Wednesday, June 16, 2010

Hypertronics announces high density modular PCB connectors

HUDSON, USA: Hypertronics Corp., a Smiths Interconnect business and world-leading provider of high performance interconnect solutions for the most demanding applications, has released its' KMR Connector Series, a 0.075 in (1.91mm) fine pitch, high density PCB connector utilizing 0.50mm diameter Hypertac Hyperboloid sockets.

KMR is available in a 200 signal contact position and is the ideal interconnect solution for use in commercial and military aircraft, as well as unmanned systems. The contact terminations include right angle through board solder, straight through board solder and SMT.

The Hypertronics KA series, available in 0.100 in pitch has been successfully used by aircraft manufacturers for decades to ensure signal reliability. The KMR connector complements the KA series by offering a finer pitch of 0.75, producing a higher signal count in a more compact space. The fine pitch design was created to meet the industry needs of increased circuit density with more contact pads and traces on the circuit board.

“We designed the KMR using the high performance Hypertac technology, to be smaller in size and weight with the capacity for high pin count to accommodate tightly spaced board designs” stated Vadim Radunsky, president.

KMR connectors, like all Hypertronics connectors, are engineered to allow for top performance under all dynamic environmental conditions. KMR connectors provide immunity to shock and vibration fretting, numerous linear paths of contact, and a self-wipe action that consistently results in better signal integrity. KMR connectors are suited for system configurations in aerospace and defense, commercial avionics, test and measurement.

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