized video screens have been installed, each three times larger than the previous monitors.
Cree’s versatile 3-in-1 high-brightness LEDs are delivering crystal-clear, high definition images to fans throughout the arena.
In addition to hosting thousands of NBA and NHL fans, the American Airlines Center also features numerous concerts and live entertainment throughout the year. Opened nearly 10 years ago and seating up to 20,000, the installation of 25 Lighthouse LED video screens is part of a large-scale technological renovation project at the arena.
This includes the first 1080x1920 high-definition video screen in any NBA or NHL facility. Overall, the new digital screens will increase video visibility throughout the facility, providing spectators with dramatic instant replays, important scoring information and dynamic ad content in vivid color and ultra-sharp detail.
“Cree’s Screen Master high-brightness LEDs provide excellent quality and performance, helping Lighthouse Technologies deliver vibrant color and crisp detail,” said Paul Thieken, Cree director of marketing, LED components. “Sports fans and concert attendees alike are sure to appreciate the stunning views, on-screen statistics and high-resolution action offered by the state-of-the-art Lighthouse video screens.”
“Cree’s broad product portfolio of LEDs featuring high-intensity output and wide viewing angles were the optimal solution for all the video screens, including the 4mm high resolution, high definition video screens Lighthouse designed for the American Airlines Center,” said Ed Whitaker, Lighthouse Technologies North American Sales Director.
The arena’s core display consists of four Lighthouse LED screens, each producing high-quality, superior-focus images to keep basketball and hockey fans front and center with all the action, and providing advertising screens on the top and bottom sections of the screen. At each end of the arena, two stadium-sized video screens have been installed, each three times larger than the previous monitors.
Avago expands series of low cost power amplifiers for point-to-point radio transmitters
SAN JOSE, USA & SINGAPORE: Avago Technologies, leading supplier of analog interface components for communications, industrial and consumer applications, announced a new pair of low cost 1-Watt power amplifiers (PAs) for use in millimeter wave (mmW) communication transmitters that operate at frequencies between 37 and 40GHz.
Avago’s AMMP-6442 monolithic microwave IC (MMIC) is a linear power amplifier offered in a 5 by 5 mm surface mount (SMT) package, while the AMMC-6442 is a MMIC die. Typical applications include Point-to-Point and Point-to-Multi-Point radio systems, and mmW communication applications.
Both the AMMP-6442 and AMMC-6442 PAs from Avago provide 30dBm of typical output power and 23dB of typical small-signal gain and are designed to provide high efficiency to help reduce power consumption.
These MMICs, which provide good linearity and high gain, are suitable for high linear applications and have 35dBm of output third order intercept point making them ideal for use as last stage power amplifiers in systems that require increased linearity for high data rate transmission.
Avago’s AMMP-6442 and AMMC-6442 are available now with pricing starting from $29 and $27, respectively in 1,000 unit volumes.
Avago’s AMMP-6442 monolithic microwave IC (MMIC) is a linear power amplifier offered in a 5 by 5 mm surface mount (SMT) package, while the AMMC-6442 is a MMIC die. Typical applications include Point-to-Point and Point-to-Multi-Point radio systems, and mmW communication applications.
Both the AMMP-6442 and AMMC-6442 PAs from Avago provide 30dBm of typical output power and 23dB of typical small-signal gain and are designed to provide high efficiency to help reduce power consumption.
These MMICs, which provide good linearity and high gain, are suitable for high linear applications and have 35dBm of output third order intercept point making them ideal for use as last stage power amplifiers in systems that require increased linearity for high data rate transmission.
Avago’s AMMP-6442 and AMMC-6442 are available now with pricing starting from $29 and $27, respectively in 1,000 unit volumes.
Shuji Nakamura joins Seoul Semiconductor as consultant
SANTA BARBARA, USA: Shuji Nakamura, widely known as the “Thomas Edison of the LED industry” has been named a scientific adviser to the leading global LED manufacturer Seoul Semiconductor Co. Ltd.
Nakamura is a professor at the Materials Department of the College of Engineering, University of California, Santa Barbara (UCSB).
He is widely known for having developed the high-brightness blue LED based on GaN in 1993, while working for Nichia Corp. in Japan. In those days, developing a blue LED was considered impossible; only red and green LEDs had been available for the prior 20 years.
Prof. Nakamura’s innovation allowed LED manufacturers to produce LEDs with three primary colors (red, green and blue) which could be mixed to express 16 million colors. Perhaps most importantly, the new technology was leveraged by the LED industry to begin commercial production of white LEDs, the semiconductor ecological light source.
GaN-based white LED will be an integral part of the global wave of lighting upgrades worldwide.
Nakamura is a co-author of “The Blue Laser Diode: The Complete Story” (Springer, 2000). His work is chronicled in the book “Brilliant! Shuji Nakamura And the Revolution in Lighting Technology” by Bob Johnstone (Prometheus Books, 2007).
In 2006, Nakamura won the Millennium Technology Prize of Finland, known as “the Nobel Prize in the technology field.” In 2004, he received the Benjamin Franklin Medal in the engineering segment, previously conferred upon Thomas Edison and Albert Einstein. In addition, he won The Economist's Innovation Award, given to only six scientists who have made an outstanding contribution to innovation of technology. In 2009, he received the Harvey Prize from the Technion in Israel.
Nakamura holds B.A., M.A. and Ph.D. degrees in Electronic Engineering from the University of Tokushima, Japan. He was appointed a professor in the Materials Department at University of California, Santa Barbara, in 2000.
As a professor in the Material Department and co-director of the Solid State Lighting and Energy Center (SSLEC) at the University of California, Santa Barbara, Prof. Nakamura is leading the effort to develop the next-generation LED and Laser Diode (LD) based on the blue LED, as well as a GaN-based solar cell.
“Seoul Semiconductor Co., Ltd. is proud to be one of the industrial sponsors of the SSLEC. Prof. Nakamura’s consulting will lead Seoul Semiconductor's bright future,” Senior Vice President S.M. Lee of Seoul Semiconductor said.
Doug Hardman, North American Marketing Director for Seoul Semiconductor, said, “The legendary Professor Shuji Nakamura’s consultancy with Seoul Semiconductor is sure to accelerate our leadership position in LED technology for North America and all the world.”
Nakamura is a professor at the Materials Department of the College of Engineering, University of California, Santa Barbara (UCSB). He is widely known for having developed the high-brightness blue LED based on GaN in 1993, while working for Nichia Corp. in Japan. In those days, developing a blue LED was considered impossible; only red and green LEDs had been available for the prior 20 years.
Prof. Nakamura’s innovation allowed LED manufacturers to produce LEDs with three primary colors (red, green and blue) which could be mixed to express 16 million colors. Perhaps most importantly, the new technology was leveraged by the LED industry to begin commercial production of white LEDs, the semiconductor ecological light source.
GaN-based white LED will be an integral part of the global wave of lighting upgrades worldwide.
Nakamura is a co-author of “The Blue Laser Diode: The Complete Story” (Springer, 2000). His work is chronicled in the book “Brilliant! Shuji Nakamura And the Revolution in Lighting Technology” by Bob Johnstone (Prometheus Books, 2007).
In 2006, Nakamura won the Millennium Technology Prize of Finland, known as “the Nobel Prize in the technology field.” In 2004, he received the Benjamin Franklin Medal in the engineering segment, previously conferred upon Thomas Edison and Albert Einstein. In addition, he won The Economist's Innovation Award, given to only six scientists who have made an outstanding contribution to innovation of technology. In 2009, he received the Harvey Prize from the Technion in Israel.
Nakamura holds B.A., M.A. and Ph.D. degrees in Electronic Engineering from the University of Tokushima, Japan. He was appointed a professor in the Materials Department at University of California, Santa Barbara, in 2000.
As a professor in the Material Department and co-director of the Solid State Lighting and Energy Center (SSLEC) at the University of California, Santa Barbara, Prof. Nakamura is leading the effort to develop the next-generation LED and Laser Diode (LD) based on the blue LED, as well as a GaN-based solar cell.
“Seoul Semiconductor Co., Ltd. is proud to be one of the industrial sponsors of the SSLEC. Prof. Nakamura’s consulting will lead Seoul Semiconductor's bright future,” Senior Vice President S.M. Lee of Seoul Semiconductor said.
Doug Hardman, North American Marketing Director for Seoul Semiconductor, said, “The legendary Professor Shuji Nakamura’s consultancy with Seoul Semiconductor is sure to accelerate our leadership position in LED technology for North America and all the world.”
Wednesday, March 24, 2010
SiFotonics announces world's first commercial integrated optical receiver
OFC/NFOEC 2010, WOBURN, USA: SiFotonics Technologies Co. Ltd., a leading supplier of optical communications components based on the Silicon Photonics technology platform, announced that the TP1001, an integrated receiver for 2.5Gb/s optical communication applications is available for volume production.
The TP1001 receiver consists of a strained Germanium detector monolithically integrated with a trans-impedance amplifier (TIA) fabricated on an 8-inch Silicon wafer. The fabrication was successfully conducted at two of the leading global semiconductor foundries.
Dr. Dong Pan, CEO of SiFotonics, said: “In the past, the industry relied on a two-chip solution to produce an optical receiver: one GaAs or InP based photodetector and one trans-impedance amplifier. At SiFotonics, we have overcome numerous technical challenges to integrate these two functions onto a single silicon chip that can be fabricated in commercially available foundries. We are thrilled to announce that our TP1001, an integrated 2.5Gb/s receiver, has passed all functional and reliability tests.
“To our knowledge, this is the world’s first commercial grade monolithically integrated optical receiver chip using CMOS technology. This exciting development came as a result of implementing many years of cutting edge research at the Massachusetts Institute of Technology, one of the world’s leading research institutions in the field of Silicon Photonics. We expect to bring a 10Gb/s version to the market using the same technologies and processes in a very short period of time.”
“The monolithic receiver is a great achievement. It shows both technical excellence and outstanding process and design coordination,” said Dr. Lionel C. Kimerling, Thomas Lord Professor of Materials Science & Engineering at the Massachusetts Institute of Technology.
“The TP1001 opens a new page in our industry not only for telecommunication applications but also for data communications as we are able to integrate additional application specific logic with TP1001 by using the same CMOS process,” added Jack Yuan, VP of Sales and Marketing of SiFotonicsTM. “In addition, the TP1001 at 2.5Gb/s brings light speed communication capability at very low cost to enable the penetration of optical links into cost sensitive applications, such as data communications and consumer electronics.”
TP1001 is a Germanium on Silicon based 2.5Gb/s Photo Detector integrated with a CMOS TIA. The TP1001 is designed to be used in front of a fiber input and operates by receiving the optical signal and converting it to an electrical signal, responding to four key optical wavelengths: 650nm, 850nm, 1310nm, and 1550nm.
Fabricated in the standard CMOS process with a +3.3V power supply, the TP1001 offers typical -25dBm sensitivity and responsivity of 0.9 A/W. The on-chip TIA offers a differential gain of 300K ohms, and the whole chip typically runs under 132mW. The TP1001 is available now for sampling and will enter mass production in June 2010.
The TP1001 receiver consists of a strained Germanium detector monolithically integrated with a trans-impedance amplifier (TIA) fabricated on an 8-inch Silicon wafer. The fabrication was successfully conducted at two of the leading global semiconductor foundries.
Dr. Dong Pan, CEO of SiFotonics, said: “In the past, the industry relied on a two-chip solution to produce an optical receiver: one GaAs or InP based photodetector and one trans-impedance amplifier. At SiFotonics, we have overcome numerous technical challenges to integrate these two functions onto a single silicon chip that can be fabricated in commercially available foundries. We are thrilled to announce that our TP1001, an integrated 2.5Gb/s receiver, has passed all functional and reliability tests.
“To our knowledge, this is the world’s first commercial grade monolithically integrated optical receiver chip using CMOS technology. This exciting development came as a result of implementing many years of cutting edge research at the Massachusetts Institute of Technology, one of the world’s leading research institutions in the field of Silicon Photonics. We expect to bring a 10Gb/s version to the market using the same technologies and processes in a very short period of time.”
“The monolithic receiver is a great achievement. It shows both technical excellence and outstanding process and design coordination,” said Dr. Lionel C. Kimerling, Thomas Lord Professor of Materials Science & Engineering at the Massachusetts Institute of Technology.
“The TP1001 opens a new page in our industry not only for telecommunication applications but also for data communications as we are able to integrate additional application specific logic with TP1001 by using the same CMOS process,” added Jack Yuan, VP of Sales and Marketing of SiFotonicsTM. “In addition, the TP1001 at 2.5Gb/s brings light speed communication capability at very low cost to enable the penetration of optical links into cost sensitive applications, such as data communications and consumer electronics.”
TP1001 is a Germanium on Silicon based 2.5Gb/s Photo Detector integrated with a CMOS TIA. The TP1001 is designed to be used in front of a fiber input and operates by receiving the optical signal and converting it to an electrical signal, responding to four key optical wavelengths: 650nm, 850nm, 1310nm, and 1550nm.
Fabricated in the standard CMOS process with a +3.3V power supply, the TP1001 offers typical -25dBm sensitivity and responsivity of 0.9 A/W. The on-chip TIA offers a differential gain of 300K ohms, and the whole chip typically runs under 132mW. The TP1001 is available now for sampling and will enter mass production in June 2010.
Sumitomo Electric, Anritsu to demo 40Gb/s serial EML 1310nm technology
OFC/NFOEC 2010, SAN DIEGO, USA: Sumitomo Electric Industries Ltd and Anritsu Co., will be conducting a joint 40Gb/s technology demonstration in Anritsu’s booth – #3140 – during OFC/NFOEC 2010. The demonstration will showcase Anritsu’s MP1800 BERT Signal Quality Analyzer and External 56G-MUX/DeMUX, and Sumitomo Electric’s 40G EML Laser and 40G Receiver.
The Sumitomo devices are XLMD MSA compliant. The XLMD MSA defines the electrical and optical interface specifications for 40Gbit/s pigtail optical devices supporting the emergence of the compact 40G transceiver module market for high-capacity networks and storage systems.
“The significance of this announcement is that it demonstrates the viability of extending the transmission distance of 40G serial transmission in a conventional single-mode environment, offering higher bandwidth per fiber,” said Masahiro Kobayashi, general manager of Lightwave Devices Division, Sumitomo Electric Device Innovations, Inc. “This demonstration paves the way for a rapid commercial development of 40G systems.”
The demonstration will feature Sumitomo Electric’s 40G EML Laser and 40G Receiver. The 40G EML is ideal for 43Gb/s serial applications and will be capable of distances up to 40 km with an integrated modulator driver IC. The 40G Receiver is housed in an 8-pin package with PIN and TIA and supports 30 GHz bandwidth.
Consisting of an MP1800 BERT Signal Quality Analyzer and MP1821A/MP1822A External 56G-MUX/DeMUX, Anritsu’s 40G test solution supports testing from 0.1Gbps to 56Gbps serial BERT with the 3.5Vp-p high-amplitude output and cross point adjustment. The solution provides the fastest Tr/Tf and minimum intrinsic jitter.
The flexible and expandable configuration of the MP1800 BERT allows users to customize the system to fit their specific applications. The solution not only supports the 56G serial BERT but also 100G applications, such as CFP testing (25.78G x 4) and DP-QPSK.
The Sumitomo devices are XLMD MSA compliant. The XLMD MSA defines the electrical and optical interface specifications for 40Gbit/s pigtail optical devices supporting the emergence of the compact 40G transceiver module market for high-capacity networks and storage systems.
“The significance of this announcement is that it demonstrates the viability of extending the transmission distance of 40G serial transmission in a conventional single-mode environment, offering higher bandwidth per fiber,” said Masahiro Kobayashi, general manager of Lightwave Devices Division, Sumitomo Electric Device Innovations, Inc. “This demonstration paves the way for a rapid commercial development of 40G systems.”
The demonstration will feature Sumitomo Electric’s 40G EML Laser and 40G Receiver. The 40G EML is ideal for 43Gb/s serial applications and will be capable of distances up to 40 km with an integrated modulator driver IC. The 40G Receiver is housed in an 8-pin package with PIN and TIA and supports 30 GHz bandwidth.
Consisting of an MP1800 BERT Signal Quality Analyzer and MP1821A/MP1822A External 56G-MUX/DeMUX, Anritsu’s 40G test solution supports testing from 0.1Gbps to 56Gbps serial BERT with the 3.5Vp-p high-amplitude output and cross point adjustment. The solution provides the fastest Tr/Tf and minimum intrinsic jitter.
The flexible and expandable configuration of the MP1800 BERT allows users to customize the system to fit their specific applications. The solution not only supports the 56G serial BERT but also 100G applications, such as CFP testing (25.78G x 4) and DP-QPSK.
ON Semiconductor 1 Amp voltage regulator family addresses market lack of devices to support sub 1 Volt rails
PHOENIX, USA: ON Semiconductor has extended its product portfolio with the introduction of five new CMOS linear voltage regulator families. The NCP69x families are optimized for use in low current consumption portable battery-powered and ‘always on’ applications such as cable modems, satellite receivers, digital-set-top boxes and electricity meters.
The NCP690, NCP691 and NCP692 are Very Low Dropout (VLDO) 1 A regulator devices available with an adjustable output voltage from 5.0 V down to 1.25 V or in fixed voltage versions.
The devices offer a power supply rejection ratio (PSRR) of 62 dB, low quiescent current (145 uA typical) and low noise (50 µVrms) operation, as well as short circuit and thermal protection. They have greatly enhanced electro-static discharge (ESD) protection of 4 kV compared to standard CMOS LDOs, and are designed to be utilized with low-cost ceramic capacitors. The NCP691 includes an enable-low function, while the NCP692 has an enable-high function.
The NCP693 1 A regulator operates with a supply current of only 65 µA at no load, and a standby mode with a supply current less than 0.15 µA, selected by a chip enable pin. Standard voltage versions are 0.8 V, 1.0 V, 1.2 V, 2.5 V and 3.3 V.
This series is complemented by the NCP694, which is an Ultra Low Dropout (ULDO) 1 A regulator for applications where there is a small differential between the input and output voltage. It offers -3 mV (typical) load regulation and a 60 μA (typical) quiescent current. A ripple rejection of 70 dB (typical), along with a current limit and thermal protection, makes this a very robust and versatile device. It is available in an adjustable version with a minimum output voltage of 1.0 V, and in fixed voltage options of 0.8 V, 1.0 V, 1.2 V, 2.5 V, and 3.3 V.
“With greater emphasis being placed on energy efficient designs, engineers need to be able to specify lower voltages,” states Mike Paquette, Director of the Regulation Business Unit at ON Semiconductor.
“With the NCP690, NCP691 and NCP692 1 A linear voltage regulators we are able to offer a high-performance solution for 1.5 V rails. By selecting the NCP693 and NCP694, our customers can add a sub 1.2 V rail to their design without needing to rely on a switcher and the associated peripheral components. This means the design will not be as complicated or electrically noisy, and will occupy less board space, as well as being more cost effective to implement.”
The NCP690, NCP691 and NCP692 are Very Low Dropout (VLDO) 1 A regulator devices available with an adjustable output voltage from 5.0 V down to 1.25 V or in fixed voltage versions.
The devices offer a power supply rejection ratio (PSRR) of 62 dB, low quiescent current (145 uA typical) and low noise (50 µVrms) operation, as well as short circuit and thermal protection. They have greatly enhanced electro-static discharge (ESD) protection of 4 kV compared to standard CMOS LDOs, and are designed to be utilized with low-cost ceramic capacitors. The NCP691 includes an enable-low function, while the NCP692 has an enable-high function.
The NCP693 1 A regulator operates with a supply current of only 65 µA at no load, and a standby mode with a supply current less than 0.15 µA, selected by a chip enable pin. Standard voltage versions are 0.8 V, 1.0 V, 1.2 V, 2.5 V and 3.3 V.
This series is complemented by the NCP694, which is an Ultra Low Dropout (ULDO) 1 A regulator for applications where there is a small differential between the input and output voltage. It offers -3 mV (typical) load regulation and a 60 μA (typical) quiescent current. A ripple rejection of 70 dB (typical), along with a current limit and thermal protection, makes this a very robust and versatile device. It is available in an adjustable version with a minimum output voltage of 1.0 V, and in fixed voltage options of 0.8 V, 1.0 V, 1.2 V, 2.5 V, and 3.3 V.
“With greater emphasis being placed on energy efficient designs, engineers need to be able to specify lower voltages,” states Mike Paquette, Director of the Regulation Business Unit at ON Semiconductor.
“With the NCP690, NCP691 and NCP692 1 A linear voltage regulators we are able to offer a high-performance solution for 1.5 V rails. By selecting the NCP693 and NCP694, our customers can add a sub 1.2 V rail to their design without needing to rely on a switcher and the associated peripheral components. This means the design will not be as complicated or electrically noisy, and will occupy less board space, as well as being more cost effective to implement.”
Fairchild's LED driver addresses customers' need for compact backlighting solution in portable designs
SAN JOSE, USA: Fairchild Semiconductor continues to meet customers’ needs for a compact, flexible solution that saves power while enabling more features in today’s battery-operated, portable electronics.
The FAN5341 is a highly efficient LED driver solution that improves brightness and resolution in portable designs, while offering 32 linear dimming steps and driving up to five white LEDs in series. By driving the LEDs in series this device ensures that all the LEDs used in applications such as mobile handsets, digital still cameras, GPS devices, MP3 players and other applications using small LCD displays have equal brightness.
This boost LED driver operates at 1.2MHz switching frequency, and integrates a Schottky diode to minimize the size of the external passive components and overall board space. With the FAN5341’s simple single-wire interface, a designer can easily control the brightness levels of the LEDs by transmitting digital pulses from the microcontroller to the FAN5341.
Since this lighting solution drives three to five LEDs in a series, the same current flows through each LED to ensure equal brightness. This LED driver also addresses space and power considerations in portable designs since it offers up to 83 percent efficiency, minimizing power consumption. The FAN5341 is assembled in a compact, low profile 2mm x 2mm UMLP package.
The FAN5341 is the newest addition to Fairchild’s portfolio of lighting solutions for portable applications. Fairchild continues to drive innovation in the lighting area by developing market-driven products that lower the overall solution cost, while providing excellent performance.
The FAN5341 is a highly efficient LED driver solution that improves brightness and resolution in portable designs, while offering 32 linear dimming steps and driving up to five white LEDs in series. By driving the LEDs in series this device ensures that all the LEDs used in applications such as mobile handsets, digital still cameras, GPS devices, MP3 players and other applications using small LCD displays have equal brightness.
This boost LED driver operates at 1.2MHz switching frequency, and integrates a Schottky diode to minimize the size of the external passive components and overall board space. With the FAN5341’s simple single-wire interface, a designer can easily control the brightness levels of the LEDs by transmitting digital pulses from the microcontroller to the FAN5341.
Since this lighting solution drives three to five LEDs in a series, the same current flows through each LED to ensure equal brightness. This LED driver also addresses space and power considerations in portable designs since it offers up to 83 percent efficiency, minimizing power consumption. The FAN5341 is assembled in a compact, low profile 2mm x 2mm UMLP package.
The FAN5341 is the newest addition to Fairchild’s portfolio of lighting solutions for portable applications. Fairchild continues to drive innovation in the lighting area by developing market-driven products that lower the overall solution cost, while providing excellent performance.
Avago announces GPS front-end module with lowest noise figure for mobile apps
SAN JOSE, USA & SINGAPORE: Avago Technologies announced the expansion of its market leading ultra low-noise GPS front-end modules for mobile GPS applications.
The ALM-2712, which has the lowest noise figure of any GPS filter-LNA-filter modules in the industry, integrates pre- and post-high rejection FBAR filters to provide superior performance. This integrated FBAR filter provides low insertion loss in GPS band frequencies and exceptional out of band rejection at cellular, DCS/PCS and WLAN band frequencies, making it an ideal device for use in simultaneous GPS (S-GPS), voice and data operations in today’s mobile handsets.
S-GPS and other location-based GPS services used in mobile handsets require a high level of receiver sensitivity. Avago’s ALM-2712 delivers a very low noise figure and high linearity performance which helps to significantly improve the sensitivity of the GPS receivers.
By integrating the low noise amplifier (LNA), pre- and post high-rejection FBAR filters, and other RF matching components into the module, the ALM-2712 does not require any external RF matching components. As a result, it helps customers to simplify the design process, and reduce board space and component count in their applications. Moreover, the ALM-2712 has a built-in shunt inductor at the RF input pin to enhance ESD production, which allows the device to survive more than 3kV of Human Body Model (HBM) ESD charge at the RF input pin.
Avago’s ALM-2712 GPS module is housed in a miniature 3.0 by 2.5 by 1.0 mm MCOB package and is ideal for use in space constrained applications. At a typical operating condition of 2.7V and 7.5mA, this GPS front-end module effectively leverages Avago’s 0.25 µm GaAs enhancement-mode pHEMT process and its leading-edge proprietary FBAR filtering technologies, to deliver a 1.26 dB noise figure, 14.2 dB gain, and + 5 dBm input third order intercept point (IIP3) and 89dBc/80dBc/72dBc of out of band rejection at cellular, DCS/PCS and WLAN band frequencies.
These features combine to make the ALM-2712 an ideal solution to help enhance the performance of the GPS receivers used in mobile handsets and other GPS applications.
The ALM-2712, which has the lowest noise figure of any GPS filter-LNA-filter modules in the industry, integrates pre- and post-high rejection FBAR filters to provide superior performance. This integrated FBAR filter provides low insertion loss in GPS band frequencies and exceptional out of band rejection at cellular, DCS/PCS and WLAN band frequencies, making it an ideal device for use in simultaneous GPS (S-GPS), voice and data operations in today’s mobile handsets.
S-GPS and other location-based GPS services used in mobile handsets require a high level of receiver sensitivity. Avago’s ALM-2712 delivers a very low noise figure and high linearity performance which helps to significantly improve the sensitivity of the GPS receivers.
By integrating the low noise amplifier (LNA), pre- and post high-rejection FBAR filters, and other RF matching components into the module, the ALM-2712 does not require any external RF matching components. As a result, it helps customers to simplify the design process, and reduce board space and component count in their applications. Moreover, the ALM-2712 has a built-in shunt inductor at the RF input pin to enhance ESD production, which allows the device to survive more than 3kV of Human Body Model (HBM) ESD charge at the RF input pin.
Avago’s ALM-2712 GPS module is housed in a miniature 3.0 by 2.5 by 1.0 mm MCOB package and is ideal for use in space constrained applications. At a typical operating condition of 2.7V and 7.5mA, this GPS front-end module effectively leverages Avago’s 0.25 µm GaAs enhancement-mode pHEMT process and its leading-edge proprietary FBAR filtering technologies, to deliver a 1.26 dB noise figure, 14.2 dB gain, and + 5 dBm input third order intercept point (IIP3) and 89dBc/80dBc/72dBc of out of band rejection at cellular, DCS/PCS and WLAN band frequencies.
These features combine to make the ALM-2712 an ideal solution to help enhance the performance of the GPS receivers used in mobile handsets and other GPS applications.
Molex showcases next-generation PRIZM LightTurn cable assemblies
OFC/NFOEC 2010, LISLE, USA: Molex Inc. announced the availability of PRIZM LightTurn cable assemblies, using the low-profile connectors from US Conec Ltd. that mate to Avago Technologies’ new MicroPODTM 120 Gbps board mounted parallel optic modules.
The Prizm LightTurn’s perpendicular mating capability improves airflow and cable management as well as increases real-estate opportunities on dense printed circuit boards (PCB).
Molex provides the multi-fiber cable assembly termination expertise and assembly capabilities for this next-generation solution. “By combining Molex’s PRIZM LightTurn cable assemblies with Molex’s high-density front panel and blindmate backplane interconnects we are able to offer our customers the most diverse end-to-end solutions,” said Tom Schiltz, product manager, Multi Fiber Products, Molex.
“The unique perpendicular mating of the PRIZM LightTurn connector to Avago’s MicroPOD module is an improvement over current parallel optical modules used in the telecom, datacom and emerging high speed computercom markets.”
The perpendicular mating allows for the tight spacing of modules and improved cable management because the parallel optical modules can be aligned in rows. The multi-fiber ribbon cable assemblies are mated on top of the modules, providing improved airflow on the PCB. By using 12-, 24-, 48-, and 72-fiber MT ferrules, PRIZM LightTurn 12 fiber ribbon fiber cables can be mated to Molex’s high density interconnects including HBMT, Array Connector and Circular MT connectors.
The Prizm LightTurn’s perpendicular mating capability improves airflow and cable management as well as increases real-estate opportunities on dense printed circuit boards (PCB).
Molex provides the multi-fiber cable assembly termination expertise and assembly capabilities for this next-generation solution. “By combining Molex’s PRIZM LightTurn cable assemblies with Molex’s high-density front panel and blindmate backplane interconnects we are able to offer our customers the most diverse end-to-end solutions,” said Tom Schiltz, product manager, Multi Fiber Products, Molex.
“The unique perpendicular mating of the PRIZM LightTurn connector to Avago’s MicroPOD module is an improvement over current parallel optical modules used in the telecom, datacom and emerging high speed computercom markets.”
The perpendicular mating allows for the tight spacing of modules and improved cable management because the parallel optical modules can be aligned in rows. The multi-fiber ribbon cable assemblies are mated on top of the modules, providing improved airflow on the PCB. By using 12-, 24-, 48-, and 72-fiber MT ferrules, PRIZM LightTurn 12 fiber ribbon fiber cables can be mated to Molex’s high density interconnects including HBMT, Array Connector and Circular MT connectors.
Avago announces new 40Gbps Ethernet QSFP transceiver for short-range multi-lane communication and interconnect apps
OFC/NFOEC 2010, SAN DIEGO, USA: Avago Technologies has announced a new four-channel pluggable parallel optic QSFP transceiver module for 40 Gigabit Ethernet applications.
This latest addition to Avago’s expanding portfolio of QSFP transceivers is a high performance module, fully compliant to the IEEE 802.3ba 40GBASE SR4 specification.
This transceiver provides a solution for multi-lane data communication and interconnect applications that integrate four independent 10 Gigabit per second (Gbps) data lanes in each direction to provide 40Gbps aggregate bandwidth. In addition to 40Gbps Ethernet interconnects, this transceiver can be used in datacom/telecom switch, and router connections, as well as data aggregation and backplane applications.
With the need for high bandwidth and density in many of today’s data centers and high performance computing applications, the bandwidth limitations, power and size requirements of copper interconnects are reaching their limits and rapidly becoming less effective. As a result, system designers are making the transition to optical interconnects, which have the capability to handle much higher bandwidths for longer reach lengths, while consuming less power to operate, and with improved EMI and flexible cable management than copper interconnect solutions.
Avago’s QSFP transceiver module provides designers with maximum flexibility to support installations of varying cable links or for difficult cable plant installations. This new QSFP transceiver module, which is now available for sampling, incorporates Avago’s proven integrated circuit and VCSEL technology to provide high performance and long life reliability.
With data rates of 10Gbps for up to 100 meters using OM3 fiber, Avago’s QSFP module is designed to operate over multimode fiber systems using a nominal wavelength of 850nm. The electrical interface uses a 38 contact edge type connector while the optical interface uses either an 8 or 12 fiber MTP® (MPO) connector.
Avago’s QSFP transceiver module also provides superior electro-optical performance to enable optimal jitter performance required for high speed computing, server clustering, Infiniband and Ethernet switching and core routers. Additionally, this transceiver is hot pluggable for ease of installation and servicing, and backward compatible with 5 and 2.5Gbps per channel applications.
This latest addition to Avago’s expanding portfolio of QSFP transceivers is a high performance module, fully compliant to the IEEE 802.3ba 40GBASE SR4 specification.
This transceiver provides a solution for multi-lane data communication and interconnect applications that integrate four independent 10 Gigabit per second (Gbps) data lanes in each direction to provide 40Gbps aggregate bandwidth. In addition to 40Gbps Ethernet interconnects, this transceiver can be used in datacom/telecom switch, and router connections, as well as data aggregation and backplane applications.
With the need for high bandwidth and density in many of today’s data centers and high performance computing applications, the bandwidth limitations, power and size requirements of copper interconnects are reaching their limits and rapidly becoming less effective. As a result, system designers are making the transition to optical interconnects, which have the capability to handle much higher bandwidths for longer reach lengths, while consuming less power to operate, and with improved EMI and flexible cable management than copper interconnect solutions.
Avago’s QSFP transceiver module provides designers with maximum flexibility to support installations of varying cable links or for difficult cable plant installations. This new QSFP transceiver module, which is now available for sampling, incorporates Avago’s proven integrated circuit and VCSEL technology to provide high performance and long life reliability.
With data rates of 10Gbps for up to 100 meters using OM3 fiber, Avago’s QSFP module is designed to operate over multimode fiber systems using a nominal wavelength of 850nm. The electrical interface uses a 38 contact edge type connector while the optical interface uses either an 8 or 12 fiber MTP® (MPO) connector.
Avago’s QSFP transceiver module also provides superior electro-optical performance to enable optimal jitter performance required for high speed computing, server clustering, Infiniband and Ethernet switching and core routers. Additionally, this transceiver is hot pluggable for ease of installation and servicing, and backward compatible with 5 and 2.5Gbps per channel applications.
NeoPhotonics unveils portfolio of 10G PON transceivers for FTTP networks
OFC/NFOEC 2010, SAN DIEGO, USA: NeoPhotonics announced a new line of 10G PON transceivers, compliant with the ITU-T G987.2 and IEEE 802.3av networking standards, to augment its portfolio of GPON and GEPON modules used in “fiber to the premise” (FTTP) networks around the world.
These new pluggable 10G OLT and ONU transceivers enhance NeoPhotonics’ existing line of GPON and GEPON modules for optical line terminals (OLT) and Optical Networking Units (ONU), which are deployed in Central Offices (CO) and at Customer Premises (CPE), respectively. Together, these OLT and ONU devices form a broad portfolio of small form factor transceivers for 10G PON systems manufacturers.
The ITU-T G987.2 compatible transceivers support data rates of 10G in the downstream direction and 2.5G burst mode transmission in the upstream direction covering nominal link budgets of 29 dB and 31 dB. The IEEE 802.3av compatible transceivers support data rates of 10G in the downstream direction and 1G burst mode transmission in the upstream direction covering link budgets of up to 30.5 dB. The OLT transceivers are offered in the XFP form factor, whereas the ONU transceivers come in space and power saving SFP+ form factor. Monitoring features allow early fault location and reduce down time in system operation.
“These 10G PON transceivers complement our current portfolio of FTTP products,” said Tim Jenks, Chairman and CEO of NeoPhotonics. “Our NG PON transceiver line meets the performance and reliability requirements for triple-play access networks and builds on our experience in several segments of the optical access market.”
These new pluggable 10G OLT and ONU transceivers enhance NeoPhotonics’ existing line of GPON and GEPON modules for optical line terminals (OLT) and Optical Networking Units (ONU), which are deployed in Central Offices (CO) and at Customer Premises (CPE), respectively. Together, these OLT and ONU devices form a broad portfolio of small form factor transceivers for 10G PON systems manufacturers.
The ITU-T G987.2 compatible transceivers support data rates of 10G in the downstream direction and 2.5G burst mode transmission in the upstream direction covering nominal link budgets of 29 dB and 31 dB. The IEEE 802.3av compatible transceivers support data rates of 10G in the downstream direction and 1G burst mode transmission in the upstream direction covering link budgets of up to 30.5 dB. The OLT transceivers are offered in the XFP form factor, whereas the ONU transceivers come in space and power saving SFP+ form factor. Monitoring features allow early fault location and reduce down time in system operation.
“These 10G PON transceivers complement our current portfolio of FTTP products,” said Tim Jenks, Chairman and CEO of NeoPhotonics. “Our NG PON transceiver line meets the performance and reliability requirements for triple-play access networks and builds on our experience in several segments of the optical access market.”
Mindspeed demos fiber-optic component family
OFC/NFOEC 2010, NEWPORT BEACH, USA: Mindspeed Technologies Inc., a leading supplier of semiconductor solutions for network infrastructure applications, is demonstrating its broad family of fiber-optic components at OFC/NFOEC 2010.
Mindspeed’s M02098 programmable burst-mode laser driver includes an integrated limiting amplifier, analog-to-digital converter (ADC) and digital-to-analog converter (DAC), and joins the company’s growing family of physical media devices (PMDs) for a comprehensive range of xPON FTTx applications.
Like its highly popular predecessor, the M02090 device, the M02098 driver incorporates the company’s proven dual closed-loop Eye-Minder technology for real-time monitoring and compensation for laser aging and temperature effects to reduce production testing requirements and lower overall optical network terminal (ONT) system costs.
The M02098 driver can be implemented in a small form factor (SFF) or small form factor pluggable (SFP) optical transceiver, or with a bi-directional optical sub-assembly (BOSA) that can be mounted directly onto the ONT board to significantly reduce overall bill-of-material (BOM) costs in Gigabit PON (GPON), Gigabit Ethernet PON (GEPON) and other xPON applications. Mindspeed will be demonstrating the M02098 driver’s proven dual closed-loop configuration along with its latest high-performance transimpedance amplifier (TIA) at OFC/NFOEC 2010.
Mindspeed will be featuring its symmetric 10G-EPON optical network unit (ONU) and optical line terminal (OLT) chipset at OFC/NFOEC 2010, which includes the low-power M02170 direct-modulated laser (DML) driver, M02172 low-power electroabsorption modulated laser (EML) driver and M02142 multi-datarate post-amplifier, which are designed in small form factor pluggable (XFP) module reference design operating at 10Gbps in both the downstream and upstream directions in support of the latest 10G-EPON specifications.
Mindspeed will also highlight its Common Public Radio Interface (CPRI) optical PMD chipset, which fully supports the latest CPRI V4.1 2009-02-18 specification and is optimized for 4.915Gbps and 6.144Gbps operation with lower power consumption compared to traditional 10Gbps PMD chipsets.
The receiver solution includes the M02020 transimpedance amplifier (TIA) combined with the M02049 limiting amplifier, optimized for 4.915 Gigabits/second (Gbps) or the M02129 TIA, combined with the M02142 limiting amplifier for 6.144Gbps. The limiting amplifiers each feature selectable bandwidth for optimal receiver sensitivity across CPRI rates.
On the transmit side, Mindspeed’s CPRI optical PMD solutions include up to 6.2Gbps M02061 laser driver for long-wave laser diodes and the M02069 driver for short-wave vertical-cavity surface-emitting lasers (VCSELs).
Mindspeed’s M02098 programmable burst-mode laser driver includes an integrated limiting amplifier, analog-to-digital converter (ADC) and digital-to-analog converter (DAC), and joins the company’s growing family of physical media devices (PMDs) for a comprehensive range of xPON FTTx applications.
Like its highly popular predecessor, the M02090 device, the M02098 driver incorporates the company’s proven dual closed-loop Eye-Minder technology for real-time monitoring and compensation for laser aging and temperature effects to reduce production testing requirements and lower overall optical network terminal (ONT) system costs.
The M02098 driver can be implemented in a small form factor (SFF) or small form factor pluggable (SFP) optical transceiver, or with a bi-directional optical sub-assembly (BOSA) that can be mounted directly onto the ONT board to significantly reduce overall bill-of-material (BOM) costs in Gigabit PON (GPON), Gigabit Ethernet PON (GEPON) and other xPON applications. Mindspeed will be demonstrating the M02098 driver’s proven dual closed-loop configuration along with its latest high-performance transimpedance amplifier (TIA) at OFC/NFOEC 2010.
Mindspeed will be featuring its symmetric 10G-EPON optical network unit (ONU) and optical line terminal (OLT) chipset at OFC/NFOEC 2010, which includes the low-power M02170 direct-modulated laser (DML) driver, M02172 low-power electroabsorption modulated laser (EML) driver and M02142 multi-datarate post-amplifier, which are designed in small form factor pluggable (XFP) module reference design operating at 10Gbps in both the downstream and upstream directions in support of the latest 10G-EPON specifications.
Mindspeed will also highlight its Common Public Radio Interface (CPRI) optical PMD chipset, which fully supports the latest CPRI V4.1 2009-02-18 specification and is optimized for 4.915Gbps and 6.144Gbps operation with lower power consumption compared to traditional 10Gbps PMD chipsets.
The receiver solution includes the M02020 transimpedance amplifier (TIA) combined with the M02049 limiting amplifier, optimized for 4.915 Gigabits/second (Gbps) or the M02129 TIA, combined with the M02142 limiting amplifier for 6.144Gbps. The limiting amplifiers each feature selectable bandwidth for optimal receiver sensitivity across CPRI rates.
On the transmit side, Mindspeed’s CPRI optical PMD solutions include up to 6.2Gbps M02061 laser driver for long-wave laser diodes and the M02069 driver for short-wave vertical-cavity surface-emitting lasers (VCSELs).
Tuesday, March 23, 2010
SAFC Hitech well positioned for HB LED manufacturing boom
ST. LOUIS, USA: SAFC Hitech, a business segment within SAFC, a division of the Sigma-Aldrich Group, announced it plans to invest $2 million (approximately 1.2mn pounds Sterling) in expanding production of trimethylgallium (TMG) at its Bromborough, Wirral, UK manufacturing plant.
The investment, which was supported by Wirral Council and The Mersey Partnership (TMP), who helped secure additional funding of 300,000 pounds from the Northwest Regional Development Agency (NWDA), is expected to enable SAFC Hitech to strengthen its position as a leading global supplier of TMG and satisfy the growing demand for the material in the production of high brightness LEDs (HBLEDs) for use in applications such as backlighting in flat panel television sets and energy efficient lighting.
Reducing energy consumption and extending energy efficiency are trends driving the global electronics industry to provide more energy-efficient products and systems. Demand in the lighting industry, for example, has seen improvement with the deployment of LEDs to replace currently ubiquitous systems - incandescent light bulbs, fluorescent lighting and its compact fluorescent lamp (CFL) derivative. As a result, the electronics market is at the start of a phase where mass manufacture of HBLEDs is occurring.
TMG has been manufactured at SAFC Hitech's Bromborough facility for a number of years, primarily for supply to the global semiconductor industry. However, as TMG also fulfills the technical criteria for devices designed for the LED, laser, communication and other markets, the boom in demand for LEDs has led to the conclusion that expanding the plant - with its expertise and specific manufacturing knowledge for this process - was the ideal business solution to meet customer demand.
The 300,000 pounds Grant for Business Investment (GBI), which was awarded by the NWDA, is part of 'Solutions for Business', the UK Government's package of publicly-funded business support designed to help companies start and grow.
Dr. Geoff Irvine, VP, Business Development, SAFC Hitech, said: "Expanding our TMG capacity not only draws on our Bromborough facility's core competencies, but also reinforces Sigma-Aldrich's overall strategy of leveraging proprietary technologies and capabilities into new, fast growing market segments, thus differentiating ourselves and our materials offerings through technical innovation."
"This investment is expected to accelerate the delivery of TMG to a growing market position and reinforce our position as a leading global manufacturer and distributor for the growing LED market worldwide, as well as create jobs in the area, which is positive news given the current economic climate."
The investment, which was supported by Wirral Council and The Mersey Partnership (TMP), who helped secure additional funding of 300,000 pounds from the Northwest Regional Development Agency (NWDA), is expected to enable SAFC Hitech to strengthen its position as a leading global supplier of TMG and satisfy the growing demand for the material in the production of high brightness LEDs (HBLEDs) for use in applications such as backlighting in flat panel television sets and energy efficient lighting.
Reducing energy consumption and extending energy efficiency are trends driving the global electronics industry to provide more energy-efficient products and systems. Demand in the lighting industry, for example, has seen improvement with the deployment of LEDs to replace currently ubiquitous systems - incandescent light bulbs, fluorescent lighting and its compact fluorescent lamp (CFL) derivative. As a result, the electronics market is at the start of a phase where mass manufacture of HBLEDs is occurring.
TMG has been manufactured at SAFC Hitech's Bromborough facility for a number of years, primarily for supply to the global semiconductor industry. However, as TMG also fulfills the technical criteria for devices designed for the LED, laser, communication and other markets, the boom in demand for LEDs has led to the conclusion that expanding the plant - with its expertise and specific manufacturing knowledge for this process - was the ideal business solution to meet customer demand.
The 300,000 pounds Grant for Business Investment (GBI), which was awarded by the NWDA, is part of 'Solutions for Business', the UK Government's package of publicly-funded business support designed to help companies start and grow.
Dr. Geoff Irvine, VP, Business Development, SAFC Hitech, said: "Expanding our TMG capacity not only draws on our Bromborough facility's core competencies, but also reinforces Sigma-Aldrich's overall strategy of leveraging proprietary technologies and capabilities into new, fast growing market segments, thus differentiating ourselves and our materials offerings through technical innovation."
"This investment is expected to accelerate the delivery of TMG to a growing market position and reinforce our position as a leading global manufacturer and distributor for the growing LED market worldwide, as well as create jobs in the area, which is positive news given the current economic climate."
Molex intros high performance LC2+ metallic optical connector for harsh environments
LISLE, USA: Molex Inc. has released the new LC2+ optical interconnect product line. The latest offering by Molex for high-density harsh environment optical applications, the LC2+ optical interconnect is a metal connector body and latch version of the popular LC connector system.
It provides an enhanced latch retention system and a specific high temperature strain relief boot that works in conjunction with the latest high temperature enhanced performance (EP) aerospace grade fiber optic cables and sealing features to protect from moisture propagation going through the connector to expensive active devices.
“Molex’s LC2+ connectors have a ruggedized, all-metal-connector housing making them ideal for use in industries that operate under harsh conditions, including industrial, military, medical, aviation and aerospace,” said Mark Matuszewski, product manager, Molex.
“The LC2+ connector’s unique features make further improvements by providing a high-performance discrete fiber solution intended for use in the most rigorous operating environments such as high temperature, severe shock and vibration as well as exposure to high moisture situations.”
The LC2+ system, which will be displayed at the Optical Fiber Communication Conference and Exposition (OFC) and the National Fiber Optic Engineers Conference (NFOEC), booth #2021, March 23-25, is fully compatible with all LC form factor connectors, adapters, active devices and tooling. The optical simplex and duplex connectors are available for multi-mode, single mode and APC applications.
In addition, the LC2+ interconnects from Molex can incorporate Polymicro Technologies’ large core specialty fibers, giving optical system designers a complete solution to connect large core optical fibers used for data, sensing and optical power transmission.
It provides an enhanced latch retention system and a specific high temperature strain relief boot that works in conjunction with the latest high temperature enhanced performance (EP) aerospace grade fiber optic cables and sealing features to protect from moisture propagation going through the connector to expensive active devices.
“Molex’s LC2+ connectors have a ruggedized, all-metal-connector housing making them ideal for use in industries that operate under harsh conditions, including industrial, military, medical, aviation and aerospace,” said Mark Matuszewski, product manager, Molex.
“The LC2+ connector’s unique features make further improvements by providing a high-performance discrete fiber solution intended for use in the most rigorous operating environments such as high temperature, severe shock and vibration as well as exposure to high moisture situations.”
The LC2+ system, which will be displayed at the Optical Fiber Communication Conference and Exposition (OFC) and the National Fiber Optic Engineers Conference (NFOEC), booth #2021, March 23-25, is fully compatible with all LC form factor connectors, adapters, active devices and tooling. The optical simplex and duplex connectors are available for multi-mode, single mode and APC applications.
In addition, the LC2+ interconnects from Molex can incorporate Polymicro Technologies’ large core specialty fibers, giving optical system designers a complete solution to connect large core optical fibers used for data, sensing and optical power transmission.
Luxtera’s OptoPHY transceiver leads industry as low cost optical interconnect for 40G Ethernet apps
OFC/NFOEC 2010, CARLSBAD, USA: Luxtera, a leader in Silicon CMOS photonics, announced OptoPHY’s support for 40G Ethernet applications.
As 10G Ethernet connections migrate to server connectivity, 40G Ethernet is emerging as a preferred solution for switch interconnect, delivering the bandwidth necessary for aggregation of multiple servers.
To enable wide deployment of 40G Ethernet, a low cost optical interconnect is required. OptoPHY is the first CMOS Photonics-based single chip transceiver for on-board deployment. Breaking cost barriers traditionally associated with optics, OptoPHY delivers low power consumption and long reach to surpass legacy copper and VCSEL-based multimode fiber transceivers.
OptoPHY features a smaller form-factor than traditional MSA modules and is ideal for switch interconnect and network interface controller (NIC) applications on servers. The solution complements standard MSA transceivers, specifically Luxtera’s award-winning 40G QSFP Active Optical Cable, Blazar.
At OFC, Luxtera will work with technology partners, Tektronix and NetLogic Microsystems, to display its optical technology through live and static demonstrations. Luxtera will have a live demonstration of OptoPHY inside the Tektronix booth and will showcase OptoPHY as well as Blazar with NetLogic.
“Tektronix is proud to be supporting a live demonstration of the OptoPHY solution for 40G Ethernet. The Tektronix DSA8200 Series Oscilloscope is ideal for characterization and IEEE 802.3 compliance of 40G designs like Luxtera’s CMOS Photonics technology,” said Brian Reich, general manager, Performance Oscilloscopes, Tektronix. “We are excited to showcase the high bandwidth optical connectivity in our testing of Luxtera’s CMOS Photonics technology.”
OptoPHY is also ideal for server-to-switch interconnects in the emerging datacenter applications. OptoPHY’s board-mountable, optical transceivers provide a reliable solution, extending 4,000 meters at industry leading power consumption under 200mW per 10G and benefits of fiber-optic EMI immunity. As datacenters continue to strive for energy efficiency to reduce operation costs and to comply with emerging “green” laws and regulations, OptoPHY leads the charge as a low cost, high performing datacenter connectivity solution.
“NetLogic’s industry-leading low power 10GbE SerDes technology, interoperating with Luxtera’s Silicon CMOS Photonics technology, provides an ideal solution for datacenter connectivity where low power, low latency links are required,” said Shantanu Mitra, vice president of marketing for Physical-Layer products at NetLogic. “Next-generation 40Gbps links based on Luxtera’s QSFP+ modules and NetLogic’s 40G PHY devices are now being developed to address the immediate need for 40Gbps connectivity.”
“Luxtera has already proven the success of Silicon Photonics transceivers in QDR InfiniBand applications and now we are bringing the benefits Silicon Photonics to the 40G Ethernet market. We are looking forward to the demonstration of product capabilities for Ethernet applications at this year’s OFC conference,” said Marek Tlalka, vice president of marketing for Luxtera. “NetLogic and Tektronix are leaders in their respective markets and we are very excited to have the opportunity to showcase our products together with joint demonstrations.”
As 10G Ethernet connections migrate to server connectivity, 40G Ethernet is emerging as a preferred solution for switch interconnect, delivering the bandwidth necessary for aggregation of multiple servers.
To enable wide deployment of 40G Ethernet, a low cost optical interconnect is required. OptoPHY is the first CMOS Photonics-based single chip transceiver for on-board deployment. Breaking cost barriers traditionally associated with optics, OptoPHY delivers low power consumption and long reach to surpass legacy copper and VCSEL-based multimode fiber transceivers.
OptoPHY features a smaller form-factor than traditional MSA modules and is ideal for switch interconnect and network interface controller (NIC) applications on servers. The solution complements standard MSA transceivers, specifically Luxtera’s award-winning 40G QSFP Active Optical Cable, Blazar.
At OFC, Luxtera will work with technology partners, Tektronix and NetLogic Microsystems, to display its optical technology through live and static demonstrations. Luxtera will have a live demonstration of OptoPHY inside the Tektronix booth and will showcase OptoPHY as well as Blazar with NetLogic.
“Tektronix is proud to be supporting a live demonstration of the OptoPHY solution for 40G Ethernet. The Tektronix DSA8200 Series Oscilloscope is ideal for characterization and IEEE 802.3 compliance of 40G designs like Luxtera’s CMOS Photonics technology,” said Brian Reich, general manager, Performance Oscilloscopes, Tektronix. “We are excited to showcase the high bandwidth optical connectivity in our testing of Luxtera’s CMOS Photonics technology.”
OptoPHY is also ideal for server-to-switch interconnects in the emerging datacenter applications. OptoPHY’s board-mountable, optical transceivers provide a reliable solution, extending 4,000 meters at industry leading power consumption under 200mW per 10G and benefits of fiber-optic EMI immunity. As datacenters continue to strive for energy efficiency to reduce operation costs and to comply with emerging “green” laws and regulations, OptoPHY leads the charge as a low cost, high performing datacenter connectivity solution.
“NetLogic’s industry-leading low power 10GbE SerDes technology, interoperating with Luxtera’s Silicon CMOS Photonics technology, provides an ideal solution for datacenter connectivity where low power, low latency links are required,” said Shantanu Mitra, vice president of marketing for Physical-Layer products at NetLogic. “Next-generation 40Gbps links based on Luxtera’s QSFP+ modules and NetLogic’s 40G PHY devices are now being developed to address the immediate need for 40Gbps connectivity.”
“Luxtera has already proven the success of Silicon Photonics transceivers in QDR InfiniBand applications and now we are bringing the benefits Silicon Photonics to the 40G Ethernet market. We are looking forward to the demonstration of product capabilities for Ethernet applications at this year’s OFC conference,” said Marek Tlalka, vice president of marketing for Luxtera. “NetLogic and Tektronix are leaders in their respective markets and we are very excited to have the opportunity to showcase our products together with joint demonstrations.”
Avago eclipses speed and bandwidth barriers with miniature embedded parallel optics modules
OFC/NFOEC 2010, SAN DIEGO, USA: Avago Technologies has developed one of the industry’s most compact and innovative low-cost, high-bandwidth parallel optic solution for short-range data and communication interconnect applications.
Avago’s miniature 12-channel embedded MicroPOD parallel optics transmitter and receiver modules support lane rates of up to 12.5 Gbit per second for an aggregate bandwidth of up to 150 Gbps. These modules enable higher density interconnect solutions than previously possible with other embedded or edge-mount pluggable optical or electrical interconnect solutions.
As an industry leader in delivering embedded parallel optics technologies for differentiated solutions, Avago’s compact transmitter and receiver modules will pave the way in the development of next generation supercomputers, networking switches and routers used in data centers, and in science, research and entertainment industries.
Versatile design solutions are possible as the MicroPOD modules support data rates from 1 to 12.5Gbps in addition to being compliant to IBTA 12xQDR Infiniband and IEEE 802.3ba 100GBASE-SR10 specifications.
Historically, the dominant form factors in embedded computing have been SNAP12 and POP4, with speeds up to 3.125 Gbps per lane. Next-generation computing, switching, and routing systems will require Terabytes of interconnect between nodes.
Avago’s novel MicroPOD modules, which have been designed to meet this market need, offer unprecedented density to extend bandwidth capacity to 12.5 Gbps per lane in a highly compact form factor. With dimensions of 7.8mm (L) by 8.2 mm (W) by 3.9mm (H), these modules incorporate Avago’s VCSEL and PIN array technology and IC technologies to optimize the modules for superior electrical signal integrity and optical performance. Signal integrity is further improved with the use of a micro LGA electrical interface to the host board.
US Conec’s miniature detachable PRIZM LightTurn connector developed specifically for Avago’s MicroPOD receiver and transmitter modules, provides the passive optical connection and enables the dense tiling of the modules on the host printed circuit board.
The use of the PRIZM LightTurn connector in combination with US Conec’s MTP brand MPO style connector provides a significant increase in card edge port density compared to serial and parallel edge-mount pluggable solutions. This solution from US Conec enables simple, low cost termination that requires no polishing of fibers and easy testing, while providing excellent coupling to Avago’s modules.
Avago will be demonstrating its innovative MicroPOD parallel optics solution at the OFC/NFOEC Conference this week at the San Diego Convention Center.
Avago’s miniature 12-channel embedded MicroPOD parallel optics transmitter and receiver modules support lane rates of up to 12.5 Gbit per second for an aggregate bandwidth of up to 150 Gbps. These modules enable higher density interconnect solutions than previously possible with other embedded or edge-mount pluggable optical or electrical interconnect solutions.
As an industry leader in delivering embedded parallel optics technologies for differentiated solutions, Avago’s compact transmitter and receiver modules will pave the way in the development of next generation supercomputers, networking switches and routers used in data centers, and in science, research and entertainment industries.
Versatile design solutions are possible as the MicroPOD modules support data rates from 1 to 12.5Gbps in addition to being compliant to IBTA 12xQDR Infiniband and IEEE 802.3ba 100GBASE-SR10 specifications.
Historically, the dominant form factors in embedded computing have been SNAP12 and POP4, with speeds up to 3.125 Gbps per lane. Next-generation computing, switching, and routing systems will require Terabytes of interconnect between nodes.
Avago’s novel MicroPOD modules, which have been designed to meet this market need, offer unprecedented density to extend bandwidth capacity to 12.5 Gbps per lane in a highly compact form factor. With dimensions of 7.8mm (L) by 8.2 mm (W) by 3.9mm (H), these modules incorporate Avago’s VCSEL and PIN array technology and IC technologies to optimize the modules for superior electrical signal integrity and optical performance. Signal integrity is further improved with the use of a micro LGA electrical interface to the host board.
US Conec’s miniature detachable PRIZM LightTurn connector developed specifically for Avago’s MicroPOD receiver and transmitter modules, provides the passive optical connection and enables the dense tiling of the modules on the host printed circuit board.
The use of the PRIZM LightTurn connector in combination with US Conec’s MTP brand MPO style connector provides a significant increase in card edge port density compared to serial and parallel edge-mount pluggable solutions. This solution from US Conec enables simple, low cost termination that requires no polishing of fibers and easy testing, while providing excellent coupling to Avago’s modules.
Avago will be demonstrating its innovative MicroPOD parallel optics solution at the OFC/NFOEC Conference this week at the San Diego Convention Center.
NeoPhotonics launches ICR for 100 Gbps and 40 Gbps coherent transmission systems
OFC/NFOEC 2010, SAN DIEGO, USA: NeoPhotonics announced the initial availability of its Integrated Coherent Receiver (ICR) for 100 Gbps and 40 Gbps transmission systems. The ICR is an integrated intradyne receiver based on NeoPhotonics’ Photonic Integrated Circuit (PIC) technology.
This device provides advanced demodulation to analyze the state-of-polarization and optical phase of a phase-modulated signal relative to an externally supplied optical reference, enabling recovery of the phase-polarization constellation of 100 Gbps Dual Polarization Quadrature Phase Shift Keyed (DP-DQPSK) format signals.
In addition, the ICR incorporates four sets of high sensitivity balanced photodiodes with four differential linear amplifiers to provide four output channels at 32 Gbaud data rates. A second version performs the same function for 40 Gbps applications.
”We are pleased to add the ICR to our existing line of PIC products for high speed transmission systems. We utilize our hybrid PIC technology to combine an integrated dual 90° Hybrid Coherent Mixer with four balanced photodiodes and the requisite linear amplifiers in a single compact package,” said Tim Jenks, Chairman and CEO of NeoPhotonics.
“NeoPhotonics is actively contributing to developments in the Optical Internetworking Forum (OIF) 100G project, particularly with respect to Integrated Photonics Receiver,” said Wupen Yuen, Vice President of Research and Development at NeoPhotonics. “NeoPhotonics is also participating in the OIF Product Showcase* for 100G components and the NeoPhotonics ICR may be seen displayed there*,” continued Dr. Yuen.
In addition to the ICR, NeoPhotonics currently offers 90° Hybrid Coherent Mixers and DQPSK Demodulators based on PIC technologies. The 90° Hybrid Coherent Mixer provides the demodulation function of the ICR, requires no electrical power, operates across the C or L band and is designed to be used with external photo-receivers. NeoPhotonics’ DQPSK demodulator consists of two Delay Line Interferometers (DLIs) and provides in-phase and quadrature analysis of a phase-encoded signal.
This device provides advanced demodulation to analyze the state-of-polarization and optical phase of a phase-modulated signal relative to an externally supplied optical reference, enabling recovery of the phase-polarization constellation of 100 Gbps Dual Polarization Quadrature Phase Shift Keyed (DP-DQPSK) format signals.
In addition, the ICR incorporates four sets of high sensitivity balanced photodiodes with four differential linear amplifiers to provide four output channels at 32 Gbaud data rates. A second version performs the same function for 40 Gbps applications.
”We are pleased to add the ICR to our existing line of PIC products for high speed transmission systems. We utilize our hybrid PIC technology to combine an integrated dual 90° Hybrid Coherent Mixer with four balanced photodiodes and the requisite linear amplifiers in a single compact package,” said Tim Jenks, Chairman and CEO of NeoPhotonics.
“NeoPhotonics is actively contributing to developments in the Optical Internetworking Forum (OIF) 100G project, particularly with respect to Integrated Photonics Receiver,” said Wupen Yuen, Vice President of Research and Development at NeoPhotonics. “NeoPhotonics is also participating in the OIF Product Showcase* for 100G components and the NeoPhotonics ICR may be seen displayed there*,” continued Dr. Yuen.
In addition to the ICR, NeoPhotonics currently offers 90° Hybrid Coherent Mixers and DQPSK Demodulators based on PIC technologies. The 90° Hybrid Coherent Mixer provides the demodulation function of the ICR, requires no electrical power, operates across the C or L band and is designed to be used with external photo-receivers. NeoPhotonics’ DQPSK demodulator consists of two Delay Line Interferometers (DLIs) and provides in-phase and quadrature analysis of a phase-encoded signal.
Verbatim to announce European entry into LED and OLED lighting markets at Light + Building 2010
EGHAM, UK: Verbatim, a Mitsubishi Chemical company, will announce its entry into the European LED and OLED lighting markets at Light + Building 2010.
Verbatim is a global consumer brand best known for optical media, external hard drives and flash memory data storage. Mitsubishi Chemical Corporation is one of the largest chemical companies in Japan and a world leader in materials for LEDs.
Visitors to the Verbatim stand at Light + Building 2010 will have the first chance to see Verbatim's forthcoming LED lighting products and witness the user benefits of the company's unique approach to the design of high colour rendering index LED and colour tunable lighting systems.
Verbatim's first LED lighting products will be on sale later this year. The stand will also feature the world's first dimmable/tone adjustable OLED prototype, which has been developed through the recently announced Mitsubishi Chemical Corporation and Pioneer Corporation OLED alliance (http://bit.ly/aO00aq).
Gary Milner, president, Verbatim EUMEA, said: "At the Light + Building show we will reveal LED lighting technology that not only provides superior performance over compact fluorescent lights (CFLs) but also offers visible advantages over other LED lighting products on the market today. Our objective is to provide consumers with a better experience of low energy lighting at a competitive price. As with our data storage products, we will be offering technology consumers can trust, based on the many decades of materials and manufacturing expertise of our parent company, Mitsubishi Chemical."
For a given light output, LED lights consume significantly less power than conventional incandescent bulbs. This means that LED lights create the lowest CO2 emissions when powered by conventional sources. They have a typical life of over 50,000 hours, which is equivalent to 15 years*. Mitsubishi Chemical's raw materials for making Verbatim LEDs, including GaN (Gallium nitride) substrate, encapsulant and phosphors, ensure superior efficiency over other LED technologies.
Verbatim is a global consumer brand best known for optical media, external hard drives and flash memory data storage. Mitsubishi Chemical Corporation is one of the largest chemical companies in Japan and a world leader in materials for LEDs.
Visitors to the Verbatim stand at Light + Building 2010 will have the first chance to see Verbatim's forthcoming LED lighting products and witness the user benefits of the company's unique approach to the design of high colour rendering index LED and colour tunable lighting systems.
Verbatim's first LED lighting products will be on sale later this year. The stand will also feature the world's first dimmable/tone adjustable OLED prototype, which has been developed through the recently announced Mitsubishi Chemical Corporation and Pioneer Corporation OLED alliance (http://bit.ly/aO00aq).
Gary Milner, president, Verbatim EUMEA, said: "At the Light + Building show we will reveal LED lighting technology that not only provides superior performance over compact fluorescent lights (CFLs) but also offers visible advantages over other LED lighting products on the market today. Our objective is to provide consumers with a better experience of low energy lighting at a competitive price. As with our data storage products, we will be offering technology consumers can trust, based on the many decades of materials and manufacturing expertise of our parent company, Mitsubishi Chemical."
For a given light output, LED lights consume significantly less power than conventional incandescent bulbs. This means that LED lights create the lowest CO2 emissions when powered by conventional sources. They have a typical life of over 50,000 hours, which is equivalent to 15 years*. Mitsubishi Chemical's raw materials for making Verbatim LEDs, including GaN (Gallium nitride) substrate, encapsulant and phosphors, ensure superior efficiency over other LED technologies.
Monday, March 22, 2010
Ban on incandescent lamps creates immense business potential
TAIWAN: Governments around the world began to commit in promoting energy-saving policies, and the cost of LED lighting began to fall; these factors help to stimulate the growth of the energy-saving market.
Research institute LEDinside indicated that with the ban on incandescent bulbs, business opportunities of 10W and below LED light bulbs began to emerge, and that light makers have cut prices in order to compete in the market that supplies nearly 20 billion units of incandescent bulbs per year.
Take a 7W LED light bulb for instance, a 7W LED bulb cost nearly $15~20 in early 2009, and LED accounted for about 60% of the cost of the bulb. As the cost of LED dropped, a 7W LED bulb currently costs 10 USD, and LED accounts for 40 percent of the cost of the bulb. With the cost decline of the LED light bulb, the retail price between incandescent and fluorescent light bulb narrowed from 15 times to 10 times.
In addition, as governments around the world are facing the soaring energy prices, various policies to reduce energy consumption have been implemented as a counter measure. The first initiative is to ban the use of high energy-consumption incandescent light bulbs.
Based on the timetable of each country planning to ban the use of incandescent bulbs, LEDinside indicated that most countries have set 2012 as the deadline of banning incandescent light bulbs, which also marks the rise of LED lighting.
A case in point – Japanese government signed the Kyoto Protocol in 1997, targeting to reduce Japan’s greenhouse gas emission by 300 million tons. If the existing lighting products are replaced by energy-saving lamps, Japan is expected to cut 3.4 million tons of carbon dioxide emissions.
Recently, the Japanese government implemented a series of subsidy policies in a bid to meet the commitment it made in the Kyoto Protocol; for example, the government will grant subsidies to business users who adopt energy-efficient LED lamps. With 2012 approaching, demand from LED bulbs replacing incandescent bulbs will boom.
Global forecast of LED light
Research institute LEDinside indicated that with the ban on incandescent bulbs, business opportunities of 10W and below LED light bulbs began to emerge, and that light makers have cut prices in order to compete in the market that supplies nearly 20 billion units of incandescent bulbs per year.
Take a 7W LED light bulb for instance, a 7W LED bulb cost nearly $15~20 in early 2009, and LED accounted for about 60% of the cost of the bulb. As the cost of LED dropped, a 7W LED bulb currently costs 10 USD, and LED accounts for 40 percent of the cost of the bulb. With the cost decline of the LED light bulb, the retail price between incandescent and fluorescent light bulb narrowed from 15 times to 10 times.
In addition, as governments around the world are facing the soaring energy prices, various policies to reduce energy consumption have been implemented as a counter measure. The first initiative is to ban the use of high energy-consumption incandescent light bulbs.
Based on the timetable of each country planning to ban the use of incandescent bulbs, LEDinside indicated that most countries have set 2012 as the deadline of banning incandescent light bulbs, which also marks the rise of LED lighting.
A case in point – Japanese government signed the Kyoto Protocol in 1997, targeting to reduce Japan’s greenhouse gas emission by 300 million tons. If the existing lighting products are replaced by energy-saving lamps, Japan is expected to cut 3.4 million tons of carbon dioxide emissions.
Recently, the Japanese government implemented a series of subsidy policies in a bid to meet the commitment it made in the Kyoto Protocol; for example, the government will grant subsidies to business users who adopt energy-efficient LED lamps. With 2012 approaching, demand from LED bulbs replacing incandescent bulbs will boom.
Global forecast of LED light
Vice President Joe Biden visits Cree to discuss green technology and American innovation
DURHAM, USA: Last Thursday, Vice President Joe Biden visited Cree to discuss the Obama administration’s commitment to fighting for issues important to America’s middle class families, including creating well-paying manufacturing jobs and building the clean energy economy. Cree, based in Durham, North Carolina, is a market-leading manufacturer of LED (light-emitting diode) products.
Vice President Biden toured Cree’s facilities with Chuck Swoboda, chairman and CEO of Cree, and spoke with employees about the benefits of working for a green technology company and their concerns about the economy.
“The ongoing support from the Obama administration is important as we promote the value of energy efficiency and sustainability in today’s economy,” said Swoboda. “Cree is creating American clean-tech jobs right now, as we continue to lead the LED lighting revolution.”
Vice President Biden toured Cree’s facilities with Chuck Swoboda, chairman and CEO of Cree, and spoke with employees about the benefits of working for a green technology company and their concerns about the economy.
“The ongoing support from the Obama administration is important as we promote the value of energy efficiency and sustainability in today’s economy,” said Swoboda. “Cree is creating American clean-tech jobs right now, as we continue to lead the LED lighting revolution.”
Saturday, March 20, 2010
Supply of commodity parts remains tight amid conservative capacity management
EL SEGUNDO, USA:While the end of 2009 brought improved availability for many commodity electronic components, supply for most parts remains tight, according to iSuppli Corp.
“As iSuppli has been reporting for several months, the recovering economy has brought renewed demand. However, component suppliers have yet to jump in with both feet when it comes to ramping up capacity,” said Eric Pratt, vice president of pricing and competitive analysis at iSuppli “And moving forward, component manufacturers will continue to take a very conservative approach to capacity expansion.”
Given the ongoing vigilance among manufacturers, inventories will remain lean for the foreseeable future. Despite Days of Inventory (DOI) remaining close to historical lows at nine of the 10 supply chain nodes tracked by iSuppli, many suppliers have no qualms with their current inventory position and remain quite comfortable at their current levels. Among the nodes, only Electronic Manufacturing Service (EMS) providers have shown an increase in inventory.
One reason for the lack of interest in expanding production is that fourth-quarter earnings for component suppliers were exceptionally high. With earnings looking good at the moment and suppliers having taken a beating in late 2008 and most of 2009, companies possess no reason to embark on risky expansion alternatives—including ramping up inventory—that might land them in trouble.
Nonetheless, the conservative approach to inventory won’t last, said Pratt, and component suppliers eventually will have to be more aggressive in order to improve market share. “As demand continues to rise and global macroeconomic trends become more visible, iSuppli believes the attitude of ‘do nothing’ will slowly change,” he added.
iSuppli predicts change will occur near to the third quarter when suppliers aim for increased market share while at the same time maintaining the profits they had acquired in late 2009 and early 2010. The achievement of those goals, however, is contingent on sustained market demand, Pratt noted.
Source: iSuppli, USA
“As iSuppli has been reporting for several months, the recovering economy has brought renewed demand. However, component suppliers have yet to jump in with both feet when it comes to ramping up capacity,” said Eric Pratt, vice president of pricing and competitive analysis at iSuppli “And moving forward, component manufacturers will continue to take a very conservative approach to capacity expansion.”
Given the ongoing vigilance among manufacturers, inventories will remain lean for the foreseeable future. Despite Days of Inventory (DOI) remaining close to historical lows at nine of the 10 supply chain nodes tracked by iSuppli, many suppliers have no qualms with their current inventory position and remain quite comfortable at their current levels. Among the nodes, only Electronic Manufacturing Service (EMS) providers have shown an increase in inventory.
One reason for the lack of interest in expanding production is that fourth-quarter earnings for component suppliers were exceptionally high. With earnings looking good at the moment and suppliers having taken a beating in late 2008 and most of 2009, companies possess no reason to embark on risky expansion alternatives—including ramping up inventory—that might land them in trouble.
Nonetheless, the conservative approach to inventory won’t last, said Pratt, and component suppliers eventually will have to be more aggressive in order to improve market share. “As demand continues to rise and global macroeconomic trends become more visible, iSuppli believes the attitude of ‘do nothing’ will slowly change,” he added.
iSuppli predicts change will occur near to the third quarter when suppliers aim for increased market share while at the same time maintaining the profits they had acquired in late 2009 and early 2010. The achievement of those goals, however, is contingent on sustained market demand, Pratt noted.
Source: iSuppli, USA
Friday, March 19, 2010
Civcom intros industry’s first integrated 40Gbps 300PIN tunable transponder with DCM and EDFA
PETACH TIKVA, ISRAEL: Civcom, a leading technology developer and manufacturer of Opto-electronic components and modules, today announced the availability of a new DPSK tunable 40G transponder as the latest complement to its 10Gbps Free Light family of tunable NRZ and RZ transponders.
Civcom’s 40Gbps 300PIN TRX module will be made available in two different packages:
* Small Form Factor (5” x 5”) featuring standard DPSK modulation format and optional integration with an EDFA.
* Standard MSA size (7” x 5”) featuring integrated tunable DCM and EDFA functions.
"We are proud to introduce the industry's first integrated 40Gbps DPSK transponder, which is built specifically to address the challenging market demands for additional network capacity,” stated Yair Itzhar, VP of Worldwide Sales and Marketing at Civcom. “By integrating our tunable optical dispersion compensation component within the module, manufacturers can effectively increase dispersion tolerance of the transponder while reducing overall cost.”
Civcom’s TRX DPSK module increases dispersion tolerance from the standard ±40ps/nm to as high as ±640ps/nm. The introduction of integrated EDFA increases the dynamic range to 20dB.
The transponder module, which is compatible with the 300PIN MSA standards and I2C standards, uses a widely tunable laser covering the entire C-Band.
Civcom’s 40Gbps 300PIN TRX module will be made available in two different packages:
* Small Form Factor (5” x 5”) featuring standard DPSK modulation format and optional integration with an EDFA.
* Standard MSA size (7” x 5”) featuring integrated tunable DCM and EDFA functions.
"We are proud to introduce the industry's first integrated 40Gbps DPSK transponder, which is built specifically to address the challenging market demands for additional network capacity,” stated Yair Itzhar, VP of Worldwide Sales and Marketing at Civcom. “By integrating our tunable optical dispersion compensation component within the module, manufacturers can effectively increase dispersion tolerance of the transponder while reducing overall cost.”
Civcom’s TRX DPSK module increases dispersion tolerance from the standard ±40ps/nm to as high as ±640ps/nm. The introduction of integrated EDFA increases the dynamic range to 20dB.
The transponder module, which is compatible with the 300PIN MSA standards and I2C standards, uses a widely tunable laser covering the entire C-Band.
Thursday, March 18, 2010
Cree announces industry’s most energy-efficient neutral and warm lighting-class LEDs
DURHAM, USA: Cree Inc. announced the commercial availability of the award-winning XLamp XP-G LED in warm- and neutral-white color temperatures (2600 K to 5000 K CCT).
These new XP-G LEDs extend Cree’s highest level of light output and efficacy across the white color spectrum, driving general lighting applications such as LED replacement lamps, outdoor area and commercial luminaires.
The warm white (3000 K) XLamp XP-G provides up to 114 lumens and 109 lumens per watt at 350 mA. Driven at 1.0 A, the XP-G warm-white produces up to 285 lumens at 84 lumens per watt, which is four times the light output than the highest available XLamp XR-E warm-white LED at equal efficacy.
The neutral-white (4000 K) XLamp XP-G provides up to 139 lumens and 132 lumens per watt at 350 mA. Driven at 1.5 A, the XP-G neutral-white produces up to 463 lumens, which is four times the light output of the XLamp XR-E cool-white LED at equal efficacy.
“We are excited to be working with the newest Cree XP-G LEDs,” said Bob Fugerer, president, Sunovia Energy Technologies. “The extremely high efficacy levels are enabling us to offer our Aimed Optics luminaires in a neutral color while maintaining the same pace-setting mounting-height-to-pole-spacing ratio and fitted target efficiency that we previously achieved with cool-white color temperatures.”
“Cree is once again setting industry-leading efficacy levels in warm and neutral white,” said Paul Thieken, Cree, director of marketing, LED Components. “These new XP-G LEDs can enable LED lighting products that not only meet but exceed the current ENERGY STAR luminaire and lamp requirements. Cree is accelerating the LED lighting revolution by pushing through performance milestones.”
XP-G LEDs deliver high efficacy at high current, potentially reducing the required number of LEDs, as well as the size and cost of LED fixtures. Neutral-white and warm-white XP-G LEDs are commercially available now in the industry’s smallest ANSI-based chromaticity bins.
These new XP-G LEDs extend Cree’s highest level of light output and efficacy across the white color spectrum, driving general lighting applications such as LED replacement lamps, outdoor area and commercial luminaires.
The warm white (3000 K) XLamp XP-G provides up to 114 lumens and 109 lumens per watt at 350 mA. Driven at 1.0 A, the XP-G warm-white produces up to 285 lumens at 84 lumens per watt, which is four times the light output than the highest available XLamp XR-E warm-white LED at equal efficacy.
The neutral-white (4000 K) XLamp XP-G provides up to 139 lumens and 132 lumens per watt at 350 mA. Driven at 1.5 A, the XP-G neutral-white produces up to 463 lumens, which is four times the light output of the XLamp XR-E cool-white LED at equal efficacy.
“We are excited to be working with the newest Cree XP-G LEDs,” said Bob Fugerer, president, Sunovia Energy Technologies. “The extremely high efficacy levels are enabling us to offer our Aimed Optics luminaires in a neutral color while maintaining the same pace-setting mounting-height-to-pole-spacing ratio and fitted target efficiency that we previously achieved with cool-white color temperatures.”
“Cree is once again setting industry-leading efficacy levels in warm and neutral white,” said Paul Thieken, Cree, director of marketing, LED Components. “These new XP-G LEDs can enable LED lighting products that not only meet but exceed the current ENERGY STAR luminaire and lamp requirements. Cree is accelerating the LED lighting revolution by pushing through performance milestones.”
XP-G LEDs deliver high efficacy at high current, potentially reducing the required number of LEDs, as well as the size and cost of LED fixtures. Neutral-white and warm-white XP-G LEDs are commercially available now in the industry’s smallest ANSI-based chromaticity bins.
Wednesday, March 17, 2010
MaxIC expands production for next generation LED lighting with WI Harper investment
BEIJING, CHINA: MaxIC Technology Corp., innovators of energy efficient integrated circuits (ICs) widely used in LEDs for general lighting, LCD TV backlighting, and consumer electronics, announced an expansion capital investment led by WI Harper Group.
Currently shipping four product lines, MaxIC will use this investment to ramp up production and expand the company’s cutting-edge R&D efforts.
With headquarters in Beijing and operation offices in Shenzhen and Hong Kong, MaxIC is known as an emerging Chinese leader in the design, development and marketing of advanced analog, mixed-signal, and power management ICs. The Company addresses several high growth segments of the Light Emitting Diodes (LED) industry including general illumination, industrial and automotive lighting, and LCD backlighting.
“MaxIC is a capital efficient fabless IC technology firm led by a team with industry credentials from an enviable group of global IC leaders,” said Peter Liu, Chairman, WI Harper Group.
“MaxIC’s strategic presence in China provides global customers with cost-effective operations and enables the firm to address huge domestic and international market opportunities. The Company is ideally situated to become a global leader and key ecosystem partner in the LED value chain.”
“LED’s are replacing legacy technology rapidly because they are highly energy efficient, avoid the use of environmental toxins, and dramatically improve the performance of consumer electronics, lighting and communications,” said Dr. Jeff Cheng, President and CEO, MaxIC Technology. “We are excited to serve this dynamic industry with high performance, high efficiency driver ICs and proud to earn WI Harper’s support.”
Currently shipping four product lines, MaxIC will use this investment to ramp up production and expand the company’s cutting-edge R&D efforts.
With headquarters in Beijing and operation offices in Shenzhen and Hong Kong, MaxIC is known as an emerging Chinese leader in the design, development and marketing of advanced analog, mixed-signal, and power management ICs. The Company addresses several high growth segments of the Light Emitting Diodes (LED) industry including general illumination, industrial and automotive lighting, and LCD backlighting.
“MaxIC is a capital efficient fabless IC technology firm led by a team with industry credentials from an enviable group of global IC leaders,” said Peter Liu, Chairman, WI Harper Group.
“MaxIC’s strategic presence in China provides global customers with cost-effective operations and enables the firm to address huge domestic and international market opportunities. The Company is ideally situated to become a global leader and key ecosystem partner in the LED value chain.”
“LED’s are replacing legacy technology rapidly because they are highly energy efficient, avoid the use of environmental toxins, and dramatically improve the performance of consumer electronics, lighting and communications,” said Dr. Jeff Cheng, President and CEO, MaxIC Technology. “We are excited to serve this dynamic industry with high performance, high efficiency driver ICs and proud to earn WI Harper’s support.”
China Ritar Power announces delay in order with China Mobile
SHENZHEN, CHINA: China Ritar Power Corp., a leading Chinese manufacturer of lead acid batteries, announced that the delivery of its order from China Mobile Ltd in the aggregate amount of $15 million originally planned for 2009 has been delayed until 2010.
The delay is a result of a later than expected 3G network rollout by China Mobile.
China Ritar's Chairman and CEO, Jiada Hu stated: "This delay resulted in lower revenue for 2009 than we originally projected. However, we remain confident that the order with China Mobile Limited will be delivered during 2010."
The delay is a result of a later than expected 3G network rollout by China Mobile.
China Ritar's Chairman and CEO, Jiada Hu stated: "This delay resulted in lower revenue for 2009 than we originally projected. However, we remain confident that the order with China Mobile Limited will be delivered during 2010."
Avago announces industry’s first surface mount HB round and oval LED lamps for electronic sign apps
SAN JOSE, USA & SINGAPORE: Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, announced the industry’s first surface mount technology (SMT) high brightness oval and round LED lamps for use in outdoor and indoor electronic sign applications.
Available in Amber, Red, Green and Blue colors, Avago’s round ALMD-xx3D and oval ALMD-Lx36 LED lamps target manufacturers of full color and monochrome traffic signs, highway variable message signs, gas station price signs, and full color video wall applications used for advertising.
With the increased use of LED lamps in the marketplace, more designers of electronic signs are moving towards using LEDs in their designs that are cost effective, offer high performance, high brightness and reliable long-term performance. Moreover, these designers are choosing SMT LEDs because of their ease of assembly, compact footprint, and manufacturing flexibility which can help to reduce overall system design and development costs.
Avago’s round ALMD-xx3D and oval ALMD-Lx36 LEDs have about the same luminous intensity as conventional high brightness through-hole LED lamps and can be assembled using common SMT assembly processes. Additionally, these LED lamps are compatible with industrial reflow soldering processes, and made with an advanced optical grade epoxy to provide superior performance in outdoor sign applications.
For easy pick and place assembly, these LED lamps are shipped in EIA-compliant tape and reels. Each reel is shipped from a single intensity and color bin to provide better uniformity.
Key features
* Compact form factor with well defined spatial radiation pattern
* Viewing angles:
ALMD-xx3D series: 30 degrees
ALMD-Lx36 series: 40 by 100 degrees
* Lens features: Tinted
* High brightness material
* Compatible with industrial reflow soldering processes
* Moisture Sensitivity Level (MSL) 2A.
Avago’s ALMD-xx3D and ALMD-Lx36 LED lamps are priced from $0.24 to $0.30 each, respectively in minimum quantities of 1,000. Samples and production quantities are available now through Avago’s direct sales channel and worldwide distribution partners.
Available in Amber, Red, Green and Blue colors, Avago’s round ALMD-xx3D and oval ALMD-Lx36 LED lamps target manufacturers of full color and monochrome traffic signs, highway variable message signs, gas station price signs, and full color video wall applications used for advertising.
With the increased use of LED lamps in the marketplace, more designers of electronic signs are moving towards using LEDs in their designs that are cost effective, offer high performance, high brightness and reliable long-term performance. Moreover, these designers are choosing SMT LEDs because of their ease of assembly, compact footprint, and manufacturing flexibility which can help to reduce overall system design and development costs.
Avago’s round ALMD-xx3D and oval ALMD-Lx36 LEDs have about the same luminous intensity as conventional high brightness through-hole LED lamps and can be assembled using common SMT assembly processes. Additionally, these LED lamps are compatible with industrial reflow soldering processes, and made with an advanced optical grade epoxy to provide superior performance in outdoor sign applications.
For easy pick and place assembly, these LED lamps are shipped in EIA-compliant tape and reels. Each reel is shipped from a single intensity and color bin to provide better uniformity.
Key features
* Compact form factor with well defined spatial radiation pattern
* Viewing angles:
ALMD-xx3D series: 30 degrees
ALMD-Lx36 series: 40 by 100 degrees
* Lens features: Tinted
* High brightness material
* Compatible with industrial reflow soldering processes
* Moisture Sensitivity Level (MSL) 2A.
Avago’s ALMD-xx3D and ALMD-Lx36 LED lamps are priced from $0.24 to $0.30 each, respectively in minimum quantities of 1,000. Samples and production quantities are available now through Avago’s direct sales channel and worldwide distribution partners.
Tuesday, March 16, 2010
Advanced Circuits acquires Circuit Express
AURORA, USA: Advanced Circuits (ACI) announced the acquisition of Circuit Express (CEI) based in Tempe, AZ.
With this acquisition Advanced Circuits, a leader in the commercial PCB arena, moves aggressively into the high-reliability, military/aerospace/defense, high-technology marketplace. The acquisition will enable Advanced Circuits and Circuit Express to further focus on their core competencies and immediately begin offering expanded services to their customer bases.
CEI brings to Advanced Circuits a stand-alone facility that specializes in advanced technologies (blind/buried vias, high-frequency laminates, .003” line/space, etchback, etc.) with a successful track record in supplying PCBs to military, aerospace, and defense customers.
Advanced Circuits continues to experience record growth and is reporting a strong start for 2010 and the addition in January of many new customers to its already significant customer base.
By allowing Circuit Express customers access to Advanced Circuits’ higher-volume production capabilities, its innovative online quoting and ordering procedures plus exclusive services FreeDFM and PCB Artist, Circuit Express achieves an immediate opportunity for revenue growth potential -- a win/win for both companies.
With this acquisition Advanced Circuits, a leader in the commercial PCB arena, moves aggressively into the high-reliability, military/aerospace/defense, high-technology marketplace. The acquisition will enable Advanced Circuits and Circuit Express to further focus on their core competencies and immediately begin offering expanded services to their customer bases.
CEI brings to Advanced Circuits a stand-alone facility that specializes in advanced technologies (blind/buried vias, high-frequency laminates, .003” line/space, etchback, etc.) with a successful track record in supplying PCBs to military, aerospace, and defense customers.
Advanced Circuits continues to experience record growth and is reporting a strong start for 2010 and the addition in January of many new customers to its already significant customer base.
By allowing Circuit Express customers access to Advanced Circuits’ higher-volume production capabilities, its innovative online quoting and ordering procedures plus exclusive services FreeDFM and PCB Artist, Circuit Express achieves an immediate opportunity for revenue growth potential -- a win/win for both companies.
Seoul Semiconductor LEDs illuminate tourist destination in Spain
VALENCIA, SPAIN: Streets will be brighter, tourists safer, and electrical bills lesser in this Mediterranean resort region, thanks to 1,000 new energy-efficient and cost-effective streetlights using Seoul Semiconductor LEDs.
It’s all part of a program initiated by Revolution LED of Spain to replace existing light bulbs on streets and in public facilities throughout the country with high-quality, energy-efficient lighting.
One thousand street lights using LEDs from Seoul Semiconductor, the global-leading LED manufacturer, have been installed in the municipality of Rafelbunyol.
A year of testing by Revolution LED proved that Seoul Semiconductor’s long-lasting LEDs are up to the job. Seoul Semiconductor LEDs offer the world’s best luminous efficacy (100lm/W) from a single light source. They reliably deliver the necessary brightness and last three times longer than traditional street lights.
Revolution LED reports that energy consumption has been reduced 65 percent as a result of replacing 160 W light bulbs with Seoul Semiconductor’s. The lighting products used in street lights contain 56, 112 and 168 LEDs made by Seoul Semiconductor for three models respectively. The 56 W LED light bulb replaces the existing 160 W bulb and lasts three times as long. The performance of the light bulbs was verified by Polytechnic University of Valencia and the Valencian Institute of Technology.
Sr. Vice President S.M. Lee of Seoul Semiconductor said that an additional 3,000 lighting fixtures soon will be installed throughout the Valencian Community. In addition, product testing is underway on the Atlantic coastal community of Jerez, Spain, where 23,000 street lights will be replaced.
It’s all part of a program initiated by Revolution LED of Spain to replace existing light bulbs on streets and in public facilities throughout the country with high-quality, energy-efficient lighting.
One thousand street lights using LEDs from Seoul Semiconductor, the global-leading LED manufacturer, have been installed in the municipality of Rafelbunyol.
A year of testing by Revolution LED proved that Seoul Semiconductor’s long-lasting LEDs are up to the job. Seoul Semiconductor LEDs offer the world’s best luminous efficacy (100lm/W) from a single light source. They reliably deliver the necessary brightness and last three times longer than traditional street lights.
Revolution LED reports that energy consumption has been reduced 65 percent as a result of replacing 160 W light bulbs with Seoul Semiconductor’s. The lighting products used in street lights contain 56, 112 and 168 LEDs made by Seoul Semiconductor for three models respectively. The 56 W LED light bulb replaces the existing 160 W bulb and lasts three times as long. The performance of the light bulbs was verified by Polytechnic University of Valencia and the Valencian Institute of Technology.
Sr. Vice President S.M. Lee of Seoul Semiconductor said that an additional 3,000 lighting fixtures soon will be installed throughout the Valencian Community. In addition, product testing is underway on the Atlantic coastal community of Jerez, Spain, where 23,000 street lights will be replaced.
ON Semiconductor to demo California Micro Devices’ HB LED protection devices at Designing with LEDs seminar
SANTA CLARA, USA: ON Semiconductor will showcase California Micro Devices’ (CMD) innovative LuxGuard family of turnkey solutions for electrostatic discharge (ESD) protection and thermal management for high power, high brightness light emitting diode (LED) lighting applications at EDN magazine’s Designing with LEDs Seminar and Workshop at the Santa Clara Convention Center in Santa Clara, California, on March 17 as a Silver Sponsor.
CMD’s new LuxGuard CM1753 and CM1754 will be spotlighted at the EDN seminar. These devices feature a 50V breakdown voltage specification, delivering a robust 8kV Human Body Model (HBM) of ESD protection with low input capacitance for high power, high efficacy HBLED lighting applications.
Designed as silicon based side mount ESD protectors, the CM1753 is designed for P-up common cathode configurations and the CM1754 provides identical protection for N-up common anode configurations. Their small form factor enables them to be used in all applications, including existing HBLED lamp modules with 1 to 15 LEDs in the string.
CMD is a wholly owned subsidiary of ON Semiconductor and a pioneer in the development of ESD protection circuits for high power HBLED applications. Since 2001, CMD has shipped more than 300 million units to customers.
The market for high power HBLEDs has expanded beyond traditional market segments such as the status and alphanumeric display markets into a wider range of lighting applications including illumination; automotive; signage and residential and commercial lighting.
Additional ON Semiconductor GreenPoint LED lighting solutions will be demonstrated at Booth 14 including:
* Halogen desk lamp converted to LED using a Cree XLAMP MC-E LED. The lamp is powered by an ON Semiconductor offline LED driver GreenPoint reference design and meets the ENERGY STAR® SSL Power Factor Requirement for Residential Luminaires.
* MR16 LED lamp powered by an ON Semiconductor 1W to 5W LED driver GreenPoint reference design, which allows operation off of 12V ac or 12V dc.
CMD’s new LuxGuard CM1753 and CM1754 will be spotlighted at the EDN seminar. These devices feature a 50V breakdown voltage specification, delivering a robust 8kV Human Body Model (HBM) of ESD protection with low input capacitance for high power, high efficacy HBLED lighting applications.
Designed as silicon based side mount ESD protectors, the CM1753 is designed for P-up common cathode configurations and the CM1754 provides identical protection for N-up common anode configurations. Their small form factor enables them to be used in all applications, including existing HBLED lamp modules with 1 to 15 LEDs in the string.
CMD is a wholly owned subsidiary of ON Semiconductor and a pioneer in the development of ESD protection circuits for high power HBLED applications. Since 2001, CMD has shipped more than 300 million units to customers.
The market for high power HBLEDs has expanded beyond traditional market segments such as the status and alphanumeric display markets into a wider range of lighting applications including illumination; automotive; signage and residential and commercial lighting.
Additional ON Semiconductor GreenPoint LED lighting solutions will be demonstrated at Booth 14 including:
* Halogen desk lamp converted to LED using a Cree XLAMP MC-E LED. The lamp is powered by an ON Semiconductor offline LED driver GreenPoint reference design and meets the ENERGY STAR® SSL Power Factor Requirement for Residential Luminaires.
* MR16 LED lamp powered by an ON Semiconductor 1W to 5W LED driver GreenPoint reference design, which allows operation off of 12V ac or 12V dc.
ECA reports slowdown in February component orders
ARLINGTON, USA: Electronic component orders slowed down in February after a big leap in the first month of the year, according to the monthly report compiled by the Electronic Components Association (ECA). The 12-month average, comparing this year’s results to last year’s, continued an ascent that began last summer.
ECA’s monthly report consolidates order information collected in confidence from leading electronic component manufacturers. The latest results seem to indicate a backing off period after a surge of orders, according to ECA President Bob Willis.
“Component manufacturers had a jump in orders over the last few months to replenish inventories for end products such as cell phones and notebook computers,” says Willis. “I think we’re seeing things even off a bit now that end-product manufacturers have brought their inventories back to levels that can meet anticipated demand.”
ECA’s monthly report consolidates order information collected in confidence from leading electronic component manufacturers. The latest results seem to indicate a backing off period after a surge of orders, according to ECA President Bob Willis.
“Component manufacturers had a jump in orders over the last few months to replenish inventories for end products such as cell phones and notebook computers,” says Willis. “I think we’re seeing things even off a bit now that end-product manufacturers have brought their inventories back to levels that can meet anticipated demand.”
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