JAPAN: Toshiba Corp. has expanded its package line-up of interface-converter bridge LSIs for high resolution LCD display that are used in tablet PC, Ultrabooks and other applications.
Mass production of "TC358778XBG" is scheduled to start in June, followed by "TC358777XBG" in July.
The ball pitch of the original product is 0.4mm, and fine pitch assembly equipment is required for production. Expanding the ball pitch from 0.4mm to 0.65mm achieves assembly with no need for such equipment. Toshiba has also optimized the pin assignment for layout without high cost PCB with more than four layers.
Those new package products reduce the set makers' cost of assembly and materials.