Tuesday, September 30, 2014

Innovative technologies introduction impacts favorably LED packaging materials market

LYON, FRANCE: The LED packaging industry is moving toward further cost reduction and new technologies including Flip Chip and Chip Scale Package (CSP), says Yole Développement (Yole) in its latest report on packaging for LED: LED Packaging Technology and Market Trends 2014.

These market and technology trends directly impact the LED & advanced packaging industry and its supply chain, especially at the material and equipment levels: whereas the equipment market enters in an infernal cycle, the materials market for LED packaging confirms its growth.

“The LED packaging materials market, including packaging substrates, phosphors, encapsulation and primary optic materials, ESD (Electrostatic Discharge) protection diodes, will grow by a factor x1.5 during the period 2014-2019," said Pars Mukish, activity leader, LED & Compound Semiconductors at Yole Développement.

No comments:

Post a Comment

Note: Only a member of this blog may post a comment.