Ticer Technologies introduces TCR-HF

CHANDLER, USA: Ticer Technologies, a manufacturer of thin film resistor materials, announced that it has added TCR-HF, a low insertion loss NiCr thin film embedded resistor copper foil designed for high frequency applications, to its line of products.

"TCR-HF answers the high frequency market's need for an embedded resistor copper foil having insertion loss performance comparable to rolled copper foil," said David Burgess, president, Ticer Technologies. "In addition, TCR-HF has excellent sheet resistance uniformity, etching accuracy characteristics associated with smooth copper and NiCr's proven predictability through printed wiring board (PWB) processes."

TCR-HF is designed for PTFE laminate and bond ply systems. Test results show:
* Insertion loss comparable to rolled copper foil out to 50 GHz;
* Wyko surface profile of 0.48 µm Rq, comparable to rolled foil at 0.4-0.5 µm Rq; and
* Peel strengths greater than 5 PLI.

The NiCr resistive alloy allows for the proven two-step etching process using cupric chloride followed by ammoniacal etchant. NiCr is not affected by the ammoniacal or alternative oxide chemistries. The NiCr alloy's predictable performance enables PWB fabricators to hit resistor value targets at the end of the process.

Applications of TCR-HF include defense microwave and radio frequency electronics; ground, airborne and speed-based radar systems; antennas and Wilkinson power dividers.