Wednesday, May 1, 2013

Molex intros next-gen high-performance, ultra-low power memory technology

USA: Molex Inc. has introduced a portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in telecommunication, networking and storage systems, advanced computing platforms, industrial controls and medical equipment.

DDR3 is an established DDR DRAM interface technology that supports data rates of 800 to 1600 Mbps with clock frequencies of 400 to 800 MHz, which is double that of the DDR2 interface. With a standard operating voltage of 1.5V, DDR3 cuts power consumption of DDR2 by 30 percent.

Molex’s DDR3 DIMM sockets feature a lower seating plane than standard designs, enabling the use of very low-profile modules with maximum seating heights below 2.80mm in ATCA blade systems. The new DDR3 DIMM sockets also feature low-level contact resistance of 10 milliohms to support the use of registered DIMM modules and reduce power consumption in blade servers.

Molex aerodynamic DDR3 DIMM sockets feature a streamlined housing and latch design to maximize airflow and eliminate trapped hot air during operation. The ergonomic latches enable quick actuation and easy removal of high-density memory modules. The low 2.40mm seating plane optimizes vertical space for more flexible socket module design heights.

Aerodynamic DDR3 DIMM sockets are available in very low profile press-fit (14.26mm), low profile press-fit (22.03mm), low profile SMT (21.34mm) and very low profile SMT (14.20mm) heights. The press-fit sockets feature smaller eye-of-needle compliant pins than standard press-fit terminals to free up valuable PCB real estate for higher-density trace routing. All Molex aerodynamic DDR3 DIMM sockets are RoHS compliant and SMT versions are halogen-free.

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