BOULDER, USA: Ball Aerospace & Technologies Corp. has delivered two Phased Array Antenna (PAA) Engineering Development Units (EDUs) for the Orion Multi-Purpose Crew Vehicle to prime contractor Lockheed Martin.
The PAA serves as a primary data and voice communication link for NASA astronauts across all mission phases from launch through flight operations and final capsule recovery. The EDUs are now undergoing testing at Lockheed Martin-Denver in preparation for subsystem Critical Design Review.
"The development and delivery of these EDUs represents a significant milestone as NASA enters the next arena of human space flight," said Jim Oschmann, VP and GM of antenna and video technologies for Ball Aerospace. "This milestone puts us on track to deliver the PAA flight units for integration into the Orion flight test vehicle that will be in production at Kennedy Space Center next year."
The Orion PAA design leverages three dozen Ball Aerospace phased array designs delivered for space, airborne, ground and marine applications, as well as an additional 11 fixed beam array products delivered for space. This product meets requirements for both the service module and crew module applications, which minimizes design and production costs.
As part of a methodical risk burn-down plan, Ball Aerospace previously built and tested a passive ten-element PAA brassboard and a thirteen-element active prototype that demonstrated array coupling, isolation and array efficiency across scan angles. Test results validated anticipated performance analysis and simulation. Ball Aerospace is the provider for Orion's Vision Navigation System, flight cameras and star trackers.
Ball Aerospace has a long history in both phased array antenna experience and human spaceflight programs. From the pioneering SEASAT satellite, to today's top-of-the line S-Band and Geodesic Dome Phased Array antennas, Ball is a proven industry leader in the application of advanced space, shipboard, aircraft and land-based phased array antenna systems. Ball has supported NASA's human space flight activities since Gemini, through Apollo, Skylab and the Space Shuttle.
Wednesday, December 7, 2011
Seoul Semiconductor launches ZC chip-on-board type DC LED
SEOUL, SOUTH KOREA: Seoul Semiconductor, a Korean LED packaging company, launched its Chip-On-Board (COB) Type of Direct Current (DC) LED, named Z-Power COB (ZC). The ZC Series, developed on Seoul Semiconductor’s Z-Power LEDs, will be used as a light source of high-brightness and high power to decrease thermal resistance and increase LED lighting product life expectancy. Moreover, it allows manufacturers to conveniently install, design and price competitive products.
The ZC Series is designed as a COB and eliminates the need for the LED to be surface-mounted onto a metal plate, permitting manufacturers to bypass the chip connection process before use. Companies can trim manufacturing and management costs and improve the end product.
The use of highly-reflective aluminum substrates in the ZC Series also greatly improves the brightness and significantly prolongs LED bulb life span. Using a single ZC chip from the Series permits the development of an LED light bulb which allows light to be distributed more evenly than lights that connect several LED packages to a single module.
ZC will be offered in 6W, 10W and 16W, each of which will be appropriate replacements for 40W, 60W incandescent light bulbs and 100W down lights, respectively.
“The ZC Series will enable manufacturers to easily produce LED light designs that ultimately afford consumers with longer-lasting LED lights at decreased electricity costs,” explained Sunghoon Bae, VP of Seoul Semiconductor. “As with the recent release of our AC LED, Acrich2, the launch of the ZC Series is aligned with Seoul Semiconductor’s commitment to providing consumers with a diverse and innovative product portfolio rooted in research and development investment.”
The recently launched ZC Series will begin mass production in December 2011 and will subsequently be available to customers.
The ZC Series is designed as a COB and eliminates the need for the LED to be surface-mounted onto a metal plate, permitting manufacturers to bypass the chip connection process before use. Companies can trim manufacturing and management costs and improve the end product.
The use of highly-reflective aluminum substrates in the ZC Series also greatly improves the brightness and significantly prolongs LED bulb life span. Using a single ZC chip from the Series permits the development of an LED light bulb which allows light to be distributed more evenly than lights that connect several LED packages to a single module.
ZC will be offered in 6W, 10W and 16W, each of which will be appropriate replacements for 40W, 60W incandescent light bulbs and 100W down lights, respectively.
“The ZC Series will enable manufacturers to easily produce LED light designs that ultimately afford consumers with longer-lasting LED lights at decreased electricity costs,” explained Sunghoon Bae, VP of Seoul Semiconductor. “As with the recent release of our AC LED, Acrich2, the launch of the ZC Series is aligned with Seoul Semiconductor’s commitment to providing consumers with a diverse and innovative product portfolio rooted in research and development investment.”
The recently launched ZC Series will begin mass production in December 2011 and will subsequently be available to customers.
element14 announces “The Innovation Series” event
SINGAPORE: element14 (formerly Farnell), the first electronic component distributor that fuses commerce and community, is hosting a two-day virtual event “the element14 Innovation Series” on the 16th and 17th of January 2012.
Last month, element14 challenged the electronics community to answer the question “Who is the next Innovator in the electronics industry?”. With the recent passing of Steve Jobs, John McCarthy and Dennis Ritchie, it appears that the torch is presently being passed from one generation to the next.
As part of the Innovation series, element14 is now bringing together industry leaders in a two-day virtual summit to share what’s next in the fields of medical, alternative energy and robotics. The event will feature a series of speakers through 30 minute livestreamed videos and the opportunity to chat live with experts who are helping bring tomorrow’s ideas to life. Attendees and presenters will interact by using Livestream.
On January 16 leading electronic manufacturers such as Microchip, Texas Instruments, Freescale, ST and Micrium will be attending and technical training on the latest products will also be provided. The following day, January 17, will feature key electronic industry thinkers discussing why these new products will matter in the next two years. They will also talk about the latest opportunities provided by emerging design tools. Key speakers will include Jack Ganssle, the Embedded Group; Gene Frantz, chief technologist at TI; and Jean Labrose, CEO of Micrium.
Throughout the two days, participants will be able to engage with leaders in the field of medical, alternative energy, robotics and lighting applications, they will also learn about the latest emerging technologies, discuss real design challenges and solutions, and chat live with the experts who continue to push the boundaries of what’s possible.
Kevin Yapp, chief marketing officer for element14, commented: “element14 is a trusted source for information, expert advice, products and services and we wanted to bring together some of the industry’s key people to talk about the trends for the coming year and beyond. The Innovation Series from element14 will be a continuing programme that we hope will showcase the innovators of today and tomorrow.”
Last month, element14 challenged the electronics community to answer the question “Who is the next Innovator in the electronics industry?”. With the recent passing of Steve Jobs, John McCarthy and Dennis Ritchie, it appears that the torch is presently being passed from one generation to the next.
As part of the Innovation series, element14 is now bringing together industry leaders in a two-day virtual summit to share what’s next in the fields of medical, alternative energy and robotics. The event will feature a series of speakers through 30 minute livestreamed videos and the opportunity to chat live with experts who are helping bring tomorrow’s ideas to life. Attendees and presenters will interact by using Livestream.
On January 16 leading electronic manufacturers such as Microchip, Texas Instruments, Freescale, ST and Micrium will be attending and technical training on the latest products will also be provided. The following day, January 17, will feature key electronic industry thinkers discussing why these new products will matter in the next two years. They will also talk about the latest opportunities provided by emerging design tools. Key speakers will include Jack Ganssle, the Embedded Group; Gene Frantz, chief technologist at TI; and Jean Labrose, CEO of Micrium.
Throughout the two days, participants will be able to engage with leaders in the field of medical, alternative energy, robotics and lighting applications, they will also learn about the latest emerging technologies, discuss real design challenges and solutions, and chat live with the experts who continue to push the boundaries of what’s possible.
Kevin Yapp, chief marketing officer for element14, commented: “element14 is a trusted source for information, expert advice, products and services and we wanted to bring together some of the industry’s key people to talk about the trends for the coming year and beyond. The Innovation Series from element14 will be a continuing programme that we hope will showcase the innovators of today and tomorrow.”
Tuesday, December 6, 2011
Rubicon marks first anniversary of Batavia sapphire growth facility
BENSENVILLE, USA: Rubicon Technology Inc., a leading provider of sapphire substrates and products to the LED, RFIC, semiconductor, and optical industries, marks the first anniversary of the company’s next-generation sapphire crystal growth facility, located in Batavia, IL.
The 135,000 sq. ft. facility is used for the production of sapphire crystals which are further processed into sapphire ingots and large diameter sapphire wafers used in products such as LED-based lighting, HDTVs, laptops, netbooks, smart phones and tablets, and automotive lighting.
As a vertically integrated supplier, Rubicon grows large sapphire crystals at the Batavia facility from raw materials in custom-built, proprietary furnaces replicating the organic sapphire creation process found in nature. The company completes the process to make large diameter wafers in their Penang, Malaysia cutting and polishing facility.
“Rubicon’s proprietary crystal growth technology, as exemplified by our Batavia plant, has been refined over the past 11 years to provide consistently high yield and the highest quality sapphire for our customers,” said Raja Parvez, Rubicon president and CEO. “Rubicon’s Batavia plant is the cornerstone of our market leadership in providing large-diameter sapphire wafers to the LED industry. Rubicon offers LED manufacturers the most reliable supply of high quality, high yield, large diameter sapphire wafers which is important to supporting the adoption of LED-based general lighting worldwide.”
To date, Rubicon has shipped more than 200,000 six-inch sapphire wafers to the LED manufacturing and RFIC industries. The transition to larger diameter wafers in LED production has started at the LED manufacturing level. Several key LED chip manufacturers have announced plans to migrate to and/or test large diameter wafers in 2011/2012. The process and cost efficiencies brought by large diameter sapphire wafers are instrumental to driving prices down in the LED industry.
Bringing down the overall price of LEDs is a key element in supporting the worldwide commercial adoption of solid state lighting based on LEDs as a light source. According to market research firm DisplaySearch, the total average LED penetration in lighting was 1.4 percent in 2010 and is forecast to reach 9.3 percent in 2014. Government entities around the world including China, European Union, Australia, Canada and the United States have introduced legislation to require energy efficient lighting.
The 135,000 sq. ft. facility is used for the production of sapphire crystals which are further processed into sapphire ingots and large diameter sapphire wafers used in products such as LED-based lighting, HDTVs, laptops, netbooks, smart phones and tablets, and automotive lighting.
As a vertically integrated supplier, Rubicon grows large sapphire crystals at the Batavia facility from raw materials in custom-built, proprietary furnaces replicating the organic sapphire creation process found in nature. The company completes the process to make large diameter wafers in their Penang, Malaysia cutting and polishing facility.
“Rubicon’s proprietary crystal growth technology, as exemplified by our Batavia plant, has been refined over the past 11 years to provide consistently high yield and the highest quality sapphire for our customers,” said Raja Parvez, Rubicon president and CEO. “Rubicon’s Batavia plant is the cornerstone of our market leadership in providing large-diameter sapphire wafers to the LED industry. Rubicon offers LED manufacturers the most reliable supply of high quality, high yield, large diameter sapphire wafers which is important to supporting the adoption of LED-based general lighting worldwide.”
To date, Rubicon has shipped more than 200,000 six-inch sapphire wafers to the LED manufacturing and RFIC industries. The transition to larger diameter wafers in LED production has started at the LED manufacturing level. Several key LED chip manufacturers have announced plans to migrate to and/or test large diameter wafers in 2011/2012. The process and cost efficiencies brought by large diameter sapphire wafers are instrumental to driving prices down in the LED industry.
Bringing down the overall price of LEDs is a key element in supporting the worldwide commercial adoption of solid state lighting based on LEDs as a light source. According to market research firm DisplaySearch, the total average LED penetration in lighting was 1.4 percent in 2010 and is forecast to reach 9.3 percent in 2014. Government entities around the world including China, European Union, Australia, Canada and the United States have introduced legislation to require energy efficient lighting.
Molex strengthens micro product support for medical technology innovators
LISLE, USA: Reaffirming its commitment to medical technology innovators as they design equipment to improve health and save lives, Molex Inc. offers a selected series of core micro products, which will be available for purchase, replacement and technical support for up to ten years, in order to more accurately align with medical industry design cycles. Micro interconnect solutions, including Molex FFC/FPC, board-to-board, microminiature wire-to-board and memory card connectors, are used in a wide range of medical device applications.
“Molex offers one of the most complete ranges of microminiature fine pitch connectors to support designers and manufacturers in the medical industry,” states Anthony Kalaijakis, strategic medical market manager, Molex. “Our micro connector series now carries a powerful commitment of ongoing product availability and support to help deliver smooth launches and long product life cycles for medical devices and equipment.”
Molex innovative micro products align with the trend toward smaller, lighter and integrated solutions for mobile and portable medical applications. The firm’s core micro products include some of the smallest and most innovative connector systems available on the market. For example:
* SlimStack 0.40 mm pitch, board-to-board system provides approximately a 25 percent overall space savings compared to competitive styles.
* IllumiMate 2.00 mm wire-to-board system supplies the narrowest width of any similar low-power connector systems, along with significant cost and performance advantages.
* FPC 0.30 mm pitch dual-contact connector offers the shortest length and most secure FPC retention compared with similar competitive versions, while eliminating the need to source a top- and bottom-style connector when routing an FPC to parallel boards.
* microSD ultra-small 1.28 mm height memory card connector reduces memory card fly-out and sticking problems in portable devices such as mobile phones.
“Molex offers one of the most complete ranges of microminiature fine pitch connectors to support designers and manufacturers in the medical industry,” states Anthony Kalaijakis, strategic medical market manager, Molex. “Our micro connector series now carries a powerful commitment of ongoing product availability and support to help deliver smooth launches and long product life cycles for medical devices and equipment.”
Molex innovative micro products align with the trend toward smaller, lighter and integrated solutions for mobile and portable medical applications. The firm’s core micro products include some of the smallest and most innovative connector systems available on the market. For example:
* SlimStack 0.40 mm pitch, board-to-board system provides approximately a 25 percent overall space savings compared to competitive styles.
* IllumiMate 2.00 mm wire-to-board system supplies the narrowest width of any similar low-power connector systems, along with significant cost and performance advantages.
* FPC 0.30 mm pitch dual-contact connector offers the shortest length and most secure FPC retention compared with similar competitive versions, while eliminating the need to source a top- and bottom-style connector when routing an FPC to parallel boards.
* microSD ultra-small 1.28 mm height memory card connector reduces memory card fly-out and sticking problems in portable devices such as mobile phones.
element14 enhances technology leadership in key markets through global agreement with Infineon
SINGAPORE: element14 (formerly Farnell), the first electronic component distributor that fuses commerce and community, is to become a globally franchised distributor for Infineon Technologies AG, enabling engineers worldwide to take advantage of Infineon’s advanced, high-quality semiconductor solutions and element14’s broad range of high-value customer services and supporting technologies.
The agreement allows element14 to strengthen its already extensive product offering to its vast global customer base, delivering the benefits of direct engagement with Infineon and access to their new leading-edge products as soon as they are introduced. Infineon’s semiconductors and system solutions embody the company’s expertise in technologies such as analogue and mixed signal, RF, power and embedded control.
“We are delighted to be working directly with Infineon, a universally respected and market-leading semiconductor manufacturer,” said Marianne Culver, Global Head of Supplier and Product Management at element14. “Delivering the Infineon portfolio to our customers throughout the world will enable us to extend our technology leadership in key market segments such as automotive, security and identification, alternative energy and transportation and mobility.”
“Establishing this relationship with a global high service distribution partner is an important move forward for both our companies,” said Robert Leindl, CVP Distribution and EMS, Infineon. “As a multi-channel distributor with a strong focus on ecommerce, element14 delivers the benefits of a highly effective global marketing and support network, which will help us strengthen our position as the manufacturer of choice for technology innovators everywhere.”
The agreement allows element14 to strengthen its already extensive product offering to its vast global customer base, delivering the benefits of direct engagement with Infineon and access to their new leading-edge products as soon as they are introduced. Infineon’s semiconductors and system solutions embody the company’s expertise in technologies such as analogue and mixed signal, RF, power and embedded control.
“We are delighted to be working directly with Infineon, a universally respected and market-leading semiconductor manufacturer,” said Marianne Culver, Global Head of Supplier and Product Management at element14. “Delivering the Infineon portfolio to our customers throughout the world will enable us to extend our technology leadership in key market segments such as automotive, security and identification, alternative energy and transportation and mobility.”
“Establishing this relationship with a global high service distribution partner is an important move forward for both our companies,” said Robert Leindl, CVP Distribution and EMS, Infineon. “As a multi-channel distributor with a strong focus on ecommerce, element14 delivers the benefits of a highly effective global marketing and support network, which will help us strengthen our position as the manufacturer of choice for technology innovators everywhere.”
IPC rolls out new printed electronics management council committee
BANNOCKBURN, USA: IPC — Association Connecting Electronics Industries -- has announced the creation of a new IPC Printed Electronics Management Council Steering Committee that will oversee the development of educational programs to support the printed electronics industry. Industry veterans Don Banfield, president of Conductive Compounds, Inc., and Steve Tomas, director of flexible electronics for FLEXcon Company, have been elected chairman and vice chairman of the steering committee.
“IPC, because of its reach across many electronics industry segments and its historic acceptance of new industries, will give us the opportunity to expand printed electronics applications and bring this enabling technology to a broader market worldwide,” Banfield said.
The new steering committee is composed of industry leaders with representation of the printed electronics industry supply chain from raw materials (inks and coated/laminated films) suppliers to PCB manufacturers to manufacturers of functional printed products.
Along with Banfield and Tomas, members of the management council include: John Andresakis, Oak-Mitskui Inc.; Neil Bolding, MacDermid Autotype Inc.; Mike McDaniel, GM Nameplate; Edward Cook, ECI Screenprint Inc.; William Driscoll, 3M Industrial Adhesives & Tapes; Daniel Gamota, Printovate Technologies Inc.; Scott Gordon, DuPont Electronics and Communications; Rajesh Kumar, DDi Corp.; Richard Morris, Saxby Business Development LLC; David Sime, Soligie Inc.; and Jaye Tyler, Si-Cal Inc.
Tony Hilvers, IPC VP of industry programs, explained that the new management council will meet to continue its work in the development of new printed electronics programs in February at IPC APEX EXPO 2012 in San Diego. This event will also feature a dedicated printed electronics area on the show floor as well as a printed electronics track in the technical conference on February 29.
Earlier this year, IPC — an American National Standards Institute-accredited, nonprofit trade association — formed a Printed Electronics Steering Committee for Standards Development (D-60) and four printed electronics subcommittees to develop standards in the areas of design (D-61), base materials/substrates (D-62), functional materials (D-63) and final assembly (D-64). These technical committees recently met in Santa Clara, Calif.
Working drafts of the base materials/substrate standard (IPC-4921) and functional materials standard (IPC-4591) were reviewed during the very well-attended meetings. The standard development committees will meet again on Thursday, March 1, at IPC APEX EXPO to continue to work on the drafts of the standards.
“IPC, because of its reach across many electronics industry segments and its historic acceptance of new industries, will give us the opportunity to expand printed electronics applications and bring this enabling technology to a broader market worldwide,” Banfield said.
The new steering committee is composed of industry leaders with representation of the printed electronics industry supply chain from raw materials (inks and coated/laminated films) suppliers to PCB manufacturers to manufacturers of functional printed products.
Along with Banfield and Tomas, members of the management council include: John Andresakis, Oak-Mitskui Inc.; Neil Bolding, MacDermid Autotype Inc.; Mike McDaniel, GM Nameplate; Edward Cook, ECI Screenprint Inc.; William Driscoll, 3M Industrial Adhesives & Tapes; Daniel Gamota, Printovate Technologies Inc.; Scott Gordon, DuPont Electronics and Communications; Rajesh Kumar, DDi Corp.; Richard Morris, Saxby Business Development LLC; David Sime, Soligie Inc.; and Jaye Tyler, Si-Cal Inc.
Tony Hilvers, IPC VP of industry programs, explained that the new management council will meet to continue its work in the development of new printed electronics programs in February at IPC APEX EXPO 2012 in San Diego. This event will also feature a dedicated printed electronics area on the show floor as well as a printed electronics track in the technical conference on February 29.
Earlier this year, IPC — an American National Standards Institute-accredited, nonprofit trade association — formed a Printed Electronics Steering Committee for Standards Development (D-60) and four printed electronics subcommittees to develop standards in the areas of design (D-61), base materials/substrates (D-62), functional materials (D-63) and final assembly (D-64). These technical committees recently met in Santa Clara, Calif.
Working drafts of the base materials/substrate standard (IPC-4921) and functional materials standard (IPC-4591) were reviewed during the very well-attended meetings. The standard development committees will meet again on Thursday, March 1, at IPC APEX EXPO to continue to work on the drafts of the standards.
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