Wednesday, October 8, 2014

Advanced packaging technologies changing LED manufacturing supply chain

LYON, FRANCE: Last month, Yole Développement (Yole) announced the update of its technology and market analysis, LED Packaging Technology & Market Trends. Under this new report, the research market and strategy consulting company highlights the impact of advanced packaging technologies in the LED industry.

“The combination of cost reduction and advanced packaging technologies such as Flip Chip and Chip Scale Package, is changing the LED industry landscape, especially its supply chain,” announced Yole.

For example, introduction of Chip Scale Package solution clearly reduces the number of manufacturing steps: today, some LED chip manufacturers, with Chip Scale Package technology already supply their products to the LED module makers directly.

Yole’s report represents a comprehensive survey on recent trends regarding LED Packaging including Flip Chip LED, Chip Scale Package, LED Filament Lamp. It describes associated technological breakthroughs and manufacturing process, provides also a list of key players involved.

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