USA: Ultratech Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), announced the first shipment of its LSA201 system to a leading IDM.
The LSA201 is built on a new platform that enables precise control over the gases that surround the wafer during processing (i.e., ambient control). At the customer's facility, the system will be used to develop leading-edge logic technology, mainly focusing on FinFETs. This first shipment of the LSA201 is an example of Ultratech's continuing efforts to develop solutions that enable the leading-edge technology roadmaps of its global customers. Ultratech plans to begin volume shipments of the LSA201 in the second half of 2013.
Ultratech's LSA201 LSA system built on the highly customizable Unity Platform includes a patented micro chamber design, which enables full-wafer ambient control in a scanning laser system. The micro chamber is a system which does not require the use of vacuum hardware. The current system is capable of running mixtures of any inert gases, but the micro-chamber architecture is extendible to more reactive gases for future processes.
The LSA201 targets middle-of-line (MOL) applications, such as silicide formation, and advanced front-end-of-line (FEOL) applications, such as defect annealing. The LSA201 is well suited for processes such as interface engineering and film property modification where ambient control is critical at sub-20nm.
Thursday, June 20, 2013
Wednesday, June 19, 2013
Photronics announces successful completion of tender offer to acquire PSMC
USA: Photronics Inc., a worldwide leader in supplying innovative imaging technology solutions for the global electronics industry, announced the successful completion of the tender offer to acquire the outstanding shares of Photronics Semiconductor Mask Corp. (PSMC), a majority-owned subsidiary of Photronics Inc.
As of the expiration of the offering period on June 18, 2013, a total of 50,259,277 shares were tendered at the offering price of NT$16.30 with the total costs of the transaction of approximately $28 million. As a result of the transaction, Photronics owns 98 percent of the outstanding shares of common stock of PSMC.
As of the expiration of the offering period on June 18, 2013, a total of 50,259,277 shares were tendered at the offering price of NT$16.30 with the total costs of the transaction of approximately $28 million. As a result of the transaction, Photronics owns 98 percent of the outstanding shares of common stock of PSMC.
NKK Switches inks global distribution agreement with Digi-Key
USA: NKK Switches, the world's leading designer and manufacturer of innovative electromechanical switches, has signed a global distribution agreement with Digi-Key Corp.
The agreement enables Digi-Key to distribute NKK's market-leading products globally, with a specific focus on North America, Europe, Japan and the Asia Pacific region.
Digi-Key is the industry leader in electronic component selection, availability and delivery. The company's customer-centric approach and global online resources combined with their expansive NKK product portfolio will help NKK enhance its global recognition and ability to market to worldwide territories.
The agreement enables Digi-Key to distribute NKK's market-leading products globally, with a specific focus on North America, Europe, Japan and the Asia Pacific region.
Digi-Key is the industry leader in electronic component selection, availability and delivery. The company's customer-centric approach and global online resources combined with their expansive NKK product portfolio will help NKK enhance its global recognition and ability to market to worldwide territories.
ShineOn revolutionizes LED lighting industry
CHINA: ShineOn Holding Inc., a global LED lighting solution provider, announced the successful demonstration of its DiscLight LED Light Engine, the world's first fully-integrated LED light engine without any external electronic components, at the Guangzhou International Lighting Exposition on June 9-12, 2014.
ShineOn's DiscLight LED Light Engine integrates a high voltage CMOS based driver IC with multi LED chip arrays on a single substrate. Leveraging its innovative control algorithm design and special IC configuration, this integrated module is capable of connecting to either 110V or a 220V AC power line directly, and can drive the LED array without requiring any additional electronic components such as voltage transformers, inductors and electrolyte capacitors.
Compared to 2-board solutions and solutions with discrete electronic components, ShineOn's elimination of such external components significantly improves the reliability as well as reducing the physical size of the module by more than 70 percent. These factors make ShineOn's DiscLight an excellent choice for indoor lighting applications ranging from 3-20W, such as candle lights, MR Light or PAR Lights.
"The LED lighting industry is at a critical stage in its evolution, and poised for accelerated growth," said Dr. Frank Fan, president of ShineOn. "Similar to the IT industry of the past 30 years, new innovations -- from chip, package, module, to system and software -- are supporting the advancement of this industry. ShineOn's successful demonstration of DiscLight is an important step for us to establish a leadership position, and we will continue to bring together the expertise of U.S. design innovations and Chinese manufacturing to provide advanced, ground-breaking module solutions for the global lighting industry."
DiscLight features include:
* High reliability and a high power factor of 0.99.
* Compact physical size at 19mm x 19mm x 2mm.
* High total lumens efficiency (including driver and LED) of less than 90lm/W at warm white with more than 80 CRI.
* linearly dimmable device that is compatible with majority of existing dimmer circuits.
* lower total system BOM cost.
ShineOn's DiscLight LED Light Engine integrates a high voltage CMOS based driver IC with multi LED chip arrays on a single substrate. Leveraging its innovative control algorithm design and special IC configuration, this integrated module is capable of connecting to either 110V or a 220V AC power line directly, and can drive the LED array without requiring any additional electronic components such as voltage transformers, inductors and electrolyte capacitors.
Compared to 2-board solutions and solutions with discrete electronic components, ShineOn's elimination of such external components significantly improves the reliability as well as reducing the physical size of the module by more than 70 percent. These factors make ShineOn's DiscLight an excellent choice for indoor lighting applications ranging from 3-20W, such as candle lights, MR Light or PAR Lights.
"The LED lighting industry is at a critical stage in its evolution, and poised for accelerated growth," said Dr. Frank Fan, president of ShineOn. "Similar to the IT industry of the past 30 years, new innovations -- from chip, package, module, to system and software -- are supporting the advancement of this industry. ShineOn's successful demonstration of DiscLight is an important step for us to establish a leadership position, and we will continue to bring together the expertise of U.S. design innovations and Chinese manufacturing to provide advanced, ground-breaking module solutions for the global lighting industry."
DiscLight features include:
* High reliability and a high power factor of 0.99.
* Compact physical size at 19mm x 19mm x 2mm.
* High total lumens efficiency (including driver and LED) of less than 90lm/W at warm white with more than 80 CRI.
* linearly dimmable device that is compatible with majority of existing dimmer circuits.
* lower total system BOM cost.
Tuesday, June 18, 2013
RFX240 CMOS PA delivers 26dBm linear power with best-in-class efficiency
USA: RFaxis Inc. has begun mass production of the RFX240 high-power 2.4GHz PA for wireless local area network (WLAN) applications.
The RFX240 is the first of RFaxis' pure CMOS high-power CMOS PA series targeting the rapidly growing wireless access point (AP), Router, Set Top Box (STB), home gateway, hot spot and other wireless infrastructure markets. The RFX240 is pin-to-pin compatible with incumbent solutions available in today’s market, including Skyworks SE2576L, SE2604L and SE2605L, which are all based on significantly more expensive compound semiconductor processes.
The RFX240 is a high power, high linearity power amplifier built on industry-standard bulk CMOS, the lowest-cost semiconductor process ever to implement an RF device. The RFX240 is optimized to provide the functionality of transmit power amplification for IEEE 802.11b/g/n applications in the 2.4GHz frequency range.
It provides 30dB power gain, 26dBm linear output power for OFDM/64QAM with 5V power supply and consumes 30mA less current than competition PAs of the same category. It integrates full-CMOS logic control, on-chip input and inter-stage impedance matching, RF decoupling, as well as a truly directional coupler based power detector for accurate closed-loop power control. The RFX240 is assembled in a compact 3.0x3.0x0.55mm 16-pin Quad Flat No-Lead (QFN) package. Samples are now available.
The RFX240 is the first of RFaxis' pure CMOS high-power CMOS PA series targeting the rapidly growing wireless access point (AP), Router, Set Top Box (STB), home gateway, hot spot and other wireless infrastructure markets. The RFX240 is pin-to-pin compatible with incumbent solutions available in today’s market, including Skyworks SE2576L, SE2604L and SE2605L, which are all based on significantly more expensive compound semiconductor processes.
The RFX240 is a high power, high linearity power amplifier built on industry-standard bulk CMOS, the lowest-cost semiconductor process ever to implement an RF device. The RFX240 is optimized to provide the functionality of transmit power amplification for IEEE 802.11b/g/n applications in the 2.4GHz frequency range.
It provides 30dB power gain, 26dBm linear output power for OFDM/64QAM with 5V power supply and consumes 30mA less current than competition PAs of the same category. It integrates full-CMOS logic control, on-chip input and inter-stage impedance matching, RF decoupling, as well as a truly directional coupler based power detector for accurate closed-loop power control. The RFX240 is assembled in a compact 3.0x3.0x0.55mm 16-pin Quad Flat No-Lead (QFN) package. Samples are now available.
Microchip’s op amps extend battery life with exceptionally low power consumption
USA: Microchip Technology Inc. announced a new nine-member low-power, general-purpose operational amplifier (op amp) family—the MCP647X/8X/9X.
These op amps provide among the industry’s best power consumption for a given gain-bandwidth product, including low quiescent current, to extend battery lifetimes. Additionally, they have exceptionally low leakage current over temperature, up to 125°C, which reduces errors in applications such as sensor conditioning. In combination with features such as input offset voltage of 1.5 mV and space-saving packages as small as SC70 and SOT-23, these op amps are ideal for a broad range of portable applications in the consumer, industrial, automotive and medical markets.
The designers of portable, battery-powered applications are challenged to lower power consumption and reduce cost and board space without compromising on the robustness and accuracy of their signal chains. The MCP647X/8X/9X family of general-purpose op amps provides low supply current, low leakage current over temperature and low input offset voltage in small packages, which offers one of the industry’s best cost-to-performance ratios.
In fact, the 1.5 mV offset voltage offers better precision than the industry standard for general-purpose op amps, without the price premium of high-precision op amps. For applications that have sensors with high output impedance or that go through accelerated life tests at high temperatures, the MCP647X/8X/9X’s low leakage current is particularly important.
These op amps provide among the industry’s best power consumption for a given gain-bandwidth product, including low quiescent current, to extend battery lifetimes. Additionally, they have exceptionally low leakage current over temperature, up to 125°C, which reduces errors in applications such as sensor conditioning. In combination with features such as input offset voltage of 1.5 mV and space-saving packages as small as SC70 and SOT-23, these op amps are ideal for a broad range of portable applications in the consumer, industrial, automotive and medical markets.
The designers of portable, battery-powered applications are challenged to lower power consumption and reduce cost and board space without compromising on the robustness and accuracy of their signal chains. The MCP647X/8X/9X family of general-purpose op amps provides low supply current, low leakage current over temperature and low input offset voltage in small packages, which offers one of the industry’s best cost-to-performance ratios.
In fact, the 1.5 mV offset voltage offers better precision than the industry standard for general-purpose op amps, without the price premium of high-precision op amps. For applications that have sensors with high output impedance or that go through accelerated life tests at high temperatures, the MCP647X/8X/9X’s low leakage current is particularly important.
AVX expands to include glass-encapsulated varistors
USA: AVX Corp. has expanded both its TransGuard and Automotive TransGuard series multilayer varistors to include glass-encapsulated, acid-resistant parts for use in high energy and harsh environment commercial, industrial, and automotive applications.
Exhibiting non-linear, bi-directional, V-I characteristics, both zinc-oxide-based ceramic semiconductor device series provide bi-directional over-voltage protection and EMI/RFI attenuation in a single SMT package. The series also feature multi-strike capability, sub 1nS response to ESD strikes, and excellent solderability.
Ideal for use in harsh environments -- such as those utilizing acid, salt, or chlorite flux -- AVX's glass-encapsulated TransGuard and Automotive TransGuard series varistors are available in three case sizes (1210, 1812, and 2220), four energy ratings (spanning 2-12J) and feature a peak current rating of up to 2000A.
Both series have Ni/Sn-plated terminations, are RoHS compliant, are rated for use in temperatures spanning -55 degrees C to +125 degrees C, and are packaged on 7" or 13" reels.
Exhibiting non-linear, bi-directional, V-I characteristics, both zinc-oxide-based ceramic semiconductor device series provide bi-directional over-voltage protection and EMI/RFI attenuation in a single SMT package. The series also feature multi-strike capability, sub 1nS response to ESD strikes, and excellent solderability.
Ideal for use in harsh environments -- such as those utilizing acid, salt, or chlorite flux -- AVX's glass-encapsulated TransGuard and Automotive TransGuard series varistors are available in three case sizes (1210, 1812, and 2220), four energy ratings (spanning 2-12J) and feature a peak current rating of up to 2000A.
Both series have Ni/Sn-plated terminations, are RoHS compliant, are rated for use in temperatures spanning -55 degrees C to +125 degrees C, and are packaged on 7" or 13" reels.
20kbps to 100kbps communication photocouplers from Toshiba lower costs, power consumption
USA: Toshiba America Electronic Components Inc., (TAEC) announced the launch of two new communication photocouplers – theTLP2301 (20kps) and TLP2303 (100kps).
Supporting RS-232 communication speed of 9.6kbps or 19.2kbps to RS-232C communication speed of 115.2kbps transmission rates for isolated communication interfaces in factory automation devices, air-conditioners, smart meters and more, these new optimal speed photocouplers bring excellent cost/performance ratios and can be driven at a low input current of 1 mA.
Isolated communication interfaces for factory automation devices (such as PLC and inverters), home appliances and housing equipment (such as air conditioners and smart meters) use a wide range of transmission rates to communicate. Until now, photocouplers with optimal speed transmission rates were not available. This forced users to choose either general-purpose transistor couplers, which provide insufficient performance, or 1 Mbps-class IC couplers, which provide the performance needed, but at a very high cost.
Toshiba developed the TLP2301 and TLP2303 to fill this gap in the market. The new photocouplers achieve a high current transfer ratio (IC/IF) and switching under low input current conditions – leading to reductions in power consumption and costs in the wide range of products that use photocouplers.
Supporting RS-232 communication speed of 9.6kbps or 19.2kbps to RS-232C communication speed of 115.2kbps transmission rates for isolated communication interfaces in factory automation devices, air-conditioners, smart meters and more, these new optimal speed photocouplers bring excellent cost/performance ratios and can be driven at a low input current of 1 mA.
Isolated communication interfaces for factory automation devices (such as PLC and inverters), home appliances and housing equipment (such as air conditioners and smart meters) use a wide range of transmission rates to communicate. Until now, photocouplers with optimal speed transmission rates were not available. This forced users to choose either general-purpose transistor couplers, which provide insufficient performance, or 1 Mbps-class IC couplers, which provide the performance needed, but at a very high cost.
Toshiba developed the TLP2301 and TLP2303 to fill this gap in the market. The new photocouplers achieve a high current transfer ratio (IC/IF) and switching under low input current conditions – leading to reductions in power consumption and costs in the wide range of products that use photocouplers.
Toshiba intros 30V power MOSFETs for base stations and servers
JAPAN: Toshiba Corp. announced the introduction of a 30V voltage power MOSFET line-up for general-purpose DC-DC converters used in base stations and servers.
The products use the latest 8th generation low-voltage trench structure and achieve the highest class[Note 1] of low ON-resistance and high-speed switching. Mass production is scheduled to start at the end of June.
The MOSFETs use the 8th generation low-voltage trench structure and achieves top class low ON-resistance. They achieve low internal gate resistance and a low gate capacity ratio (Cgd/Cgs), which contributes to prevention of the self turn-on phenomenon.
The products use the latest 8th generation low-voltage trench structure and achieve the highest class[Note 1] of low ON-resistance and high-speed switching. Mass production is scheduled to start at the end of June.
The MOSFETs use the 8th generation low-voltage trench structure and achieves top class low ON-resistance. They achieve low internal gate resistance and a low gate capacity ratio (Cgd/Cgs), which contributes to prevention of the self turn-on phenomenon.
Medium-power LED lighting remains unstable, declines by only 1 percent; TV backlight declines by approximately 2~4 percent due to China’s policies
TAIWAN: According to LEDinside, a research division of TrendForce, the Q2 supply for medium-power LED for lighting applications remains unstable. While the current market demand still came from warm white LED, the shortage situation won’t be eased until July. Hence, the price of medium-power LED for lighting application has declined by 1~3 percent in this quarter and that of high-power LED has declined by 3 percent as well.
With backlight applications being impacted by the lack of strong demand and the Chinese government’s subsidy on TV market has been ended, TV manufacturers are conservative about the 3Q13 stock, and are less willing to place long term purchase orders. Overall, the prices of LEDs for backlight applications showed a slight decrease, which are below 5 percent.
Whether low-price tablets and Chinese TV subsidy policy can continue, may impact the growth momentum for Q3 backlight market
Although HTC, LG, and Motorola announced to let go of the tablet market, the tablet product owns higher gross margins--which are relatively larger than those of the other 3C products--have managed to attract manufacturers in mobile, PC, TV, and system areas.
These include: Lenovo, HP, Acer, and Google, all of which have released their own tablets. All together with whitebox mobile market, the worldwide tablet shipment in 2013 is forecasted to reach 200 million units. In addition, The highest and lowest prices of LED for tablet applications were $0.06 and $0.033, respectively, which declined by 4 percent.
The price of LED for TV application has started to slow down in this quarter. The average price of single chip 7020 was around $0.103, a 2 percent decline. In addition, the average price of double chip 7020 for premium TV model was $0.17, with this quarter’s highest market price dropping down to $0.2.
After stocking for China’s May Day holiday, the average price of 7030 package used mostly in edge-lid TV was $0.165, which declined by 2 percent this quarter.
2Q13 medium-power LED quoted price declined by only 1 percent
In terms of lighting applications, medium-power LED’s C/P ratio is better than others. Thus, 5630 package is mostly introduced in LED bulbs or tubes. Since Samsung upgraded their product and made adjustments in production lines, it caused the tightened supply situation for 5630 in china, which limited the price decline for medium-power 5630 LED to only 1 percent.
As for high power LED, although its market demand has started to increase, the price is still steadily decreasing because each manufacturer is continuing to release new product specifications. The high power LED price declined by approximately 3 percent in this quarter.
LEDinside viewpoint
Backlight market: Although China’s LED package technology and chip specifications lag behind from those of Korea-based and Taiwan-based package manufacturers, China TV brand manufacturers adopt market segment marketing strategies, such as direct-type LED TV adopted domestic package in those areas with low request for specifications and patents. After Chinese package manufacturers enter the TV supply chain, it will cause more serious oversupply situation for China’s TV backlight market.
Lighting market: As the supply for medium-power 5630 LED is still unstable in June, there seems no noticeable reduction on market price. But many big LED manufacturers are planning to release new high power LED products, thus there might be another price reduction in 3Q13 to boost the market.
With backlight applications being impacted by the lack of strong demand and the Chinese government’s subsidy on TV market has been ended, TV manufacturers are conservative about the 3Q13 stock, and are less willing to place long term purchase orders. Overall, the prices of LEDs for backlight applications showed a slight decrease, which are below 5 percent.
Whether low-price tablets and Chinese TV subsidy policy can continue, may impact the growth momentum for Q3 backlight market
Although HTC, LG, and Motorola announced to let go of the tablet market, the tablet product owns higher gross margins--which are relatively larger than those of the other 3C products--have managed to attract manufacturers in mobile, PC, TV, and system areas.
These include: Lenovo, HP, Acer, and Google, all of which have released their own tablets. All together with whitebox mobile market, the worldwide tablet shipment in 2013 is forecasted to reach 200 million units. In addition, The highest and lowest prices of LED for tablet applications were $0.06 and $0.033, respectively, which declined by 4 percent.
The price of LED for TV application has started to slow down in this quarter. The average price of single chip 7020 was around $0.103, a 2 percent decline. In addition, the average price of double chip 7020 for premium TV model was $0.17, with this quarter’s highest market price dropping down to $0.2.
After stocking for China’s May Day holiday, the average price of 7030 package used mostly in edge-lid TV was $0.165, which declined by 2 percent this quarter.
2Q13 medium-power LED quoted price declined by only 1 percent
In terms of lighting applications, medium-power LED’s C/P ratio is better than others. Thus, 5630 package is mostly introduced in LED bulbs or tubes. Since Samsung upgraded their product and made adjustments in production lines, it caused the tightened supply situation for 5630 in china, which limited the price decline for medium-power 5630 LED to only 1 percent.
As for high power LED, although its market demand has started to increase, the price is still steadily decreasing because each manufacturer is continuing to release new product specifications. The high power LED price declined by approximately 3 percent in this quarter.
LEDinside viewpoint
Backlight market: Although China’s LED package technology and chip specifications lag behind from those of Korea-based and Taiwan-based package manufacturers, China TV brand manufacturers adopt market segment marketing strategies, such as direct-type LED TV adopted domestic package in those areas with low request for specifications and patents. After Chinese package manufacturers enter the TV supply chain, it will cause more serious oversupply situation for China’s TV backlight market.
Lighting market: As the supply for medium-power 5630 LED is still unstable in June, there seems no noticeable reduction on market price. But many big LED manufacturers are planning to release new high power LED products, thus there might be another price reduction in 3Q13 to boost the market.
Mouser stocking highest frequency PLL from Analog Devices
TAIWAN: Mouser Electronics Inc. is now stocking the industry’s highest frequency PLL Synthesizer, from Analog Devices.
ADI ADF41020 Microwave PLL Synthesizer is designed to significantly reduce component count and system cost while improving performance in next-generation radio designs.
ADI ADF41020 consists of a low noise, digital phase frequency detector, a precision charge pump, a programmable reference divider, and high-frequency programmable feedback dividers. A complete synthesizer can be implemented if the PLL is used with an external loop filter and VCO (voltage controlled oscillator).
This PLL synthesizer can be used to implement local oscillators as high as 18 GHz in the up-conversion and down-conversion sections of wireless receivers and transmitters. ADF41020 is ideal for use in a variety of applications, including microwave point-to-point and multi-point radios, wireless infrastructure equipment, VSAT (Very Small Aperture Terminal) radios, semiconductor test equipment, radar applications, and private mobile radios.
EV-ADF41020EB1Z is available to evaluate the performance of ADF41020.
ADI ADF41020 Microwave PLL Synthesizer is designed to significantly reduce component count and system cost while improving performance in next-generation radio designs.
ADI ADF41020 consists of a low noise, digital phase frequency detector, a precision charge pump, a programmable reference divider, and high-frequency programmable feedback dividers. A complete synthesizer can be implemented if the PLL is used with an external loop filter and VCO (voltage controlled oscillator).
This PLL synthesizer can be used to implement local oscillators as high as 18 GHz in the up-conversion and down-conversion sections of wireless receivers and transmitters. ADF41020 is ideal for use in a variety of applications, including microwave point-to-point and multi-point radios, wireless infrastructure equipment, VSAT (Very Small Aperture Terminal) radios, semiconductor test equipment, radar applications, and private mobile radios.
EV-ADF41020EB1Z is available to evaluate the performance of ADF41020.
Monday, June 17, 2013
Agilent intros next-gen 6½ digit digital multimeters
USA: Agilent Technologies Inc. introduced the Truevolt Series digital multimeters.
These DMMs offer several advantages over previous models. They help engineers see their measurement data in new ways, get actionable information faster, and document their results more easily. Exclusive Truevolt technology reduces extraneous factors such as noise, injected current and input bias current for increased measurement confidence.
The Agilent 34461A DMM is a direct replacement for the industry-standard Agilent 34401A DMM, and was designed to make migration easy for current users of the 34401A. The Agilent 34460A offers engineers a basic entry point to the 6½ digit class of DMMs.
Compared with the 34401A DMM, the new 34461A offers expanded current ranges from 100 µA to 10 A. Both the 34460A and 34461A have a temperature measurement function (RTD/PT100, thermistor) and expanded diode measurement capability to allow engineers to measure a larger full-scale voltage (5 V) so they can test more diode types, such as LEDs.
These DMMs offer several advantages over previous models. They help engineers see their measurement data in new ways, get actionable information faster, and document their results more easily. Exclusive Truevolt technology reduces extraneous factors such as noise, injected current and input bias current for increased measurement confidence.
The Agilent 34461A DMM is a direct replacement for the industry-standard Agilent 34401A DMM, and was designed to make migration easy for current users of the 34401A. The Agilent 34460A offers engineers a basic entry point to the 6½ digit class of DMMs.
Compared with the 34401A DMM, the new 34461A offers expanded current ranges from 100 µA to 10 A. Both the 34460A and 34461A have a temperature measurement function (RTD/PT100, thermistor) and expanded diode measurement capability to allow engineers to measure a larger full-scale voltage (5 V) so they can test more diode types, such as LEDs.
VPG releases new generation of ultra-high-precision Z-foil power current sensing resistors
USA: Vishay Precision Group Inc. announced that its Vishay Foil Resistors brand (VFR) has released new ultra-high-precision Z-Foil power current sensing resistors for applications where rapid ΔR stabilization and resistance stability under transient power conditions are required.
Designed to provide optimal performance when mounted on a chassis or cooled heat sink, the VCS331Z, VCS332Z, VFP4Z, and CSNG Series feature low TCR of ±0.2 ppm/°C from -55°C to +125°C, +25°C ref., PCR (ΔR due to self-heating) of 4 ppm/W typical, and tolerances to ±0.01 percent.
For high-power applications, the devices offer power ratings up to 10 W (on heatsink) and a four-terminal Kelvin configuration in order to remove the unwanted influence of lead resistance and lead sensitivity to temperature.
“In applications such as force-balance scales, electronic beam deflection systems, and switching power supplies, accuracy and repeatability are likely to be more important than power handling requirements and depend to a major extent on precision current sense resistors with Kelvin connections,” said Yuval Hernik, senior director of Application Engineering for VFR.
“The resistors must have extreme thermal efficiency, well-distributed internal heat from power dissipation, very low thermal EMF, and fast thermal stabilization. All these characteristics, which can be found in the VCS331Z, VCS332Z, VFP4Z, and CSNG, are necessary to prevent errors caused by uneven heat from external sources such as the power amplifiers and other circuit elements.”
Designed to provide optimal performance when mounted on a chassis or cooled heat sink, the VCS331Z, VCS332Z, VFP4Z, and CSNG Series feature low TCR of ±0.2 ppm/°C from -55°C to +125°C, +25°C ref., PCR (ΔR due to self-heating) of 4 ppm/W typical, and tolerances to ±0.01 percent.
For high-power applications, the devices offer power ratings up to 10 W (on heatsink) and a four-terminal Kelvin configuration in order to remove the unwanted influence of lead resistance and lead sensitivity to temperature.
“In applications such as force-balance scales, electronic beam deflection systems, and switching power supplies, accuracy and repeatability are likely to be more important than power handling requirements and depend to a major extent on precision current sense resistors with Kelvin connections,” said Yuval Hernik, senior director of Application Engineering for VFR.
“The resistors must have extreme thermal efficiency, well-distributed internal heat from power dissipation, very low thermal EMF, and fast thermal stabilization. All these characteristics, which can be found in the VCS331Z, VCS332Z, VFP4Z, and CSNG, are necessary to prevent errors caused by uneven heat from external sources such as the power amplifiers and other circuit elements.”
GigOptix leverages parallel component products to expand into high speed CE optical links market
USA: GigOptix Inc. leveraged its position as a key merchant component supplier in datacom markets serving the Cloud, to introduce devices that enable a wide range of high speed optical links for consumer systems and applications.
GigOptix’s parallel optical devices are now shipping in production volumes for use in embedded active optical cables (AOCs), pluggables and optical backplanes targeting high speed optical data links for consumer electronics connectivity and applications, such as:
1. Tablets, ultrabooks, and smartphones using the highest video and display resolution
2. 4K/8K high resolution video capture and multi-link transfer for video recording and consumer TVs in the living room and in studios
3. High definition video broadcast links for end points with reaches of greater than 100 meters
4. High speed applications used in 2D and 3D security and safety systems, gesture recognition and motion tracking
Recently, GigOptix parallel chipsets were used by a global electronics OEM to enable full production of 4K high definition video capture and transfer in several of its consumer products. GigOptix 4-channel parallel devices were used in 40Gbps active cable transfer rates to support increased video frame rates and HD 3D imaging. GigOptix chipsets simplify consumer system designs by being fully programmable and providing advanced signal conditioning for superior optical performance with low power consumption.
GigOptix’s parallel optical devices are now shipping in production volumes for use in embedded active optical cables (AOCs), pluggables and optical backplanes targeting high speed optical data links for consumer electronics connectivity and applications, such as:
1. Tablets, ultrabooks, and smartphones using the highest video and display resolution
2. 4K/8K high resolution video capture and multi-link transfer for video recording and consumer TVs in the living room and in studios
3. High definition video broadcast links for end points with reaches of greater than 100 meters
4. High speed applications used in 2D and 3D security and safety systems, gesture recognition and motion tracking
Recently, GigOptix parallel chipsets were used by a global electronics OEM to enable full production of 4K high definition video capture and transfer in several of its consumer products. GigOptix 4-channel parallel devices were used in 40Gbps active cable transfer rates to support increased video frame rates and HD 3D imaging. GigOptix chipsets simplify consumer system designs by being fully programmable and providing advanced signal conditioning for superior optical performance with low power consumption.
Magneti Marelli inaugurates US automotive lighting plant in Pulaski
USA: A new Magneti Marelli Automotive Lighting plant for the production of headlamps and rear lights was inaugurated yesterday in Pulaski, Tenn.
This is the first lighting production plant in the United States, further strengthening an already established presence in the NAFTA region, which includes plants in Ciudad Juárez and Tepotzotlán, Mexico, and the R&D Center in Auburn Hills, Mich., with 180 engineers.
Sergio Marchionne, CEO of Fiat S.p.A and chairman and CEO of Chrysler Group LLC, Tennessee governor Bill Haslam, US Senator Lamar Alexander, Congressman Marsha Blackburn, Pulaski Mayor Patrick Ford, and the heads of Magneti Marelli, Eugenio Razelli, CEO of Magneti Marelli, James Rosseau, country manager for Magneti Marelli North America and Stephane Vedie, CEO for Automotive Lighting North America, attended the inauguration ceremony.
The new production unit was built with an investment of approximately $54 million. The plant currently employs 90 people but Magneti Marelli anticipates that number to reach to approximately 850 employees within the next four years.
This is the first lighting production plant in the United States, further strengthening an already established presence in the NAFTA region, which includes plants in Ciudad Juárez and Tepotzotlán, Mexico, and the R&D Center in Auburn Hills, Mich., with 180 engineers.
Sergio Marchionne, CEO of Fiat S.p.A and chairman and CEO of Chrysler Group LLC, Tennessee governor Bill Haslam, US Senator Lamar Alexander, Congressman Marsha Blackburn, Pulaski Mayor Patrick Ford, and the heads of Magneti Marelli, Eugenio Razelli, CEO of Magneti Marelli, James Rosseau, country manager for Magneti Marelli North America and Stephane Vedie, CEO for Automotive Lighting North America, attended the inauguration ceremony.
The new production unit was built with an investment of approximately $54 million. The plant currently employs 90 people but Magneti Marelli anticipates that number to reach to approximately 850 employees within the next four years.
Silego intros smallest full-featured load switches
USA: Silego Technology is introducing two new GreenFET3 load switch products: SLG59M1495V and SLG59M1512V.
SLG59M1512V is a dual channel load switch that is packaged in an ultra-small single 8 pin TDFN 1.0x1.6mm package. Each channel can be configured and enabled independently. This device supports a linear voltage ramp on each channel, and the ramp rate on each channel can be adjusted independently using external resistors.
The device can switch power rails in the range from 1.0V to 5.0V. Each channel can handle up to 1A continuous current and 1.5A peak current. The RDSON is rated at 80mohm.
SLG59M1495V is single channel version of SLG59M1512 housed in 1.0x1.0mm package. This device shares many of the same operating characteristics as the dual channel device, including linear ramp rate that is user adjustable, and 1 A continuous current rating.
SLG59M1512V is a dual channel load switch that is packaged in an ultra-small single 8 pin TDFN 1.0x1.6mm package. Each channel can be configured and enabled independently. This device supports a linear voltage ramp on each channel, and the ramp rate on each channel can be adjusted independently using external resistors.
The device can switch power rails in the range from 1.0V to 5.0V. Each channel can handle up to 1A continuous current and 1.5A peak current. The RDSON is rated at 80mohm.
SLG59M1495V is single channel version of SLG59M1512 housed in 1.0x1.0mm package. This device shares many of the same operating characteristics as the dual channel device, including linear ramp rate that is user adjustable, and 1 A continuous current rating.
Friday, June 14, 2013
Toshiba expands package line-up of interface bridge LSI for LCD
JAPAN: Toshiba Corp. has expanded its package line-up of interface-converter bridge LSIs for high resolution LCD display that are used in tablet PC, Ultrabooks and other applications.
Mass production of "TC358778XBG" is scheduled to start in June, followed by "TC358777XBG" in July.
The ball pitch of the original product is 0.4mm, and fine pitch assembly equipment is required for production. Expanding the ball pitch from 0.4mm to 0.65mm achieves assembly with no need for such equipment. Toshiba has also optimized the pin assignment for layout without high cost PCB with more than four layers.
Those new package products reduce the set makers' cost of assembly and materials.
Mass production of "TC358778XBG" is scheduled to start in June, followed by "TC358777XBG" in July.
The ball pitch of the original product is 0.4mm, and fine pitch assembly equipment is required for production. Expanding the ball pitch from 0.4mm to 0.65mm achieves assembly with no need for such equipment. Toshiba has also optimized the pin assignment for layout without high cost PCB with more than four layers.
Those new package products reduce the set makers' cost of assembly and materials.
RS Components set up its first electronic center in Bangalore
INDIA: RS Components has come up with its very first electronic centre in Bangalore/Bengaluru.
The establishment of the electronic Centre’s in Bangalore underscores RS Components- commitment to the growing electronic components market and electronic design engineering communities in the region.
The sole objective of RS Components is to provide customers with all the products and solutions they require followed by top-of-the-line service and support and most importantly, all of this in one place. RS Components offers one of the widest ranges of high-performance products from top suppliers of the world. The portfolio consists of over 550,000 products of the most demanded products required by electronic design engineers.
Nearly, 70 percent of its products portfolio caters to the electronic industry. The company is continuously expanding its electronic products range with new technologies to meet the needs of design engineers and buyers.
In addition, RS Components dedicated team of technical experts is combining proprietary intelligence with the latest relevant information from the world’s top electronics suppliers to provide the most comprehensive and appropriate technical knowledge and solutions for engineers.
The establishment of the electronic Centre’s in Bangalore underscores RS Components- commitment to the growing electronic components market and electronic design engineering communities in the region.
The sole objective of RS Components is to provide customers with all the products and solutions they require followed by top-of-the-line service and support and most importantly, all of this in one place. RS Components offers one of the widest ranges of high-performance products from top suppliers of the world. The portfolio consists of over 550,000 products of the most demanded products required by electronic design engineers.
Nearly, 70 percent of its products portfolio caters to the electronic industry. The company is continuously expanding its electronic products range with new technologies to meet the needs of design engineers and buyers.
In addition, RS Components dedicated team of technical experts is combining proprietary intelligence with the latest relevant information from the world’s top electronics suppliers to provide the most comprehensive and appropriate technical knowledge and solutions for engineers.
Northrop Grumman develops GaAs E-band high-power monolithic microwave ICs
USA: Northrop Grumman Corp. has developed new gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) high-power amplifiers operating in the E-Band communication frequency spectrum.
The APH667 and the APH668 are GaAs-based broadband, three-stage amplifier devices that operate from 81 – 86GHz and 71 – 76GHz respectively.
In 2004, Northrop Grumman became the first company to provide commercial availability of E-Band semiconductors. These new products are an example of Northrop's ongoing effort to push the boundaries of robust GaAs technology, said Frank Kropschot, GM, Microelectronics Products and Services, Northrop Grumman Aerospace Systems.
"Customers typically combine several MMIC products in this frequency band to achieve higher output power. The APH667 and APH668 will allow them to dramatically reduce the number of components required to reach those goals, simplifying the product's architecture and enhancing the performance."
Pre-production quantities of the APH667 and APH668 will be available in the third quarter of 2013 with production quantities available in fourth quarter of 2013.
The APH667 and the APH668 are GaAs-based broadband, three-stage amplifier devices that operate from 81 – 86GHz and 71 – 76GHz respectively.
In 2004, Northrop Grumman became the first company to provide commercial availability of E-Band semiconductors. These new products are an example of Northrop's ongoing effort to push the boundaries of robust GaAs technology, said Frank Kropschot, GM, Microelectronics Products and Services, Northrop Grumman Aerospace Systems.
"Customers typically combine several MMIC products in this frequency band to achieve higher output power. The APH667 and APH668 will allow them to dramatically reduce the number of components required to reach those goals, simplifying the product's architecture and enhancing the performance."
Pre-production quantities of the APH667 and APH668 will be available in the third quarter of 2013 with production quantities available in fourth quarter of 2013.
Thursday, June 13, 2013
Diodes Inc. improves power density with integrated high-voltage regulator transistors
USA: Diodes Inc. announced the monolithic integration of a transistor, Zener diode and resistor into a standard SOT89 package.
With this integration, the ZXTR200x family of high-voltage regulators from Diodes Incorporated boosts power-circuit densities through reductions in component count and footprint. Principle applications for the devices are in networking, telecom and Power-over-Ethernet (PoE) where they are ideal voltage supply regulators for primary-side controllers in 48V DC-DC PSUs.
The ZXTR2005Z, ZXTR2008Z and ZXTR2012Z regulator transistors provide designers with high-voltage regulation by taking a nominal 48V input and generating fixed output voltages of 5V, 8V and 12V, where standard linear regulators cannot be used.
The line and load regulation capabilities within the devices safeguard continuous operation by preventing latch-up from transient voltage drops. Additionally, the unique structure allows the input to successfully tolerate spurious voltages up to a maximum of 100V, creating a safety margin in the event of transient over-voltage conditions.
With this integration, the ZXTR200x family of high-voltage regulators from Diodes Incorporated boosts power-circuit densities through reductions in component count and footprint. Principle applications for the devices are in networking, telecom and Power-over-Ethernet (PoE) where they are ideal voltage supply regulators for primary-side controllers in 48V DC-DC PSUs.
The ZXTR2005Z, ZXTR2008Z and ZXTR2012Z regulator transistors provide designers with high-voltage regulation by taking a nominal 48V input and generating fixed output voltages of 5V, 8V and 12V, where standard linear regulators cannot be used.
The line and load regulation capabilities within the devices safeguard continuous operation by preventing latch-up from transient voltage drops. Additionally, the unique structure allows the input to successfully tolerate spurious voltages up to a maximum of 100V, creating a safety margin in the event of transient over-voltage conditions.
Low consumer awareness main obstacle for Chinese LED lighting market
TAIWAN: TrendForce ’s research division LEDinside and Consumer research division AVANTI joint research results showed that only 25 percent of average Chinese consumers had a clear knowledge of LED bulbs. If LED lighting wants to popularize their products, the key is through increasing consumer awareness.
The research was initiated by LEDinside with AVANTI conducting a survey with over 3000 online participants. The current information collected is used to understand the average consumer awareness of LED lighting, consumer buying habits, purchasing channels, brand recognition, and other factors that can influence the purchase of luminaries.
The survey results show that out of 3000 people, 63 percent had clear knowledge of energy saving lights, 53 percent for incandescent lights, while only 25 percent had clear knowledge of LED light bulbs.
During the past few years with the environmental protection and energy saving trend growing, LED has been embraced by commercial and public lighting. However, the penetration rate for residential lighting has not been as high. According to LEDinside predictions for 2012, LED residential lighting only makes up 1 percent of all luminous flux demands for residential lighting.
The research shows that the reason for such a low penetration rate is due to consumer awareness. The common consideration for the business world is whether or not LED lighting C/P ratio can surpass that of traditional lighting. Assuming that the above participants in the survey are rationally minded, have an ample amount of information, and have the ability to clearly weigh pros and cons, then the best consumption plan was used.
Yet, LEDinside’s investigation discovered that consumer awareness for LED is limited with only 25 percent actually having knowledge of LED bulbs. However, the 25 percent who knew LED where still unclear about the benefit of LED bulbs, power consumption, and price. And, 55 percent of people incorrectly believed that the power consumption was 11-20W(LED bulbs on the market are all 3W, 5W, 7W).
With the plan to have about 4 billion luminaries in the Chinese residential lighting market scale and penetration rate predicted to rise from 1 percent in 2012 to 15 percent by 2015, demand is expected to increase from 700 million to 1 billion with the next three years accumulated market capacity reaching 36.3 billion RMB. LEDinside believes that the key to opening up this vast market is clearly through increasing consumer awareness.
The research was initiated by LEDinside with AVANTI conducting a survey with over 3000 online participants. The current information collected is used to understand the average consumer awareness of LED lighting, consumer buying habits, purchasing channels, brand recognition, and other factors that can influence the purchase of luminaries.
The survey results show that out of 3000 people, 63 percent had clear knowledge of energy saving lights, 53 percent for incandescent lights, while only 25 percent had clear knowledge of LED light bulbs.
During the past few years with the environmental protection and energy saving trend growing, LED has been embraced by commercial and public lighting. However, the penetration rate for residential lighting has not been as high. According to LEDinside predictions for 2012, LED residential lighting only makes up 1 percent of all luminous flux demands for residential lighting.
The research shows that the reason for such a low penetration rate is due to consumer awareness. The common consideration for the business world is whether or not LED lighting C/P ratio can surpass that of traditional lighting. Assuming that the above participants in the survey are rationally minded, have an ample amount of information, and have the ability to clearly weigh pros and cons, then the best consumption plan was used.
Yet, LEDinside’s investigation discovered that consumer awareness for LED is limited with only 25 percent actually having knowledge of LED bulbs. However, the 25 percent who knew LED where still unclear about the benefit of LED bulbs, power consumption, and price. And, 55 percent of people incorrectly believed that the power consumption was 11-20W(LED bulbs on the market are all 3W, 5W, 7W).
With the plan to have about 4 billion luminaries in the Chinese residential lighting market scale and penetration rate predicted to rise from 1 percent in 2012 to 15 percent by 2015, demand is expected to increase from 700 million to 1 billion with the next three years accumulated market capacity reaching 36.3 billion RMB. LEDinside believes that the key to opening up this vast market is clearly through increasing consumer awareness.
Mitsubishi Electric to launch super-mini DIPIPM ver. 6
JAPAN: Mitsubishi Electric Corp. will launch its Ver.6 Series transfer-molded super-mini dual in-line package intelligent power module (DIPIPM) using a seventh-generation IGBT with a CSTBT structure.
The module reduces both power loss and the cost of inverter drive systems for motors used in air conditioners and other small-capacity motor drive applications. Sales begin June 21.
This product will be exhibited at Power Conversion Intelligent Motion (PCIM) Asia 2013, which will be held in Shanghai, China from June 18 to 20.
The Super-mini DIPIPM Ver.6 Series is compliant with the European Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).
The module reduces both power loss and the cost of inverter drive systems for motors used in air conditioners and other small-capacity motor drive applications. Sales begin June 21.
This product will be exhibited at Power Conversion Intelligent Motion (PCIM) Asia 2013, which will be held in Shanghai, China from June 18 to 20.
The Super-mini DIPIPM Ver.6 Series is compliant with the European Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).
Mouser delivers industry's first 1200V HF silicon carbide half-bridge module from Cree
TAIWAN: Mouser Electronics Inc. is stocking the industry's first SiC MOSFET and SiC Schottky diode combined in a single half-bridge package—the CAS100H12AM1 from Cree.
Cree CAS100H12AM1 1200V High-Frequency Silicon Carbide Half-bridge Module is the first commercially available all silicon carbide (SiC) power module. It is also the first fully-qualified module with both SiC MOSFETs and SiC Schottky diodes combined in a single half-bridge package. This new dual module features ultra-low loss and high ruggedness for high-frequency operation.
The CAS100H12AM1 has demonstrated up to 100kHz operation and provides 100A current handling at 1200V blocking. Higher frequency operation enables compact and lightweight systems and less expensive inductors and capacitors in the system. The CAS100H12AM1 is ideal for industrial applications including high power converters, motor drives, solar inverters, UPS and SMPS, and induction heating.
Cree CAS100H12AM1 1200V High-Frequency Silicon Carbide Half-bridge Module is the first commercially available all silicon carbide (SiC) power module. It is also the first fully-qualified module with both SiC MOSFETs and SiC Schottky diodes combined in a single half-bridge package. This new dual module features ultra-low loss and high ruggedness for high-frequency operation.
The CAS100H12AM1 has demonstrated up to 100kHz operation and provides 100A current handling at 1200V blocking. Higher frequency operation enables compact and lightweight systems and less expensive inductors and capacitors in the system. The CAS100H12AM1 is ideal for industrial applications including high power converters, motor drives, solar inverters, UPS and SMPS, and induction heating.
Wednesday, June 12, 2013
IXYS Integrated Circuits Division offers three wide voltage range 1.5A MOSFET and IGBT gate drivers
USA: IXYS Integrated Circuits Division (ICD) Inc. announced the immediate availability of the IX4426, IX4427, and IX4428 low-cost, dual low-side gate driver ICs.
Each one of the IX4426/7/8 outputs is capable of sourcing and sinking 1.5A, and they have a wide operating voltage range of 4.5V to 35V, which is much higher than competitive parts. The inputs of each driver are TTL and CMOS compatible, and are virtually immune to latch-up. The IX4426/7/8 are specified with an operating temperature range of -40C to +125C.
The IX4426 is configured as a dual inverting driver; the IX4427 is configured as a dual non-inverting driver; and the IX4428 is configured with one inverting and one non-inverting driver. All versions have an industry standard pinout and are available in an 8-lead SOIC package. The IX4426N, IX4427N and IX4428N devices are lower cost drop-in replacements for various competitive 1.5A gate drivers, while providing a much higher 35V operating capability.
The low cost IX4426/7/8 are well suited for driving power MOSFETs and IGBTs in switching power supplies, motor controls, and DC to DC converters. The IX4426/7/8 devices are added to IXYS ICD's extensive gate driver IC portfolio, which includes its popular IXD_600 series of low side gate driver ICs. The IXD_600 series offers gate drivers rated from 2A up to 30A.
These families of gate drivers are compatible with IXYS’ Zilog MCUs for digital power control, with IXYS’ families of rugged power MOSFETs and IGBTs. The IX446/7/8 devices are available in production quantities.
Each one of the IX4426/7/8 outputs is capable of sourcing and sinking 1.5A, and they have a wide operating voltage range of 4.5V to 35V, which is much higher than competitive parts. The inputs of each driver are TTL and CMOS compatible, and are virtually immune to latch-up. The IX4426/7/8 are specified with an operating temperature range of -40C to +125C.
The IX4426 is configured as a dual inverting driver; the IX4427 is configured as a dual non-inverting driver; and the IX4428 is configured with one inverting and one non-inverting driver. All versions have an industry standard pinout and are available in an 8-lead SOIC package. The IX4426N, IX4427N and IX4428N devices are lower cost drop-in replacements for various competitive 1.5A gate drivers, while providing a much higher 35V operating capability.
The low cost IX4426/7/8 are well suited for driving power MOSFETs and IGBTs in switching power supplies, motor controls, and DC to DC converters. The IX4426/7/8 devices are added to IXYS ICD's extensive gate driver IC portfolio, which includes its popular IXD_600 series of low side gate driver ICs. The IXD_600 series offers gate drivers rated from 2A up to 30A.
These families of gate drivers are compatible with IXYS’ Zilog MCUs for digital power control, with IXYS’ families of rugged power MOSFETs and IGBTs. The IX446/7/8 devices are available in production quantities.
Molex subsidiary Polymicro showcases specialty optical fibers at CLEO 2013
USA: Polymicro Technologies, a subsidiary of Molex Inc., will exhibit FBPI optical fiber and hollow silica fiber products at the Conference on Lasers and Electro-Optics (CLEO), sponsored by the American Physical Society/Division of Laser Science, IEEE Photonics Society and the Optical Society.
Being held June 9-14 at the San Jose Convention Center in California, the CLEO 2013 technical show provides an annual forum for scientists involved in chromatographic separations.
“Many spectroscopic applications require high performance optical fibers that transmit light over a broad spectrum,” states Robert Dauphinais, business development manager, Polymicro Technologies. “Unlike standard optical fibers which are limited by transmission spectral range, Polymicro’s proprietary optical fiber transmits a wider range of wavelengths with relative uniformity across the wavelength range.”
Being held June 9-14 at the San Jose Convention Center in California, the CLEO 2013 technical show provides an annual forum for scientists involved in chromatographic separations.
“Many spectroscopic applications require high performance optical fibers that transmit light over a broad spectrum,” states Robert Dauphinais, business development manager, Polymicro Technologies. “Unlike standard optical fibers which are limited by transmission spectral range, Polymicro’s proprietary optical fiber transmits a wider range of wavelengths with relative uniformity across the wavelength range.”
TI DLP takes interactivity to next level
USA: Texas Instruments (TI) DLP unveiled new technology advancements that will make seamless interactivity a reality for projection and display. DLP's multitouch technology prototype, which is being shown for the first time this week, lets customers turn any surface into a fully interactive touch screen for multiple users.
Combined with DLP's any-format-3D-compatibility, solid state illumination and high-contrast 1080p data projectors, this new technology will enable classrooms and boardrooms to create powerful shared interactive experiences.
"It's no longer enough to be able to simply view content, consumers expect to interact with their technology in a seamless way," said Roger Carver, manager of DLP Front Projection. "The solution we're demonstrating this week registers up to 20 points of touch on any surface, and from a technical standpoint, there's no reason we can't move well beyond."
Between 2010 and 2012 global sales of interactive projectors more than tripled reaching over 140,000 units shipped, and according to Futuresource, demand continues to rise this year. Consistent with the market trend toward interactive displays, schools are looking for a way to replicate the traditional chalk or whiteboard shared-learning experience with technology. With multitouch interactivity, DLP is creating a platform that will allow teams of students to participate simultaneously on a screen big enough to fill an entire wall.
Manufacturers such as Hitachi, NEC, Panasonic and Ricoh have been adding DLP technology to their existing product lines to leverage DLP innovations.
Combined with DLP's any-format-3D-compatibility, solid state illumination and high-contrast 1080p data projectors, this new technology will enable classrooms and boardrooms to create powerful shared interactive experiences.
"It's no longer enough to be able to simply view content, consumers expect to interact with their technology in a seamless way," said Roger Carver, manager of DLP Front Projection. "The solution we're demonstrating this week registers up to 20 points of touch on any surface, and from a technical standpoint, there's no reason we can't move well beyond."
Between 2010 and 2012 global sales of interactive projectors more than tripled reaching over 140,000 units shipped, and according to Futuresource, demand continues to rise this year. Consistent with the market trend toward interactive displays, schools are looking for a way to replicate the traditional chalk or whiteboard shared-learning experience with technology. With multitouch interactivity, DLP is creating a platform that will allow teams of students to participate simultaneously on a screen big enough to fill an entire wall.
Manufacturers such as Hitachi, NEC, Panasonic and Ricoh have been adding DLP technology to their existing product lines to leverage DLP innovations.
Wavien intros ultra bright LED fiber optic illuminator using RLT technology
USA: Wavien Inc. introduced an ultra bright LED fiber optic illuminator using its patented Recycling Light Technology (RLT), designed for architectural and signage applications.
Wavien's new system combines the improved brightness produced by RLT technology with the long lifetime of LED technology. This combination overcomes past obstacles to fiber optic signage and architectural applications, which were hampered by the short lifetime of arc lamp illuminators and insufficient brightness of LED illuminators.
Wavien's new illuminator can support both 3M single core fiber or Schott multi-fiber bundles, allowing the RLT system to replace neon-based signs currently used in a wide variety of side-firing applications.
The RLT technology greatly improves brightness to LEDs with full red, green, blue and white color capability. Using a 4-color LED package allows the light output to be digitally control and produce unlimited color variations. This multi-color capability is not available in traditional neon signs and will provide a new dimension in a broad variety of signage and architectural applications.
Traditional light collection optics platforms do not increase LED brightness and as a result, are not efficient for projection. The basis of Wavien's RLT technology is a very low-cost recycling collar optical component that captures the wasted light in conventional optics designs, recycles the light and redirects it back into the output beam allowing increased efficiency, while reducing the power consumption.
Wavien's new system combines the improved brightness produced by RLT technology with the long lifetime of LED technology. This combination overcomes past obstacles to fiber optic signage and architectural applications, which were hampered by the short lifetime of arc lamp illuminators and insufficient brightness of LED illuminators.
Wavien's new illuminator can support both 3M single core fiber or Schott multi-fiber bundles, allowing the RLT system to replace neon-based signs currently used in a wide variety of side-firing applications.
The RLT technology greatly improves brightness to LEDs with full red, green, blue and white color capability. Using a 4-color LED package allows the light output to be digitally control and produce unlimited color variations. This multi-color capability is not available in traditional neon signs and will provide a new dimension in a broad variety of signage and architectural applications.
Traditional light collection optics platforms do not increase LED brightness and as a result, are not efficient for projection. The basis of Wavien's RLT technology is a very low-cost recycling collar optical component that captures the wasted light in conventional optics designs, recycles the light and redirects it back into the output beam allowing increased efficiency, while reducing the power consumption.
Vishay announces IHTH high-current, high-temperature inductors for automotive apps
USA: Vishay Intertechnology Inc. has introduced two new IHTH high-current, high-temperature through-hole inductors in the 0750 and 1125 case sizes.
For automotive applications, the AEC-Q200-qualified IHTH-0750IZ-5A and IHTH-1125KZ-5A feature high operating temperatures to +155 °C, high rated currents to 125 A, and a wide range of inductance values from 0.47 to 100 microhenries.
With a frequency range up to 10 MHz for some values, the devices released today serve as high-performing, space- and power-saving solutions for voltage regulator modules (VRM) and DC/DC converters.
The IHTH-0750IZ-5A and IHTH-1125KZ-5A are designed for high-temperature automotive applications, including engine and transmission control units, diesel injection drivers, LED drivers, HID lighting, and noise suppression for motors in windshield wipers, power seats and mirrors, and heating and ventilation blowers.
The new inductors handle high transient current spikes without hard saturation. Packaged in an RoHS-compliant, 100 percent lead (Pb)-free shielded, composite construction that reduces buzz noise to ultra-low levels, the devices are specified for an operating temperature range of -55 °C to +155 °C, with high resistance to thermal shock, moisture, mechanical shock, and vibration. The inductors are halogen-free and conform to Vishay "Green" standards.
For automotive applications, the AEC-Q200-qualified IHTH-0750IZ-5A and IHTH-1125KZ-5A feature high operating temperatures to +155 °C, high rated currents to 125 A, and a wide range of inductance values from 0.47 to 100 microhenries.
With a frequency range up to 10 MHz for some values, the devices released today serve as high-performing, space- and power-saving solutions for voltage regulator modules (VRM) and DC/DC converters.
The IHTH-0750IZ-5A and IHTH-1125KZ-5A are designed for high-temperature automotive applications, including engine and transmission control units, diesel injection drivers, LED drivers, HID lighting, and noise suppression for motors in windshield wipers, power seats and mirrors, and heating and ventilation blowers.
The new inductors handle high transient current spikes without hard saturation. Packaged in an RoHS-compliant, 100 percent lead (Pb)-free shielded, composite construction that reduces buzz noise to ultra-low levels, the devices are specified for an operating temperature range of -55 °C to +155 °C, with high resistance to thermal shock, moisture, mechanical shock, and vibration. The inductors are halogen-free and conform to Vishay "Green" standards.
NXP brings high efficiency to 12V MR16 lamps with dimmable LED controller
THE NETHERLANDS & CHINA: NXP Semiconductors N.V. has unveiled the SSL3401 -- a dimmable single-stage controller IC for retrofit MR16 LED lamps using 12V AC mains.
The SSL3401 offers compatibility with an exceptionally wide range of dimmers and transformers -- working with over 80 percent of the most common combinations -- in a compact form factor that fits in all commonly used MR16 GU5.3 and AR111 housings and sockets. Supporting an ambient temperature range up to 105ºC, the SSL3401 also provides temperature rollback protection.
Based on NXP GreenChip technology, the SSL3401 generates a stable and accurate current while dimming down to below 5 percent of maximum light output in most common practical situations.
While maximum lamp power depends on the thermal design of the lamp, a typical 7W MR16 LED lamp using the SSL3401 achieves THD below 15 percent, power factor above 0.9, efficiency up to 78 percent and LED ripple current below ±10 percent.
The SSL3401 offers compatibility with an exceptionally wide range of dimmers and transformers -- working with over 80 percent of the most common combinations -- in a compact form factor that fits in all commonly used MR16 GU5.3 and AR111 housings and sockets. Supporting an ambient temperature range up to 105ºC, the SSL3401 also provides temperature rollback protection.
Based on NXP GreenChip technology, the SSL3401 generates a stable and accurate current while dimming down to below 5 percent of maximum light output in most common practical situations.
While maximum lamp power depends on the thermal design of the lamp, a typical 7W MR16 LED lamp using the SSL3401 achieves THD below 15 percent, power factor above 0.9, efficiency up to 78 percent and LED ripple current below ±10 percent.
Tuesday, June 11, 2013
GE Albeo high bay LED lighting at Weber State University
USA: Weber State University’s installation of GE’s Albeo LED High Bay lighting at the Dee Events Center has been met with resounding cheers for its lighting quality and energy savings.
By replacing high-intensity discharge (HID) lighting commonly found in sports arenas, the Albeo ABHX-Series uses 70 percent less energy and is expected to save the university nearly $40,000 each year.
When assessing a potential energy-saving project, the WSU Energy & Sustainability Office looks at other institutions’ solutions for ideas. But there were no examples to consider when an analysis of campus energy use revealed that HID lighting at the Dee Events Center was one of the single biggest power hogs.
By replacing high-intensity discharge (HID) lighting commonly found in sports arenas, the Albeo ABHX-Series uses 70 percent less energy and is expected to save the university nearly $40,000 each year.
When assessing a potential energy-saving project, the WSU Energy & Sustainability Office looks at other institutions’ solutions for ideas. But there were no examples to consider when an analysis of campus energy use revealed that HID lighting at the Dee Events Center was one of the single biggest power hogs.
IXYS intros anode gated thyristor technology platform
SWITZERLAND: IXYS Corp. announced a new Anode Gated Thyristor (AGT) Technology Platform.
The first product derived from this new Technology Platform is the CLB30I1200HB, a 30 ampere, 1200 volt single thyristor in a TO-247 discrete package. The gate control of the CLB30I1200HB is connected to the anode side of the silicon die instead of to the cathode side, as done in a standard thyristor.
The combination of the Anode Gated Thyristor (AGT) together with a standard thyristor, e.g. the CLA30E1200HB, gives several interesting configurations. Thyristor phase-leg configurations normally contain two separated gate driver potentials, but by replacing one thyristor with the AGT, it will reduce to only one gate driver potential. This will save one complete gate driver circuit.
Also, an AC switch configuration benefits from the AGT. Here the switch can be operated with only one gate drive circuit. This shows great cost saving possibilities by reducing the gate drive component count. Therefore it will also have a positive impact on the Mean Time To Failure (MTTF) in the final application.
The AGT platform has similar electrical specification as the standard thyristor and is not limited to the 1200V/30A ratings of the CLB30I1200HB. In the future, various die sizes with higher and lower current/voltage ratings are planned to complete the AGT product portfolio. This new Thyristor Platform is made possible by IXYS’ known and proven thyristor technologies and in-house production methods.
Several applications are targeted by the Anode Gated Thyristor for example: line rectifying, soft-starters, motor control, AC power/lighting and temperature control. Generally, power control applications that use TRIACs, or thyristors are ideal for the use of this AGT, with simplified design and better performance.
The first product derived from this new Technology Platform is the CLB30I1200HB, a 30 ampere, 1200 volt single thyristor in a TO-247 discrete package. The gate control of the CLB30I1200HB is connected to the anode side of the silicon die instead of to the cathode side, as done in a standard thyristor.
The combination of the Anode Gated Thyristor (AGT) together with a standard thyristor, e.g. the CLA30E1200HB, gives several interesting configurations. Thyristor phase-leg configurations normally contain two separated gate driver potentials, but by replacing one thyristor with the AGT, it will reduce to only one gate driver potential. This will save one complete gate driver circuit.
Also, an AC switch configuration benefits from the AGT. Here the switch can be operated with only one gate drive circuit. This shows great cost saving possibilities by reducing the gate drive component count. Therefore it will also have a positive impact on the Mean Time To Failure (MTTF) in the final application.
The AGT platform has similar electrical specification as the standard thyristor and is not limited to the 1200V/30A ratings of the CLB30I1200HB. In the future, various die sizes with higher and lower current/voltage ratings are planned to complete the AGT product portfolio. This new Thyristor Platform is made possible by IXYS’ known and proven thyristor technologies and in-house production methods.
Several applications are targeted by the Anode Gated Thyristor for example: line rectifying, soft-starters, motor control, AC power/lighting and temperature control. Generally, power control applications that use TRIACs, or thyristors are ideal for the use of this AGT, with simplified design and better performance.
Kickstart IoT development with TI's SimpleLink Wi-Fi CC3000 booster pack
USA: To help professional engineers, hobbyists and university students kickstart the development of Wi-Fi-enabled Internet of Things (IoT) applications, Texas Instruments Inc. (TI) announced the SimpleLink Wi-Fi CC3000 BoosterPack.
The new Wi-Fi BoosterPack is powered by the SimpleLink Wi-Fi CC3000 module from TI, which offers simplified Wi-Fi connectivity for microcontroller (MCU) -based systems. Working with both the MSP430 and Tiva C Series MCU LaunchPad evaluation kits, the CC3000 BoosterPack (CC3000BOOST) quickly gets designs started for a wide variety of MCU-based home automation, health and fitness and machine to machine (M2M) applications.
Since the new BoosterPack is based on TI's SimpleLink Wi-Fi CC3000 module, it benefits from features including reduced development time, lower manufacturing costs, less board space, easier certification, and minimal required RF expertise. Armed with TI's unique SmartConfig™ technology, the new SimpleLink Wi-Fi CC3000 BoosterPack allows for one-step activation of multiple in-home, headless devices to get them quickly connected to the Wi-Fi network.
The new Wi-Fi BoosterPack is powered by the SimpleLink Wi-Fi CC3000 module from TI, which offers simplified Wi-Fi connectivity for microcontroller (MCU) -based systems. Working with both the MSP430 and Tiva C Series MCU LaunchPad evaluation kits, the CC3000 BoosterPack (CC3000BOOST) quickly gets designs started for a wide variety of MCU-based home automation, health and fitness and machine to machine (M2M) applications.
Since the new BoosterPack is based on TI's SimpleLink Wi-Fi CC3000 module, it benefits from features including reduced development time, lower manufacturing costs, less board space, easier certification, and minimal required RF expertise. Armed with TI's unique SmartConfig™ technology, the new SimpleLink Wi-Fi CC3000 BoosterPack allows for one-step activation of multiple in-home, headless devices to get them quickly connected to the Wi-Fi network.
Toshiba: Novel device structure for low power consumption MOSFETs for RF/analog apps
JAPAN: Toshiba Corp. announced the development of a high power gain transistor using a CMOS compatible process.
The transistor efficiently reduces power consumption in high frequency RF/analog front-end application. Details will be presented on June 12 at the 2013 Symposia on VLSI Technology and Circuits, held in Kyoto, Japan, June 11-14, 2013.
Rapid growth in wireless and mobile devices, including smart phones and tablets, is driving demand for RF/Analog circuits offering low-power consumption and high-performance. However, it is difficult to apply the advanced device and process technologies widely used in digital circuitry to RF/Analog circuits, as transistor scaling results in noise and deterioration in energy gain efficiency.
Toshiba has addressed this problem with a novel device structure using two different materials as the gate electrode of a single MOSFET and a process integration scheme that employs a widely used common semiconductor manufacturing method. This approach has achieved nanometer level gate length control.
Experimental results with the transistor have secured significantly lower power consumption without any slow down in operation speed.
The distinctive characteristic of the device structure is a thin oxide barrier film between the two materials, the n-type Si and p-type Si in the gate electrode, which suppresses impurity inter-diffusion. A high electric field under the gate electrode region can be achieved, enhancing amplifier efficiency. A different gate oxide film thickness is implemented with different gate electrode materials. This structure achieves a well-controlled device property in saturation mode even in low operation voltage.
The new device fabrication process is also applicable to the high-permittivity (high-k) gate insulator used in advanced digital LSI manufacturing.
The transistor efficiently reduces power consumption in high frequency RF/analog front-end application. Details will be presented on June 12 at the 2013 Symposia on VLSI Technology and Circuits, held in Kyoto, Japan, June 11-14, 2013.
Rapid growth in wireless and mobile devices, including smart phones and tablets, is driving demand for RF/Analog circuits offering low-power consumption and high-performance. However, it is difficult to apply the advanced device and process technologies widely used in digital circuitry to RF/Analog circuits, as transistor scaling results in noise and deterioration in energy gain efficiency.
Toshiba has addressed this problem with a novel device structure using two different materials as the gate electrode of a single MOSFET and a process integration scheme that employs a widely used common semiconductor manufacturing method. This approach has achieved nanometer level gate length control.
Experimental results with the transistor have secured significantly lower power consumption without any slow down in operation speed.
The distinctive characteristic of the device structure is a thin oxide barrier film between the two materials, the n-type Si and p-type Si in the gate electrode, which suppresses impurity inter-diffusion. A high electric field under the gate electrode region can be achieved, enhancing amplifier efficiency. A different gate oxide film thickness is implemented with different gate electrode materials. This structure achieves a well-controlled device property in saturation mode even in low operation voltage.
The new device fabrication process is also applicable to the high-permittivity (high-k) gate insulator used in advanced digital LSI manufacturing.
TI intros industry's smallest low-power, dual-channel push-button reset controllers for portable apps
USA: Texas Instruments Inc. (TI) has introduced two tiny push-button reset controllers for space-constrained, power-sensitive applications such as pedometers, fitness bands, cell phones and tablets.
The dual-channel TPS3420 and TPS3421 feature low power consumption and a selectable reset time delay to improve system stability.
Push-button reset controllers are required for portable electronics with an embedded battery. In practice, the user presses and holds one or two external keys for a specific period of time, which turns the portable device off or generates a reset.
The TPS3420 and TPS3421 use a long input delay to provide the intended system reset and avoid reset from short push-button or key presses. This reset configuration enables differentiation between software interrupts and hard system resets. The timers are the first in a family of new push-button controllers from TI to ensure a hard and full system reset when needed to increase efficiency.
The dual-channel TPS3420 and TPS3421 feature low power consumption and a selectable reset time delay to improve system stability.
Push-button reset controllers are required for portable electronics with an embedded battery. In practice, the user presses and holds one or two external keys for a specific period of time, which turns the portable device off or generates a reset.
The TPS3420 and TPS3421 use a long input delay to provide the intended system reset and avoid reset from short push-button or key presses. This reset configuration enables differentiation between software interrupts and hard system resets. The timers are the first in a family of new push-button controllers from TI to ensure a hard and full system reset when needed to increase efficiency.
Monday, June 10, 2013
IXYS Integrated Circuits Division offers three new 3A gate drivers For power MOSFETs and IGBTs
USA: IXYS Integrated Circuits Division (ICD) Inc., a wholly owned subsidiary of IXYS Corp., announced the availability of the IX4423/4/5 low cost, dual low side gate driver ICs.
Each one of the IX4423/4/5 outputs is capable of sourcing and sinking 3A, and have a wide operating voltage range of 4.5V to 35V, which is much higher than competitive parts. The inputs of each driver are CMOS compatible, and are virtually immune to latch-up. The IX4423/4/5 are specified with an operating temperature range of -40C to +125C.
The IX4423 is configured as a dual inverting driver; the IX4424 is configured as a dual non-inverting driver; and the IX4425 is configured with one inverting and one non-inverting driver. The IX4423N, IX4424N and IX4425N devices are drop in replacements for the MIC4423YM, MIC4424YM and MIC4425YM respectively, but offer operating voltages of up to 35V versus a maximum operating voltage of 18V.
The low cost IX4423/4/5 are well suited for driving power MOSFETs, IGBTs and even thyristors in switching power supplies, motor controls, and DC to DC converters. All versions have an industry standard pinout and are available in an 8-lead SOIC package. The IX4423/4/5 are added to IXYS ICD's extensive gate driver IC portfolio, which includes its popular IXD_600 series of low side gate driver ICs. The IXD_600 series offers gate drivers rated from 2A up to 30A.
These gate drivers are compatible with IXYS’ Zilog MCUs for digital power control and with IXYS’ rugged power MOSFETs and IGBTs. The IX4423/4/5 devices are available in production quantities.
Each one of the IX4423/4/5 outputs is capable of sourcing and sinking 3A, and have a wide operating voltage range of 4.5V to 35V, which is much higher than competitive parts. The inputs of each driver are CMOS compatible, and are virtually immune to latch-up. The IX4423/4/5 are specified with an operating temperature range of -40C to +125C.
The IX4423 is configured as a dual inverting driver; the IX4424 is configured as a dual non-inverting driver; and the IX4425 is configured with one inverting and one non-inverting driver. The IX4423N, IX4424N and IX4425N devices are drop in replacements for the MIC4423YM, MIC4424YM and MIC4425YM respectively, but offer operating voltages of up to 35V versus a maximum operating voltage of 18V.
The low cost IX4423/4/5 are well suited for driving power MOSFETs, IGBTs and even thyristors in switching power supplies, motor controls, and DC to DC converters. All versions have an industry standard pinout and are available in an 8-lead SOIC package. The IX4423/4/5 are added to IXYS ICD's extensive gate driver IC portfolio, which includes its popular IXD_600 series of low side gate driver ICs. The IXD_600 series offers gate drivers rated from 2A up to 30A.
These gate drivers are compatible with IXYS’ Zilog MCUs for digital power control and with IXYS’ rugged power MOSFETs and IGBTs. The IX4423/4/5 devices are available in production quantities.
New Fluke Networks family of certification tools improve profitability for cable installers
USA: Fluke Networks announced its new family of Versiv Cable Certification Testers designed to help data communications installers more quickly, accurately and profitably achieve system acceptance for copper and fiber jobs.
Versiv is a powerful platform offering interchangeable modules for copper, fiber and Optical Time Domain Reflectometer (OTDR) testing, as well as new software innovations that speed test time and accuracy, and simplify testing setup, planning and reporting.
In a global study of cabling professionals, mistakes, complexity and rework are adding more than a week of labor to a typical 1,000 cabling drop installation, resulting in average losses of more than $2,500 USD. To combat these growing challenges, Versiv has been built from the ground up to go beyond testing and troubleshooting to address the entire certification lifecycle. Its new capabilities help contractors manage the complexities of today’s certification landscape and reduce errors that can threaten profitability.
Key to simplifying the complexity is the new ProjX management system. In addition to allowing team leaders to set up test parameters to work across multiple jobs and media, the system accelerates planning and setup of projects by allowing technicians to capture consistent test parameters across an entire job, or switch from job to job by simply clicking between projects stored in the tester.
The system also allows up-to-the-minute project analysis and oversight to help speed certification and reporting. If problems are encountered during the testing process, technicians can create a “Fix Later” troubleshooting to-do list for later evaluation by more experienced installers.
Versiv also features an intuitive and instructive touch screen interface that elevates the capabilities of the less experienced installers, and increases the speed of testing and global ISO Level V testing compliance. From wizards that speed set up to the advanced Taptive user interface for navigation to new workflow enhancements, all of the new features in Versiv combine to make it the fastest tester on the market, so jobs get done right the first time.
Versiv is a powerful platform offering interchangeable modules for copper, fiber and Optical Time Domain Reflectometer (OTDR) testing, as well as new software innovations that speed test time and accuracy, and simplify testing setup, planning and reporting.
In a global study of cabling professionals, mistakes, complexity and rework are adding more than a week of labor to a typical 1,000 cabling drop installation, resulting in average losses of more than $2,500 USD. To combat these growing challenges, Versiv has been built from the ground up to go beyond testing and troubleshooting to address the entire certification lifecycle. Its new capabilities help contractors manage the complexities of today’s certification landscape and reduce errors that can threaten profitability.
Key to simplifying the complexity is the new ProjX management system. In addition to allowing team leaders to set up test parameters to work across multiple jobs and media, the system accelerates planning and setup of projects by allowing technicians to capture consistent test parameters across an entire job, or switch from job to job by simply clicking between projects stored in the tester.
The system also allows up-to-the-minute project analysis and oversight to help speed certification and reporting. If problems are encountered during the testing process, technicians can create a “Fix Later” troubleshooting to-do list for later evaluation by more experienced installers.
Versiv also features an intuitive and instructive touch screen interface that elevates the capabilities of the less experienced installers, and increases the speed of testing and global ISO Level V testing compliance. From wizards that speed set up to the advanced Taptive user interface for navigation to new workflow enhancements, all of the new features in Versiv combine to make it the fastest tester on the market, so jobs get done right the first time.
Mouser launches new programmable logic technology site
TAIWAN: Mouser Electronics Inc. announced its newest technology site on Mouser.com focusing on Programmable Logic Technology.
This new site helps design engineers learn more about the different types of programmable logic technology and identify the ideal components for particular applications.
Programmable Logic Devices (PLDs) vary from simple combinations of digital logic integrated on one chip to Complex Programmable Logic Devices (CPLDs) and Field Programmable Gate Arrays (FPGAs). The hardware devices can be designed into any logical function where an Application Specific IC (ASIC) could be used and have the ability to update their functionality after production making a single device suitable for multiple applications.
Mouser’s Programmable Logic Technology site serves as an introductory resource center for PLD technology. The site spotlights some of the industry’s latest high-performance programmable logic devices, including Altera’s Cyclone V System-on-Chip FPGA and MAX V CPLD.
Featured articles on the site take an in-depth look at some of the advantages offered by designing with PLDs. Mouser delves into how flexible PLD solutions allow designers to develop highly integrated, custom application-specific SoCs, from simple combinational logic to full system-level designs.
This new site helps design engineers learn more about the different types of programmable logic technology and identify the ideal components for particular applications.
Programmable Logic Devices (PLDs) vary from simple combinations of digital logic integrated on one chip to Complex Programmable Logic Devices (CPLDs) and Field Programmable Gate Arrays (FPGAs). The hardware devices can be designed into any logical function where an Application Specific IC (ASIC) could be used and have the ability to update their functionality after production making a single device suitable for multiple applications.
Mouser’s Programmable Logic Technology site serves as an introductory resource center for PLD technology. The site spotlights some of the industry’s latest high-performance programmable logic devices, including Altera’s Cyclone V System-on-Chip FPGA and MAX V CPLD.
Featured articles on the site take an in-depth look at some of the advantages offered by designing with PLDs. Mouser delves into how flexible PLD solutions allow designers to develop highly integrated, custom application-specific SoCs, from simple combinational logic to full system-level designs.
Friday, June 7, 2013
Aehr and iST announce delivery of additional test capacity of ABTS-Pi system to iST
USA: Aehr Test Systems and Integrated Service Technology, Inc. (iST) announced that Aehr Test has delivered an additional ABTS-Pi Advanced Burn-in and Test System with high power and an individual temperature control system to meet additional capacity needs at iST.
Founded in 1994, iST group, which is headquartered in Hsinchu, Taiwan, is a leading lab-service company, specializing in the development of IC product testing and analysis, failure analysis, debugging, reliability test, and material analysis.
Due to the outsourcing trend among large international manufacturers, iST has also taken on the role of an independent quality testing laboratory for brand-name companies' outsourced products and has been certified by Motorola, Dell, Cisco, and Delphi. iST is now one of the top laboratories in the world.
iST is adding the high power and individual temperature control capacity to their existing installed base of ABTS systems at their Taiwan facility. iST also has an installed base of ABTS systems at their Shanghai facility.
iST group has expanded its operations to Beijing, Shanghai, Shenzhen, Kansan, Japan and Sunnyvale (USA), in order to provide customers with prompt, reliable and high quality technical service.
Founded in 1994, iST group, which is headquartered in Hsinchu, Taiwan, is a leading lab-service company, specializing in the development of IC product testing and analysis, failure analysis, debugging, reliability test, and material analysis.
Due to the outsourcing trend among large international manufacturers, iST has also taken on the role of an independent quality testing laboratory for brand-name companies' outsourced products and has been certified by Motorola, Dell, Cisco, and Delphi. iST is now one of the top laboratories in the world.
iST is adding the high power and individual temperature control capacity to their existing installed base of ABTS systems at their Taiwan facility. iST also has an installed base of ABTS systems at their Shanghai facility.
iST group has expanded its operations to Beijing, Shanghai, Shenzhen, Kansan, Japan and Sunnyvale (USA), in order to provide customers with prompt, reliable and high quality technical service.
Rochester Electronics re-introduces National Semiconductor's LM110 voltage follower series
USA: As part of its Extension-of-Life program, Rochester Electronics has re-introduced the LM110 Voltage Follower Series originally manufactured by National Semiconductor.
This series has been tested at temperatures ranging from -55°C to 125°C, and are most useful in fast sample and hold circuits, active filters, or as general-purpose buffers.
The LM110 Voltage Follower Series can function as a plug-in replacement for the LM102 Voltage Follower Series, providing a higher speed and wider operating voltage range.
This series has been tested at temperatures ranging from -55°C to 125°C, and are most useful in fast sample and hold circuits, active filters, or as general-purpose buffers.
The LM110 Voltage Follower Series can function as a plug-in replacement for the LM102 Voltage Follower Series, providing a higher speed and wider operating voltage range.
Thursday, June 6, 2013
SemiLEDs broadens vertical UV-LED portfolio with mid- and high-power offerings
TAIWAN: SemiLEDs Corp. announced the release of two new product families, the 10-watt high-power N9 series, and the 0.17 to 0.50-watt mid-power P50N series.
Both product families take advantage of SemiLEDs unique patented vertical LED structure that delivers superior performance in directional industrial applications, such as printing, coating and curing, and specialty applications including signage and medical or cosmetic uses.
The N9 series, housed on a 9 x 9mm ceramic package, is offered in wavelengths from 385 to 420nm in 5nm bins. Drive currents up to 1,000mA delivers typical output of 5,000mW of optical power at the nominal 350mA drive rate at 30V. The lambertian output distribution is highly compatible with secondary optics to allow precise control of the high-intensity UV light.
Compared to the standard 1000-4000 hour life of the incumbent UV lamp technologies, vertical UV-LED systems support lifetimes of up to 50,000 hours under optimal thermal management conditions, thereby decreasing system maintenance requirements in applications where even planned downtime carries substantial monetary costs.
In addition, with instant on/off capabilities and a compact point-source that is compatible with a wide variety of optics, the SemiLEDs N9 UV-LED allows solution integrators to eliminate maintenance-intensive components such as mechanical shutters or focusing windows. High-output UV sources are commonly used in semiconductor and electronic photo-resistive etching or processing, as well as high-throughput printing systems, and larger scale industrial bonding or curing applications, often eliminating the need for toxic solvents.
The mid-power P50N UV-LED series consists of a complete product family available for 0.17, 0.34 and 0.50-watt drive options, delivering up to 140mW of output, for wavelengths from 385 to 420nm in 5nm bins. The 5 x 5mm package is ideally suited for integration into compact arrays or for high-reliability backlight elements in UV-driven signage.
The wide selection of output combinations simplifies the system integrator's task by allowing a common design platform for portable device applications, such as cosmetics or health care, where differing
performance profiles are needed to address separate curing or treatment functions.
Both product families take advantage of SemiLEDs unique patented vertical LED structure that delivers superior performance in directional industrial applications, such as printing, coating and curing, and specialty applications including signage and medical or cosmetic uses.
The N9 series, housed on a 9 x 9mm ceramic package, is offered in wavelengths from 385 to 420nm in 5nm bins. Drive currents up to 1,000mA delivers typical output of 5,000mW of optical power at the nominal 350mA drive rate at 30V. The lambertian output distribution is highly compatible with secondary optics to allow precise control of the high-intensity UV light.
Compared to the standard 1000-4000 hour life of the incumbent UV lamp technologies, vertical UV-LED systems support lifetimes of up to 50,000 hours under optimal thermal management conditions, thereby decreasing system maintenance requirements in applications where even planned downtime carries substantial monetary costs.
In addition, with instant on/off capabilities and a compact point-source that is compatible with a wide variety of optics, the SemiLEDs N9 UV-LED allows solution integrators to eliminate maintenance-intensive components such as mechanical shutters or focusing windows. High-output UV sources are commonly used in semiconductor and electronic photo-resistive etching or processing, as well as high-throughput printing systems, and larger scale industrial bonding or curing applications, often eliminating the need for toxic solvents.
The mid-power P50N UV-LED series consists of a complete product family available for 0.17, 0.34 and 0.50-watt drive options, delivering up to 140mW of output, for wavelengths from 385 to 420nm in 5nm bins. The 5 x 5mm package is ideally suited for integration into compact arrays or for high-reliability backlight elements in UV-driven signage.
The wide selection of output combinations simplifies the system integrator's task by allowing a common design platform for portable device applications, such as cosmetics or health care, where differing
performance profiles are needed to address separate curing or treatment functions.
RS Components stocks latest energy efficient super junction MOSFETs from Fuji Electric
ENGLAND: RS Components (RS) is stocking the latest devices in the Super J-MOS MOSFET series from Fuji Electric.
The four new MOSFETs -- the FMW20N60S1HF, FMW30N60S1HF, FMW47N60S1HF, and FMW79N60S1HF -- have been developed using the super junction structure, which, unlike a conventional planar structure, enables a significant decrease in on-resistance without reducing the voltage tolerance of the device, leading to substantially lower power consumption. In addition, the surface design of the super junction structure has been optimised to achieve low conduction and switching loss.
Fuji developed the Super J-MOS series in response to heightened global environmental awareness, which has led to a demand for the increased energy efficiency of electronic devices. In particular, there has been a strong emphasis on improving power conversion efficiency in applications such as information and communications equipment including Internet servers, uninterruptible power supply systems, broadcasting equipment, and photovoltaic power conditioners.
The new Super J-MOS MOSFETs from Fuji Electric can be ordered from RS Components for same-day despatch.
The four new MOSFETs -- the FMW20N60S1HF, FMW30N60S1HF, FMW47N60S1HF, and FMW79N60S1HF -- have been developed using the super junction structure, which, unlike a conventional planar structure, enables a significant decrease in on-resistance without reducing the voltage tolerance of the device, leading to substantially lower power consumption. In addition, the surface design of the super junction structure has been optimised to achieve low conduction and switching loss.
Fuji developed the Super J-MOS series in response to heightened global environmental awareness, which has led to a demand for the increased energy efficiency of electronic devices. In particular, there has been a strong emphasis on improving power conversion efficiency in applications such as information and communications equipment including Internet servers, uninterruptible power supply systems, broadcasting equipment, and photovoltaic power conditioners.
The new Super J-MOS MOSFETs from Fuji Electric can be ordered from RS Components for same-day despatch.
Wednesday, June 5, 2013
MEMSIC intros high-performance two-axis magnetic sensor
Sensors Expo 2013, USA: MEMSIC Inc. announced the availability of its MMC246xMT two-axis magnetic sensor.
This fully integrated high performance part is provided in a miniature 2.0 mm. x 2.0 mm. x 1.0 mm. Land Grid Array (LGA) package and is capable of operating from a single 1.8 V supply.
It offers the industry's best performance at the lowest power consumption for a two-axis magnetic sensor, making it ideal for portable applications. Applications include electronic compassing, in-vehicle GPS assist, GPS wristwatches and industrial field measurements including traffic control and parking management.
The MEMSIC MMC246xMT Two-Axis Magnetic Sensor uses MEMSIC's proprietary anisotropic magnetic resistive (AMR) technology to achieve its high performance. Operating over the range of +/- 6 Gauss full scale, its fully integrated design provides all of the necessary circuit functions to facilitate its design into systems while saving space, reducing cost and increasing reliability over other solutions that require external circuit elements.
This fully integrated high performance part is provided in a miniature 2.0 mm. x 2.0 mm. x 1.0 mm. Land Grid Array (LGA) package and is capable of operating from a single 1.8 V supply.
It offers the industry's best performance at the lowest power consumption for a two-axis magnetic sensor, making it ideal for portable applications. Applications include electronic compassing, in-vehicle GPS assist, GPS wristwatches and industrial field measurements including traffic control and parking management.
The MEMSIC MMC246xMT Two-Axis Magnetic Sensor uses MEMSIC's proprietary anisotropic magnetic resistive (AMR) technology to achieve its high performance. Operating over the range of +/- 6 Gauss full scale, its fully integrated design provides all of the necessary circuit functions to facilitate its design into systems while saving space, reducing cost and increasing reliability over other solutions that require external circuit elements.
Molex unveils RF DIN 1.0/2.3 modular backplane system
IMS2013, USA: Molex Inc. announced a high-performance connector system designed specifically to enable PCB developers in the video, commercial broadcast and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints.
The RF DIN 1.0/2.3 Modular Backplane System features a unique bracket housing design, which enables an expansion capability of up to 10 ports for increased orthogonal PCB mating flexibility. The system will be showcased at the International Microwave Symposium, June 2-7, booth 719.
The modular board-to-board system offers multiple options including a standard four port, 75 Ohm contact version or customizable six, eight and 10 ports with 50 Ohm contacts. The DIN 1.0/2.3 interface allows up to 1.00 mm of axial engagement tolerance, providing users with increased flexibility when mating orthogonal PCBs.
The RF DIN 1.0/2.3 backplane system is the only one on the market capable of increasing board-to-board content for DC to 3 GHz frequency applications making it ideal for CATV, communication systems and high-density radio applications. The connectors also feature a push-pull coupling design for quick installation and a plastic housing that engages before the RF contact to prevent damage from stubbing.
The RF DIN 1.0/2.3 Modular Backplane System features a unique bracket housing design, which enables an expansion capability of up to 10 ports for increased orthogonal PCB mating flexibility. The system will be showcased at the International Microwave Symposium, June 2-7, booth 719.
The modular board-to-board system offers multiple options including a standard four port, 75 Ohm contact version or customizable six, eight and 10 ports with 50 Ohm contacts. The DIN 1.0/2.3 interface allows up to 1.00 mm of axial engagement tolerance, providing users with increased flexibility when mating orthogonal PCBs.
The RF DIN 1.0/2.3 backplane system is the only one on the market capable of increasing board-to-board content for DC to 3 GHz frequency applications making it ideal for CATV, communication systems and high-density radio applications. The connectors also feature a push-pull coupling design for quick installation and a plastic housing that engages before the RF contact to prevent damage from stubbing.
RFMD expands portfolio with best-in-class microwave voltage-controlled attenuator
USA: RF Micro Devices Inc. has released the RFSA2113, a broadband, microwave voltage-controlled attenuator.
The RFSA2113 provides a complete monolithic solution in a small 3mm x 3mm QFN package and operates over a frequency range of 50MHz to 18GHz.
The RFSA2113 also incorporates a new circuit architecture that offers high IP3, high attenuation range, low DC current, broad bandwidth and a temperature compensated linear-in-dB control voltage characteristic.
The attenuator's temperature-stable operation allows for the elimination of off-chip calibration and correction circuitry, reducing both cost and DC power requirements.
Real world applications for the RFSA2113 microwave voltage-controlled attenuator include wireless backhaul, test instrumentation, military and satellite communications.
The RFSA2113 provides a complete monolithic solution in a small 3mm x 3mm QFN package and operates over a frequency range of 50MHz to 18GHz.
The RFSA2113 also incorporates a new circuit architecture that offers high IP3, high attenuation range, low DC current, broad bandwidth and a temperature compensated linear-in-dB control voltage characteristic.
The attenuator's temperature-stable operation allows for the elimination of off-chip calibration and correction circuitry, reducing both cost and DC power requirements.
Real world applications for the RFSA2113 microwave voltage-controlled attenuator include wireless backhaul, test instrumentation, military and satellite communications.
RFMD intros 500 Watt GaN L-band amplifier
USA: RF Micro Devices Inc. has introduced the RFHA1027, a gallium nitride (GaN) matched power transistor (MPT) that will deliver industry-leading pulse power performance of 500W in a compact flanged package at L-Band.
RFMD's new amplifier is optimized for pulsed power applications requiring efficiency and compact size. It operates from 1.2 GHz to 1.4 GHz and provides 500W of pulsed RF power from a 50 Volt supply. It also
offers high gain of 16.5 dB and high efficiency of 55 percent.
The RFHA1027 is housed in a small form factor package of 24mm by 17.4 mm, and is input and output matched to 50 ohms, efficiently minimizing external components. In addition, the package leverages RFMD's advanced heat-sink and power-dissipation technologies to deliver excellent thermal stability and conductivity.
The RFHA1027 targets new and existing radar architectures requiring ruggedness and reliability. The introduction of RFHA1027 follows the previous release of RFHA1020 (280W L-Band) and RF3928 (280W S-Band).
RFMD's new amplifier is optimized for pulsed power applications requiring efficiency and compact size. It operates from 1.2 GHz to 1.4 GHz and provides 500W of pulsed RF power from a 50 Volt supply. It also
offers high gain of 16.5 dB and high efficiency of 55 percent.
The RFHA1027 is housed in a small form factor package of 24mm by 17.4 mm, and is input and output matched to 50 ohms, efficiently minimizing external components. In addition, the package leverages RFMD's advanced heat-sink and power-dissipation technologies to deliver excellent thermal stability and conductivity.
The RFHA1027 targets new and existing radar architectures requiring ruggedness and reliability. The introduction of RFHA1027 follows the previous release of RFHA1020 (280W L-Band) and RF3928 (280W S-Band).
Fluke 709H precision current loop calibrator delivers power of HART in a compact test tool
UAE: Fluke Corp. introduced the Fluke 709H Precision Current Loop Calibrator with HART Communications, an affordable, easy-to-use tool with a user-friendly interface and HART capabilities that reduces the time it takes to measure or source, voltage or current, and power up a loop.
With its best-in-class accuracy at 0.01 percent of reading, the Fluke 709H is ideal for process technicians who need a precise loop calibrator and powerful HART communicator in one compact, rugged, reliable tool.
The 709H supports a select set of HART universal and common practice commands. In the communicator mode, technicians can read basic device information, perform diagnostic tests, and trim the calibration on most HART-enabled transmitters. In the past, this could only be done with a dedicated communicator, a high-end multifunction calibrator, or a laptop computer with a HART modem. It also features a built-in, selectable 250-ohm resistor to tune the loop for HART communications.
The 709H and non-HART 709 models feature an intuitive interface with dedicated buttons, a Quick-Set rotary encoder knob, and simple two wire connection for quick, easy measurements. The dedicated 0-100 percent span and 25 percent step buttons make for quick and easy testing. Ramping and auto-stepping enables technicians to perform tests remotely and be in "two places at once."
The optional 709H/TRACK software with communication cable can document milliamp measurements and HART transmitter parameters and upload to a PC.
With its best-in-class accuracy at 0.01 percent of reading, the Fluke 709H is ideal for process technicians who need a precise loop calibrator and powerful HART communicator in one compact, rugged, reliable tool.
The 709H supports a select set of HART universal and common practice commands. In the communicator mode, technicians can read basic device information, perform diagnostic tests, and trim the calibration on most HART-enabled transmitters. In the past, this could only be done with a dedicated communicator, a high-end multifunction calibrator, or a laptop computer with a HART modem. It also features a built-in, selectable 250-ohm resistor to tune the loop for HART communications.
The 709H and non-HART 709 models feature an intuitive interface with dedicated buttons, a Quick-Set rotary encoder knob, and simple two wire connection for quick, easy measurements. The dedicated 0-100 percent span and 25 percent step buttons make for quick and easy testing. Ramping and auto-stepping enables technicians to perform tests remotely and be in "two places at once."
The optional 709H/TRACK software with communication cable can document milliamp measurements and HART transmitter parameters and upload to a PC.
RS provides energy-winning Discovery kit from ST battery NFC/RFID memory apps
GERMANY: RS Components (RS) has the availability of M24LR Discovery Kit from STMicroelectronics, a leading supplier of semiconductors for electronic applications announced.
The M24LR Discovery Kit is an easy-to-use development platform for contactless memory with unique opportunities for energy. It contains all functions that require engineers for the development of battery-free electronic applications, the data ISO/IEC15693-kompatiblen with NFC-enabled smartphones or Lese-/Schreibgeräten for RFID (Radio Frequency Identification) to exchange.
The complete development platform supports the quick design and integration of energy-autonomous data acquisition, tracking of assets or diagnostic facilities in many applications. Examples include accessories for phones and tablets, computer peripherals , electronic price signs, home appliances, industrial automation, sensor and surveillance systems and products for personal health care.
The combination of the industry standard I 2 C-bus and contactless RF interface of the dual-interface memory of the EEPROM can M24LR with the host system via wired or wireless communication. In addition, the RF interface of M24LR radio waves from the environment, which are emitted from Lese-/Schreibgeräten RFID and NFC-enabled phones or tablets into energy to power the circuits and to enable battery-free operation.
The M24LR Discovery kit consists of two modules, which communicate wirelessly with each other: a rate controlled by a 32-bit microprocessor STM32 HF-Sende-/Empfangsplatine for wireless communication with a 13.56 MHz Multiprotokoll-RFID/NFC-Sendeempfänger (CR95HF) with Serial data access via SPI and UART and a battery-free board that the dual-interface EEPROM (M24LR), an 8-bit microprocessor with low power consumption (STM8L) and a temperature sensor includes (STTS75).
M24LR Discovery Kit s are now at RS Components in stock and on the day the order ships.
The M24LR Discovery Kit is an easy-to-use development platform for contactless memory with unique opportunities for energy. It contains all functions that require engineers for the development of battery-free electronic applications, the data ISO/IEC15693-kompatiblen with NFC-enabled smartphones or Lese-/Schreibgeräten for RFID (Radio Frequency Identification) to exchange.
The complete development platform supports the quick design and integration of energy-autonomous data acquisition, tracking of assets or diagnostic facilities in many applications. Examples include accessories for phones and tablets, computer peripherals , electronic price signs, home appliances, industrial automation, sensor and surveillance systems and products for personal health care.
The combination of the industry standard I 2 C-bus and contactless RF interface of the dual-interface memory of the EEPROM can M24LR with the host system via wired or wireless communication. In addition, the RF interface of M24LR radio waves from the environment, which are emitted from Lese-/Schreibgeräten RFID and NFC-enabled phones or tablets into energy to power the circuits and to enable battery-free operation.
The M24LR Discovery kit consists of two modules, which communicate wirelessly with each other: a rate controlled by a 32-bit microprocessor STM32 HF-Sende-/Empfangsplatine for wireless communication with a 13.56 MHz Multiprotokoll-RFID/NFC-Sendeempfänger (CR95HF) with Serial data access via SPI and UART and a battery-free board that the dual-interface EEPROM (M24LR), an 8-bit microprocessor with low power consumption (STM8L) and a temperature sensor includes (STTS75).
M24LR Discovery Kit s are now at RS Components in stock and on the day the order ships.
Tuesday, June 4, 2013
Asian Circuits unveils enhanced surface mount PCB assembly services
CANADA: Asian Circuits Inc., a Canadian, contract electronics manufacturer, has unveiled an enhanced SMT electronic assembly service to provide surface mount (SMT) PCB assembly for prototype and small production runs that are capable of fast turnaround times for PCB prototypes and maximum assembly flexibility for a wide variety of PCB designs.
Asian Circuits' surface mount PCB assembly services are ideal for prototype and small production runs and use both manual and automatic smd assembly processes for either single- and double-sided placement of all components. Asian Circuits' enhanced service has expanded assembly capabilities to include a wide variety of PCBs including, BGA, QFN, SOIC, PLCC, QFP, UBGA, POP, and other small chip packages that have a pitch of 0.3mm (8 mils) or larger.
One of thee most important factors in surface mount PCB assembly is the soldering process. Asian Circuits has innovated the soldering process to ensure it is matched to a circuit design as well as any other design constrictions. In order to detect the joint soldering quality, X-ray inspection is utilized.
For leadless parts such as QFN, DFN and BGA packages, where there is no way to perform a direct visual inspection, 3D X-ray inspection is used to verify any quality issues associated SMT soldering. In addition, reflow surface mount soldering requirements are followed for individual surface mount device parts for all assembly orders.
Asian Circuits' surface mount PCB assembly services are ideal for prototype and small production runs and use both manual and automatic smd assembly processes for either single- and double-sided placement of all components. Asian Circuits' enhanced service has expanded assembly capabilities to include a wide variety of PCBs including, BGA, QFN, SOIC, PLCC, QFP, UBGA, POP, and other small chip packages that have a pitch of 0.3mm (8 mils) or larger.
One of thee most important factors in surface mount PCB assembly is the soldering process. Asian Circuits has innovated the soldering process to ensure it is matched to a circuit design as well as any other design constrictions. In order to detect the joint soldering quality, X-ray inspection is utilized.
For leadless parts such as QFN, DFN and BGA packages, where there is no way to perform a direct visual inspection, 3D X-ray inspection is used to verify any quality issues associated SMT soldering. In addition, reflow surface mount soldering requirements are followed for individual surface mount device parts for all assembly orders.
Belkin releases USB 3.0 dual video docking stands for ultrabooks and Windows 8 tablets
COMPUTEX TAIPEI 2013, TAIWAN: Belkin has released two new docking stands: a Dual Video Docking Stand for Windows 8 tablets and Dual Video Docking Stand for Ultrabooks, making mobile computing easier and more productive for business users.
The stands, which leverage DisplayLink® technology, allow users to turn an Ultrabook or Windows 8 tablet into a full-function desktop with a single plug-and-display USB 3.0 cable. Belkin will showcase the docking stands and other mobile computing solutions at COMPUTEX TAIPEI in Taiwan, June 4-8.
The new docking stands are designed to provide versatility to accommodate mixed platforms and multiple users, including visiting professionals, contractors and ‘hot desk’ environments. Because it allows easy access to multiple peripherals, users can configure their workstations based on their preferences.
The stands, which leverage DisplayLink® technology, allow users to turn an Ultrabook or Windows 8 tablet into a full-function desktop with a single plug-and-display USB 3.0 cable. Belkin will showcase the docking stands and other mobile computing solutions at COMPUTEX TAIPEI in Taiwan, June 4-8.
The new docking stands are designed to provide versatility to accommodate mixed platforms and multiple users, including visiting professionals, contractors and ‘hot desk’ environments. Because it allows easy access to multiple peripherals, users can configure their workstations based on their preferences.
Agilent announces industry-first capabilities for envelope tracking for LTE power-amplifier and power-supply development
USA: Agilent Technologies Inc. announced two software releases that support the design and verification of envelope tracking, a technique that improves the efficiency and linearity of power amplifiers used in mobile handsets. New capabilities available in Agilent Signal Studio software and Agilent 89600 VSA software will help developers quickly optimize their envelope-tracking implementations.
In Signal Studio for LTE/LTE-Advanced (FDD or TDD), developers can now define and optimize test stimuli for power amplifiers using envelope waveforms based on the LTE in-phase/quadrature (I/Q) signal. In addition, the crucial timing alignment between envelope and I/Q can be achieved with picosecond resolution and real-time adjustments. For playback during testing, Signal Studio can download the resulting waveforms to Agilent’s X-Series signal generators and 33500 Series waveform generators.
The latest release of Agilent 89600 VSA software is uniquely able to provide simultaneous envelope and RF analysis, enabling users to characterize and optimize envelope-shaping curves and time alignment. New features include stimulus/response functions with automatic time, amplitude and phase compensation, which simplify power amplifier measurements such as AM/AM, AM/PM and gain compression. Through compatibility with Agilent X-Series signal analyzers and Infiniium oscilloscopes, the software helps users achieve deeper insights into the performance of their envelope-tracking designs.
In Signal Studio for LTE/LTE-Advanced (FDD or TDD), developers can now define and optimize test stimuli for power amplifiers using envelope waveforms based on the LTE in-phase/quadrature (I/Q) signal. In addition, the crucial timing alignment between envelope and I/Q can be achieved with picosecond resolution and real-time adjustments. For playback during testing, Signal Studio can download the resulting waveforms to Agilent’s X-Series signal generators and 33500 Series waveform generators.
The latest release of Agilent 89600 VSA software is uniquely able to provide simultaneous envelope and RF analysis, enabling users to characterize and optimize envelope-shaping curves and time alignment. New features include stimulus/response functions with automatic time, amplitude and phase compensation, which simplify power amplifier measurements such as AM/AM, AM/PM and gain compression. Through compatibility with Agilent X-Series signal analyzers and Infiniium oscilloscopes, the software helps users achieve deeper insights into the performance of their envelope-tracking designs.
GE LED retail lamps freshen old-world market
USA: At The Fresh Market, shoppers can catch not only a delectable aroma, but also the hint of classical music in the air.
When the specialty grocery retailer decided to test updated indoor lighting at its new stores—to be followed by updated lighting at some existing stores—it wanted an energy-saving LED replacement lamp with a high color rendering index (CRI) and long life.
After a thorough evaluation, it found its final answer in GE’s energy smart 17-watt LED PAR38 Retail lamp. Once all installations are complete, GE’s grocery store lighting solution will result in a more than 10 million annual kilowatt hour (kWh) reduction.
GE’s PAR38 LED lamps helped The Fresh Market maintain its retail atmosphere by enhancing the color quality of goods while reducing glare, consuming less energy and generating less heat than the traditional halogen lamps they replaced. Since March 2011,
The Fresh Market has installed nearly 17,000 LED replacement lamps in its stores. Once all 130+ locations are complete this year, its comprehensive lighting update will translate to a total annual energy reduction of more than 10 million kWh.
When the specialty grocery retailer decided to test updated indoor lighting at its new stores—to be followed by updated lighting at some existing stores—it wanted an energy-saving LED replacement lamp with a high color rendering index (CRI) and long life.
After a thorough evaluation, it found its final answer in GE’s energy smart 17-watt LED PAR38 Retail lamp. Once all installations are complete, GE’s grocery store lighting solution will result in a more than 10 million annual kilowatt hour (kWh) reduction.
GE’s PAR38 LED lamps helped The Fresh Market maintain its retail atmosphere by enhancing the color quality of goods while reducing glare, consuming less energy and generating less heat than the traditional halogen lamps they replaced. Since March 2011,
The Fresh Market has installed nearly 17,000 LED replacement lamps in its stores. Once all 130+ locations are complete this year, its comprehensive lighting update will translate to a total annual energy reduction of more than 10 million kWh.
Molex online RF cable assembly configurator goes live
USA: Molex Inc. recently launched an online RF Assembly Builder for distributors, customers and prospective customers. Available now at molex.com/molex/family/RF_Configurator.jsp, the free configurator tool simplifies the design process and allows the user to build a complete assembly and instantly submit an RFQ, without downloading any application or software.
The RF Assembly Builder features step-by-step prompts for designing Molex RF cable assemblies. Users specify connectors, cables, options, preferred delivery and any special application instructions. The RF Assembly Builder also allows the user to specify cable or connector styles not shown in the standard selection.
The configuration is forwarded immediately to a Molex sales engineer for confirmation and a confidential quote. If a user configures a cable assembly that is a close match to one already available, Molex will coordinate the quotation with the stocking distributor.
The RF Assembly Builder features step-by-step prompts for designing Molex RF cable assemblies. Users specify connectors, cables, options, preferred delivery and any special application instructions. The RF Assembly Builder also allows the user to specify cable or connector styles not shown in the standard selection.
The configuration is forwarded immediately to a Molex sales engineer for confirmation and a confidential quote. If a user configures a cable assembly that is a close match to one already available, Molex will coordinate the quotation with the stocking distributor.
Cree UR series LED upgrade kit breaks payback barrier to obsolete linear fluorescent lighting
USA: Linear fluorescent lighting may have seen its last days thanks to the inventive, new Cree UR Series LED Upgrade Kit that can deliver payback in less than two years and makes upgrading to LED lighting simple and easy.
Cree Inc. introduced a 102 lumen-per-watt linear LED upgrade kit to replace fluorescent lamps. The new UR Series is easy to install, saves over 50 percent in energy, provides better light, and lasts up to twice as long as the standard 32W fluorescent lamps it replaces.
The innovative upgrade kit is designed to fit into existing T8/T12 linear fluorescent fixtures – allowing end users to easily upgrade to LED. The new UR Series LED upgrade kit covers both two-feet and four-feet lengths in various lamp configurations.
The UR Series installs faster than competitive retrofit LED tubes and complex LED conversion kits due to its unique magnet design, quick connect technology and form-fitted driver. Designed to be compatible with existing fluorescent fixtures, the UR Series LED lightbars and driver can fit into almost any linear fluorescent luminaire without the need to reuse existing sockets and ballasts.
Cree Inc. introduced a 102 lumen-per-watt linear LED upgrade kit to replace fluorescent lamps. The new UR Series is easy to install, saves over 50 percent in energy, provides better light, and lasts up to twice as long as the standard 32W fluorescent lamps it replaces.
The innovative upgrade kit is designed to fit into existing T8/T12 linear fluorescent fixtures – allowing end users to easily upgrade to LED. The new UR Series LED upgrade kit covers both two-feet and four-feet lengths in various lamp configurations.
The UR Series installs faster than competitive retrofit LED tubes and complex LED conversion kits due to its unique magnet design, quick connect technology and form-fitted driver. Designed to be compatible with existing fluorescent fixtures, the UR Series LED lightbars and driver can fit into almost any linear fluorescent luminaire without the need to reuse existing sockets and ballasts.
MACOM announces ultra-small broadband variable gain amplifier
USA: M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, announced a new broadband variable gain amplifier for multi-market applications.
The MAAM-011100 is designed for customers who need a versatile, broadband, low cost and ultra-small variable gain amplifier solution for WiFi, WiMax, IMS, Point to Point, Test & Measurement, Electronic Warfare and Aerospace and Defense applications.
The MAAM-011100 is packaged in a convenient plastic 1.5x1.2 TDFN while still providing superior broadband performance over competing alternatives. The single gain control pin and ultra-small size provides real estate constrained customers with an easy, low cost solution for a variety of applications.
The MAAM-011100 is designed for customers who need a versatile, broadband, low cost and ultra-small variable gain amplifier solution for WiFi, WiMax, IMS, Point to Point, Test & Measurement, Electronic Warfare and Aerospace and Defense applications.
The MAAM-011100 is packaged in a convenient plastic 1.5x1.2 TDFN while still providing superior broadband performance over competing alternatives. The single gain control pin and ultra-small size provides real estate constrained customers with an easy, low cost solution for a variety of applications.
Sumitomo Electric expands S-band offering for radar apps
USA: Sumitomo Electric Device Innovations USA Inc. (SEDU), a leading provider of advanced wireless and optical communications solutions, is introducing new 500W single-ended GaN power amplifiers (PAs) for S-band radar at IMS 2013 in Seattle.
The devices are the first in their class housed in a space-saving IV package--at 17.4mm x 24mm x 5 mm about half the size of current PAs--while offering high efficiency and gain to Radar manufacturers.
"The new PAs are a natural extension of our expertise in GaN technology and reduced footprint, resulting in devices that combine high-power performance into the smallest packages," says John Wyatt, president of
Sumitomo Electric Device Innovations. "This expertise enables radar designers to evolve designs into smaller form factors while enhancing performance."
The devices are the first in their class housed in a space-saving IV package--at 17.4mm x 24mm x 5 mm about half the size of current PAs--while offering high efficiency and gain to Radar manufacturers.
"The new PAs are a natural extension of our expertise in GaN technology and reduced footprint, resulting in devices that combine high-power performance into the smallest packages," says John Wyatt, president of
Sumitomo Electric Device Innovations. "This expertise enables radar designers to evolve designs into smaller form factors while enhancing performance."
Sumitomo Electric announces Ku-Band GaN HEMT for satcom
USA: Sumitomo Electric Device Innovations USA Inc. (SEDU) has introduced its first Ku-Band GaN HEMT power amplifier (PA) for SATCOM applications.
GaN technology allows significantly higher output powers--50W for GaN vs. 30W for GaAs. Tuned for operation from 13.75 to 14.5 GHz, the new SGK1314-50A PA is internally matched for extended Ku SATCOM band to provide optimum power and gain in a 50-ohm system.
"Our expertise in GaN technology offers new possibilities to SATCOM applications. The new GaN PAs provide the ability to simplify the design by reducing the number of required transistors," says John Wyatt, president of Sumitomo Electric Device Innovations USA. "For example, the 50W GaN HEMT replaces 2 GaAs FETs and also provides higher gain and efficiency."
GaN technology allows significantly higher output powers--50W for GaN vs. 30W for GaAs. Tuned for operation from 13.75 to 14.5 GHz, the new SGK1314-50A PA is internally matched for extended Ku SATCOM band to provide optimum power and gain in a 50-ohm system.
"Our expertise in GaN technology offers new possibilities to SATCOM applications. The new GaN PAs provide the ability to simplify the design by reducing the number of required transistors," says John Wyatt, president of Sumitomo Electric Device Innovations USA. "For example, the 50W GaN HEMT replaces 2 GaAs FETs and also provides higher gain and efficiency."
Skyworks inrtros breakthrough LNAs
USA: Skyworks Solutions Inc. unveiled a portfolio of low noise amplifiers (LNAs) that provide best-in-class noise figure, a critical component to boosting weak incoming signals for today’s 4G wireless infrastructure as well as diverse broad market systems including GPS, broadband, military and satellite communications.
OEMs can now leverage a single Skyworks LNA to address all cellular, ISM and military bands, enabling unconditional stability and simple band specific external matching across a wide voltage range.
“Skyworks’ newest LNAs are achieving unprecedented performance levels, while enabling a multitude of high performance base station, cellular repeater and remote radio head platforms,” said David Stasey, VP and GM of analog solutions at Skyworks. “Leveraging our analog design expertise, IP and scale, Skyworks is delivering highly differentiated solutions and creating competitive advantages for our customers.”
OEMs can now leverage a single Skyworks LNA to address all cellular, ISM and military bands, enabling unconditional stability and simple band specific external matching across a wide voltage range.
“Skyworks’ newest LNAs are achieving unprecedented performance levels, while enabling a multitude of high performance base station, cellular repeater and remote radio head platforms,” said David Stasey, VP and GM of analog solutions at Skyworks. “Leveraging our analog design expertise, IP and scale, Skyworks is delivering highly differentiated solutions and creating competitive advantages for our customers.”
Three billion Bosch MEMS sensors
GERMANY: Micro-electro-mechanical systems (MEMS) are the eyes and ears – and every other sense – of modern mobile devices. Bosch is using these tiny high-tech helpers to teach cars and modern electronic devices how to sense the world around them.
Originally developed for automotive electronics systems, these components can now be found in smartphones, laptop and tablet computers, games consoles, and sports watches. Many of the latest functions for cars and electronic devices – including the ESP® electronic stability program and the use of gestures rather than keys to operate smartphones – would be unthinkable without these highly sensitive measuring instruments.
Bosch supplies sensors for a wide range of applications in the consumer electronics and automotive industries. These sensors measure pressure, acceleration, rotary motion, mass flow, and the earth’s magnetic field. Bosch has been at the forefront of MEMS technology since it first emerged, and today it generates more sales in the extremely dynamic MEMS sensor market than any other supplier.
Since the start of production in 1995, the company has manufactured well in excess of three billion MEMS sensors, with production volumes hitting new highs year after year. It took Bosch 13 years to manufacture the first billion, another three years to reach two billion, and only a further 18 months to cross the three-billion mark. In 2012, some 600 million sensors emerged from its state-of-the-art wafer fab in Reutlingen – or 2.4 million each working day.
“It’s no longer possible to imagine automotive or consumer electronics without MEMS sensors. In the future, they will act as the eyes and ears for systems and objects connected via the internet of things and services,” says Klaus Meder, president of the Bosch Automotive Electronics division.
Originally developed for automotive electronics systems, these components can now be found in smartphones, laptop and tablet computers, games consoles, and sports watches. Many of the latest functions for cars and electronic devices – including the ESP® electronic stability program and the use of gestures rather than keys to operate smartphones – would be unthinkable without these highly sensitive measuring instruments.
Bosch supplies sensors for a wide range of applications in the consumer electronics and automotive industries. These sensors measure pressure, acceleration, rotary motion, mass flow, and the earth’s magnetic field. Bosch has been at the forefront of MEMS technology since it first emerged, and today it generates more sales in the extremely dynamic MEMS sensor market than any other supplier.
Since the start of production in 1995, the company has manufactured well in excess of three billion MEMS sensors, with production volumes hitting new highs year after year. It took Bosch 13 years to manufacture the first billion, another three years to reach two billion, and only a further 18 months to cross the three-billion mark. In 2012, some 600 million sensors emerged from its state-of-the-art wafer fab in Reutlingen – or 2.4 million each working day.
“It’s no longer possible to imagine automotive or consumer electronics without MEMS sensors. In the future, they will act as the eyes and ears for systems and objects connected via the internet of things and services,” says Klaus Meder, president of the Bosch Automotive Electronics division.
Mouser stocks Cypress PSoC 4 programmable SoC
TAIWAN: Mouser Electronics Inc. is now stocking Cypress’s PSoC 4 programmable SoC, which combines Cypress’ PSoC analog and digital fabric, CapSense capacitive touch technology with ARM’s Cortex-M0.
Cypress Semiconductor’s PSoC 4 ARM Cortex-M0 Based Programmable SoC architecture combines Cypress’ best-in-class PSoC analog and digital fabric and industry-leading CapSense capacitive touch technology with ARM’s power-efficient Cortex-M0 core.
The truly scalable, cost-efficient architecture delivers PSoC’s trademark flexibility, analog performance and integration, along with access to dozens of free PSoC Components—“virtual chips” represented by icons in Cypress’ PSoC Creator integrated design environment. The new PSoC4 device class will challenge proprietary 8-bit and 16-bit microcontrollers (MCUs), along with other 32-bit devices.
Mouser is also stocking Cypress’ PSoC ARM Cortex-M0 Pioneer Kit, which is an easy-to-use and inexpensive development platform enabling you to create unique designs with the flexibility of PSoC 4. Featuring a member of the PSoC 4200 family, this kit gives you the power of an ARM Cortex-M0 combined with the fully customizable analog and digital fabric of the PSoC in the palm of your hands.
Cypress Semiconductor’s PSoC 4 ARM Cortex-M0 Based Programmable SoC architecture combines Cypress’ best-in-class PSoC analog and digital fabric and industry-leading CapSense capacitive touch technology with ARM’s power-efficient Cortex-M0 core.
The truly scalable, cost-efficient architecture delivers PSoC’s trademark flexibility, analog performance and integration, along with access to dozens of free PSoC Components—“virtual chips” represented by icons in Cypress’ PSoC Creator integrated design environment. The new PSoC4 device class will challenge proprietary 8-bit and 16-bit microcontrollers (MCUs), along with other 32-bit devices.
Mouser is also stocking Cypress’ PSoC ARM Cortex-M0 Pioneer Kit, which is an easy-to-use and inexpensive development platform enabling you to create unique designs with the flexibility of PSoC 4. Featuring a member of the PSoC 4200 family, this kit gives you the power of an ARM Cortex-M0 combined with the fully customizable analog and digital fabric of the PSoC in the palm of your hands.
PowerbyProxi to preview highly resonant technology with Qi compatibility
Computex 2013, USA: PowerbyProxi, in partnership with the Wireless Power Consortium (WPC), will demonstrate the next evolution of Qi at Computex 2013, June 4-8, 2013, in Taipei, Taiwan.
The company will reveal a sneak peek of PowerbyProxi's highly resonant technology showing full spatial freedom, simultaneous charging of multiple devices and interoperability with the existing Qi specification.
PowerbyProxi is a leading developer and proven supplier of wireless power solutions who joined the WPC in mid-May. "Our goal is to share our expertise and intellectual property to help advance the technical capabilities of the Qi standard and ultimately provide the best experience for the consumer," said Fady Mishriki, EVP and CTO of PowerbyProxi.
"By revealing this prototype at Computex, we're illustrating how quickly we've begun to contribute to the WPC with plans to extend specifications and ensure backward compatibility with the existing Qi ecosystem."
PowerbyProxi will be offering the sneak preview of their highly resonant technology at the WPC booth, G436, in Exhibition Hall 3 at the Taipei World Trade Center June 4-8, 2013.
The company will reveal a sneak peek of PowerbyProxi's highly resonant technology showing full spatial freedom, simultaneous charging of multiple devices and interoperability with the existing Qi specification.
PowerbyProxi is a leading developer and proven supplier of wireless power solutions who joined the WPC in mid-May. "Our goal is to share our expertise and intellectual property to help advance the technical capabilities of the Qi standard and ultimately provide the best experience for the consumer," said Fady Mishriki, EVP and CTO of PowerbyProxi.
"By revealing this prototype at Computex, we're illustrating how quickly we've begun to contribute to the WPC with plans to extend specifications and ensure backward compatibility with the existing Qi ecosystem."
PowerbyProxi will be offering the sneak preview of their highly resonant technology at the WPC booth, G436, in Exhibition Hall 3 at the Taipei World Trade Center June 4-8, 2013.
Agilent launches Cary 7000 universal measurement spectrophotometer
USA: Agilent Technologies Inc. has launched the Cary 7000 universal measurement spectrophotometer (UMS), offering the highest quality and performance of any UV-Vis-NIR system, including complete sample characterization, lower cost per analysis and improved data quality for thin film, solar, glass, optics and other advanced materials applications.
The new product offers researchers a cutting-edge tool for discovery and development, and it provides manufacturers with the ability to reduce costs through faster time-to-market and more rigorous quality control.
The fully automated Cary 7000 UMS delivers:
* Measurements of transmission, absolute reflection and scattering without moving the sample.
* Automated, unattended operation that saves time and money.
* Superior optical performance that provides world-leading 10 Absorbance unit capabilities to measure the most challenging of samples.
The new product offers researchers a cutting-edge tool for discovery and development, and it provides manufacturers with the ability to reduce costs through faster time-to-market and more rigorous quality control.
The fully automated Cary 7000 UMS delivers:
* Measurements of transmission, absolute reflection and scattering without moving the sample.
* Automated, unattended operation that saves time and money.
* Superior optical performance that provides world-leading 10 Absorbance unit capabilities to measure the most challenging of samples.
Monday, June 3, 2013
Fairchild's 100V BoostPak solution provides improved reliability
USA: Fairchild Semiconductor optimizes the MOSFET and diode selection process by introducing a family of 100 V BoostPak devices that combines a MOSFET and diode in one package to replace discrete solutions currently used in LED TV / monitor backlight, LED lighting and DC-DC converter applications.
By integrating the MOSFET and diode into a single package, the FDD1600N10ALZD and the FDD850N10LD devices save board space, simplify assembly, lower bill of material (BOM) costs and improve reliability of the application.
The devices feature an N-channel MOSFET produced using Fairchild’s PowerTrench process that has been tailored to minimize the on-state resistance while maintaining superior switching performance. The NP diode is a hyperfast rectifier with low forward voltage drop and excellent switching performance. It has much lower leakage current than a Shottky diode, which improves system reliability in high temperature applications.
By integrating the MOSFET and diode into a single package, the FDD1600N10ALZD and the FDD850N10LD devices save board space, simplify assembly, lower bill of material (BOM) costs and improve reliability of the application.
The devices feature an N-channel MOSFET produced using Fairchild’s PowerTrench process that has been tailored to minimize the on-state resistance while maintaining superior switching performance. The NP diode is a hyperfast rectifier with low forward voltage drop and excellent switching performance. It has much lower leakage current than a Shottky diode, which improves system reliability in high temperature applications.
Cree ships over 2 million GaN HEMT devices for telecom infrastructure
IMS2013, USA: Cree Inc. has surpassed a significant milestone in shipping over two million GaN High Electron Mobility Transistors (HEMT) for cellular telecommunications and is providing game-changing benefits over traditional silicon-based technologies, including higher power, higher efficiency and wider bandwidth.
As mobile devices such as smartphones are becoming more widespread, telecommunications companies are looking for innovative technologies to improve channel capacity and speed of wireless systems, while simultaneously lowering power consumption of transmission amplifiers.
The use of GaN HEMT in transmitter amplifiers is gaining attention in the cellular telecommunications industry due to the ability to decrease power consumption and size, and increase bandwidth capabilities.
The world’s mobile networks are reported to consume about 120TWh of electricity per year (for an average cost of $14.4 billion), and 50 percent of the networks power is consumed by power amplifiers and associated components. Consequently, improved power amplifier efficiency can result in considerable energy savings.
The next-generation performance enabled by Cree GaN HEMT are required to support today’s 4G LTE cellular networks, as well as to help drive LTE release 10 and advanced LTE networks currently being developed. The superior efficiency and bandwidth advantages of GaN HEMTs help LTE cellular network transmitters achieve smaller size, lower weight and improved thermal management compared with incumbent technologies.
GaN HEMT power amplifiers allow for data channel bandwidths over 100MHz and wide instantaneous RF bandwidths, helping operators aggregate multiple, non-adjacent frequencies to maximize the benefits of their licensed spectrum. Another significant advantage is improved transmitter efficiency, which offers tremendous energy savings for operating budgets.
As mobile devices such as smartphones are becoming more widespread, telecommunications companies are looking for innovative technologies to improve channel capacity and speed of wireless systems, while simultaneously lowering power consumption of transmission amplifiers.
The use of GaN HEMT in transmitter amplifiers is gaining attention in the cellular telecommunications industry due to the ability to decrease power consumption and size, and increase bandwidth capabilities.
The world’s mobile networks are reported to consume about 120TWh of electricity per year (for an average cost of $14.4 billion), and 50 percent of the networks power is consumed by power amplifiers and associated components. Consequently, improved power amplifier efficiency can result in considerable energy savings.
The next-generation performance enabled by Cree GaN HEMT are required to support today’s 4G LTE cellular networks, as well as to help drive LTE release 10 and advanced LTE networks currently being developed. The superior efficiency and bandwidth advantages of GaN HEMTs help LTE cellular network transmitters achieve smaller size, lower weight and improved thermal management compared with incumbent technologies.
GaN HEMT power amplifiers allow for data channel bandwidths over 100MHz and wide instantaneous RF bandwidths, helping operators aggregate multiple, non-adjacent frequencies to maximize the benefits of their licensed spectrum. Another significant advantage is improved transmitter efficiency, which offers tremendous energy savings for operating budgets.
ANADIGICS unveils unique RF amplifier solution for small-cell apps
USA: ANADIGICS Inc. introduced a new style of RF power amplifier (PA) optimized to power 3G and 4G small-cell base stations.
Paired with digital or RF predistortion systems, these highly integrated designs create easy-to-use solutions that deliver very high efficiencies with the stringent linearity required for WCDMA, HSPA, and LTE networks.
ANADIGICS' new PAs demonstrate compelling performance in compact surface mount modules that incorporate circuit components normally required separately.
The first ANADIGICS product that demonstrates this new power amplifier approach is the ASC7517. Operating in the 2100 MHz to 2170 MHz frequency band, the ACS7517 delivers 1.4 W of power using only a 2.85 V and 5 V supply, while operating with a power efficiency of 28 percent.
Used in a predistortion system, the PA supports the stringent adjacent channel level rejection (ACLR) requirements of WCDMA, HSPA, and LTE systems without compromising efficiency. This multistage PA also provides 42 dB of RF gain, thereby eliminating the need for driver amplifiers.
The ACS7517 uses a Doherty architecture, but does not require negative voltage supplies, separate control voltage for the integrated peaking amplifier, or critical supply sequencing. In addition, the PA does not
require voltage adjustments to perform optimally over a wide -40 to +85 degrees Celsius operating temperature range.
The ASC7517 is offered in a compact 8 mm by 14 mm by 1.3 mm surface-mount package that integrates both the RF matching and power combining circuit elements to save valuable PCB space and provide a cost-effective solution that is significantly less complex than a traditional Doherty solution.
Paired with digital or RF predistortion systems, these highly integrated designs create easy-to-use solutions that deliver very high efficiencies with the stringent linearity required for WCDMA, HSPA, and LTE networks.
ANADIGICS' new PAs demonstrate compelling performance in compact surface mount modules that incorporate circuit components normally required separately.
The first ANADIGICS product that demonstrates this new power amplifier approach is the ASC7517. Operating in the 2100 MHz to 2170 MHz frequency band, the ACS7517 delivers 1.4 W of power using only a 2.85 V and 5 V supply, while operating with a power efficiency of 28 percent.
Used in a predistortion system, the PA supports the stringent adjacent channel level rejection (ACLR) requirements of WCDMA, HSPA, and LTE systems without compromising efficiency. This multistage PA also provides 42 dB of RF gain, thereby eliminating the need for driver amplifiers.
The ACS7517 uses a Doherty architecture, but does not require negative voltage supplies, separate control voltage for the integrated peaking amplifier, or critical supply sequencing. In addition, the PA does not
require voltage adjustments to perform optimally over a wide -40 to +85 degrees Celsius operating temperature range.
The ASC7517 is offered in a compact 8 mm by 14 mm by 1.3 mm surface-mount package that integrates both the RF matching and power combining circuit elements to save valuable PCB space and provide a cost-effective solution that is significantly less complex than a traditional Doherty solution.
EMCORE intros DFB laser modules for wireless and distributed antenna system apps
USA: EMCORE Corp., a leading provider of compound semiconductor-based components and subsystems for the fiber optics and solar power markets, announced that it has introduced two new Distributed Feedback (DFB) laser modules designed for analog wireless and Distributed Antenna System (DAS) applications.
The new 1764 1550 nm C-Band DWDM and 1615 1310 nm DFB Laser Modules will be previewed at ANGACOM, June 4-6 at the Cologne Germany Fairgrounds by EMCORE and EQ Photonics in hall 10.2, stand D038.
The increasing demands on wireless networks from social media, texting, email, and uploading and downloading of applications, music, videos and photos is creating greater and greater need for deployment of cost-effective, integrated wireless DAS systems.
The new 1764 and 1615 Series laser modules are designed, tested and optimized specifically to support highly-linearized wireless applications. These lasers are matched to 50 Ohm systems typical of wireless networks and have a wide operating temperature range of -40 degrees C to +85 degrees C for reliable performance in harsh node environments and narrow transmitter designs. Both models have bandwidth up to 2.7 GHz.
The new 1764 1550 nm C-Band DWDM and 1615 1310 nm DFB Laser Modules will be previewed at ANGACOM, June 4-6 at the Cologne Germany Fairgrounds by EMCORE and EQ Photonics in hall 10.2, stand D038.
The increasing demands on wireless networks from social media, texting, email, and uploading and downloading of applications, music, videos and photos is creating greater and greater need for deployment of cost-effective, integrated wireless DAS systems.
The new 1764 and 1615 Series laser modules are designed, tested and optimized specifically to support highly-linearized wireless applications. These lasers are matched to 50 Ohm systems typical of wireless networks and have a wide operating temperature range of -40 degrees C to +85 degrees C for reliable performance in harsh node environments and narrow transmitter designs. Both models have bandwidth up to 2.7 GHz.
MicroWave announces advanced GaAs pHEMT-based ultra-broadband driver MMIC amplifier up to 50 GHz
USA: MicroWave Technology Inc. (MwT), the RF division of IXYS Corp., announced that it offers an advanced AlGaAs/InGaAs pHEMT-based MMIC ultra-broadband driver amplifier product up to 50 GHz.
The product is targeted at applications including fiber optics communications, microwave/mm-wave communications systems, microwave/mm-wave testing equipment, and military applications.
The MMA-005022 is an ultra-broadband Traveling Wave Amplifier MMIC with medium output power and high gain over a full range of nearly DC 30 KHz to 50 GHz. It offers a typical +22 dBm saturated power and +20 dBm output power at a 1dB gain compression point at 30 GHz.
The MMIC chip typically has 16 dB gain across the band with +/- 1dB gain flatness. The typical input/out return loss for the chip is 15 dB. The DC bias is 200 mA drain current with 7V drain voltage.
The MMIC chip typically has 16 dB gain across the band with +/- 1dB gain flatness. The typical input/out return loss for the chip is 15 dB. The DC bias is 200 mA drain current with 7V drain voltage.
RS Components partners with Philips Lumileds in global distribution deal
USA: RS Components (RS) has entered into a global distribution agreement with Philips Lumileds, a leading provider of LED technologies.
This partnership with RS is part of a recent initiative by Philips Lumileds to restructure its distribution channels, steered by the LED vendor's strategic objective to grow its customer base globally through expansion into new markets.
In its 16 distribution centres located around the world RS has the capacity to stock the full breadth of the Philips Lumileds range, and is thus equipped to provide luminaire designers with immediate access to a comprehensive portfolio of application-specific LED solutions. Products can be sourced and purchased quickly online via the RS website and despatched on the same day.
"This agreement with RS means that we are able to serve the needs of our growing customer base and continue our widespread expansion into new target markets," said Pierre-Yves Lesaicherre, CEO Philips Lumileds. "With its worldwide presence and excellent online ordering and design support capabilities, RS is a valuable asset to our global network of distribution partners."
"Our strategy at RS is focused heavily on reducing design times for engineers by supporting them with free online design resources, and by providing fast, easy access to a vast selection of products direct from stock," said Jonathan Boxall, Global Head of Semiconductors at RS Components. "We are delighted to be partnering with Philips Lumileds, a move that will provide luminaire designers worldwide with a significant competitive advantage by combining leading-edge LED products with a time- and cost-efficient sourcing and purchasing experience."
This partnership with RS is part of a recent initiative by Philips Lumileds to restructure its distribution channels, steered by the LED vendor's strategic objective to grow its customer base globally through expansion into new markets.
In its 16 distribution centres located around the world RS has the capacity to stock the full breadth of the Philips Lumileds range, and is thus equipped to provide luminaire designers with immediate access to a comprehensive portfolio of application-specific LED solutions. Products can be sourced and purchased quickly online via the RS website and despatched on the same day.
"This agreement with RS means that we are able to serve the needs of our growing customer base and continue our widespread expansion into new target markets," said Pierre-Yves Lesaicherre, CEO Philips Lumileds. "With its worldwide presence and excellent online ordering and design support capabilities, RS is a valuable asset to our global network of distribution partners."
"Our strategy at RS is focused heavily on reducing design times for engineers by supporting them with free online design resources, and by providing fast, easy access to a vast selection of products direct from stock," said Jonathan Boxall, Global Head of Semiconductors at RS Components. "We are delighted to be partnering with Philips Lumileds, a move that will provide luminaire designers worldwide with a significant competitive advantage by combining leading-edge LED products with a time- and cost-efficient sourcing and purchasing experience."
GigOptix demos leading high E-band power amplifier performance
IMS2013, USA: GigOptix Inc. announced the successful demonstration of new high E-band power amplifier EXP8603 with enhanced P1dB, P3dB and reduced power consumption.
GigOptix EXP8603 high E-band second generation power amplifier device has demonstrated enhanced P1dB, Psat performance and reduced power consumption in the laboratory testing respect to first generation device EXP8602. The EXP8603 provides saturated output power at 3dB gain compression (P3dB) of 24dBm and an output power at 1dB gain compression point (P1dB) of 23dBm across the full bandwidth of 81-86GHz with a total gain of 18dB.
The EXP8603 has also an integrated output power detector with a dynamic range of more than 20dB. The improved P1dB and P3dB performance has been achieved while simultaneously decreasing the power consumption of the product by more than 10% and maintaining the gain. The EXP8603 also demonstrated an output intercept point (OIP3) above 31dBm across the full frequency range of 81-86GHz.
GigOptix EXP8603 high E-band second generation power amplifier device has demonstrated enhanced P1dB, Psat performance and reduced power consumption in the laboratory testing respect to first generation device EXP8602. The EXP8603 provides saturated output power at 3dB gain compression (P3dB) of 24dBm and an output power at 1dB gain compression point (P1dB) of 23dBm across the full bandwidth of 81-86GHz with a total gain of 18dB.
The EXP8603 has also an integrated output power detector with a dynamic range of more than 20dB. The improved P1dB and P3dB performance has been achieved while simultaneously decreasing the power consumption of the product by more than 10% and maintaining the gain. The EXP8603 also demonstrated an output intercept point (OIP3) above 31dBm across the full frequency range of 81-86GHz.
Mouser president and CEO Glenn Smith celebrates 40 years of service
USA: Mouser Electronics Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, announced the 40th company anniversary milestone of Glenn Smith, Mouser’s president and CEO.
In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work part-time in the warehouse of what was little more than a mom and pop electronics catalog start-up in San Diego. Smith was one of just 12 employees.
With strategic vision, Smith has built the company into a global corporation that today - four decades later - has 1,200 employees, 400,000 customers, more than $600 million annual revenue, and 19 offices on three continents.
Not long after Smith started at Mouser, his foresight and leadership qualities were evident. From the warehouse, he moved on to management positions at every department, including technical sales, marketing, purchasing, operations and information technology. In 1985, he was promoted to senior VP and GM with responsibility for day-to-day operations.
In 1986, Smith was instrumental in moving the operation to Mansfield, Texas, placing Mouser near the DFW International Airport for expanded distribution capabilities. Two years later, Smith was named company president. Fort Worth-based TTI Inc. acquired Mouser in 2000 and by 2004, Smith was named president and CEO, a position he retained in 2007 after Mouser and TTI were acquired by Warren Buffett’s Berkshire Hathaway Inc.
In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work part-time in the warehouse of what was little more than a mom and pop electronics catalog start-up in San Diego. Smith was one of just 12 employees.
With strategic vision, Smith has built the company into a global corporation that today - four decades later - has 1,200 employees, 400,000 customers, more than $600 million annual revenue, and 19 offices on three continents.
Not long after Smith started at Mouser, his foresight and leadership qualities were evident. From the warehouse, he moved on to management positions at every department, including technical sales, marketing, purchasing, operations and information technology. In 1985, he was promoted to senior VP and GM with responsibility for day-to-day operations.
In 1986, Smith was instrumental in moving the operation to Mansfield, Texas, placing Mouser near the DFW International Airport for expanded distribution capabilities. Two years later, Smith was named company president. Fort Worth-based TTI Inc. acquired Mouser in 2000 and by 2004, Smith was named president and CEO, a position he retained in 2007 after Mouser and TTI were acquired by Warren Buffett’s Berkshire Hathaway Inc.
Mitsubishi Electric to strengthen services for FA products in Indonesia
JAPAN: Mitsubishi Electric Corp. announced that subsidiary PT Mitsubishi Electric Indonesia will establish a new factory automation (FA) center at its Jakarta office to provide enhanced services to locally operating manufacturers, especially Japanese automotive and component makers.
The facility, scheduled to begin operating on June 3, will support the ongoing expansion of Mitsubishi Electric’s FA business in Indonesia.
The Indonesia FA Center will provide technical consultation, training and support for FA products, including programmable logic controllers, human machine interfaces, inverters, servos and numerical control machining. Services will be available in Indonesian, English and Japanese for assured customer satisfaction.
Indonesia, which has a population of 240 million, boasts the largest economy in the ASEAN region. Major Japanese manufacturers of autos and auto parts are increasing local production capacity to capture greater market share in this fast-expanding economy.
“We aim to satisfy our customers’ increasing demands for FA product support,” said Takeshi Terada, president and CEO of PT Mitsubishi Electric Indonesia. “Our current structure of providing support through local distributors and our ASEAN FA center in Singapore has served us well, but our needs continue to grow. Our new Indonesia FA center will provide more timely product support and training in both Indonesian and English and, if required, in Japanese as well through Japanese engineers stationed at the center.”
The facility, scheduled to begin operating on June 3, will support the ongoing expansion of Mitsubishi Electric’s FA business in Indonesia.
The Indonesia FA Center will provide technical consultation, training and support for FA products, including programmable logic controllers, human machine interfaces, inverters, servos and numerical control machining. Services will be available in Indonesian, English and Japanese for assured customer satisfaction.
Indonesia, which has a population of 240 million, boasts the largest economy in the ASEAN region. Major Japanese manufacturers of autos and auto parts are increasing local production capacity to capture greater market share in this fast-expanding economy.
“We aim to satisfy our customers’ increasing demands for FA product support,” said Takeshi Terada, president and CEO of PT Mitsubishi Electric Indonesia. “Our current structure of providing support through local distributors and our ASEAN FA center in Singapore has served us well, but our needs continue to grow. Our new Indonesia FA center will provide more timely product support and training in both Indonesian and English and, if required, in Japanese as well through Japanese engineers stationed at the center.”
Low input noise over wide bandwidth offered in differential amplifier from Measurement Specialties
USA: Measurement Specialties, a leading global manufacturer in sensor-based measuring of pressure/force, position, vibration, temperature, humidity and fluid properties, now offers a 3-channel DC differential amplifier with an exceptionally low noise input of less than 20 microVrms. The new Model 121 enables precision measurement on up to three channels simultaneously.
Offering programmable gain up to 9,999 and user-defined output scaling, the new signal conditioner is ideal for use with bridge-type or differential output accelerometers, pressure transducers and load cells.
The unit's low noise floor over a wide frequency bandwidth up 200 kHz makes for exceptional, accurate measurement of dynamic signals. The Model 121 is used in a variety of instrumentation lab, vibration and shock testing as well as process monitoring applications.
Full scale accuracy is ±0.5 percent and linearity is ±0.1 percent. The Model 121 also features an auto-zero function that can be initiated by the operator to maximize voltage span in the data acquisition system. Each of the amplifier's three channels features a 9-pin D-sub connector. Input impedance is less than 1 Megohm.
User-configurable shunt calibration can be applied via an internal or external resistor to any of the four legs of the transducer under test. Default shunt value is 150 kohm.
Testing parameters of the Model 121 can be easily set from the unit's front panel via a simple push button interface. The unit stores settings for all functions on internal memory, and will automatically restore the last session's settings on power-up.
Offering programmable gain up to 9,999 and user-defined output scaling, the new signal conditioner is ideal for use with bridge-type or differential output accelerometers, pressure transducers and load cells.
The unit's low noise floor over a wide frequency bandwidth up 200 kHz makes for exceptional, accurate measurement of dynamic signals. The Model 121 is used in a variety of instrumentation lab, vibration and shock testing as well as process monitoring applications.
Full scale accuracy is ±0.5 percent and linearity is ±0.1 percent. The Model 121 also features an auto-zero function that can be initiated by the operator to maximize voltage span in the data acquisition system. Each of the amplifier's three channels features a 9-pin D-sub connector. Input impedance is less than 1 Megohm.
User-configurable shunt calibration can be applied via an internal or external resistor to any of the four legs of the transducer under test. Default shunt value is 150 kohm.
Testing parameters of the Model 121 can be easily set from the unit's front panel via a simple push button interface. The unit stores settings for all functions on internal memory, and will automatically restore the last session's settings on power-up.
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