Thursday, March 21, 2013

Orbotech wins $18 million in frame agreements from two leading PCB makers

ISRAEL: Orbotech Ltd has signed major frame agreements, totaling approximately $18 million in value, with two leading printed circuit board makers in Taiwan and China for the mass production of high density interconnect PCBs.

These orders, which are expected to include multiple Paragon\ laser direct imaging and automated optical inspection systems, as well as related digital production tools, reflect an increasing level of capital investment by PCB customers in the most up-to-date Orbotech technology used in the manufacture of advanced PCBs for highly sophisticated electronic devices.

“We are gratified that these customers, which are major suppliers to several of the world’s top electronics companies, have once again selected Orbotech solutions as part of their strategic growth plan,” commented Richard Klapholz, corporate executive VP of Electronics Business at Orbotech.

He added: “PCB manufacturers are coming to realize that the significant challenges involved in the mass production of high quality, ultra-thin and increasingly complex boards can now only be met by the use of systems having LDI capabilities. The highly competitive nature of the advanced micro manufacturing segment requires continuous development of new production techniques that can keep pace with the rapid advances in electronics innovation and we are very pleased to be partnering with our customers in this process.”

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