SEMICON West 2011, PORTLAND, USA: ESI Inc., a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, announced the availability of the Model 5390 micromachining system for advanced LED packaging. The Model 5390 laser-based micromachining system is uniquely designed for creation of electrical interconnections on LED packages and is optimized for industry-leading via placement accuracy and high yields.
“Our customers are demanding new, innovative manufacturing processes that enable them to enhance light output and product reliability on smaller and smaller LED packages,” said Martin Orrick, senior director in ESI’s Interconnect and Micromachining Group. “Our Model 5390 enables the industry’s fastest and highest via placement accuracy.”
Featuring ESI’s production-proven, high-speed compound beam positioner coupled with a high-power CO2 laser, the Model 5390 provides user-definable variable pulse width and pulse repetition frequencies of up to 300 kHz for wide range of applications. The system can produce more than 100 vias per second in typical single layer dielectric materials. The company shipped the first unit to a leading LED manufacturer in the last quarter.
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